Rohm BU3087FV-E Built in vcxo,spread-spectrum clock generator Datasheet

Datasheet
Built in VCXO,
Spread-Spectrum Clock Generator
BU3087FV
●Description
BU3087FV has built in VCXO that is necessary for the
Digital-TV signal reception.
Connecting 27MHz crystal oscillator generates clock
signals to 74.25MHz for Hi-Vision.
BU3087FV has built in Spread-Spectrum function too.
●Key Specifications
„ Crystal Pullability
„ Modulation Frequency
„ Cycle-to-Cycle Jitter
„ Operating Current
„ Operating Temperature
●Features
„ 3225 size crystal is usable
„ ON / OFF of Spread-Spectrum is selectable
„ Four kinds of Modulation-Rate is selectable
（±0.25% / ±0.50% / ±0.75% / ±1.00%）
„ Triangular Modulation
±105ppm (Typ.)
34.5kHz (Typ.)
180psec (Typ.)
45mA (Typ.)
-10℃ to +75℃
(Typ.)
(Typ.)
(Max.)
5.00mm x 6.40mm x 1.35mm
●Package
SSOP-B16
●Applications
Digital-TV, STB, TV-Tuner
SSOP-B16
●Typical Application Circuit
3.3V (Typ.)
CL
27MHz Crystal
CL
RD
XOUT
XIN
0.1μF
0.1μF
AVDD1
PDB
AVSS1
CLKOUT
VCTRL
VDD
AVDD2
VSS
AVSS2
SSON
MODSEL1
TEST
MODSEL2
CLK27M
0.1μF
Figure 1. Typical Application Circuit
(Caution) CL and RD in Typical Application Circuit should be optimized as to using crystal and board condition.
○Product structure：Silicon monolithic integrated circuit
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product is not designed protection against radioactive rays
1/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Block Diagram
7:MODSEL1
with Pull-up
8:MODSEL2
with Pull-down
Control
Logic
11:SSON
with Pull-up
Spread-Spectrum
10:TEST
with Pull-down
14:CLKOUT
PLL
15:PDB
with Pull-up
4:VCTRL
1:XIN
9:CLK27M
VCXO
16:XOUT
Figure 2. Block Diagram
●Pin Configuration
1
XIN
2
XOUT
16
AVDD1
PDB
15
3
AVSS1
CLKOUT
14
4
VCTRL
VDD
14
5
AVDD2
VSS
12
6
AVSS2
SSON
11
7
MODSEL1
TEST
10
8
MODSEL2
CLK27M
9
Figure 3.Pin Configuration (TOP VIEW)
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
2/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Pin Function
PIN No.
PIN Name
Function
1
XIN
2
AVDD1
Power supply for VCXO
3
AVSS1
GND for VCXO
4
VCTRL
VCXO control input terminal
5
AVDD2
Power supply for PLL-Analog
6
AVSS2
GND for PLL-Analog
7
MODSEL1
8
MODSEL2
9
CLK27M
10
TEST
Test terminal, with pull-down
11
SSON
Spread-Spectrum ON／OFF choice（H：ON、L：OFF）, with pull-up
12
VSS
GND for PLL-Digital
13
VDD
Power supply for PLL-Digital
14
CLKOUT
15
PDB
16
XOUT
Crystal Input terminal
Spread-Spectrum Modulation control terminal
(Refer to Table of Spread-Spectrum Modulation)
with pull-up
Spread-Spectrum Modulation control terminal
(Refer to Table of Spread-Spectrum Modulation)
with pull-down
27.000000MHz Output
74.250000MHz Output
Power-down control terminal, with pull-up
Crystal Output terminal
●Table of Spread-Spectrum Modulation（1Pin_XIN input frequency =27.000000MHz）
In the case of 11Pin_SSON=H, outputs it according to the following table.
