80 MHz Bandwidth, Dual IF Receiver AD6673 Data Sheet FEATURES FUNCTIONAL BLOCK DIAGRAM AVDD DRVDD DVDD AGND DGND DRGND AD6673 VIN+A VIN–A PIPELINE 11-BIT ADC JESD-204B INTERFACE NSR VCM VIN+B VIN–B SYSREF± SYNCINB± CLK± RFCLK PIPELINE 11-BIT ADC HIGH SPEED SERIALIZERS SERDOUT0± CML, TX OUTPUTS SERDOUT1± NSR CMOS DIGITAL INPUT PDWN CMOS DIGITAL OUTPUT FDA FDB CONTROL REGISTERS CLOCK GENERATION CMOS DIGITAL INPUT/OUTPUT RST SDIO SCLK CS FAST DETECT 10632-001 JESD204B Subclass 0 or Subclass 1 coded serial digital outputs Signal-to-noise ratio (SNR) = 71.9 dBFS at 185 MHz AIN and 250 MSPS with NSR set to 33% Spurious-free dynamic range (SFDR) = 88 dBc at 185 MHz AIN and 250 MSPS Total power consumption: 707 mW at 250 MSPS 1.8 V supply voltages Integer 1-to-8 input clock divider Sample rates of up to 250 MSPS IF sampling frequencies of up to 400 MHz Internal analog-to-digital converter (ADC) voltage reference Flexible analog input range 1.4 V p-p to 2.0 V p-p (1.75 V p-p nominal) ADC clock duty cycle stabilizer (DCS) 95 dB channel isolation/crosstalk Serial port control Energy saving power-down modes Figure 1. APPLICATIONS Communications Diversity radio and smart antenna (MIMO) systems Multimode digital receivers (3G) TD-SCDMA, WiMAX, WCDMA, CDMA2000, GSM, EDGE, LTE I/Q demodulation systems General-purpose software radios PRODUCT HIGHLIGHTS 1. The configurable JESD204B output block with an integrated phase-locked loop (PLL) to support up to 5 Gbps per lane with up to two lanes. 2. IF receiver includes two, 11-bit, 250 MSPS ADCs with programmable noise shaping requantizer (NSR) function that allows for improved SNR within a reduced bandwidth of 22% or 33% of the sample rate. 3. Support for an optional RF clock input to ease system board design. 4. Proprietary differential input maintains excellent SNR performance for input frequencies of up to 400 MHz. 5. An on-chip integer, 1-to-8 input clock divider and SYNC input allows synchronization of multiple devices. 6. Operation from a single 1.8 V power supply. 7. Standard serial port interface (SPI) that supports various product features and functions, such as controlling the clock DCS, power-down, test modes, voltage reference mode, overrange fast detection, and serial output configuration. This product may be protected by one or more U.S. or international patents. Rev. C Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2012–2015 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com AD6673* PRODUCT PAGE QUICK LINKS Last Content Update: 03/25/2017 COMPARABLE PARTS DESIGN RESOURCES View a parametric search of comparable parts. • AD6673 Material Declaration • PCN-PDN Information EVALUATION KITS • Quality And Reliability • AD6673 Evaluation Board • Symbols and Footprints • High Speed ADC FMC Interposer DISCUSSIONS DOCUMENTATION View all AD6673 EngineerZone Discussions. Data Sheet • AD6673: 80 MHz Bandwidth, Dual IF Receiver Data Sheet SAMPLE AND BUY Visit the product page to see pricing options. SOFTWARE AND SYSTEMS REQUIREMENTS • AD6673 Evaluation Board, ADC-FMC Interposer & Xilinx KC705 Reference Design TECHNICAL SUPPORT Submit a technical question or find your regional support number. TOOLS AND SIMULATIONS • Visual Analog DOCUMENT FEEDBACK • AD6673 AMI Model Submit feedback for this data sheet. REFERENCE MATERIALS Informational • JESD204 Serial Interface This page is dynamically generated by Analog Devices, Inc., and inserted into this data sheet. A dynamic change to the content on this page will not trigger a change to either the revision number or the content of the product data sheet. This dynamic page may be frequently modified. AD6673 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 33% Bandwidth Mode (>60 MHz at 184.32 MSPS) .............. 25 Applications ....................................................................................... 1 Digital Outputs ............................................................................... 26 Functional Block Diagram .............................................................. 1 JESD204B Transmit Top Level Description ............................ 26 Product Highlights ........................................................................... 1 JESD204B Overview .................................................................. 26 Revision History ............................................................................... 3 Synchronization .......................................................................... 27 General Description ......................................................................... 4 ADC Overrange and Gain Control.......................................... 33 Specifications..................................................................................... 5 ADC Overrange (OR)................................................................ 33 ADC DC Specifications ............................................................... 5 Gain Switching ............................................................................ 33 ADC AC Specifications ............................................................... 6 DC Correction ................................................................................ 35 Digital Specifications ................................................................... 7 DC Correction Bandwidth........................................................ 35 Switching Specifications .............................................................. 9 DC Correction Readback .......................................................... 35 Timing Specifications ................................................................ 10 DC Correction Freeze ................................................................ 35 Absolute Maximum Ratings .......................................................... 11 DC Correction (DCC) Enable Bits .......................................... 35 Thermal Characteristics ............................................................ 11 Serial Port Interface (SPI) .............................................................. 36 ESD Caution ................................................................................ 11 Configuration Using the SPI ..................................................... 36 Pin Configuration and Function Descriptions ........................... 12 Hardware Interface ..................................................................... 36 Typical Performance Characteristics ........................................... 14 SPI Accessible Features .............................................................. 37 Equivalent Circuits ......................................................................... 16 Memory Map .................................................................................. 38 Theory of Operation ...................................................................... 18 Reading the Memory Map Register Table............................... 38 ADC Architecture ...................................................................... 18 Memory Map Register Table ..................................................... 39 Analog Input Considerations.................................................... 18 Memory Map Register Description ......................................... 43 Voltage Reference ....................................................................... 20 Applications Information .............................................................. 44 Clock Input Considerations ...................................................... 20 Design Guidelines ...................................................................... 44 Power Dissipation and Standby Mode..................................... 23 Outline Dimensions ....................................................................... 45 Noise Shaping Requantizer ........................................................... 24 Ordering Guide .......................................................................... 45 22% Bandwidth Mode (>40 MHz at 184.32 MSPS) .............. 24 Rev. C | Page 2 of 45 Data Sheet AD6673 REVISION HISTORY 12/15—Rev. B to Rev. C Changes to Nyquist Clock Input Options Section ......................20 Added Synchronization Section ....................................................27 Added Clock Adjustment Register Writes Section .....................28 Changes to Link Setup Parameters Section .................................28 Changes to Additional Digital Output Configuration Options Section ..............................................................................................30 Added Table 14; Renumbered Sequentially .................................31 Changes to Table 18 ........................................................................39 Changes to Figure 57 Caption .......................................................45 12/13—Rev. A to Rev. B Changes to Features Section ............................................................ 1 Changes to Functional Block Diagram .......................................... 1 Changes to Table 4 ............................................................................ 8 Change to Figure 3 ............................................................................ 9 Changes to Table 8 ..........................................................................11 Change to Figure 20, Figure 21, and Figure 24 ...........................15 Added Figure 26; Renumbered Sequentially ............................... 16 Changes to Table 9 .......................................................................... 18 Changes to JESD204B Overview Section .................................... 25 Changes to JESD204B Synchronization Section ......................... 26 Change to Table 10 .......................................................................... 