TI EV2300 Evm interface board Datasheet

User's Guide
SLUU159C – February 2005 – Revised January 2012
EV2300 EVM Interface Board
This user's guide describes the function and operation of the EV2300 evaluation module. This guide
includes a complete description of the EV2300 EVM, as well as a bill of materials, and schematic.
1
2
3
Contents
Introduction .................................................................................................................. 2
Interfaces ..................................................................................................................... 2
EV2300 Bill of Materials, Component Placement, Schematic ........................................................ 6
List of Figures
...............................................................................................................
1
Board Layer 1
2
Solder Mask 1 ............................................................................................................... 9
8
3
Solder Mask 2 .............................................................................................................. 10
4
Board Layer 2 .............................................................................................................. 11
5
Component Placement 1 ................................................................................................. 12
6
Component Placement 2 ................................................................................................. 13
7
Internal Board Layer 1 .................................................................................................... 14
8
Internal Board Layer 2 .................................................................................................... 15
List of Tables
1
Ordering Information ........................................................................................................ 2
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EV2300 EVM Interface Board
1
Introduction
1
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Introduction
This EVM interface board enables an IBM-compatible or other type (with required driver for the particular
platform) PC to communicate with Texas Instruments SMBus, HDQ, or DQ interface gas gauges via a
Universal Serial Bus (USB) port. In addition to this board, PC software is required to interpret the gas
gauge data to complete the evaluation system.
1.1
Features
•
•
•
1.2
Kit Contents
•
•
1.3
Fully powered from the USB port
Capable of providing a 25-mA 3.3-V source
Complete interface between USB and SMBus, I2C, and HDQ (8/16) interfaces using a simple API
EV2300 circuit module
Standard USB cable
Ordering Information
Table 1. Ordering Information
EVM Part Number
EV2300
2
Interfaces
The EV2300 interfaces are described in the following table. The reference designators on the circuit board
and the functions are also listed.
Reference
Designator
HDQ and SMB
2
IC
USB
2
Function
SMBus, HDQ, and DQ Interface ports
2
Terminal block for connecting to a target device
E PROM I C Interface
Terminal for connecting to a target E2PROM or I2C interface
battery monitor
USB Interface
Interface to host computer
EV2300 EVM Interface Board
2
Function
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Interfaces
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2.1
Overview
The EV2300 is enclosed and is provided as shown.
2.2
EV2300 Controller
The EV2300 controller is a bq8012 running at 4 MHz. The controller firmware is stored in flash memory
and is executed by the core at power-up after the boot ROM code verifies the integrity words.
The controller communicates with target device(s) through either: a 2-wire SMBus communication port, a
1-wire HDQ port, or a 2-wire E2PROM I2C port. The 2-wire SMBus communication port supports both
SMBus and I2C protocols.
2.3
USB Interface (USB)
The interface board connects to a USB port (version 1.1) on a host computer and is powered from the
port. All communication over the USB is proprietary and does not fit any USB-defined device classes.
Therefore communication with the device requires a loader and driver from Texas Instruments.
The loader enumerates the device (determines it is present on the USB), then loads the EV2300 controller
firmware for the USB interface. Once the firmware load is complete, the loader sends a command to the
USB interface IC to execute the new program and the loader driver exits. A new driver takes control and
enumerates the EV2300 and makes the device present to programs running on the host.
The installer for the USB EVB installs:
1. A loader driver
2. A binary to load onto the USB interface IC
3. An EV2300 controller driver for direct access to the device
4. An EV2300 DLL for application access to the device
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EV2300 EVM Interface Board
3
Interfaces
2.4
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HDQ Interface (HDQ)
This interface allows a host computer to interact with a slave or target device through the two-wire SMBus
or the one-wire HDQ interfaces. The ports are labeled with the corresponding signal names above each
port connector. Connect the signal and a ground reference (GND), and optionally VOUT, to a target
device.
The two-wire interface supports SMBus version 1.1 byte, word, block transactions with and without PEC.
The SMBus limits the capacitance on each line (Data and Clock) to 100 pF. The EV2300 places 8 pF on
each line, so a device may place up to 92 pF total. If the capacitive load approaches or exceeds 100 pF,
SMBus communication may not be reliable.
2.5
Pin
Name
1
GND
Ground return/reference for HDQ interface
Description
2
VOUT
Controlled EEPROM power. Supplies 5 VDC to a target EEPROM IC
3
HDQ
HDQ one-wire interface. Pulled up to 3.3-V rail with a 10-kΩ resistor
4
VCC
Supplies 3.3 VDC to a target. Current load should be limited to 30 mA
I2C/EEPROM Interface (I2C)
This interface allows a host computer to interact with a target E2PROM or other I2C interface device such
as a battery monitor device through a two-wire I2C interface. The interface contains a controlled power pin,
the I2C clock and data lines, and a ground reference.