MODSEL2
MODSEL1
CLKOUT
L
L
74.250000MHz ±0.25% Modulation
L
H
74.250000MHz ±0.50% Modulation
H
L
74.250000MHz ±0.75% Modulation
H
H
74.250000MHz ±1.00% Modulation
In the case of 11Pin・SSON=L, outputs unmodulated clock.
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
3/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Ratings
Unit
Supply voltage
VDD
-0.3 to 4.0
V
Input Voltage
VIN
-0.3 to VDD+0.3
V
Storage Temperature
range
Tstg
-55 to 125
°C
Power dissipation
PD
690※1
mW
※1
A measure value at mounting on 70mm x 70mm x 1.6mm glass epoxy substrate.
In the case of exceeding Ta=25°C, 6.9mW should be reduced per 1°C.
●Recommended Operating Ratings
Parameter
Symbol
Ratings
Unit
Supply voltage
VDD
3.135 to 3.465
V
Input ”H” Voltage
VIH
0.8VDD to VDD
V
Input ”L” Voltage
VIL
0.0 to 0.2VDD
V
Operating Temperature
topr
-10 to 75
°C
Frequency Control
Voltage
Vc
0.0 to VDD
V
Output load
CL
15 (MAX)
pF
※1
In case of Output load exceeds previous value , consideration should be adapted Rise Time and Fall Time for condition of use.
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
4/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Electrical Characteristics
DC Characteristics
(VDD=3.3V, Ta=25°C, Crystal Frequency=27.000000MHz, at No Load, unless otherwise specified）
Parameter
Symbol
Limit
Min.
Typ.
Max.
Unit
Output H voltage
VOH
VDD-0.4
－
－
V
Output L voltage
VOL
－
－
0.4
V
Conditions
IOH=4.0mA
IOL=4.0mA
Operating
Circuit current
IDD
－
45.0
58.0
mA
Input H current 1
IupH
-1.5
－
1.5
μA
Input H current 2
IdnH
35.0
70.0
105.5
μA
MODSEL2, TEST Terminal,VIH=VDD
Input H current 3
IdirH
-1.5
－
1.5
μA
VCTRL Terminal,VIH=VDD
Input L current 1
IupL
-105.5
-70.0
-35.0
μA
PDB, SSON, MODSEL1 Terminal
VIL=0.0V
Input L current 2
IdnL
-1.5
－
1.5
μA
MODSEL2, TEST Terminal,VIL=0.0V
Input L current 3
IdirL
-1.5
－
1.5
μA
VCTRL Terminal,VIL=0.0V
CLKOUT
CLKOUT 74.248144 74.250000 74.251856
Crystal Pullability
Spread-Spectrum
Modulation Frequency
※1
Output no load,
±0.50% Modulation
PDB, SSON, MODSEL1 Terminal
VIH=VDD
MHz VCTRL=1/2VDD
fp
±80
±105
±130
ppm 0≦VCTRL≦VDD
Fmod
32.5
34.5
36.5
kHz
※1
Triangular Modulation,
Independently of Modulation Rate
This is a guarantee with only IC. It is finished with confirmation to operate with Crystal (DSX321G・8pF load) made in DAISHINKU CORP.
AC Characteristics
(VDD=3.3V, Ta=25°C, Crystal Frequency=27.000000MHz, Output load=15pF, unless otherwise specified）
Following the table cannot test directly on characteristic when shipment, so it is a design guarantee.
Parameter
Duty
Symbol
Duty
Limit
Min.
Typ.
Max.
45
50
55
Unit
%
Conditions
Measured at 1/2VDD
Period Jitter 1σ※2,
in Spread-Spectrum OFF
Period Jitter MIN-MAX value※2,
in Spread-Spectrum OFF
Cycle-to-Cycle Jitter,
In ±0.50% Modulation
Jitter 1σ
JsSD
－
35
－
psec
Jitter P-P
JsABS
－
180
－
psec
Jitter
Cycle-to-Cycle
JsCyCy
－
180
－
psec
Rise Time
Tr
－
1.2
－
nsec
Time between 0.2VDD and 0.8VDD
Fall Time
Tf
－
0.7
－
nsec
Time between 0.8VDD and 0.2VDD
Tlock
－
－
1
msec
※3
Lock Up Time
※２
※３
Jitter means center value when using Japan Tektronix : TDS7104 Digital Phosphor Oscilloscope.
