Chip Resistor Array Chip Resistor Array Type: EXB1:0201x2 EXB2:0402x2, 0402x4, 0402x8 EXB3:0603x2, 0603x4 EXBV:0603x2, 0603x4 EXBS:0805x4 ■ Features ● High density 2 resistors in 0.8 mm × 0.6 mm size (14V, Convex Terminal) 2 resistors in 1.0 mm × 1.0 mm size (24V, Convex Terminal) 2 resistors in 1.6 mm × 1.6 mm size (34V, Convex Terminal) 2 resistors in 1.6 mm × 1.6 mm size (V4V, Concave Terminal) 4 resistors in 2.0 mm × 1.0 mm size (28V, Convex Terminal) 4 resistors in 3.2 mm × 1.6 mm size (38V, Convex Terminal) 4 resistors in 3.2 mm × 1.6 mm size (V8V, Concave Terminal) 4 resistors in 5.08 mm × 2.2 mm size (S8V, Concave Terminal) 8 resistors in 3.8 mm × 1.6 mm size (2HV, Convex Terminal) ● Improvement of placement efficiency Placement efficiency of Chip Resistor Array is two or four or eight times of the flat type chip resistor ● Approved under the ISO 9001 system ■ Explanation of Part Numbers E X B V ■ Construction (Example : EXBV8V) 8 V 4 7 2 J V ■ Schematics ● Isolated type 14V, 24V, 34V, V4V 28V, 38V, V8V, S8V 2 resistors 4 resistors 2HV 8 resistors Chip Resistor Array ■ Dimensions in mm (not to scale) V8V, S8V V4V 28V 38V 14V, 34V Surface Mount Resistors 24V 2HV Type (inches) L W T EXB14V (0201×2) Dimensions (mm) B fD 0.80 0.60 0.35 0.35 EXB24V (0402×2) 1.00±0.05 1.00±0.05 0.35±0.05 0.33±0.05 0.15±0.10 EXB28V (0402×4) 2.00±0.10 1.00±0.10 0.35±0.10 0.20±0.10 EXBV4V (0603×2) 1.60+0.20 Ð0.10 1.60+0.20 Ð0.10 0.60±0.10 EXB34V (0603×2) 1.60±0.20 1.60±0.15 EXBV8V (0603×4) 3.20+0.20 Ð0.10 EXB38V (0603×4) P E G ±0.10 0.50 Ñ 0.15±0.10 0.34±0.05 0.65±0.10 Ñ 0.25±0.05 0.20±0.10 Ñ 0.50±0.10 Ñ 0.25±0.10 0.60±0.10 0.30±0.15 (0.3) 0.80±0.10 0.45±0.10 0.40±0.15 0.50±0.10 0.45±0.15 (0.30±0.20) Ñ 0.80±0.15 Ñ 0.30±0.20 1.60+0.20 Ð0.10 0.60±0.10 0.60±0.10 0.30±0.15 (0.3) 0.80±0.10 0.45±0.10 0.45±0.15 3.20±0.20 1.60±0.15 0.50±0.10 0.45±0.15 (0.30±0.20) Ñ 0.80±0.15 Ñ 0.35±0.20 EXBS8V (0805×4) 5.08+0.20 Ð0.10 2.20+0.20 Ð0.10 0.70±0.20 0.80±0.15 0.50±0.15 (0.5) 1.27±0.20 0.70±0.20 0.55±0.15 EXB2HV (0402×8) 3.80±0.10 1.60±0.10 0.45±0.10 0.30±0.10 (0.30±0.10) Ñ 0.50±0.10 Ñ 0.30±0.10 ±0.10 ±0.10 A ±0.10 ±0.10 (0.15 ±0.10 ) Ñ ( ) Reference Chip Resistor Array ■ Ratings 10 Ω to 1 MΩ: E24 series Resistance Range ResistanceTolerance 14V,2HV,24V,28V,38V,34V J: ±5 % V4V,V8V,S8V G: ±2 %, J: ±5 % 14V,24V,V4V,34V 4 terminal Number of Terminal 28V,38V,V8V,S8V 8 terminal 16 terminal 2HV 14V,24V,V4V,34V 2 resistors Number of Resistors 28V,38V,V8V,S8V 4 resistors Power Rating at 70 ¡C Item Specifications 2HV 8 resistors 14V,28V 0.031 W/element 24V,V4V,34V,V8V,38V 0.063 W/element 0.1 W/element 0.063 W/element (0.25 W/package) S8V 2HV Specifications 14V Limiting Element Voltage(1) 2HV Max. Rated Continuous 24V,28V,38V,34V,V4V,V8V Working Voltage S8V 14V 2HV Max. Over-load Voltage(2) 24V,28V,38V,34V,V4V,V8V S8V 12.5 V 25 V 50 V 100 V 25 V 50 V 100 V 200 V T.C.R. ±200 ×10 Ð6/ûC(ppm/ûC) Category Temperature Range (Operating Temperature Range) Ð55 ûC to 125 ûC ( Jumper Array Item ) (A) R000 Rated Current (A) R000 Max. Overload Current 14V,2HV,24V,28V,38V,34V,V4V,V8V S8V 14V,2HV,24V,28V,38V,34V,V4V,V8V S8V 1A 2A 2A 4A (1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= √Power Rating × Resistance Value, or Limiting Element Voltage (max. RCWV) listed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 × Power Rating or max. Overload (Voltage) listed above whichever less. Power Derating Curve For resistors operated in ambient temperature above 70 ¡C, power rating shall be derated in accordance with the right figure. ■ Packaging Methods ● Standard