4
Pin
Name
1
GND
Ground return. Connected to the SMD and HDQ GND
2
SCL
I2C clock. This line must be pulled up by the target.
3
SDA
I2C data. This line must be pulled up by the target.
4
VOUT
EV2300 EVM Interface Board
Description
Controlled EEPROM power. Supplies 5 VDC to a target EEPROM IC
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Interfaces
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2.6
SMBus Interface (SMBus)
Pin
Name
1
GND
Description
2
SMBC
SMB clock pin. This pin is pulled to 3.3 VDC through a 10-kΩ resistor. Do not exceed 5.6 VDC on
this pin.
3
SMBD
SMB data pin. This pin is pulled to 3.3 VDC through a 10-kΩ resistor. Do not exceed 5.6 VDC on
this pin.
4
NC
Ground reference
Not connected on this board. This pin is floating.
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EV2300 EVM Interface Board
5
EV2300 Bill of Materials, Component Placement, Schematic
3
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EV2300 Bill of Materials, Component Placement, Schematic
This chapter includes the schematic, component placement on the circuit board, and a listing of the bill of
materials for the EV2300 EVM.
3.1
Bill of Materials (BOM)
10
C1-C7,
C10-C12,
C15, C20
Capacitor, ceramic, 0.1 µF, 25 V, X7R, 10%
603
0
C13
Open
603
2
C16, C21
Capacitor, POSCAP 4.7 µF, 35 V, 20%
1
C18
Capacitor, ceramic, 2200 pF, 50 V, C0G, 10%
1
C19
2
C8, C9
0
(2)
(3)
(4)
Description
(2) (3) (4)
Ref Des
(1)
6
(1)
Qty
Size
MFR
Part Number
TDK
C1608X7R1E104KT
6032 ©)
AVX
TAJC475K035R
603
TDK
C1608C0G1H222KT
Capacitor, ceramic, 150 pF, 50 V, C0G, 10%
603
TDK
C1608C0G1H151KT
Capacitor, ceramic, 22 pF, 50 V, C0G, 10%
603
TDK
C1608C0G1H220KT
D1-D7, D9,
D13-D15,
D17
Open
0.068 × 0.049
2
D12, D19
Diode, LED, green, 20 mA, 0.9 mcd
0.068 × 0.049 Panasonic
LN1371G-(TR)
1
D20
Diode, LED, red, 20 mA, 0.9 mcd
0.068 × 0.049 Panasonic
LN1271R-(TR)
3
D21-D23
Diode, dual, 250 mA, 70 V
SOT23
Vishay-Liteon
BAW56GS08
5
D8, D10,
D11, D16,
D18
Diode, low capacitance, TVS
SOT23
General Semi GL05T
1
J1
Connector, USB upstream (Type B)
0.47" × 0.67"
Molex
67068-1000
3
J13-J15
Header, friction lock assembly, 4-pin right angle
0.400 x 0.500
Molex
22-05-3041
1
J2
Header, 11 pin, 100 mil spacing, (36-pin strip)
121100
Sullins
PTC36SAAN
0
J3-J5,
J8-J11
Open
0.038"
1
J7
Header, 2 pin, 100 mil spacing, (36-pin strip)
0.100 × 2"
Sullins
PTC36SAAN
1
Q1
Transistor, NPN, high-performance, 500 mA
SOT23
Fairchild
MMBT2222A
1
Q2
MOSFET, P-ch, –12 V, 4 A, 51 mΩ
SOT23
Vishay
Si2335DS
4
R1, R14,
R16, R19
Resistor, chip, 10 kΩ, 1/16 W, 5%
603
Std
Std
12
R13, R15,
R21–R24,
R26, R27,
R45, R46,
R49, R50
Resistor, chip, 100 Ω, 1/16 W, 5%
603
Std
Std
3
R18, R42,
R43
Resistor, chip, 1 MΩ, 1/16 W, 1%
603
Std
Std
1
R2
Resistor, chip, 15 kΩ, 1/16 W, 5%
603
Std
Std
7
R3–R5,
R32–R34,
R39
Resistor, chip, 100 kΩ, 1/16 W, 5%
603
Std
Std
3
R30, R51,
R52
Resistor, chip, 620 Ω, 1/16 W, 5%
603
Std
Std
2
R31, R41
Resistor, chip, 10 Ω, 1/16 W, 5%
603
Std
Std
1
R35
Resistor, chip, 61.9 kΩ, 1/16 W, 1%
603
Std
Std
1
R53
Resistor, chip, 0 Ω, 1/16 W, 5%
603
Std
Std
Reference designators marked with an asterisk (*) cannot be substituted. All other components can be substituted with
equivalent manufacturers components.