26 Change to Configure Detailed Options Section ......................... 27 Changes to Figure 50 ...................................................................... 29 Changes to Figure 52, Figure 53, and Figure 54 .......................... 30 Deleted Built-In Self-Test (BIST) and Output Test Section ...... 33 Changes to Table 17 ........................................................................ 37 Changes to Power and Ground Recommendations Section ..... 41 Updated Outline Dimensions........................................................ 42 10/12—Rev.0 to Rev. A Changes to Applications Section and Figure 1.............................. 1 10/12—Revision 0: Initial Version Rev. C | Page 3 of 45 AD6673 Data Sheet GENERAL DESCRIPTION The AD6673 is an 11-bit, 250 MSPS, dual-channel intermediate frequency (IF) receiver specifically designed to support multiantenna systems in telecommunication applications where high dynamic range performance, low power, and small size are desired. The device consists of two high performance analog-to-digital converters (ADCs) and noise shaping requantizer (NSR) digital blocks. Each ADC consists of a multistage, differential pipelined architecture with integrated output error correction logic, and each ADC features a wide bandwidth switched capacitor sampling network within the first stage of the differential pipeline. An integrated voltage reference eases design considerations. A duty cycle stabilizer (DCS) compensates for variations in the ADC clock duty cycle, allowing the converters to maintain excellent performance. Each ADC output is connected internally to an NSR block. The integrated NSR circuitry allows for improved SNR performance in a smaller frequency band within the Nyquist bandwidth. The device supports two different output modes selectable via the SPI. With the NSR feature enabled, the outputs of the ADCs are processed such that the AD6673 supports enhanced SNR performance within a limited portion of the Nyquist bandwidth while maintaining an 11-bit output resolution. The NSR block can be programmed to provide a bandwidth of either 22% or 33% of the sample clock. For example, with a sample clock rate of 250 MSPS, the AD6673 can achieve up to 76.3 dBFS SNR for a 55 MHz bandwidth in the 22% mode and up to 73.5 dBFS SNR for a 82 MHz bandwidth in the 33% mode. When the NSR block is disabled, the ADC data is provided directly to the output at a resolution of 11 bits. The AD6673 can achieve up to 65.9 dBFS SNR for the entire Nyquist bandwidth when operated in this mode. This allows the AD6673 to be used in telecommunication applications such as a digital predistortion observation path where wider bandwidths are required. By default, the ADC output data is routed directly to the two external JESD204B serial output lanes. These outputs are at current mode logic (CML) voltage levels. Two modes are supported such that output coded data is either sent through one lane or two (L = 1; F = 4 or L = 2; F = 2). Single lane operation supports converter rates up to 125 MSPS. Synchronization input controls (SYNCINB± and SYSREF±) are provided. The AD6673 receiver digitizes a wide spectrum of IF frequencies. Each receiver is designed for simultaneous reception of a separate antenna. This IF sampling architecture greatly reduces component cost and complexity compared with traditional analog techniques or less integrated digital methods. Flexible power-down options allow significant power savings, when desired. Programmable overrange level detection is supported for each channel via dedicated fast detect pins. Programming for setup and control are accomplished using a 3-wire SPI-compatible serial interface with numerous modes to support board level system testing. The AD6673 is available in a 48-lead LFCSP and is specified over the industrial temperature range of −40°C to +85°C. Rev. C | Page 4 of 45 Data Sheet AD6673 SPECIFICATIONS ADC DC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, DVDD = 1.8 V, maximum sample rate for speed grade, VIN = −1.0 dBFS differential input, 1.75 V p-p full-scale input range, DCS enabled, link parameters used are M = 2 and L = 2, unless otherwise noted. Table 1. Parameter RESOLUTION ACCURACY No Missing Codes Offset Error Gain Error Differential Nonlinearity (DNL) Integral Nonlinearity (INL)1 MATCHING CHARACTERISTIC Offset Error Gain Error TEMPERATURE DRIFT Offset Error Gain Error INPUT REFERRED NOISE VREF = 1.0 V ANALOG INPUT Input Span Input Capacitance2 Input Resistance3 Input Common-Mode Voltage POWER SUPPLIES Supply Voltage AVDD DRVDD DVDD Supply Current IAVDD IDRVDD + IDVDD NSR Disabled NSR Enabled, 22% Mode NSR Enabled, 33% Mode POWER CONSUMPTION Sine Wave Input NSR Disabled NSR Enabled, 22% Mode NSR Enabled, 33% Mode Standby Power4 Power-Down Power Temperature Full Full Full Full Full 25°C Full 25°C Min 11 Typ Max Unit Bits +16 +2.5 ±0.6 mV %FSR LSB LSB LSB LSB Guaranteed −16 −6 ±0.25 ±0.7 ±0.3 Full Full −15 −2 +15 +3 mV %FSR Full Full ±2 ±50 ppm/°C ppm/°C 25°C 0.32 LSB rms Full Full Full Full 1.75 2.5 20 0.9 V p-p pF kΩ V Full Full Full 1.7 1.7 1.7 Full Full Full Full Full Full Full Full Full Full Full 1.8 1.8 1.8 1.9 1.9 1.9 V V V 254 282 139 187 211 150 mA mA mA mA mA 707 794 837 334 9 1 Measured with a low input frequency, full-scale sine wave. Input capacitance refers to the effective capacitance between one differential input pin and its complement. 3 Input resistance refers to the effective resistance between one differential input pin and its complement. 4 Standby power is measured with a dc input and the CLK± pin active. 2 Rev. C | Page 5 of 45 mW mW mW mW mW AD6673 Data Sheet ADC AC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, DVDD = 1.8 V, maximum sample rate for speed grade, VIN = −1.0 dBFS differential input, 1.75 V p-p full-scale input range, DCS enabled, link parameters used are M = 2 and L = 2, unless otherwise noted. Table 2. Parameter1 SIGNAL-TO-NOISE-RATIO (SNR) NSR Disabled fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz Temperature 25°C 25°C 25°C 25°C Full 25°C fIN = 220 MHz NSR Enabled 22% Bandwidth Mode fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz 25°C 25°C 25°C 25°C Full 25°C fIN = 220 MHz NSR Enabled 33% Bandwidth Mode fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz 25°C 25°C 25°C 25°C Full 25°C fIN = 220 MHz SIGNAL-TO-NOISE AND DISTORTION (SINAD) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz 25°C 25°C 25°C 25°C Full 25°C fIN = 220 MHz EFFECTIVE NUMBER OF BITS (ENOB) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz WORST SECOND OR THIRD HARMONIC fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz Rev. C | Page 6 of 45 Min Typ Max 66.6 66.2 66.4 66.2 Unit dBFS dBFS dBFS dBFS dBFS dBFS 65.6 65.9 76.3 75.7 74.8 74.2 dBFS dBFS dBFS dBFS dBFS dBFS 72.6 73.6 73.5 72.1 72.6 71.9 dBFS dBFS dBFS dBFS dBFS dBFS 70.0 71.4 65.5 65.4 65.2 65.1 64.7 dBFS dBFS dBFS dBFS dBFS dBFS 25°C 25°C 25°C 25°C 25°C 10.6 10.6 10.5 10.5 10.5 Bits Bits Bits Bits Bits 25°C 25°C 25°C 25°C Full 25°C −90 −87 −86 −88 dBc dBc dBc dBc dBc dBc 64.5 −80 −86 Data Sheet AD6673 Parameter1 SPURIOUS-FREE DYNAMIC RANGE (SFDR) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz Temperature 25°C 25°C 25°C 25°C Full 25°C fIN = 220 MHz WORST OTHER (HARMONIC OR SPUR) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz TWO-TONE SFDR fIN = 184.12 MHz (−7 dBFS), 187.12 MHz (−7 dBFS) CROSSTALK2 FULL POWER BANDWIDTH3 1 2 3 Min Typ Max 90 87 86 88 Unit dBc dBc dBc dBc dBc dBc 80 86 25°C 25°C 25°C 25°C Full 25°C −96 −94 −94 −94 −91 dBc dBc dBc dBc dBc dBc 25°C Full 25°C 88 95 1000 dBc dB MHz −80 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions. Crosstalk is measured at 100 MHz with −1.0 dBFS on one channel and no input on the alternate channel. Full power bandwidth is the bandwidth of operation determined by where the spectral power of the fundamental frequency is reduced by 3 dB. DIGITAL SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, DVDD = 1.8 V, maximum sample rate for speed grade, VIN = −1.0 dBFS differential input, 1.75 V p-p full-scale input range, DCS enabled, link parameters used are M = 2 and L = 2, unless otherwise noted. Table 3. Parameter DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−) Input CLK± Clock Rate Logic Compliance Internal Common-Mode Bias Differential Input Voltage Input Voltage Range Input Common-Mode Range High Level Input Current Low Level Input Current Input Capacitance Input Resistance RF CLOCK INPUT (RFCLK) Input CLK± Clock Rate Logic Compliance Internal Bias Input Voltage Range Input Voltage Level High Low High Level Input Current Low Level Input Current Input Capacitance Input Resistance (AC-Coupled) Temperature Min Full 40 Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Rev. C | Page 7 of 45 Typ Max Unit 625 MHz CMOS/LVDS/LVPECL 0.9 12 V V p-p V V µA µA pF kΩ 1500 MHz AGND AVDD V V 1.2 AGND 0 −150 AVDD 0.6 +150 0 0.3 AGND 0.9 0 −60 8 3.6 AVDD 1.4 +60 0 4 10 650 CMOS/LVDS/LVPECL 0.9 8 1 10 12 V V µA µA pF kΩ AD6673 Parameter SYNCIN INPUT (SYNCINB+, SYNCINB−) Logic Compliance Internal Common-Mode Bias Differential Input Voltage Range Input Voltage Range Input Common-Mode Range High Level Input Current Low Level Input Current Input Capacitance Input Resistance SYSREF INPUT (SYSREF+/SYSREF−) Logic Compliance Internal Common-Mode Bias Differential Input Voltage Range Input Voltage Range Input Common-Mode Range High Level Input Current Low Level Input Current Input Capacitance Input Resistance LOGIC INPUT (RST, CS)1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUT (SCLK, PDWN)2 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUTS (SDIO)2 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance DIGITAL OUTPUTS (SERDOUT0±, SERDOUT1±) Logic Compliance Differential Output Voltage (VOD) Output Offset Voltage (VOS) DIGITAL OUTPUTS (SDIO, FDA, FDB) High Level Output Voltage (VOH) IOH = 50 µA IOH = 0.5 