Quantity Type (inches) EXB14V (0201×2) EXB24V, 28V (0402×2, 0402×4) EXBV4V, V8V (0603×2, 0603×4) EXB34V, 38V (0603×2, 0603×4) EXBS8V (0805×4) EXB2HV (0402×8) Thickness (mm) Weight/1000 pcs. (g) Punched (Paper) Taping Embossed Taping 10000 pcs./reel Ñ 10000 pcs./reel Ñ 0.35 14V: 0.5 0.35 24V: 1.2 28V: 0.6 V4V: 5 V8V: 10 5000 pcs./reel Ñ 0.5 34V: 3.5 38V: 5000 pcs./reel Ñ 0.7 S8V: 30 Ñ 2500 pcs./reel 0.45 2HV: 9 5000 pcs./reel Ñ 2 7 Chip Resistor Array ● Punched (Paper) Taping Reel fA 0 180.0Ð3.0 Type 14V, 2HV Dimensions 24V, 28V (mm) V4V, 34V V8V, 38V fB fC 60 min. 13.0±1.0 W Type 14V 24V 28V Dimensions V4V (mm) 34V V8V 38V 2HV 11.4±2.0 Dimensions Type (mm) S8V fA 0 180.0 Ð3.0 W 13.0±1.0 W F E 1.95 ±0.15 1.95 ±0.20 8.00 ±0.20 3.50 ±0.05 1.75 ±0.10 2.00 ±0.15 3.60 ±0.20 1.90 ±0.15 4.10 ±0.15 P0 fD0 T 1.20 ±0.05 P2 0.45 ±0.05 2.00 ±0.05 4.00 ±0.10 1.50 +0.10 0 0.84 ±0.05 0.64 ±0.05 0.84 ±0.05 0.64 ±0.05 ● Embossed Taping ● Embossed Taping Reel Dimensions Type (mm) S8V B 0.90 ±0.05 1.20 ±0.05 2.20±0.10 Type P1 14V 24V 2.00 ±0.10 28V Dimensions V4V (mm) 34V V8V 4.00 ±0.10 38V 2HV T 9.0±1.0 A 0.70 ±0.05 fB 60 min. A B W F E P0 Dimensions Type S8V 2.80 ±0.20 5.70±0.20 12.00±0.30 5.50 ±0.05 1.75 ±0.10 4.00±0.10 (mm) fC 13.0±1.0 P1 Dimensions Type (mm) S8V 4.00±0.10 T 15.4±2.0 P2 2.00 ±0.05 fD0 t2 fD1 1.50 +0.10 1.6 max. 1.50 +0.10 0 0 ■ Land pattern design Recommendable land pattern design for Network chip is as shown below figure. Type (Not to scale) Unit (mm) Dimensions a b c p f 14V 0.3 0.3 0.3 0.50 0.9 24V 0.5 0.65 1.4 to 1.5 28V 0.4 0.50 1.4 0.35 to 0.40 0.35 to 0.40 0.525 0.25 V4V,V8V 0.7 to 0.9 0.4 to 0.45 0.4 to 0.45 0.80 2 to 2.4 34V,38V 0.7 to 0.9 0.4 to 0.5 0.80 2.2 to 2.6 0.5 to 0.75 0.5 to 0.75 1.27 3.2 to 3.8 0.50 2 S8V 1 to 1.2 2HV 1 0.4 to 0.5 0.425 0.25 Surface Mount Resistors Type 14V, 2HV Dimensions 24V, 28V (mm) V4V, 34V V8V, 38V ● Punched (Paper) Taping Chip Resistor Array Cautions for Safety 1. Component Placement A Take measure against mechanical stress during and after mounting so as not to damage the termination and protective coating. B Misplacement of components on the land pattern may cause solder bridge problem. 2. Soldering Precaution and recommondations are described below. (a)Soldering iron Keep the followings: A Soldering iron tip shall not touch the protective coating of the part. B Solder as quick as possible (within 3 seconds) when the temperature of the soldering iron tip is over 280 ¡C. (b)Reflow soldering Recommendable reflow soldering is shown right. 3. Cleaning Recommendable cleaning method is shown below. Solvents Isopropyl Alcohol Cleaning condition Ultrasonic wave washing 1 minute maxium 5 minutes Power: 20 W/L maximum Frequency: 10 kHz to 100 kHz Dipping [ ] 4. If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and confirmation test with the resistors actually mounted on your own board. When the load of more than rated power is applied under the load condition at steady state, it may impair performance and/or reliability of resistor. Never exceed the rated power. 5. Chlorine type or other high-activity flux is not recommeded as the residue may affect performance or reliability of resistors. 6. When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. When using a soldering iron with a tip at high temperature, solder for a time as short as possible (three seconds or less up to 350 ¡C). 7. Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage protective film or the body of resistor and may affect resistorÕs performance. 8. Do not use the product in dewy atmospheres.