EIC4953-8 4.90-5.30 GHz 8-Watt Internally Matched Power FET ISSUED 02/28/2008 FEATURES • • • • • • • 4.90–5.30GHz Bandwidth Input/Output Impedance Matched to 50 Ohms +39.5 dBm Output Power at 1dB Compression 10.5 dB Power Gain at 1dB Compression 35% Power Added Efficiency -46 dBc IM3 at PO = 28.5 dBm SCL 100% Tested for DC, RF, and RTH Caution! ESD sensitive device. ELECTRICAL CHARACTERISTICS (Ta = 25°C) PARAMETERS/TEST CONDITIONS1 SYMBOL P1dB G1dB ∆G PAE Output Power at 1dB Compression f = 4.90-5.30GHz VDS = 10 V, IDSQ ≈ 2200mA Gain at 1dB Compression f = 4.90-5.30GHz VDS = 10 V, IDSQ ≈ 2200mA Gain Flatness f = 4.90-5.30GHz VDS = 10 V, IDSQ ≈ 2200mA Power Added Efficiency at 1dB Compression f = 4.90-5.30GHz VDS = 10 V, IDSQ ≈ 2200mA Id1dB Drain Current at 1dB Compression IM3 Output 3rd Order Intermodulation Distortion ∆f=10MHz 2-Tone Test. Pout=28.5 dBm S.C.L Vds = 10 V, IDSQ ≈ 65% IDSS f = 5.30GHz IDSS Saturated Drain Current VP Pinch-off Voltage RTH Thermal Resistance3 MIN TYP MAX UNITS 38.5 39.5 dBm 9.5 10.5 dB ±0.6 dB 35 f = 4.90-5.30GHz % 2300 -43 2600 mA dBc -46 VDS = 3 V, VGS = 0 V 4000 5000 mA VDS = 3 V, IDS = 40 mA -2.5 -4.0 V 3.5 4.0 Note: 1. Tested with 100 Ohm gate resistor. 2. S.C.L. = Single Carrier Level. o C/W 3. Overall Rth depends on case mounting. ABSOLUTE MAXIMUM RATING1,2 SYMBOLS Vds Vgs Igsf Igsr Pin Tch Tstg Pt PARAMETERS ABSOLUTE1 CONTINUOUS2 Drain-Source Voltage 15 10V Gate-Source Voltage -5 -4.5V Forward Gate Current 86.4mA 28.8mA Reverse Gate Current -14.4mA -4.8mA Input Power 38.5dBm @ 3dB Compression Channel Temperature 175 oC 175 oC Storage Temperature -65 to +175 oC -65 to +175 oC Total Power Dissipation 38W 38W Note: 1. Exceeding any of the above ratings may result in permanent damage. 2. Exceeding any of the above ratings may reduce MTTF below design goals. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com page 1 of 2 Revised February 2008 EIC4953-8 4.90-5.30 GHz 8-Watt Internally Matched Power FET ISSUED 02/28/2008 PACKAGES OUTLINE Dimensions in inches, Tolerance + .005 unless otherwise specified EIC4953-8 (Hermetic) Excelics EIC4953-8NH (Non-Hermetic) Excelics .024 EIC4953-8 .827±.010 .669 EIC4953-8NH .421 .120 MIN .120 MIN YYWW YYWW SN SN .004 .125 .063 .508±.008 .442 .004 .168±.010 .105±.008 ALL DIMENSIONS IN INCHES ALL DIMENSIONS IN INCHES Caution! ESD sensitive device. Caution! ESD sensitive device. ORDERING INFORMATION Part Number Packages Grade1 fTest (GHz) P1dB (min) IM3 (min)2 EIC4953-8 Hermetic Industrial 4.90-5.30GHz 38.5 -43 EIC4953-8NH Non-Hermetic Industrial 4.90-5.30GHz 38.5 -43 Notes: 1. Contact factory for military and hi-rel grades. 2. Exact test conditions are specified in “Electrical Characteristics” table. DISCLAIMER EXCELICS SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. EXCELICS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN. LIFE SUPPORT POLICY EXCELICS SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF EXCELICS SEMICONDUCTOR, INC. AS HERE IN: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com page 2 of 2 Revised February 2008