Rohm BD9328EFJ-E2 Simple step-down switching regulator with built-in power mosfet Datasheet

Single-chip Type with Built-in FET Switching Regulators
Simple Step-down
Switching Regulator
with Built-in Power MOSFET
BD9328EFJ
No.11027EAT55
●Description
The BD9328EFJ is a synchronous step-down switching regulator that integrates 2 low resistance N-channel MOSFETs.
It achieves 2A continuous output current over a wide input supply range.
Current mode operation provides fast transient response and easy phase compensation.
●Features
1) Wide operating INPUT Range 4.2V～18.0V
2) 2A Output Current
3) Hi-side / Lo-side FET ON-resistance; 0.15 / 0.13Ω Power Switch
4) Low ESR Output Ceramic Capacitors are Available
5) Low Standby Current during Shutdown Mode
6) 380 kHz Fixed Operating Frequency
7) Feedback voltage 0.9V ±1.5% Accuracy at room temp. (±2.0% guaranteed for -25℃ to 85℃ temperature range)
8) Protection Circuits
Under Voltage Lockout Protection
Thermal Shutdown
Over Current Protection
9) HTSOP-J8 Package with Exposed thermal PAD.
●Applications
Distributed Power System
Pre-Regulator for Linear Regulator
●Absolute maximum ratings (Ta = 25℃)
Parameter
Symbol
Ratings
Unit
Supply Voltage
VIN
20
V
Switch Voltage
VSW
20
V
Power Dissipation for HTSOP-J8
Pd
3760 *1
mW
Package thermal resistance θja *2
θja
29.27
℃/W
Package thermal resistance θjc *2
θjc
3.75
℃/W
Operating Temperature Range
Topr
-40～+85
℃
Storage Temperature Range
Tstg
-55～+150
℃
Tjmax
150
℃
BST Voltage
VBST
VSW+7
V
EN Voltage
VEN
20
V
All other pins
VOTH
20
V
Junction Temperature
*1 Derating in done 30.08 mW/℃ for operating above Ta≧25℃(Mount on 4-layer 70.0mm×70.0mm×1.6mm board)
*2 Mount on 4-layer 50mm x 30mm x 1.6mm application board
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1/15
2011.02 - Rev.A
Technical Note
BD9328EFJ
●Operation Range (Ta= -40～85℃)
Parameter
Symbol
Ratings
Min
Typ
Max
Unit
Supply Voltage
VIN
4.2
12
18
V
SW Voltage
VSW
-0.5
-
18
V
Output current
ISW3
-
-
2
A
VRANGE
0.9
-
VIN x 0.7
V
Output voltage range
●Electrical characteristics (Unless otherwise specified VIN=12V Ta=25℃)
Limits
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Error amplifier block
FB input bias current
IFB
-
0.02
2
µA
Feedback voltage1
VFB1
0.886
0.900
0.914
V
Voltage follower
Feedback voltage2
VFB2
0.882
0.900
0.918
V
Ta=-25℃～85℃
Hi-side FET On-resistance
RONH
-
0.15
-
Ω
ISW= -0.8A
Lo-side FET On-resistance
RONL
-
0.13
-
Ω
ISW= 0.8A
Hi/Lo-side FET Leak current
ILEAKN
-
0
10
µA
VIN= 18V,
VSW = 0V / 18V
Switch Current Limit
ILIMIT3
3
-
-
A
Maximum duty cycle
MDUTY
-
90
-
%
VFB= 0V
Enable Sink current
IEN
90
180
270
µA
VEN= 12V
Enable Threshold voltage
VEN
1.0
1.2
1.4
V
Under Voltage Lockout threshold
VUVLO
3.5
3.75
4.0
V
Under Voltage Lockout Hysteresis
VHYS
-
0.3
-
V
Soft Start Current
ISS
5
10
15
µA
VSS= 0 V
Soft Start Time
TSS
-
22
-
ms
CSS= 0.1 µF
FOSC
300
380
460
kHz
Circuit Current
ICC
-
1.2
3
mA
VFB= 1.5V, VEN= 12V
Quiescent Current
IQUI
-
15
27
µA
VEN= 0V
SW block – SW
General
Operating Frequency
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
2/15
VIN rising
2011.02 - Rev.A
Technical Note
BD9328EFJ
●Block Diagram
VIN
EN
5V
OSC
VREF
VREG
BST
12V
OCP
VIN
UVLO
IBIAS
FB
TSD
LVS
S
DRV
+
+ ERR
-
COMP
SLOPE
LOGIC
R
+
PWM
－
OUTPUT
SW
LVS
SS
Soft Start
GND
Fig.1 Block Diagram
●Typical Application Circuit
C_PC
3300pF
R_PC
7.5kΩ
R_DW
10kΩ
R_UP
27kΩ
FB
COMP
EN
SS
C_SS
0.1μF
Thermal Pad
GND
SW
VIN
BST
(to be shorted to GND)
VIN 12V
VOUT 3.3V
C_CO1
20μF
C_BS
0.1μF
10µH
R_BS
22Ω
C_VC1
10μF
L
※R_BS protect from VIN-BST short destruction.