These assemblies are ESD sensitive, ESD precautions should be observed.
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
EV2300 EVM Interface Board
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Qty
Ref Des
(1)
Description
(2) (3) (4)
Size
MFR
Part Number
1
R54
Resistor, chip, 113 kΩ, 1/16 W, 0.1%
603
Vishay
TNPW06031133BT9R
T1
1
R6
Resistor, chip, 1.5 kΩ, 1/16 W, 5%
603
Std
Std
0
R7,
R10-R12,
R17, R20,
R25, R28,
R36-R38,
R40
Open
603
2
R8, R9
Resistor, chip, 33 Ω, 1/16 W, 5%
603
Std
Std
0
SW1
Open
5 mm × 5 mm
2
U1, U2
IC, Single bus buffer gate with 3-state output, with
negative enable
DCK
TI
SN74LVC1G125DCK
1
U3
IC, Single bus buffer gate with 3-state output, with
positive enable
DCK
TI
SN74LVC1G126DCK
1
U4
IC, USB, general purpose, device controller
0.480 ×
0.480"
TI
TUSB3210PM
1
U5
IC, ultra low-power LDO regulator, 3.3 V, 50 mA
SOT23-5
TI
TPS77033DBV
1
U6
IC, Advance gas gauge
DBT38
TI
bq8015DBT
1
Y1 or Y4
Crystal, high performance, 12.00 MHz, SMT
0.126 × 0.126 Citizen or
Daishinku
CSA-309-12.000MABJ
or DSX630G-12.00
MHz
0
Y2 or Y3
Crystal, 32.768 MHz, 7-12 pF capacitance
1,9 mm × 5
mm
Daishinku or
ECS
DST520G-32.768kHz
or ECS-0.327-8-14
1
N/A
Plastic enclosure, bone, Texas Instruments
silkscreen
PacTec
84107-501-039
Wire Cable Assembly (5)
1
Mate
Connector, female, 0.100 centers
22-01-30 47
Molex
4
N/A
Terminals, crimp, tin
08-50-011 4
Molex
N/A
Wire, insulated 22 Awg, red, 18 inches (±3 inches)
(VOUT)
Any
Any
N/A
Wire, insulated 22 Awg, white, 18 inches (±3 inches)
(SCL)
Any
Any
N/A
Wire, insulated 22 Awg, black, 18 inches (±3 inches)
(GND)
Any
Any
N/A
Wire, insulated 22 Awg, brown, 18 inches (±3
inches) (SDA)
Any
Any
N/A
Heatshrink 1"
Any
Any
1
(5)
Make one EEPROM connector wire assembly for each assembly produced, from J15 mate, 4 - 22 AWG wires and crimp
terminals. Wire colors for pin numbers are listed below. Strip and tin flying leads 0.25 inches from end of wire.
Red - pin #4 (signal VOUT)
Brown - pin #3 (signal SDA)
White - pin #2 (signal SCL)
Black - pin #1 (GND)
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EV2300 Bill of Materials, Component Placement, Schematic
3.2
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EV2300 Component Placement
Figure 1. Board Layer 1
8
EV2300 EVM Interface Board
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EV2300 Bill of Materials, Component Placement, Schematic
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Figure 2. Solder Mask 1
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EV2300 Bill of Materials, Component Placement, Schematic
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Figure 3. Solder Mask 2
10
EV2300 EVM Interface Board
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Figure 4. Board Layer 2
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EV2300 Bill of Materials, Component Placement, Schematic
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Figure 5. Component Placement 1
12
EV2300 EVM Interface Board
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Figure 6. Component Placement 2
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EV2300 Bill of Materials, Component Placement, Schematic
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Figure 7. Internal Board Layer 1
14
EV2300 EVM Interface Board
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Figure 8. Internal Board Layer 2
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EV2300 EVM Interface Board
15
EV2300 Bill of Materials, Component Placement, Schematic
1
OUT
EN NC/FB
IN
4
5
EV2300 EVM Interface Board
GND
16
2
EV2300 Schematic
3
3.3
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+
+
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Revision History
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Revision History
Changes from A Revision (February 2005) to B Revision ............................................................................................. Page
•
•
Changed label ............................................................................................................................ 3
Changed HDQ Interface pin names .................................................................................................... 4
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from B Revision (December 2011) to C Revision ........................................................................................... Page
•
Added Schematic
.......................................................................................................................
16
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
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Revision History
17
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