Time between voltage supply leads to 3.135V and output clock gets stable.
●Spread-Spectrum Modulation Waveform
Modulation Waveform is triangular. Modulation Rate is selectable among ±0.25%／±0.50%／±0.75%／±1.00%.
In addition, Modulation Frequency is 34.5kHz without depending on Modulation Rate.
( Figure 4 shows ±0.50% Modulation Waveform. )
74.250000MHz x (100 + 0.5)%
74.250000MHz
74.250000MHz x (100 - 0.5)%
Modulation Frequency； 34.5kHz
Figure 4. Spread-Spectrum Modulation Waveform
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Typical Wave Forms (VDD=3.3v, Ta=25°C, Spread-Spectrum OFF setting)
CLK27M
(500mV/div.)
CLK27M
(500mV/div.)
TIME (5nsec/div.)
Figure 5. CLK27M Output Waveform
TIME (1nsec/div.)
Figure 6. CLK27M Period-Jitter
CLKOUT
(500mV/div.)
CLKOUT
(500mV/div.)
TIME (5nsec/div.)
Figure 7. CLKOUT Output Waveform
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TIME (1nsec/div.)
Figure 8. CLKOUT Period-Jitter
6/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF)
180
180
VDD=3.3V
Ta=25°C
160
Period-Jitter MIN-MAX : JsABS[psec]
Period-Jitter MIN-MAX : JsABS[psec]
160
140
120
100
80
60
40
20
140
120
100
0
80
60
40
20
0
3.1
3.2
3.3
3.4
SUPPLY VOLTAGE : VDD[V]
3.5
-20
55
55
Ta=25°C
54
54
53
53
52
52
Duty : Duty[%]
Duty : Duty[%]
80
Figure 10. CLK27M Period-Jitter MIN-MAX
Figure 9. CLK27M Period-Jitter MIN-MAX
51
50
49
50
49
48
47
47
46
46
45
45
3.2
3.3
3.4
SUPPLY VOLTAGE : VDD[V]
3.5
Figure 11. CLK27M Duty
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
VDD=3.3V
51
48
3.1
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
-20
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
80
Figure 12. CLK27M Duty
7/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF)
2.4
2.4
VDD=3.3V
2.0
2.0
1.6
1.6
Rise-Time : Tr[nsec]
Rise-Time : Tr[nsec]
Ta=25°C
1.2
0.8
0.4
1.2
0.8
0.4
0.0
0.0
3.10
3.20
3.30
3.40
SUPPLY VOLTAGE : VDD[V]
3.50
-20
80
Figure 14. CLK27M Rise-Time
Figure 13. CLK27M Rise-Time
1.4
1.4
VDD=3.3V
Ta=25°C
1.2
1.2
1.0
1.0
Fall-Time : Tf[nsec]
Fall-Time : Tf[nsec]
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
0.8
0.6
0.4
0.2
0.8
0.6
0.4
0.2
0.0
0.0
3.10
3.20
3.30
3.40
SUPPLY VOLTAGE : VDD[V]
3.50
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
80
Figure 16. CLK27M Fall-Time
Figure 15. CLK27M Fall-Time
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
-20
8/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF)
280
280
VDD=3.3V
240
Period-Jitter MIN-MAX : JsABS[psec]
Period-Jitter MIN-MAX : JsABS[psec]
Ta=25°C
200
160
120
80
40
0
240
200
160
120
80
40
0
3.1
3.2
3.3
3.4
SUPPLY VOLTAGE : VDD[V]
3.5
-20
80
Figure 18. CLKOUT Period-Jitter MIN-MAX
Figure 17. CLKOUT Period-Jitter MIN-MAX
55
55
VDD=3.3V
Ta=25°C
54
54
53
53
52
52
Duty : Duty[%]
Duty : Duty[%]
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
51
50
49
51
50
49
48