mA Data Sheet Temperature Min Typ Max Unit LVDS Full Full Full Full Full Full Full Full 0.9 0.3 AGND 0.9 −5 −5 12 3.6 DVDD 1.4 +5 +5 1 16 20 V V p-p V V µA µA pF kΩ LVDS Full Full Full Full Full Full Full Full 0.9 0.3 AGND 0.9 −5 −5 8 Full Full Full Full Full Full 1.22 0 −5 −100 Full Full Full Full Full Full 1.22 0 45 −10 Full Full Full Full Full Full 1.22 0 −10 −100 4 10 12 V V µA µA kΩ pF 2.1 0.6 100 +10 V V µA µA kΩ pF 2.1 0.6 +10 −45 V V µA µA kΩ pF 750 1.05 mV V 26 2 26 5 400 0.75 Full Full Full 1.79 1.75 CML 600 DRVDD/2 V V p-p V V µA µA pF kΩ 2.1 0.6 +5 −45 26 2 Full Full Full Rev. C | Page 8 of 45 3.6 AVDD 1.4 +5 +5 V V Data Sheet AD6673 Parameter Low Level Output Voltage (VOL) IOL = 1.6 mA IOL = 50 µA 1 2 Temperature Full Full Full Min Typ Max Unit 0.2 0.05 V V Max Unit 250 MSPS ns ns ns ns 2.2 2.1 1.0 0.16 ns ns ns ns ps rms Full 25°C 25°C 25°C L/(20 × M × fS) 50 0.78 25 Seconds % UI µs 25°C 25°C 25°C Full 10 250 50 5 µs ms ms Multiframes Full 5 Multiframes Full 1 Multiframe Pull-up. Pull-down. SWITCHING SPECIFICATIONS Table 4. Parameter CLOCK INPUT PARAMETERS Conversion Rate1 SYSREF± Setup Time to Rising Edge CLK±2 SYSREF± Hold Time from Rising Edge CLK±2 SYSREF± Setup Time to Rising Edge RFCLK2 SYSREF± Hold Time from Rising Edge RFCLK2 CLK± Pulse Width High Divide-by-1 Mode, DCS Enabled Divide-by-1 Mode, DCS Disabled Divide-by-2 Mode Through Divide-by-8 Mode Aperture Delay Aperture Uncertainty (Jitter) DATA OUTPUT PARAMETERS Data Output Period or Unit Interval (UI) Data Output Duty Cycle Data Valid Time PLL Lock Time (tLOCK) Wake-Up Time (Standby) Time ADC (Power-Down)3 Time Output (Power-Down)4 Subclass 0: SYNCINB± Falling Edge to First Valid K.28 Characters (Delay Required for Rx CGS Start) Subclass 1: SYSREF± Rising Edge to First Valid K.28 Characters (Delay Required for SYNCB± Rising Edge/Rx CGS Start) CGS Phase K.28 Characters Duration Pipeline Delay JESD204B M1, L1 Mode (Latency) JESD204B M1, L2 Mode (Latency) JESD204B M2, L1 Mode (Latency) JESD204B M2, L2 Mode (Latency) Additional Pipeline Latency with NSR Enabled Fast Detect (Latency) Data Rate per Lane Uncorrelated Bounded High Probability (UBHP) Jitter Random Jitter at 5.0 Gbps Output Rise/Fall Time Differential Termination Resistance Out-of-Range Recovery Time Symbol Temperature Min fS tREFS tREFH tREFSRF tREFHRF tCH Full Full Full Full Full 40 Full Full Full Full Full 1.8 1.9 0.8 tA tJ Full Full Full Full Full Full 25°C 25°C 25°C 25°C 25°C Full 1 Typ 0.31 0 0.50 0 2.0 2.0 36 59 25 36 2 7 5.0 8 1.7 60 100 3 Conversion rate is the clock rate after the divider. Refer to Figure 3 for timing diagram. Wake-up time ADC is defined as the time required for the ADC to return to normal operation from power-down mode. 4 Wake-up time output is defined as the time required for JESD204B output to return to normal operation from power-down mode. 5 Cycles refers to ADC conversion rate cycles. 2 3 Rev. C | Page 9 of 45 Cycles5 Cycles Cycles Cycles Cycles Cycles Gbps ps ps rms ps Ω Cycles AD6673 Data Sheet TIMING SPECIFICATIONS Table 5. Parameter SPI TIMING REQUIREMENTS (See Figure 56) tDS tDH tCLK tS tH tHIGH tLOW tEN_SDIO tDIS_SDIO tSPI_RST Test Conditions/Comments Min Typ Max Unit Setup time between the data and the rising edge of SCLK Hold time between the data and the rising edge of SCLK Period of the SCLK Setup time between CS and SCLK Hold time between CS and SCLK Minimum period that SCLK should be in a logic high state Minimum period that SCLK should be in a logic low state Time required for the SDIO pin to switch from an input to an output relative to the SCLK falling edge (not shown in figures) Time required for the SDIO pin to switch from an output to an input relative to the SCLK rising edge (not shown in figures) Time required after hard or soft reset until SPI access is available (not shown in figures) 2 2 40 2 2 10 10 10 ns ns ns ns ns ns ns ns 10 ns 500 µs Timing Diagrams SAMPLE N N – 36 N+1 N – 35 ANALOG INPUT SIGNAL N – 34 N–1 N – 33 CLK– CLK+ CLK– CLK+ SERDOUT1± SAMPLE N – 36 ENCODED INTO 2 8b/10b SYMBOLS SAMPLE N – 35 ENCODED INTO 2 8b/10b SYMBOLS SAMPLE N – 34 ENCODED INTO 2 8b/10b SYMBOLS Figure 2. Data Output Timing RFCLK CLK+ SYSREF+ tREFS tREFSRF tREFH SYSREF+ SYSREF– SYSREF– NOTES 1. CLOCK INPUT IS EITHER RFCLK OR CLK±, NOT BOTH. Figure 3. SYSREF± Setup and Hold Timing Rev. C | Page 10 of 45 tREFHRF 10632-003 CLK– 10632-002 SERDOUT0± Data Sheet AD6673 ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS Table 6. Parameter ELECTRICAL AVDD to AGND DRVDD to AGND DVDD to DGND VIN+A/VIN+B, VIN−A/VIN−B to AGND CLK+, CLK− to AGND RFCLK to AGND VCM to AGND CS, PDWN to AGND SCLK to AGND SDIO to AGND RST to DGND FDA, FDB to DGND SERDOUT0+, SERDOUT0−, SERDOUT1+, SERDOUT1− to AGND SYNCINB+, SYNCINB− to DGND SYSREF+, SYSREF− to AGND ENVIRONMENTAL Operating Temperature Range (Ambient) Maximum Junction Temperature Under Bias Storage Temperature Range (Ambient) Rating −0.3 V to +2.0 V −0.3 V to +2.0 V −0.3 V to +2.0 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.3 V −0.3 V to AVDD + 0.3 V −0.3 V to AVDD + 0.3 V −0.3 V to DVDD + 0.3 V −0.3 V to DVDD + 0.3 V −0.3 V to DRVDD + 0.3 V −0.3 V to DVDD + 0.3 V −0.3 V to AVDD + 0.3 V −40°C to +85°C 150°C The exposed paddle must be soldered to the ground plane for the LFCSP package. This increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 7. Thermal Resistance Package Type 48-Lead LFCSP 7 mm × 7 mm (CP-48-13) Airflow Velocity (m/sec) 0 1.0 2.5 θJA1, 2 25 22 20 θJC1, 3 2 θJB1, 4 14 Unit °C/W °C/W °C/W 1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board. Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per MIL-STD-883, Method 1012.1. 4 Per JEDEC JESD51-8 (still air). 2 Typical θJA is specified for a 4-layer printed circuit board (PCB) with a solid ground plane. As shown in Table 7, airflow increases heat dissipation, which reduces θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces the θJA. ESD CAUTION −65°C to +125°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 11 of 45 AD6673 Data Sheet 48 47 46 45 44 43 42 41 40 39 38 37 AVDD AVDD VIN–B VIN+B AVDD AVDD VCM AVDD AVDD VIN+A VIN–A AVDD PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 36 35 34 33 32 31 30 29 28 27 26 25 AD6673 TOP VIEW (Not to Scale) AVDD DNC PDWN CS SCLK SDIO DVDD DNC DNC FDA FDB DVDD NOTES 1. DNC = DO NOT CONNECT. DO NOT CONNECT TO THIS PIN. 2. THE EXPOSED THERMAL PADDLE ON THE BOTTOM OF THE PACKAGE PROVIDES THE GROUND REFENCE FOR DRVDD AND AVDD. THIS EXPOSED PADDLE MUST BE CONNECTED TO GROUND FOR PROPER OPERATION. 10632-004 DVDD SYNCINB+ SYNCINB– DVDD DGND SERDOUT1+ SERDOUT1– DRVDD SERDOUT0– SERDOUT0+ DGND DVDD 13 14 15 16 17 18 19 20 21 22 23 24 AVDD 1 RFCLK 2 CLK– 3 CLK+ 4 AVDD 5 SYSREF+ 6 SYSREF– 7 AVDD 8 DVDD 9 RST 10 DVDD 11 DNC 12 Figure 4. Pin Configuration (Top View) Table 8. Pin Function Descriptions Pin No. ADC Power Supplies 1, 5, 8, 36, 37, 40, 41, 43, 44, 47, 48 9, 11, 13, 16, 24, 25, 30 12, 28, 29, 35 17, 23 20 Exposed Paddle ADC Analog 2 3 4 38 39 42 45 46 ADC Fast Detect Outputs 26 27 Digital Inputs 6 7 14 15 Mnemonic Type Description AVDD DVDD DNC DGND DRVDD Supply Supply AGND/DRGND Ground Analog Power Supply (1.8 V Nominal). Digital Power Supply (1.8 V Nominal). Do Not Connect. Ground Reference for DVDD. JESD204B PHY Serial Output Driver Supply (1.8 V Nominal). Note that the DRVDD power is referenced to the AGND Plane. The exposed thermal paddle on the bottom of the package provides the ground reference for DRVDD and AVDD. This exposed paddle must be connected to ground for proper operation. RFCLK CLK− CLK+ VIN−A VIN+A VCM Input Input Input Input Input Output VIN+B VIN−B Input Input ADC RF Clock Input. ADC Nyquist Clock Input—Complement. ADC Nyquist Clock Input—True. Differential Analog Input Pin (−) for Channel A. Differential Analog Input Pin (+) for Channel A. Common-Mode Level Bias Output for Analog Inputs. Decouple this pin to ground using a 0.1 µF capacitor. Differential Analog Input Pin (+) for Channel B. Differential Analog Input Pin (−) for Channel B. FDB FDA Output Output Channel B Fast Detect Indicator (CMOS Levels). Channel A Fast Detect Indicator (CMOS Levels). SYSREF+ SYSREF− SYNCINB+ SYNCINB− Input Input Input Input JESD204B LVDS SYSREF Input—True JESD204B LVDS SYSREF Input—Complement. JESD204B LVDS SYNC Input—True JESD204B LVDS SYNC Input—Complement. Supply Rev. C | Page 12 of 45 Data Sheet Pin No. Data Outputs 18 19 21 22 DUT Controls 10 31 32 33 34 AD6673 Mnemonic Type Description SERDOUT1+ SERDOUT1− SERDOUT0− SERDOUT0+ Output Output Output Output Lane B CML Output Data—True. Lane B CML Output Data—Complement. Lane A CML Output Data—Complement. Lane A CML Output Data—True. RST SDIO SCLK CS PDWN Input Input/Output Input Input Input Digital Reset (Active Low). SPI Serial Data I/O. SPI Serial Clock. SPI Chip Select (Active Low). Power-Down Input (Active High). The operation of this pin depends on the SPI mode and can be configured as powerdown or standby (see Table 18). Rev. C | Page 13 of 45 AD6673 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS AVDD = 1.8 V, DRVDD = 1.8 V, DVDD = 1.8 V, sample rate is 250 MSPS, DCS enabled, 1.75 V p-p differential input, VIN = −1.0 dBFS, 32k sample, TA = 25°C, link parameters used were M = 2 and L = 2, unless otherwise noted. 