Fig.2 Application Circuit
Symbol
Maker
Part No
Input capacitor
C_VC1
TDK
C3225JB1E106K
10µF/25V
Output capacitor
C_CO1
TDK
C3216JB1C106M
10µF/16V
Inductor
L
TDK
SLF10165-100M3R8
10µH/3.8A
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
3/15
2011.02 - Rev.A
Technical Note
BD9328EFJ
●Block Operation
・VREG
A block to generate constant-voltage for DC/DC boosting.
・VREF
A block that generates internal reference voltage of 5.1 V (Typ.).
・TSD/UVLO
TSD (Thermal shutdown)/UVLO (Under Voltage Lockout) protection block.
The TSD circuit shuts down IC at high temperature.
The UVLO circuit shuts down the IC when the VCC is Low Voltage.
・Error amp block (ERR)
This is the circuit to compare the reference voltage and the feedback voltage of output voltage. The COMP pin voltage
resulting from this comparison determines the switching duty. At the time of startup, since the soft start is operated by
the SS pin voltage, the COMP pin voltage is limited to the SS pin voltage.
・Oscillator block (OSC)
This block generates the oscillating frequency.
・SLOPE block
This block generates the triangular waveform from the clock created by OSC. Generated triangular waveform is sent to
the PWM comparator.
・PWM block
The COMP pin voltage output by the error amp is compared to the SLOPE block's triangular waveform to determine the
switching duty. Since the switching duty is limited by the maximum duty ratio which is determined internally, it does not
become 100%.
・DRV block
A DC/DC driver block. A signal from the PWM is input to drive the power FETs.
・Soft start circuit
Since the output voltage rises gradually while restricting the current at the time of startup, it is possible to prevent the
output voltage overshoot or the rush current.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
4/15
2011.02 - Rev.A
Technical Note
BD9328EFJ
●Outward form
4.9±0.1
(Max5.25 include.BURR)
+6°
-4°
(3.2)
5
7
6
2
4
3
1PIN MARK
0.545
1
0.65±0.15
1.05±0.2
(2.4)
6.0±0.2
3.9±0.1
8
+0.05
+0.05
-0.03
0.17 -0.03
0.08±0.08
0.85±0.05
1.0MAX
S
+0.05
0.42 -0.04
1.27
0.08
0.08
M
S
Fig.3 HTSOP-J8 Package
(Unit:mm)
●Pin Assignment and Pin Function
Pin No.
Pin name
1
BST
High-Side Gate Drive Boost Input
2
VIN
Power Input
3
SW
Power Switching Output
4
GND
5
FB
6
COMP
7
EN
Enable Input
8
SS
Soft Start Control Input
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
Function
Ground
Feed Back Input
Compensation Node
5/15
2011.02 - Rev.A
Technical Note
BD9328EFJ
●Typical Performance Characteristics (Unless otherwise specified, VIN= 12V Ta = 25℃)
1.6
0.01
32
28
1.4
0.005
24
1
IFB (uA)
20
ICC (uA)
ICC (mA)
1.2
16
0
12
0.8
-0.005
8
0.6
4
0.4
-0.01
0
3
6
9
12
15
18
4
6
8
10
VIN (V)
12
14
16
0
18
0.4
0.8
Fig.5 Stand by current
(IC not active)
Fig.4 Circuit Current
(No switching)
0.92
0.26
0.91
0.22
1.2
1.6
2
2.4
VFB (V)
VIN (V)
Fig.6 Input Bias Current
370
0.90
FOSC (kHz)
RON [Ω]
Feedback Voltage[V]
365
0.18
360
355
350
0.14
0.89
345
0.88
-40
-20
0
20
40
60
80
0.1
-40
-20
0
20
40
60
340
-40
80
TEMP[℃]
Fig.7 Feedback voltage
-20
0
20
40
60
80
TEMP (°C)
TEMP[°C]
Fig.8 Hi,Low-Side
On-resistance
Fig.9 Operating Frequency
95
1000
Vout
90
Efficiency[%]
80
Soft start time[ms]
85
SS
75
70
SW
65
100
10
60
Iout
55
1
50
0
500
1000
1500
2000
2500
0.01
3000
Io[mA]
Fig.10 STEP Down Efficiency
(VIN= 12V VOUT= 3.3V L=10µH)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
0.1
1
Css[uF]
Fig.11 OverCurrent
