CX-7-SM CRYSTAL 20 MHz to 50 MHz Ultra-Miniature, Low Profile AT-Cut Surface Mount Crystal ™ actual size DESCRIPTION side view STATEK’s ultra-miniature, low profile CX-7-SM AT-cut crystals in leadless ceramic packages are designed for surface mounting on printed circuit boards or hybrid circuits. These crystals are low profile and have a very small land pattern. Maximum process temperature should not exceed 260OC. PACKAGE DIMENSIONS FEATURES Designed for surface mount applications using infrared, vapor phase, wave solder or epoxy mount techniques Low profile (less than 1.2mm) hermeitcally sealed ceraminc package A TOP BOTTOM Excellent aging characteristics D Available with glass or ceramic lid High shock and vibration resistance B Custom designs available C Full military testing available Designed and manufactured in the USA APPLICATIONS Industrial, Computer & Communications General purpose clock oscillator TYP. MAX. DIM INCHES mm INCHES mm A .157 4.00 .162 4.11 B .072 1.83 .085 2.16 C - - D .035 0.89 DIM “C” GLASS LID see below .045 1.14 CERAMIC LID PCMCIA MAX INCHES mm INCHES mm Fax, Modem and LAN SM1 .045 1.14 .050 1.27 Smart card SM2 .046 1.17 .051 1.30 PDA and notebook computers SM3 .048 1.22 .053 1.35 Handheld instrumentation Cellular SUGGESTED LAND PATTERN PCS GRID COURTYARD Military & Aerospace .177[4.50] Airborne hybrid computer .121[3.07] Military high speed modem MCM .092 [2.34] .055[1.40] .067[1.70] 10155 - Rev A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany www.rsg-electronic.de SPECIFICATIONS TERMINATIONS Specifications are typical at 25oC unless otherwise noted. Specifications are subject to change without notice. 49 MHz Designation SM1 SM2 SM3 Motional Resistance R1(k⍀) 14 Motional Capacitance C1 (fF) 2.4 Quality Factor Q (k) Termination Gold Plated Nickel, Solder Plated Nickel, Solder Plated and Solder Dipped 100 Shunt Capacitance Co (pF) 0.8 PACKAGING Load Capacitance A +_ 0.01% ( +_ 100ppm) B +_ 0.1% C +_ 1.0% 10pF (unless specified by customer) Drive Level 200 W MAX. Frequency-Temperature Stability** -10OC to +70OC from Calibration Tolerance* + _ 10ppm -40 C to +85 C from + _ 35ppm -55OC to +125OC from + _ 50ppm O O Aging, first year 5ppm MAX. Shock, survival*** 5,000g peak 0.3 msec., 1/2 sine Vibration, survival 20g rms, 10-2,000 Hz random Operating Temperature -10OC to +70OC Commercial -40OC to +85OC Industrial -55OC to +125OC Military Storage Temperature -55OC to +125OC CX-7-SM -Tray Pack (Standard) -16mm tape, 7” or 13” reels (Optional) Per EIA 481 (see data sheet 10109) EQUIVALENT CIRCUIT C0 1 L1 C1 R1 2 R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance CONVENTIONAL CMOS PIERCE OSCILLATOR CIRCUIT Max Process Temperature 260OC for 20 sec. Rf Note: The characteristics of the frequency temperature stability follow that of AT-Cut thickness-shear mode. BUFFER AMPLIFIER CS * Tighter tolerances available as low as +_ 5 ppm ** Does not include calibration tolerance *** Higher shock version available CG OSC Freq (fO) RA Contact factory for design guidelines CX-7 CD CX-1 HOW TO ORDER CX-7-SM CRYSTALS CX-7 “S” if special or custom design. *Other calibration fill in ppm. C=Ceramic Lid Blank=Glass Lid SM1 49 MHz SM1 SM2 SM3 Frequency ( 50 *Calibration Tolerance @25OC (A) (B) (C) / 50 / 100 / I ) *Frequency Total Frequency Temp. Range: Stability over Tolerance C = Commercial Temp. Range I = Industrial M = Military S = Specify 10155 - Rev A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de