0 SNR: 66.5dBFS SFDR: 84dBc 100 SNR/SFDR (dBc AND dBFS) –20 AMPLITUDE (dBFS) 120 fIN: 90.1MHz fS: 250MSPS –40 –60 –80 –100 SFDR (dBFS) 80 SNR (dBFS) 60 SFDR (dBc) 40 20 50 100 FREQUENCY (MHz) 10632-005 0 –60 –40 –20 0 INPUT AMPLITUDE (dBFS) 100 fIN: 185.1MHz fS: 250MSPS SFDR, CHANNEL A (dBFS) 95 SNR/SFDR (dBc and dBFS) SNR: 66.2dBFS –20 SFDR: 84dBc AMPLITUDE (dBFS) –80 Figure 8. AD6673-250 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 185.1 MHz Figure 5. AD6673-250 Single-Tone FFT with fIN = 90.1 MHz 0 0 –100 10632-008 SNR (dBc) –120 –40 –60 –80 90 85 80 SFDR, CHANNEL B (dBFS) 75 SNR, CHANNEL A (dBFS) 70 –100 65 50 100 FREQUENCY (MHz) 100 200 300 400 FREQUENCY (MHz) 0 fIN: 305.1MHz fS: 250MSPS SNR: 65.5dBFS –20 SFDR: 82dBc SFDR (dBc) SFDR/IMD (dBc and dBFS) –20 –40 –60 –80 –40 IMD (dBc) –60 SFDR (dBFS) –80 –100 –100 –120 –120 –100 0 50 100 FREQUENCY (MHz) Figure 7. AD6673-250 Single-Tone FFT with fIN = 305.1 MHz –90 –80 –70 –60 –50 –40 –30 INPUT AMPLITUDE (dBFS) –20 –10 0 10632-010 IMD (dBFS) 10632-007 AMPLITUDE (dBFS) 0 Figure 9. AD6673-250 Single-Tone SNR/SFDR vs. Input Frequency (fIN) Figure 6. AD6673-250 Single-Tone FFT with fIN = 185.1 MHz 0 60 10632-006 0 10632-009 SNR, CHANNEL B (dBFS) –120 Figure 10. AD6673-250 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 89.12 MHz, fIN2 = 92.12 MHz Rev. C | Page 14 of 45 Data Sheet AD6673 0 100 SFDR, CHANNEL A (dBFS) SFDR (dBc) 95 SFDR, CHANNEL B (dBFS) SNR/SFDR (dBc AND dBFS) SFDR/IMD (dBc and dBFS) –20 –40 IMD (dBc) –60 SFDR (dBFS) –80 90 85 80 75 SNR, CHANNEL B (dBFS) 70 –100 65 IMD (dBFS) –80 –70 –60 –50 –40 –30 SNR, CHANNEL A (dBFS) –20 –10 0 INPUT AMPLITUDE (dBFS) 60 40 190 240 Figure 14. AD6673-250 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 90.1 MHz 2,000,000 fS: 250MSPS fIN1: 89.12MHz AT –7dBFS fIN2: 92.12MHz AT –7dBFS 2,097,124 TOTAL HITS 1779257 1,800,000 –20 SFDR: 85dBc 1,600,000 –40 NUMBER OF HITS AMPLITUDE (dBFS) 140 SAMPLE RATE (MSPS) Figure 11. AD6673-250 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 184.12 MHz, fIN2 = 187.12 MHz 0 90 10632-014 –90 10632-011 –120 –100 –60 –80 1,400,000 1,200,000 1,000,000 800,000 600,000 400,000 –100 317867 50 100 FREQUENCY (MHz) Figure 12. AD6673-250 Two-Tone FFT with fIN1 = 89.12 MHz, fIN2 = 92.12 MHz 0 fS: 250MSPS fIN1: 184.12MHz AT –7dBFS fIN2: 187.12MHz AT –7dBFS –40 –60 –80 –100 –120 0 50 100 FREQUENCY (MHz) 10632-013 AMPLITUDE (dBFS) –20 SFDR: 84dBc Figure 13. AD6673-250 Two-Tone FFT with fIN1 = 184.12 MHz, fIN2 = 187.12 MHz Rev. C | Page 15 of 45 0 N N+1 OUTPUT CODE Figure 15. AD6673-250 Grounded Input Histogram 10632-015 0 10632-012 200,000 –120 AD6673 Data Sheet EQUIVALENT CIRCUITS AVDD AVDD VIN+A VIN+B VIN–A VIN–B 400Ω SDIO 10632-022 10632-016 31kΩ Figure 16. Equivalent Analog Input Circuit Figure 20. Equivalent SDIO Circuit AVDD AVDD AVDD AVDD 0.9V 15kΩ PDWN, SCLK 15kΩ CLK+ 400Ω 31kΩ 10632-017 10632-021 CLK– Figure 21. Equivalent SCLK or PDWN Input Circuit Figure 17. Equivalent Clock lnput Circuit DVDD DRVDD DRVDD DRVDD 3mA RTERM SERDOUT0+ SERDOUT1+ DVDD 3mA 17kΩ SERDOUT0– SERDOUT1– VCM 17kΩ SYNCINB+ SYNCINB– 3mA 10632-217 10632-019 3mA DVDD 0.9V Figure 18. Digital CML Output Circuit AVDD Figure 22. Equivalent SYNCINB± Input Circuit 0.5pF AVDD INTERNAL CLOCK DRIVER RFCLK AVDD AVDD 0.9V 10kΩ 17kΩ 17kΩ 10632-317 BIAS CONTROL SYSREF– 10632-018 SYSREF+ Figure 19. Equivalent RF Clock lnput Circuit Figure 23. Equivalent SYSREF± Input Circuit Rev. C | Page 16 of 45 Data Sheet AD6673 DVDD AVDD AVDD DVDD 28kΩ CS 400Ω Figure 24. Equivalent CS Input Circuit 28kΩ Figure 26. RST Equivalent Circuit AVDD 10632-123 400Ω VCM 400Ω 10632-126 10632-020 RST Figure 25. Equivalent VCM Circuit Rev. C | Page 17 of 45 AD6673 Data Sheet THEORY OF OPERATION The dual ADC design can be used for diversity reception of signals, where the ADCs operate identically on the same carrier but from two separate antennae. The ADCs can also be operated with independent analog inputs. The user can sample frequencies from dc to 300 MHz using appropriate low-pass or band-pass filtering at the ADC inputs with little loss in ADC performance. Operation to 400 MHz analog input is permitted but occurs at the expense of increased ADC noise and distortion. A synchronization capability is provided to allow synchronized timing between multiple devices. Programming and control of the AD6673 are accomplished using a 3-pin, SPI-compatible serial interface. ADC ARCHITECTURE The AD6673 architecture consists of a dual, front-end, sampleand-hold circuit, followed by a pipelined switched capacitor ADC. The quantized outputs from each stage are combined into a final 11-bit result in the digital correction logic. Alternately, the 11-bit result can be processed through the NSR block before it is sent to the digital correction logic. The pipelined architecture permits the first stage to operate on a new input sample and the remaining stages to operate on the preceding samples. Sampling occurs on the rising edge of the clock. Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched capacitor digital-toanalog converter (DAC) and an interstage residue amplifier (MDAC). The MDAC magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage simply consists of a flash ADC. The input stage of each channel contains a differential sampling circuit that can be ac- or dc-coupled in differential or single-ended modes. The output staging block aligns the data, corrects errors, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing digital output noise to be separated from the analog core. The AD6673 dual IF receiver can simultaneously digitize two channels, making it ideal for diversity reception and digital predistortion (DPD) observation paths in telecommunication systems. The dual IF receiver design can be used for diversity reception of signals, whereas the ADCs operate identically on the same carrier but from two separate antennae. The ADCs can also be operated with independent analog inputs. The user can input frequencies from dc to 300 MHz using appropriate lowpass or band-pass filtering at the ADC inputs with little loss in performance. Operation to a 400 MHz analog input is permitted; however, it occurs at the expense of increased ADC noise and distortion. A synchronization capability is provided to allow synchronized timing between multiple devices. Programming and control of the AD6673 are accomplished using a 3-wire SPI-compatible serial interface. ANALOG INPUT CONSIDERATIONS The analog input to the AD6673 is a differential, switched capacitor circuit that has been designed for optimum performance while processing a differential input signal. The clock signal alternatively switches the input between sample mode and hold mode (see the configuration shown in Figure 27). When the input is switched into sample mode, the signal source must be capable of charging the sampling capacitors and settling within 1/2 clock cycle. A small resistor in series with each input can help reduce the peak transient current that is required from the output stage of the driving source. A shunt capacitor can be placed across the inputs to provide dynamic charging currents. This passive network creates a low-pass filter at the ADC input; therefore, the precise values are dependent on the application. In intermediate frequency (IF) undersampling applications, reduce the shunt capacitors. In combination with the driving source impedance, the shunt capacitors limit the input bandwidth. Refer to the AN-742 Application Note, Frequency Domain Response of Switched-Capacitor ADCs; the AN-827 Application Note, A Resonant Approach to Interfacing Amplifiers to SwitchedCapacitor ADCs; and the Analog Dialogue article, “TransformerCoupled Front-End for Wideband A/D Converters,” for more information on this subject. BIAS S S CFB CS VIN+ CPAR1 CPAR2 S S H CS VIN– CPAR1 CPAR2 S CFB S BIAS 10632-023 The AD6673 has two analog input channels and two JESD204B output lanes. The signal passes through several stages before appearing at the output port(s). Figure 27. Switched-Capacitor Input For best dynamic performance, match the source impedances driving VIN+ and VIN− and differentially balance the inputs. Rev. C | Page 18 of 45 Data Sheet AD6673 Input Common Mode C2 The analog inputs of the AD6673 are not internally dc biased. In ac-coupled applications, the user must provide this bias externally. Setting the device so that VCM = 0.5 × AVDD (or 0.9 V) is recommended for optimum performance. An on-board common-mode voltage reference is included in the design and is available from the VCM pin. Using the VCM output to set the input common mode is recommended. Optimum performance is achieved when the common-mode voltage of the analog input is set by the VCM pin voltage (typically 0.5 × AVDD). Decouple the VCM pin to ground by using a 0.1 µF capacitor, as described in the Applications Information section. Place this decoupling capacitor close to the pin to minimize the series resistance and inductance between the part and this capacitor. R3 VIN– 33Ω 15Ω VCM 15pF 0.1µF 10632-024 200Ω 33Ω Table 9. Example RC Network Figure 28. Differential Input Configuration Using the ADA4930-2 Frequency Range (MHz) 0 to 100 100 to 300 For baseband applications where SNR is a key parameter, differential transformer coupling is the recommended input configuration. An example is shown in Figure 29. To bias the analog input, the VCM voltage can be connected to the center tap of the secondary winding of the transformer. C1 Differential (pF) 8.2 3.9 R1 Series (Ω) 33 15 C2 R3 R1 0.1µF 0.1µF R2 2V p-p VIN+ 33Ω S S P ADC C1 0.1µF 33Ω 0.1µF R1 R2 R3 VIN– 33Ω C2 Figure 30. Differential Double Balun Input Configuration Rev. C | Page 19 of 45 VCM 0.1µF 10632-026 P 0.1µF In the double balun and transformer configurations, the value of the input capacitors and resistors is dependent on the input frequency and source impedance. Based on these parameters, the value of the input resistors and capacitors may need to be adjusted or some components may need to be removed. Table 9 displays recommended values to set the RC network for different input frequency ranges. However, these values are dependent on the input signal and bandwidth and should be used only as a starting guide. Note that the values given in Table 9 are for each R1, R2, C1, C2, and R3 components shown in Figure 29 and Figure 30. AVDD VIN+ 120Ω 33Ω At input frequencies in the second Nyquist zone and above, the noise performance of most amplifiers is not adequate to achieve the true SNR performance of the AD6673. For applications where SNR is a key parameter, differential double balun coupling is the recommended input configuration (see Figure 30). In this configuration, the input is ac-coupled and the VCM voltage is provided to each input through a 33 Ω resistor. These resistors compensate for losses in the input baluns to provide a 50 Ω impedance to the driver. ADC ADA4930-2 R3 VCM Consider the signal characteristics when selecting a transformer. Most RF transformers saturate at frequencies below a few megahertz. Excessive signal power can also cause core saturation, which leads to distortion. 