Protection
6/15
Fig.12 Soft Start Time
2011.02 - Rev.A
Technical Note
BD9328EFJ
VOUT-MAX: +48mV
VOUT
Δ: 25.2 mV
VOUT
VOUT: 20.0 mV / Div
VOUT-MIN: -50m V
VOUT: 50 mV / Div
IOUT
IOUT: 1.0 A / Div
IOUT
IOUT: 1.0 A / Div
Fig.13 Transient Response
Fig.14 Output Ripple Voltage
(VIN= 12V VOUT= 3.3V L= 10µH Cout =20µF Iout= 0.2-1.0A )
(VIN= 12V VOUT= 3.3V L= 10µH Cout =20µF I out= 1.0A )
VOUT-MAX: +100mV
VOUT
VOUT
Δ:25.6 mV
VOUT: 20.0 mV / Div
VOUT-MIN: -100mV
VOUT: 100 mV / Div
IOUT
IOUT
IOUT: 1.0 A / Div
IOUT: 1.0 A / Div
Fig.15 Transient Response
Fig.16 Output Ripple Voltage
(VIN= 12V VOUT= 3.3V L= 10µH Cout =20µF Iout= 0.2-2.0A)
(VIN= 12V VOUT= 3.3V L= 10µH Cout =20µF I out= 2.0A )
EN
EN: 10V / Div
TSS
22ms
VOUT
VOUT: 1.0V / Div
IOUT
Fig.17 Start Up waveform
(VIN= 12V VOUT= 3.3V L= 10µH CSS= 0.1µF)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
7/15
2011.02 - Rev.A
Technical Note
BD9328EFJ
●Selecting Application Components
(1) Output LC filter constant selection (Buck Converter)
The Output LC filter is required to supply constant current to the output load. A larger value inductance at this filter
results in less inductor ripple current(∆IL) and less output ripple voltage. However, the larger value inductors tend to
have less fast load transient-response, a larger physical size, a lower saturation current and higher series resistance. A
smaller value inductance has almost opposite characteristics above. So Choosing the Inductor ripple current(∆IL)
between 20 to 40% of the averaged inductor current (equivalent to the output load current) is a good compromise.
IOUTMAX + IL /2
should not reach
the rated value level
IL
VIN
VOUT
ILR
L
Inductor averaged current
COUT
t
Fig.18
Fig.19
Setting ∆IL = 30% x Averaged Inductor current (2A) = 0.6 [A]
L=
VOUT  (VIN - VOUT) x
1
VIN x FOSC x ∆IL
= 10µ [H]
Where VIN= 12V, VOUT= 3.3V, FOSC= 380 kHz,
; FOSC is a switching frequency
Also the inductor should have the higher saturation current than IOUTMAX + ∆IL / 2.
The output capacitor COUT affects the output ripple-voltage. Choose the large capacitor to achieve the small
ripple-voltage enough to meet the application requirement.
Output ripple voltage ∆VRPL is calculated by the following equation.
1
∆IL  ( RESR +
) [V]
∆VRPL =
8x COUT x FOSC
Where RESR is a parasitic series resistance in output capacitor.
Setting COUT = 20µF, RESR = 10mΩ
∆VRPL = 0.6 x (10m + 1 / (8 x 20µ x 380k)) = 15.8mV
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
8/15
2011.02 - Rev.A
Technical Note
BD9328EFJ
(2) Loop Compensation
Choosing compensation capacitor CCMP and resistor RCMP
The current-mode buck converter has 2-poles and 1-zero system. Choosing the compensation resistor and capacitor is
important for a good load-transient response and good stability.
The example of DC/DC converter application bode plot is shown below.
The compensation resistor RCMP will decides the cross over frequency FCRS (the frequency that the total DC-DC
loop-gain falls to 0dB).
Setting the higher cross over frequency achieves good response speed, however less stability. While setting the lower
cross over frequency shows good stability but worse response speed.
The 1/10 of switching frequency for the cross over frequency shows a good performance at most applications.
( i ) Choosing phase compensation resistor RCMP
The compensation resistor RCMP can be on following formula.