48
47
47
46
46
45
45
3.1
3.2
3.3
3.4
SUPPLY VOLTAGE : VDD[V]
3.5
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
80
Figure 20. CLKOUT Duty
Figure 19. CLKOUT Duty
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
-20
9/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF)
2.4
2.4
VDD=3.3V
2.0
2.0
1.6
1.6
Rise-Time : Tr[nsec]
Rise-Time : Tr[nsec]
Ta=25°C
1.2
0.8
0.4
1.2
0.8
0.4
0.0
0.0
3.10
3.20
3.30
3.40
SUPPLY VOLTAGE : VDD[V]
3.50
-20
80
Figure 22. CLKOUT Rise-Time
Figure 21. CLKOUT Rise-Time
1.4
1.4
VDD=3.3V
Ta=25°C
1.2
1.2
1.0
1.0
Fall-Time : Tf[nsec]
Fall-Time : Tf[nsec]
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
0.8
0.6
0.4
0.2
0.8
0.6
0.4
0.2
0.0
0.0
3.10
3.20
3.30
3.40
SUPPLY VOLTAGE : VDD[V]
3.50
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
80
Figure 24. CLKOUT Fall-Time
Figure 23. CLKOUT Fall-Time
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
-20
10/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Typical Wave Forms (VDD=3.3v, Ta=25°C, Spread-Spectrum ON setting)
CLKOUT
(10dB/div.)
CLKOUT
(10dB/div.)
FREQUENCY (500kHz/div.)
Figure 25. CLKOUT±0.25% Modulation Spectrum
FREQUENCY (500kHz/div.)
Figure 26. CLKOUT±0.50% Modulation Spectrum
CLKOUT
(10dB/div.)
CLKOUT
(10dB/div.)
FREQUENCY (500kHz/div.)
Figure 27. CLKOUT±0.75% Modulation Spectrum
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
FREQUENCY (500kHz/div.)
Figure 28. CLKOUT±1.00% Modulation Spectrum
11/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Typical Wave Forms (VDD=3.3v, Ta=25°C, Spread-Spectrum ON setting)
CLKOUT (60psec/div.)
TIME (20μsec/div.)
Figure 29. CLKOUT±0.25% Modulation Waveform
CLKOUT (78psec/div.)
TIME (20μsec/div.)
Figure 30. CLKOUT±0.50% Modulation Waveform
CLKOUT (93psec/div.)
TIME (20μsec/div.)
Figure 31. CLKOUT±0.75% Modulation Waveform
CLKOUT (113psec/div.)
TIME (20μsec/div.)
Figure 32. CLKOUT±1.00% Modulation Waveform
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
12/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF)
36.5
36.5
Ta=25°C
VDD=3.3V
36.0
Modulation-Frequency : Fmod[kHz]
Modulation-Frequency : Fmod[kHz]
36.0
35.5
35.0
34.5
34.0
33.5
33.0
32.5
3.20
3.30
3.40
SUPPLY VOLTAGE : VDD[V]
34.5
34.0
33.5
33.0
3.50
-20
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
80
Figure 34. CLKOUT ±0.50% Modulation Frequency
Figure 33. CLKOUT ±0.50% Modulation Frequency
0.60
0.60
Ta=25°C
VDD=3.3V
0.58
0.56
0.56
0.54
0.54
Modulation-Rate [%]
Modulation-Rate [%]
35.0
32.5
3.10
0.58
35.5
0.52
0.50
0.48
0.46
0.52
0.50
0.48
0.46
0.44
0.44
0.42
0.42
0.40
0.40
3.10
3.20
3.30
3.40
SUPPLY VOLTAGE : VDD[V]
3.50
-20
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
80
Figure 36. CLKOUT ±0.50% Modulation Rate
Figure 35. CLKOUT ±0.50% Modulation Rate
Modulation Frequency has a same characteristic despite a Modulation control.