5pF 0.1µF VIN– Figure 29. Differential Transformer-Coupled Configuration 200Ω 15Ω ADC R2 C2 15pF 33Ω C1 0.1µF The output common-mode voltage of the ADA4930-2 is easily set with the VCM pin of the AD6673 (see Figure 28), and the driver can be configured in a Sallen-Key filter topology to provide band-limiting of the input signal. 90Ω 49.9Ω R1 Optimum performance is achieved while driving the AD6673 in a differential input configuration. For baseband applications, the AD8138, ADA4937-2, ADA4938-2, and ADA4930-2 differential drivers provide excellent performance and a flexible interface to the ADC. 76.8Ω VIN+ 10632-025 2V p-p Differential Input Configurations VIN R2 R1 R2 Series (Ω) 0 0 C2 Shunt (pF) 15 8.2 R3 Shunt (Ω) 24.9 24.9 AD6673 Data Sheet AVDD An alternative to using a transformer-coupled input at frequencies in the second Nyquist zone is to use an amplifier with variable gain. The AD8375 or AD8376 digital variable gain amplifier (DVGA) provides good performance for driving the AD6673. Figure 31 shows an example of the AD8376 driving the AD6673 through a band-pass antialiasing filter. 4pF 10632-028 165Ω VPOS 5.1pF 1nF 4pF Figure 32. Equivalent Nyquist Clock Input Circuit ADC 3.9pF 301Ω 15pF VCM 165Ω 1nF 20kΩ║2.5pF 68nH 10632-027 1000pF 180nH 220nH NOTES 1. ALL INDUCTORS ARE COILCRAFT® 0603CS COMPONENTS WITH THE EXCEPTION OF THE 1µH CHOKE INDUCTORS (COILCRAFT 0603LS). 2. FILTER VALUES SHOWN ARE FOR A 20MHz BANDWIDTH FILTER CENTERED AT 140MHz. Figure 31. Differential Input Configuration Using the AD8376 VOLTAGE REFERENCE A stable and accurate voltage reference is built into the AD6673. The full-scale input range can be adjusted by varying the reference voltage via the SPI. The input span of the ADC tracks the reference voltage changes linearly. CLOCK INPUT CONSIDERATIONS The AD6673 has two options for deriving the input sampling clock, a differential Nyquist sampling clock input or an RF clock input (which is internally divided by 4). The clock input is selected in Register 0x09 and, by default, is configured for the Nyquist clock input. For optimum performance, clock the AD6673 Nyquist sample clock input, CLK+ and CLK−, with a differential signal. The signal is typically ac-coupled into the CLK+ and CLK− pins via a transformer or via capacitors. These pins are biased internally (see Figure 32) and require no external bias. If the clock inputs are floated, CLK− is pulled slightly lower than CLK+ to prevent spurious clocking. For applications where a single-ended low jitter clock between 40 MHz to 200 MHz is available, an RF transformer is recommended. An example using an RF transformer in the clock network is shown in Figure 33. At frequencies above 200 MHz, an RF balun is recommended, as seen in Figure 34. The back-toback Schottky diodes across the transformer secondary limit clock excursions into the AD6673 to approximately 0.8 V p-p differential. This limit helps prevent the large voltage swings of the clock from feeding through to other portions of the AD6673, yet preserves the fast rise and fall times of the clock, which are critical to low jitter performance. The Nyquist clock input pins, CLK+ and CLK−, are internally biased to 0.9 V and have a typical input impedance of 4 pF in parallel with 10 kΩ (see Figure 32). The input clock is typically ac-coupled to CLK+ and CLK−. Some typical clock drive circuits are presented in Figure 33 through Figure 36 for reference. 50Ω ADC CLK+ 100Ω 390pF CLK– SCHOTTKY DIODES: HSMS2822 Figure 33. Transformer-Coupled Differential Clock (Up to 200 MHz) CLOCK INPUT 390pF 25Ω ADC 390pF CLK+ 390pF 1nF CLK– 25Ω Nyquist Clock Input Options The AD6673 Nyquist clock input supports a differential clock between 40 MHz to 625 MHz. The clock input structure supports differential input voltages from 0.3 V to 3.6 V and is therefore compatible with various logic family inputs, such as CMOS, LVDS, and LVPECL. A sine wave input is also accepted, but higher slew rates typically provide optimal performance. Clock source jitter is a critical parameter that can affect performance, as described in the Jitter Considerations section. If the inputs are floated, pull the CLK− pin low to prevent spurious clocking. 390pF CLOCK INPUT Mini-Circuits® ADT1-1WT, 1:1Z 390pF XFMR 10632-029 1µH CLK– 180nH 220nH 1µH AD8376 CLK+ SCHOTTKY DIODES: HSMS2822 10632-030 1000pF 0.9V Figure 34. Balun-Coupled Differential Clock (Up to 625 MHz) In some cases, it is desirable to buffer or generate multiple clocks from a single source. In those cases, Analog Devices, Inc., offers clock drivers with excellent jitter performance. Figure 35 shows a typical PECL driver circuit that uses PECL drivers such as the AD9510, AD9511, AD9512, AD9513, AD9514, AD9515, AD9516-0, AD9516-1, AD9516-2, AD9516-3, AD9516-4, AD9516-5, AD9517-0, AD9517-1, AD9517-2, AD9517-3, AD9517-4, AD9518-0, AD9518-1, AD9518-2, AD9518-3, AD9518-4, AD9520-0, AD9520-1, AD9520-2, AD9520-3, AD9520-4, AD9520-5, AD9522-0, AD9522-1, AD9522-2, AD9522-3, AD9522-4, AD9522-5, AD9523, AD9524, ADCLK905, ADCLK907, and ADCLK925. Rev. C | Page 20 of 45 Data Sheet AD6673 1pF CLK+ AD95xx 100Ω 10kΩ 0.1µF CLK– 50kΩ 240Ω 50kΩ 240Ω BIAS CONTROL Figure 37. Equivalent RF Clock Input Circuit Figure 35. Differential PECL Sample Clock (Up to 625 MHz) It is recommended that the RF clock input of the AD6673 be driven with a PECL or sine wave signal with a minimum signal amplitude of 600 mV peak to peak. Regardless of the type of signal being used, clock source jitter is of the most concern, as described in the Jitter Considerations section. Figure 38 shows the preferred method of clocking when using the RF clock input on the AD6673. It is recommended that a 50 Ω transmission line be used to route the clock signal to the RF clock input of the AD6673 due to the high frequency nature of the signal and terminate the transmission line close to the RF clock input. Analog Devices also offers LVDS clock drivers with excellent jitter performance. A typical circuit is shown in Figure 36 and uses LVDS drivers such as the AD9510, AD9511, AD9512, AD9513, AD9514, AD9515, AD9516-0, AD9516-1, AD9516-2, AD9516-3, AD9516-4, AD9516-5, AD9517-0, AD9517-1, AD9517-2, AD9517-3, AD9517-4, AD9518-0, AD9518-1, AD9518-2, AD9518-3, AD9518-4, AD9520-0, AD9520-1, AD9520-2, AD9520-3, AD9520-4, AD9520-5, AD9522-0, AD9522-1, AD9522-2, AD9522-3, AD9522-4, AD9522-5, AD9523, and AD9524. 0.1µF 0.1µF CLOCK INPUT 0.1µF RF CLOCK INPUT 100Ω 0.1µF LVDS DRIVER 50Ω Tx LINE RFCLK CLK– 50kΩ 0.1µF 50Ω 50kΩ 10632-032 CLOCK INPUT ADC ADC CLK+ AD95xx 10632-033 PECL DRIVER Figure 38. Typical RF Clock Input Circuit Figure 39 shows the RF clock input of the AD6673 being driven from the LVPECL outputs of the AD9515. The differential LVPECL output signal from the AD9515 is converted to a singleended signal using an RF balun or RF transformer. The RF balun configuration is recommended for clock frequencies associated with the RF clock input. Figure 36. Differential LVDS Sample Clock (Up to 625 MHz) RF Clock Input Options The AD6673 RF clock input supports a single-ended clock between 625 GHz to 1.5 GHz. The equivalent RF clock input circuit is shown in Figure 37. The input is self biased to 0.9 V and is typically ac-coupled. The input has a typical input impedance of 10 kΩ in parallel with 1 pF at the RFCLK pin. VDD 127Ω 0.1µF ADC 127Ω 0.1µF 50Ω Tx LINE 0.1µF RFCLK CLOCK INPUT AD9515 0.1µF 50Ω LVPECL DRIVER 0.1µF CLOCK INPUT 82.5Ω 82.5Ω Figure 39. Differential PECL RF Clock Input Circuit Rev. C | Page 21 of 45 10632-035 0.1µF INTERNAL CLOCK DRIVER RFCLK 10632-031 CLOCK INPUT ADC 0.1µF 10632-034 0.1µF CLOCK INPUT AD6673 Data Sheet Input Clock Divider Jitter Considerations The AD6673 contains an input clock divider with the ability to divide the Nyquist input clock by integer values between 1 and 8. The RF clock input uses an on-chip predivider to divide the clock input by four before it reaches the 1-to-8 divider. This allows for higher input frequencies to be achieved on the RF clock input. The divide ratios can be selected using Register 0x09 and Register 0x0B. Register 0x09 is used to set the RF clock input, and Register 0x0B can be used to set the divide ratio of the 1-to-8 divider for both the RF clock input and the Nyquist clock input. For divide ratios other than 1, the duty-cycle stabilizer is automatically enabled. High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR at a given input frequency (fIN) due to jitter (tJ) can be calculated by SNRHF = −10 log[(2π × fIN × tJRMS)2 + 10 ( − SNRLF /10) ] In the equation, the rms aperture jitter represents the root-meansquare of all jitter sources, which include the clock input, the analog input signal, and the ADC aperture jitter specification. IF undersampling applications are particularly sensitive to jitter, as shown in Figure 41. 