2πx VOUT x FCRS x COUT
VFB x GMP x GMA
RCMP =
[Ω]
Where
VOUT; Output voltage, FCRS; Cross over frequency, COUT; Output Capacitor,
VFB; internal feedback voltage (0.9V(TYP)), GMP ; Current Sense Gain (7.8A/V(TYP)) ,
GMA ; Error Amplifier Trans-conductance (300µA/V(TYP))
Setting VOUT= 3.3V, FCRS= 38kHz, COUT= 20µF;
2πx 3.3 x 38k x 20u
0.9 x 7.8 x 300u
RCMP =
=
7.48k ~= 7.5k
[Ω]
( ii ) Choosing phase compensation capacitor CCMP
For the stability of DC/DC converter, canceling the phase delay that derives from output capacitor COUT and
resistive load ROUT by inserting the phase advance.
The phase advance can be added by the zero on compensation resistor RCMP and capacitor CCMP.
Making Fz= FCRS / 6 gives a first-order estimate of CCMP.
Compensation Capacitor
CCMP=
1
2π x RCMP x Fz
[F]
CCMP=
1
2π x 7.5k x 6.3k
=
Setting Fz= FCRS/6 = 6.3kHz;
Compensation Capacitor
3.54n ~= 3.3n
[F]
( iii ) The condition of the loop compensation stability
The stability of DC/DC converter is important. To secure the operating stability, please check the loop compensation
has the enough phase-margin. For the condition of loop compensation stability, the phase-delay must be less than
150 degree where Gain is 0 dB.
Feed forward capacitor CRUP boosts phase margin over a limited frequency range and is sometimes used to
improve loop response. CRUP will be more effective if RUP >> RUP||RDW
V OUT
A
(a)
Gain [dB]
R UP
C RUP
FB
R DW
－
GBW(b)
COMP
0
＋
R CMP
0.9V
C CMP
PHASE
－90
F
FCRS
0
－90°
PHASE MARGIN
－180°
－180
Fig.20
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
Fig.21
9/15
F
2011.02 - Rev.A
Technical Note
BD9328EFJ
(3) Design of Feedback Resistance constant
Set the feedback resistance as shown below.
0.9V
VOUT =
VOUT
+
R1
R1 + R2
R2
 0.9
[V]
ERR
－
FB
R2
Fig.22
●Soft Start Function
ERRAMP
↓
COMP
ISS 10µA
SS
+
+
CSS
-
An adjustable soft-start function to prevent high inrush current
during start-up is available.
The soft-start time is set by the external capacitor connected to
SS pin.
The soft start time is given by;
TSS [s] = 2.2 x Css /
ISS
Setting CSS= 0.1µF;
TSS= 2.2 x 0.1µ / 10µ = 22 [ms]
Please confirm the overshoot of the output voltage and inrush
current when deciding the SS capacitor value.
Fig.23
●EN Function
VIN
EN
The EN terminal control IC’s shut down.
Leaving EN terminal open makes IC shutdown.
To start the IC, EN terminal should be connected to VIN or the
other power source output.
When the EN voltage exceed 1.2V (typ.), the IC start
operating.
66 kΩ(typ.)
91 kΩ(typ.)
REN
EN
ON/OFF
Signal
(Attention)
Chattering happens if standing lowering speed is slow
when standing of EN pin is lowered.
The reverse current in which the input side and the
pressure operation are done from the output side is
generated when chattering operates with the output
voltage remained, and there is a case to destruction.
Please set to stand within 100us when you control
ON/OFF by the EN signal.
This necessity doesn't exist when EN pin is connected
with VIN and EN is not controlled.
The control by open drain MOSFET shown in a left chart
is recommended.
Fig.24
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
10/15
2011.02 - Rev.A
Technical Note
BD9328EFJ
●Layout Pattern Consideration
Two high pulsing current flowing loops exist in the buck regulator system. The first loop, when FET is ON, starts from the
input capacitors, to the VIN terminal, to the SW terminal, to the inductor, to the output capacitors, and then returns to the
input capacitor through GND. The second loop, when FET is OFF, starts from the low FET, to the inductor, to the output
capacitor, and then returns to the low FET through GND. To reduce the noise and improve the efficiency, please minimize
these two loop area. Especially input capacitor, output capacitor and low FET should be connected to GND plain.
PCB Layout may affect the thermal performance, noise and efficiency greatly. So please take extra care when designing
PCB Layout patterns.
L
VIN
CIN
FET
VOUT
COUT
Fig.25 Current loop in Buck regulator system
・The thermal Pad on the back side of IC has the great thermal conduction to the chip. So using the GND plain as broad and
wide as possible can help thermal dissipation. And a lot of thermal via for helping the spread of heat to the different layer is
also effective.
・The input capacitors should be connected as close as possible to the VIN terminal.
・Keep sensitive signal traces such as trace connected FB and COMP away from SW pin.