Modulation Rate has a same trend despite a control.
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF)
360
360
VDD=3.3V
300
Cycle-to-Cycle Jitter : JsCyCy[psec]
Cycle-to-Cycle Jitter : JsCyCy[psec]
Ta=25°C
240
180
120
60
0
300
240
180
120
60
0
3.1
3.2
3.3
3.4
SUPPLY VOLTAGE : VDD[V]
3.5
-20
80
Figure 38. CLKOUT ±0.25% Modulation
Figure 37. CLKOUT ±0.25% Modulation
Cycle-to-Cycle Jitter
Cycle-to-Cycle Jitter
360
360
Ta=25°C
VDD=3.3V
300
Cycle-to-Cycle Jitter : JsCyCy[psec]
Cycle-to-Cycle Jitter : JsCyCy[psec]
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
240
180
120
60
0
300
240
180
120
60
0
3.1
3.2
3.3
3.4
SUPPLY VOLTAGE : VDD[V]
3.5
-20
80
Figure 40. CLKOUT ±0.50% Modulation
Figure 39. CLKOUT ±0.50% Modulation
Cycle-to-Cycle Jitter
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
Cycle-to-Cycle Jitter
14/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF)
360
360
VDD=3.3V
300
Cycle-to-Cycle Jitter : JsCyCy[psec]
Cycle-to-Cycle Jitter : JsCyCy[psec]
Ta=25°C
240
180
120
60
0
300
240
180
120
60
0
3.1
3.2
3.3
3.4
SUPPLY VOLTAGE : VDD[V]
3.5
-20
80
Figure 42. CLKOUT ±0.75% Modulation
Figure 41. CLKOUT ±0.75% Modulation
Cycle-to-Cycle Jitter
Cycle-to-Cycle Jitter
360
360
Ta=25°C
VDD=3.3V
300
Cycle-to-Cycle Jitter : JsCyCy[psec]
Cycle-to-Cycle Jitter : JsCyCy[psec]
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
240
180
120
60
0
300
240
180
120
60
0
3.1
3.2
3.3
3.4
SUPPLY VOLTAGE : VDD[V]
3.5
-20
80
Figure 44. CLKOUT ±1.00% Modulation
Figure 43. CLKOUT ±1.00% Modulation
Cycle-to-Cycle Jitter
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
Cycle-to-Cycle Jitter
15/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF)
60
60
Ta=25°C
VDD=3.3V
56
Operating Current : Icc[mA]
Operating Current : Icc[mA]
56
52
48
44
40
52
48
44
40
3.1
3.2
3.3
3.4
SUPPLY VOLTAGE : VDD[V]
3.5
-20
0
20
40
60
AMBIENT TEMPERATURE : Ta[℃]
80
Figure 46. Operating Current
Figure 45. Operating Current
120
VDD=3.3v, Ta=25°C
Crystal Pullability : fp[ppm]
80
40
0
-40
-80
-120
-160
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
VCXO-Control-Voltage : Vctrl[V]
2.4
2.7
3.0
3.3
Figure 47. VCXO Crystal Pullability
VCXO Crystal Pullability has been gathered from following the evaluation environment.
Evaluation board: 70mm x 70mm x 1.6mm, 4 layers、FR-4
Using parts : 27MHz Crystal (DSX321G・8pF load) made in DAISHINKU CORP. RD=200Ω, CL=4pF
VCXO Crystal Pullability modulates by a using crystal and a board condition.
In order to use, should be checked matting with a final board condition.
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Typical Application Circuit
In the case of Spread-Spectrum Modulation Rate =±0.75% setting, 7Pin_MODSEL1 connects GND, and 8Pin_MODSEL2
connect Power supply directly following the diagram.
In the case of other Modulation Rate setting, should be changed connections as a Table of Spread-Spectrum Modulation (P3).