70 ÷4 68 ÷1 TO ÷8 DIVIDER 66 10632-036 64 Figure 40. AD6673 Clock Divider Circuit The AD6673 clock divider can be synchronized using the external system reference (SYSREF) input. Bit 1 and Bit 2 of Register 0x3A allow the clock divider to be resynchronized on every SYSREF signal or only on the first signal after the register is written. A valid SYSREF causes the clock divider to reset to its initial state. This synchronization feature allows multiple parts to have their clock dividers aligned to guarantee simultaneous input sampling. SNR (dBc) NYQUIST CLOCK The AD6673 contains a DCS that retimes the nonsampling (falling) edge, providing an internal clock signal with a nominal 50% duty cycle. This allows the user to provide a wide range of clock input duty cycles without affecting the performance of the AD6673. Jitter on the rising edge of the input clock is still of paramount concern and is not reduced by the duty cycle stabilizer. The duty cycle control loop does not function for clock rates of less than 40 MHz nominally. The loop has a time constant associated with it that must be considered when the clock rate can change dynamically. A wait time of 1.5 µs to 5 µs is required after a dynamic clock frequency increase or decrease before the DCS loop is relocked to the input signal. During the time that the loop is not locked, the DCS loop is bypassed, and the internal device timing is dependent on the duty cycle of the input clock signal. In such applications, it may be appropriate to disable the duty cycle stabilizer. In all other applications, enabling the DCS circuit is recommended to maximize ac performance. 60 58 56 0.05 ps 0.20 ps 0.50 ps 1.00 ps 1.50 ps MEASURED 54 52 50 1 Clock Duty Cycle Typical high speed ADCs use both clock edges to generate a variety of internal timing signals and, as a result, may be sensitive to clock duty cycle. Commonly, a ±5% tolerance is required on the clock duty cycle to maintain dynamic performance characteristics. 62 10 100 INPUT FREQUENCY (MHz) 1000 10632-037 RFCLK Figure 41. AD6673-250 SNR vs. Input Frequency and Jitter Treat the clock input as an analog signal in cases where aperture jitter may affect the dynamic range of the AD6673. Separate the power supplies for the clock drivers from the ADC output driver supplies to avoid modulating the clock signal with digital noise. Low jitter, crystal controlled oscillators make the best clock sources. If the clock is generated from another type of source (by gating, dividing, or another method), retime it by the original clock at the last step. Refer to the AN-501 Application Note, Aperture Uncertainty and ADC System Performance, and the AN-756 Application Note, Sampled Systems and the Effects of Clock Phase Noise and Jitter, for more information about jitter performance as it relates to ADCs. Rev. C | Page 22 of 45 Data Sheet AD6673 POWER DISSIPATION AND STANDBY MODE As shown in Figure 42, the power dissipated by the AD6673 is proportional to its sample rate. The data in Figure 42 was taken using the same operating conditions as those used for the Typical Performance Characteristics section. 0.8 0.7 TOTAL POWER 0.5 POWER (AVDD) 0.4 When using the SPI port interface, the user can place the ADC in power-down mode or standby mode. Standby mode allows the user to keep the internal reference circuitry powered when faster wake-up times are required. See the Memory Map Register Description section and the AN-877 Application Note, Interfacing to High Speed ADCs via SPI, for additional details. 0.3 POWER (DVDD + DRVDD) 0.2 0.1 0 40 90 140 190 ENCODE FREQUENCY (MSPS) Low power dissipation in power-down mode is achieved by shutting down the reference, reference buffer, biasing networks, and clock. Internal capacitors are discharged when entering powerdown mode and then must be recharged when returning to normal operation. As a result, wake-up time is related to the time spent in power-down mode, and shorter power-down cycles result in proportionally shorter wake-up times. 240 10632-038 TOTAL POWER (W) 0.6 By asserting PDWN (either through the SPI port or by asserting the PDWN pin high), the AD6673 is placed in power-down mode. In this state, the ADC typically dissipates about 9 mW. Asserting the PDWN pin low returns the AD6673 to its normal operating mode. Figure 42. AD6673-250 Power vs. Encode Rate Rev. C | Page 23 of 45 AD6673 Data Sheet NOISE SHAPING REQUANTIZER fS = 250MSPS fIN = 185.1MHz AT –1dBFS SNR = 74.3dB SFDR = 85dBc –20 Two different bandwidth modes are provided; the mode can be selected from the SPI port. In each of the two modes, the center frequency of the band can be tuned such that IFs can be placed anywhere in the Nyquist band. –40 –60 –80 –100 –120 22% BANDWIDTH MODE (>40 MHz AT 184.32 MSPS) 0 50 100 FREQUENCY (MHz) 10632-040 The NSR feature can be independently controlled per channel via the SPI. 0 AMPLITUDE (dBFS) The AD6673 features a NSR to allow higher than 11-bit SNR to be maintained in a subset of the Nyquist band. The harmonic performance of the receiver is unaffected by the NSR feature. When enabled, the NSR contributes an additional 0.6 dB of loss to the input signal, such that a 0 dBFS input is reduced to −0.6 dBFS at the output pins. Figure 44. 22% Bandwidth Mode, Tuning Word = 28 (fS/4 Tuning) 0 fS = 250MSPS fIN = 185.1MHz AT –1dBFS SNR = 74.3dB SFDR = 85dBc –20 AMPLITUDE (dBFS) The first bandwidth mode offers excellent noise performance over 22% of the ADC sample rate (44% of the Nyquist band) and can be centered by setting the NSR mode bits in the NSR control register (Address 0x3C) to 0. In this mode, the useful frequency range can be set using the 6-bit tuning word in the NSR tuning register (Address 0x3E). There are 57 possible tuning words (TW); each step is 0.5% of the ADC sample rate. The following three equations describe the left band edge (f0), the channel center (fCENTER), and the right band edge (f1), respectively: f0 = fADC × .005 × TW –40 –60 –80 –100 –120 f1 = f0 + 0.22 × fADC Figure 43 to Figure 45 show the typical spectrum that can be expected from the AD6673 in the 22% bandwidth mode for three different tuning words. 0 fS = 250MSPS fIN = 185.1MHz AT –1dBFS SNR = 74dB SFDR = 85dBc AMPLITUDE (dBFS) –20 –40 –60 –80 0 –120 0 50 100 10632-039 –100 Figure 43. 22% Bandwidth Mode, Tuning Word = 13 Rev. C | Page 24 of 45 0 50 100 FREQUENCY (MHz) Figure 45. 22% Bandwidth Mode, Tuning Word = 41 10632-041 fCENTER = f0 + 0.11 × fADC Data Sheet AD6673 33% BANDWIDTH MODE (>60 MHz AT 184.32 MSPS) 0 –60 –80 0 50 100 FREQUENCY (MHz) Figure 47. 33% Bandwidth Mode, Tuning Word = 17 (fS/4 Tuning) f1 = f0 + 0.33 × fADC 0 –20 AMPLITUDE (dBFS) 0 fS = 250MSPS fIN = 185.1MHz AT –1dBFS SNR = 72dB SFDR = 85dBc –40 fS = 250MSPS fIN = 185.1MHz AT –1dBFS SNR = 72dB SFDR = 85dBc –40 –60 –80 –60 –100 –80 –120 0 50 100 FREQUENCY (MHz) –100 –120 50 100 FREQUENCY (MHz) 10632-042 Figure 48. 33% Bandwidth Mode, Tuning Word = 27 Figure 46. 33% Bandwidth Mode, Tuning Word = 5 Rev. C | Page 25 of 45 10632-044 Figure 46 to Figure 48 show the typical spectrum that can be expected from the AD6673 in the 33% bandwidth mode for three different tuning words. 0 10632-043 –120 fCENTER = f0 + 0.165 × fADC AMPLITUDE (dBFS) –40 –100 f0 = fADC × .005 × TW –20 SNR = 72dB SFDR = 85dBc –20 AMPLITUDE (dBFS) The second bandwidth mode offers excellent noise performance over 33% of the ADC sample rate (66% of the Nyquist band) and can be centered by setting the NSR mode bits in the NSR control register (Address 0x3C) to 1. In this mode, the useful frequency range can be set using the 6-bit tuning word in the NSR tuning register (Address 0x3E). There are 57 possible tuning words (TW); each step is 0.5% of the ADC sample rate. The following three equations describe the left band edge (f0), the channel center (fCENTER), and the right band edge (f1), respectively: fS = 250MSPS fIN = 185.1MHz AT –1dBFS AD6673 Data Sheet DIGITAL OUTPUTS JESD204B TRANSMIT TOP LEVEL DESCRIPTION The AD6673 digital output uses the JEDEC Standard No. JESD204B, Serial Interface for Data Converters. JESD204B is a protocol to link the AD6673 to a digital processing device over a serial interface of up to 5 Gbps link speeds (2.75 Gbps, 11-bit ADC data rate). The benefits of the JESD204B interface include a reduction in required board area for data interface routing and the enabling of smaller packages for converter and logic devices. The AD6673 supports single or dual lane interfaces. JESD204B OVERVIEW The JESD204B data transmit block assembles the parallel data from the ADC into frames and uses 8b/10b encoding as well as optional scrambling to form serial output data. Lane synchronization is supported using special characters during the initial establishment of the link, and additional synchronization is embedded in the data stream thereafter. A matching external receiver is required to lock onto the serial data stream and recover the data and clock. For additional details on the JESD204B interface, refer to the JESD204B standard. The AD6673 JESD204B transmit block maps the output of the two ADCs over a link. A link can be configured to use either single or dual serial differential outputs that are called lanes. The JESD204B specification refers to a number of parameters to define the link, and these parameters must match between the JESD204B transmitter (AD6673 output) and receiver. The JESD204B link is described according to the following parameters: • • • • • • • • • • • • • • S = samples transmitted/single converter/frame cycle (AD6673 value = 1) M = number of converters/converter device (AD6673 value = 2 by default, or can be set to 1) L = number of lanes/converter device (AD6673 value = 1 or 2) N = converter resolution (AD6673 value = 11) N’ = total number of bits per sample (AD6673 value = 16) CF = number of control words/frame clock cycle/converter device (AD6673 value = 0) CS = number of control bits/conversion sample (configurable on the AD6673 up to 2 bits) K = number of frames per multiframe (configurable on the AD6673) HD = high density mode (AD6673 value = 0) F = octets/frame (AD6673 value = 2 or 4, dependent upon L = 2 or 1) C = control bit (overrange, overflow, underflow; available on the AD6673) T = tail bit (available on the AD6673) SCR = scrambler enable/disable (configurable on the AD6673) FCHK = checksum for the JESD204B parameters (automatically