・The inductor and the output capacitors should be placed close to SW pin as much as possible.
CIN
L
BST
SS
VIN
EN
SW
COMP
GND
FB
COUT
VOUT
Fig.26 The example of PCB layout pattern
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
11/15
2011.02 - Rev.A
Technical Note
BD9328EFJ
●I/O Equivalent Circuit Diagram
1.BST
3.SW
VIN
5.FB
VIN
VIN
REG
SW
6.COMP
VIN
EF
7.EN
8.SS
VIN
VIN
VIN
POWER DISSIPATION: PD [mW]
●Power Dissipation
4000
(4)3760mW
HTSOP-J8 Package
On 70  70  1.6 mm glass epoxy PCB
(3)2110mW
(1) 1-layer board (Backside copper foil area 0 mm 0 mm)
(2) 2-layer board (Backside copper foil area 15 mm  15 mm)
(3) 2-layer board (Backside copper foil area 70 mm  70 mm)
(4) 4-layer board (Backside copper foil area 70 mm  70 mm)
3000
2000
(2)1100mW
1000
(1)820mW
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta [°C]
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
12/15
2011.02 - Rev.A
Technical Note
BD9328EFJ
●Notes for use
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may
result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such
damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special
mode where the absolute maximum ratings may be exceeded is anticipated.
2) GND potential
Ensure a minimum GND pin potential in all operating conditions.
3) Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Pin short and mistake fitting
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by the
presence of a foreign object may result in damage to the IC.
5) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.
6) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure,
and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process.
7) Ground wiring patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring patterns of any external components.
8) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of
parasitic elements.
For example, when the resistors and transistors are connected to the pins as shown in Fig.27 , a parasitic diode or a
transistor operates by inverting the pin voltage and GND voltage.
The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result
of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC
malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will
trigger the operation of parasitic elements such as by the application of voltages lower than the GND (P substrate) voltage
to input and output pins.
Resistor
Transistor (NPN)
B
～
～
B
E
～
～
C
(Pin B)
(Pin B)
～
～
(Pin A)
GND
P+
N
N
P
N
N
N
Parasitic
elements
P+
N
(Pin A)
P substrate
Parasitic elements
GND
P
～
～
P+
Parasitic elements
E
GND
N
P
P+
C
Parasitic
elements
GND
GND
Fig.27 Example of a Simple Monolithic IC Architecture
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
13/15
2011.02 - Rev.A
Technical Note
BD9328EFJ
9) Overcurrent protection circuits
An overcurrent protection circuit designed according to the output current is incorporated for the prevention of IC damage
that may result in the event of load shorting. This protection circuit is effective in preventing damage due to sudden and
unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or
transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capacity has negative
characteristics to temperatures.
10) Thermal shutdown circuit (TSD)
This IC incorporates a built-in TSD circuit for the protection from thermal destruction. The IC should be used within the
specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power
dissipation limits, the attendant rise in the chip's junction temperature Tj will trigger the TSD circuit to turn off all output
power elements. Operation of the TSD circuit presumes that the
IC's absolute maximum ratings have been exceeded. Application designs should never make use of the TSD circuit.
11) Testing on application boards
At the time of inspection of the installation boards, when the capacitor is connected to the pin with low impedance, be sure
to discharge electricity per process because it may load stresses to the IC. Always turn the IC's power supply off before
connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as
an antistatic measure, and use similar caution when transporting or storing the IC.
12) EN control speed
Chattering happens if standing lowering speed is slow when standing of EN pin is lowered. The reverse current in which
the input side and the pressure operation are done from the output side is generated when chattering operates with the
output voltage remained, and there is a case to destruction. Please set to stand within 100us when you control ON/OFF by
the EN signal.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
14/15
2011.02 - Rev.A
Technical Note
BD9328EFJ
●Ordering part number
B
D
9
Part No.
3
2
8
E
Part No.
F
J
Package
EFJ: HTSOP-J8
-
E
2
Packaging and forming specification
E2: Embossed tape and reel
HTSOP-J8
<Tape and Reel information>
+6°
4°
−4°
(2.4)
3.9±0.1
6.0±0.2
8 7 6 5
1
1.05±0.2
(3.2)
0.65±0.15
4.9±0.1
(MAX 5.25 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
2 3 4
1PIN MARK
+0.05
0.17 -0.03
1.0MAX
0.545
S
0.08±0.08
0.85±0.05
1.27
+0.05
0.42 -0.04
0.08
M
0.08 S
1pin
Reel
(Unit : mm)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
15/15
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2011.02 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
R1120A