(In the case of ±0.50% setting, it is no problem that 7Pin_MODSEL1 and 8Pin_MODSEL2 are OPEN Manages.)
3.3V (Typ.)
CL
27MHz Crystal
CL
RD
XOUT
XIN
0.1μF
0.1μF
AVDD1
PDB
AVSS1
CLKOUT
VCTRL
VDD
AVDD2
VSS
AVSS2
SSON
MODSEL1
TEST
MODSEL2
CLK27M
0.1μF
Figure 48. Modulation Rate =±0.75% setting Typical Application Circuit
In the case of Spread-Spectrum OFF setting, 11Pin_SSON connect GND directly as the following diagram.
(In the case of using Spread-Spectrum, it is no problem that 11Pin_SSON are OPEN Manages.)
3.3V (Typ.)
CL
27MHz Crystal
CL
RD
XOUT
XIN
0.1μF
0.1μF
AVDD1
PDB
AVSS1
CLKOUT
VCTRL
VDD
AVDD2
VSS
AVSS2
SSON
MODSEL1
TEST
MODSEL2
CLK27M
0.1μF
Figure 49. Spread-Spectrum OFF setting Typical Application Circuit
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Application Information
Basically, mount ICs to the printed circuit board for use.
(If the ICs are not mounted to the printed circuit board, the characteristics of ICs may not be fully demonstrated.)
Mount 0.1µF capacitors in the vicinity of the IC Pins between 2Pin_AVDD1, 3Pin_AVSS1, and 5Pin_AVDD2,
6Pin_AVSS2, and 12Pin_VSS, 13Pin_VDD respectively.
To obtain accurate frequency, confirm the Crystal-matching with the last board to get rid of a problem
by a mass-production.
Depending on the conditions of the printed circuit board, mount an additional electrolytic capacitor between the power
supply and GND terminal.
For EMI protection, it is effective to put ferrite beads in the origin of power supply to be fed to BU3087FV from the
printed circuit board or to insert a capacitor (of 1Ω or less), which bypasses high frequency desired, between the power
supply and the GND terminal.
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring,
width of GND wiring, and routing of wiring.
Typical Application Circuit is recommendation, but in order to use, thoroughly check to be sure characteristic.
●Power Dissipation
(SSOP-B16 package)
POWER DISSIPATION : Pd [mW]
700
600
500
400
300
200
100
0
0
25
50
75
AMBIENT TEMPERATURE : Ta [℃]
100
125
* 70mm x 70mm x 1.6mm Glass Epoxy Board
Figure 50. Power Dissipation Curve (Pd-Ta Curve)
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
18/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●I/O Equivalence Circuit
Pin No.
Equivalent Circuit
Schmitt-trigger Pin
7, 11, 15
( with Pull-Up )
8, 10
( with Pull-Down )
To IC inside
VCXO Control Input Pin
4
To IC inside
From IC inside
Clock Output Pin
9, 14
From IC inside
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
19/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●I/O Equivalence Circuit
Pin No.
Equivalent Circuit
Crystal Input Pin
1
To IC inside
From IC inside
Crystal Output Pin
16
From IC inside
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
20/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Operational Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
21/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Ordering Information
B
U
3
0
8
7
Part Number
F
V
-
Package
FV : SSOP-B16
E2
Packaging and forming specification
E2: Embossed tape and reel
●Physical Dimension Tape and Reel Information
SSOP-B16
<Tape and Reel information>
5.0±0.2
9
0.3Min.
4.4±0.2
6.4±0.3
16
1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
8
0.10
1.15±0.1
0.15±0.1
0.1
0.65
1pin
0.22±0.1
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
SSOP-B16(TOP VIEW)
Part Number Marking
3087F
LOT Number
1PIN MARK
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
22/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
BU3087FV
●Revision History
Date
Revision
17.AUG.2012
001
Changes
New Release
www.rohm.com
©j 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
23/23
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.