calculated and stored in register map) Figure 49 shows a simplified block diagram of the AD6673 JESD204B link. By default, the AD6673 is configured to use two converters and two lanes. Converter A data is output to SERDOUT0+/SERDOUT0−, and Converter B is output to SERDOUT1+/SERDOUT1−. The AD6673 allows for other configurations such as combining the outputs of both converters onto a single lane or changing the mapping of the A and B digital output paths. These modes are setup through a quick configuration register in the SPI register map, along with additional customizable options. By default in the AD6673, the 11-bit converter word from each converter is broken into two octets (8 bits of data). Bit 13 (MSB) through Bit 6 are in the first octet (Bits[13:11] are Logic 0). The second octet contains Bit 5 through Bit 0 (LSB), and two tail bits are added to fill the second octet. The tail bits can be configured as zeros, pseudorandom number sequences, or control bits indicating overrange, underrange, or valid data conditions. The two resulting octets can be scrambled. Scrambling is optional; however, it is available to avoid spectral peaks when transmitting similar digital data patterns. The scrambler uses a self synchronizing, polynomial-based algorithm defined by the equation 1 + x14 + x15. The descrambler in the receiver should be a self-synchronizing version of the scrambler polynomial. The two octets are then encoded with an 8b/10b encoder. The 8b/10b encoder works by taking eight bits of data (an octet) and encoding them into a 10-bit symbol. Figure 50 shows how the 11-bit data is taken from the ADC, the tail bits are added, the two octets are scrambled, and how the octets are encoded into two 10-bit symbols. Figure 50 illustrates the default data format. At the data link layer, in addition to the 8b/10b encoding, the character replacement is used to allow the receiver to monitor frame alignment. The character replacement process occurs on the frame and multiframe boundaries, and implementation depends on which boundary is occurring, and if scrambling is enabled. If scrambling is disabled, the following applies. If the last scrambled octet of the last frame of the multiframe equals the last octet of the previous frame, the transmitter replaces the last octet with the control character /A/ = /K28.3/. On other frames within the multiframe, if the last octet in the frame equals the last octet of the previous frame, the transmitter replaces the last octet with the control character /F/= /K28.7/. If scrambling is enabled, the following applies. If the last octet of the last frame of the multiframe equals 0x7C, the transmitter replaces the last octet with the control character /A/ = /K28.3/. On other frames within the multiframe, if the last octet equals 0xFC, the transmitter replaces the last octet with the control character /F/ = /K28.7/. Refer to JEDEC Standard No. 204B-July 2011 for additional information about the JESD204B interface. Section 5.1 covers the transport layer and data format details, and Section 5.2 covers scrambling and descrambling. Rev. C | Page 26 of 45 Data Sheet AD6673 SYNCHRONIZATION 11. Enable the JESD204B receiver, and initiate a link. The AD6673 requires internal synchronization to process the ADC data and produce a JESD204B output. To accommodate extreme temperature changes and inconsistent power-up conditions that may occur, the timing of these circuits requires an additional margin. To increase the timing margin, a procedure is required to maintain internal timing synchronization and JESD204B link quality. Subclass 0 and Harmonic Input Clock There are four specific cases to consider: JESD204B Subclass 0 or Subclass 1 operation, and Nyquist or harmonic clocking. Harmonic clocking uses an input clock, where the AD6673 internal clock divider can be set to divide by a multiple of between 2 and 8 of the ADC sample rate (using Register 0x0B). See Table 14 for a description of how the JESD204B link modes of operation are configured using Register 0x3A. Subclass 0 and Nyquist Input Clock For Subclass 0 and Nyquist input clock (deterministic latency is not required and an external SYSREF signal is not used), 1. Apply power to the AD6673. Allow the voltages and clocks to stabilize. 2. Apply a soft reset by writing 0x3C to Register 0x00. 3. Wait at least 500 µs. 4. Set Register 0xEE and Register 0xEF to 0x80. 5. Configure the AD6673 as desired, including the JESD204B parameters. Configure the link setup parameters (see the Link Setup Parameters section). 6. Establish an internal local multiframe clock (LMFC) within the AD6673 by writing 0xFF to Register 0xF3. 7. Wait at least six LMFCs. 8. Perform the clock adjustment register writes (see the Clock Adjustment Register Writes section). 9. Wait at least six LMFCs. 10. Enable the JESD204B receiver, and initiate a link. For Subclass 0 and the harmonic input clock, 1. Apply power to the AD6673. Allow the voltages and clocks to stabilize. 2. Assert a power-down by either using the PDWN input or by setting Register 0x08 to 0x05. 3. Configure the proper clock divide setting in Register 0x0B. Commit the clock divide setting by writing 0x01 to Register 0xFF. 4. Set Register 0xEE and Register 0xEF to 0x80. 5. Configure the AD6673 as desired including the JESD204B parameters. Configure the link setup parameters (see the Link Setup Parameters section). 6. Deassert the power-down, and wait at least 250 ms. 7. Force an internal alignment within the AD6673 by writing 0xFF to Register 0xF3. 8. Wait at least six LMFCs. 9. Perform the clock adjustment register writes (see the Clock Adjustment Register Writes section). 10. Wait at least six LMFCs. 11. Enable the JESD204B receiver, and initiate a link. Subclass 1 and Harmonic Input Clock For Subclass 1 and the harmonic input clock, 1. 2. 3. 4. 5. Subclass 1 and Nyquist Input Clock For Subclass 1 and the Nyquist input clock (when deterministic latency is required and an external SYSREF is used), 1. Apply power to the AD6673. Allow the voltages and clocks to stabilize. 2. Apply a soft reset by writing 0x3C to Register 0x00. 3. Wait at least 500 µs. 4. Set Register 0xEE and Register 0xEF to 0x80. 5. Configure the AD6673 as desired including the JESD204B parameters. Configure the link setup parameters (see the Link Setup Parameters section). 6. Force an internal alignment within the AD6673 by writing 0xFF to Register 0xF3. 7. Wait at least six LMFCs. 8. Establish a LMFC within the AD6673 by providing a SYSREF signal. 9. Perform the clock adjustment register writes (see the Clock Adjustment Register Writes section). 10. Wait at least six LMFCs. 6. 7. 8. 9. 10. 11. 12. 13. Apply power to the AD6673. Allow the voltages and clocks to stabilize. Assert a power-down by either using the PDWN input or by setting Register 0x08 to 0x05. Configure the proper clock divide setting in Register 0x0B. Commit the clock divide setting by writing 0x01 to Register 0xFF. Set Register 0xEE and Register 0xEF to 0x80. Configure the AD6673 as desired including the JESD204B parameters. Configure the link setup parameters (see the Link Setup Parameters section). Deassert the power-down, and wait at least 250 ms. Force an internal alignment within the AD6673 by writing 0xFF to Register 0xF3. Wait at least six LMFCs. Set the LMFC using the SYSREF signal for JESD204B Subclass 1 operation. Perform the clock adjustment register writes (see the Clock Adjustment Register Writes section). Enable the JESD204B receiver, and initiate a link. Wait at least six LMFCs. Bring the JESD204B receiver out of reset. If the AD6673 has been configured for continuous SYSREF± mode of operation using Register 0x3A, Bit 2 = 1, it is important to disable the internal SYSREF± buffer by setting Register 0x3A, Bit 0 = 0, to remove the impact of external false triggers that affects the digital path. Rev. C | Page 27 of 45 AD6673 Data Sheet Clock Adjustment Register Writes transmit four multiframes. Dummy samples are inserted between the required characters so that full multiframes are transmitted. The four multiframes include the following: Perform the clock adjustment writes in the following order: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. Set Register 0xEE to 0x81. Set Register 0xEF to 0x81. Set Register 0xEE to 0x82. Set Register 0xEF to 0x82. Set Register 0xEE to 0x83. Set Register 0xEF to 0x83. Set Register 0xEE to 0x84. Set Register 0xEF to 0x84. Set Register 0xEE to 0x85. Set Register 0xEF to 0x85. Set Register 0xEE to 0x86. Set Register 0xEF to 0x86. Set Register 0xEE to 0x87. Set Register 0xEF to 0x87. • • • • Multiframe 1: Begins with an /R/ character [K28.0] and ends with an /A/ character [K28.3]. Multiframe 2: Begins with an /R/ character followed by a /Q/ [K28.4] character, followed by link configuration parameters over 14 configuration octets (see Table 10), and ends with an /A/ character. Many of the values of the parameters are of the notation of the value – 1. Multiframe 3: Is the same as Multiframe 1. Multiframe 4: Is the same as Multiframe 1. Data Transmission Phase In the data transmission phase, frame alignment is monitored with control characters. Character replacement is used at the end of frames. Character replacement in the transmitter occurs in the following instances: JESD204B Synchronization Details The AD6673 supports JESD204B Subclass 0 and Subclass 1, and establishes synchronization of the link through one or two control signals, SYNC and, for Subclass 1, SYSREF, and a common device clock. SYSREF and SYNC are common to all converter devices for alignment purposes at the system level. • The synchronization process is accomplished over three phases: code group synchronization (CGS), initial lane alignment sequence (ILAS), and data transmission. If scrambling is enabled, the bits are not actually scrambled until the data transmission phase, and the CGS phase and ILAS phase do not use scrambling. Table 10. Fourteen Configuration Octets of the ILAS Phase CGS Phase In the CGS phase, the JESD204B transmit block transmits /K28.5/ characters. The receiver (external logic device) must locate K28.5 characters in its input data stream using clock and data recovery (CDR) techniques. When in Subclass 1 mode, the receiver locks on to the K28.5 characters. Once detected, the receiver initiates a SYSREF edge so that the AD6673 transmit data establishes an LMFC internally. The SYSREF edge also resets any sampling edges within the ADC to align sampling instances to the LMFC. This is important to maintain synchronization across multiple devices. At the internal clock of the next receiver, if Subclass 0, or at the LMFC boundary of the next receiver, if Subclass 1, the receiver or logic device deasserts the SYNC~ signal (SYNCINB± goes high), and the transmitter block begins the ILAS phase. ILAS Phase • No. 0 1 2 3 4 5 6 7 8 9 10 11 12 13 If scrambling is disabled and the last octet of the frame or multiframe equals the octet value of the previous frame. If scrambling is enabled and the last octet of the multiframe is equal to 0x7C, or the last octet of a frame is equal to 0xFC. Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 DID[7:0] Bit 2 Bit 1 Bit 0 (LSB) BID[3:0] LID[4:0] L[4:0] SCR F[7:0] K[4:0] M[7:0] CS[1:0] SUBCLASS[2:0] JESDV[2:0] HD N[4:0] N’[4:0] S[4:0] CF[4:0] Reserved, Don’t Care Reserved, Don’t Care FCHK[7:0] Link Setup Parameters The following sections demonstrate how to configure the AD6673 JESD204B interface paremeters. These details are a subset of the setup details provided in the Synchronization section. The steps to configure the output include the following: In the ILAS phase, the transmitter sends out a known pattern, and the receiver aligns all lanes of the link and verifies the parameters of the link. 1. 2. 3. 4. The ILAS phase begins after SYNC~ has been deasserted (goes high). If Subclass 0, the transmitter begins ILAS at the internal clock of the next transmitter. If Subclass 1, at the LMFC boundary of the next transmitter, the transmit block begins to 5. 6. Rev. C | Page 28 of 45 Disable the lanes before changing the configuration. Select the quick configuration option. Configure the detailed options. Verify FCHK, the checksum of the JESD204B interface parameters. Set additional digital output configuration options. Reenable the lane(s). Data Sheet AD6673 • Disable Lanes Before Changing Configuration Before modifying the JESD204B link parameters, disable the link and hold it in reset. This is accomplished by writing Logic 1 to Register 0x5F, Bit 0. The JESD204B specification also calls for the number of octets per multiframe (K × F) to be between 17 and 1024. The F value is fixed through the quick configuration setting to ensure that this relationship is true. Select Quick Configuration Option Table 11. JESD204B Configurable Identification Values Write to Register 0x5E, the 204B quick configuration register, to select the configuration options. See Table 13 for configuration options and resulting JESD204B parameter values. DID Value LID (Lane 0) LID (Lane 1) DID BID • • • • 0x11 = one converter, one lane 0x12 = one converter, two lanes 0x21 = two converters, one lane 0x22 = two converters, two lanes • Configure the tail bits and control bits. • • With N’ = 16 and N = 11, there are two bits available per sample for transmitting additional information over the JESD204B link. The options are tail bits or control bits. By default, tail bits of 0b00 value are used. Tail bits are dummy bits sent over the link to complete the two octets and do not convey any information about the input signal. Tail bits can be fixed zeros (default) or pseudorandom numbers (Register 0x5F, Bit 6). One or two control bits can be used instead of the tail bits through Register 0x72, Bits[7:6]. The tail bits can be set using Register 0x14, Bits[7:5], and tail bits can be enabled using Address 0x5F, Bit 6. Set lane identification values. • • • Per the JESD204B specification, a multiframe is defined as a group of K successive frames, where K is between 1 and 32, and it requires that the number of octets be between 17 and 1024. The K value is set to 32 by default in Register 0x70, Bits[7:0]. Note that the K value is the register value plus 1. The K value can be changed; however, it must comply with a few conditions. The AD6673 uses a fixed value for octets per frame [F] based on the JESD204B quick configuration setting. K must also be a multiple of 4 and conform to the following equation: 32 ≥ K ≥ Ceil (17/F) Scrambling can be enabled or disabled by setting Register 0x6E, Bit 7. By default, scrambling is enabled. Per the JESD204B protocol, scrambling is functional only after the lane synchronization has completed. Select lane synchronization options. Most of the synchronization features of the JESD204B interface are enabled by default for typical applications. In some cases, these features can be disabled or modified as follows: • ILAS enabling is controlled in Register 0x5F, Bits[3:2] and by default is enabled. Optionally, to support some unique instances of the interfaces (such as NMCDA-SL), the JESD204B interface can be programmed to either disable the ILAS sequence or continually repeat the ILAS sequence. The AD6673 has fixed values of some of the JESD204B interface parameters, and they are as follows: • JESD204B allows parameters to identify the device and lane. These parameters are transmitted during the ILAS phase, and they are accessible in the internal registers. There are three identification values: device identification (DID), bank identification (BID), and lane identification (LID). DID and BID are device specific; therefore, they can be used for link identification. Set number of frames per multiframe, K. • Value Range 0…31 0…31 0…255 0…15 Scramble, SCR. Configure Detailed Options • Register, Bits 0x67, [4:0] 0x68, [4:0] 0x64, [7:0] 0x65, [3:0] • • [N] = 11: number of bits per converter is 11, in Register 0x72, Bits[3:0]; Register 0x72 represents a value of N – 1. [N’] = 16: number of bits per sample is 16, in Register 0x73, Bits[3:0]; Register 0x73 represents a value of N' – 1. [CF] = 0: number of control words/frame clock cycle/ converter is 0, in Register 0x75, Bits[4:0]. Verify read only values: lanes per link (L), octets per frame (F), number of converters (M), and samples per converter per frame (S). The AD6673 calculates values for some JESD204B parameters based on other settings, particularly the quick configuration register selection. The read only values here are available in the register map for verification. • • • • • Rev. C | Page 29 of 45 [L] = lanes per link can be 1 or 2; read the values from Register 0x6E, Bit 0 [F] = octets per frame can be 1, 2, or 4; read the value from Register 0x6F, Bits[7:0] [HD] = high density mode can be 0 or 1; read the value from Register 0x75, Bit 7 [M] = number of converters per link can be 1 or 2; read value from Register 0x71, Bits[7:0] [S] = samples per converter per frame can be 1 or 2: read the value from Register 0x74, Bits[4:0] AD6673 Data Sheet Verify FCHK, Checksum of JESD204B Interface Parameters Additional Digital Output Configuration Options The JESD204B parameters can be verified through the checksum value [FCHK] of the JESD204B interface parameters. Each lane has an FCHK value associated with it. The FCHK value is transmitted during the ILAS second multiframe and can be read from the internal registers. Other data format controls include the following: The checksum value is the modulo 256 sum of the parameters listed in the No. column of Table 12. The checksum is calculated by adding the parameter fields before they are packed into the octets shown in Table 12. • The FCHK for the lane configuration for data coming out of Lane 0 can be read from Register 0x78. Similarly, the FCHK for the lane configuration for data coming out of Lane 1 can be read from Register 0x79. Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 DID[7:0] Bit 2 Bit 1 Invert the polarity of the serial output data: Register 0x60, Bit 1. ADC data format (offset binary, twos complement): Register 0x14, Bits[1:0]. Options for interpreting SYSREF± and SYNCINB± signals in Register 0x3A. See Table 14 for additional descriptions of Register 0x3A controls. Option to remap converter and lane assignments, Register 0x82 and Register 0x83. See Figure 49 for a simplified block diagram. • • Reenable Lanes After Configuration Table 12. JESD204B Configuration Table Used in ILAS and CHKSUM Calculation No. 0 1 2 3 4 5 6 7 8 9 10 • Bit 0 (LSB) After modifying the JESD204B link parameters, enable the link so that the synchronization process can begin. This is accomplished by writing Logic 0 to Register 0x5F, Bit 0. BID[3:0] LID[4:0] L[4:0] SCR F[7:0] K[4:0] M[7:0] CS[1:0] SUBCLASS[2:0] JESDV[2:0] N[4:0] N’[4:0] S[4:0] CF[4:0] AD6673 DUAL IF RECEIVER CONVERTER A INPUT CONVERTER A CONVERTER A SAMPLE A PRIMARY CONVERTER INPUT [0] PRIMARY LANE OUTPUT [0] SERDOUT0 LANE 0 JESD204B LANE CONTROL (M = 1, 2; L = 1, 2) B SECONDARY CONVERTER INPUT [1] SECONDARY LANE OUTPUT [1] LANE 1 LANE MUX (SPI REGISTER MAPPING: 0x82,0x83) A CONVERTER B INPUT SECONDARY CONVERTER INPUT [1] SECONDARY LANE OUTPUT [1] LANE 1 JESD204B LANE CONTROL (M = 1, 2; L = 1, 2) CONVERTER B CONVERTER B SAMPLE B PRIMARY CONVERTER INPUT [0] PRIMARY LANE OUTPUT [0] LANE 0 10632-045 SYSREF SERDOUT1 SYNCINB Figure 49. AD6673 Transmit Link Simplified Block Diagram Rev. C | Page 30 of 45 Data Sheet A PATH (LSB) JESD204B TEST PATTERN 10-BIT 8B/10B ENCODER/ CHARACTER REPLACEMENT OPTIONAL SCRAMBLER 1 + x14 + x15 A6 A7 A8 A9 A10 A11 A12 A13 C0 C1 A0 A1 A2 A3 A4 A5 S8 S9 S10 S11 S12 S13 S14 S15 S0 S1 S2 S3 S4 S5 S6 S7 SERDOUT± SERIALIZER E10 E11 E12 E13 E14 E15 E16 E17 E18 E19 E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 E19 . . . E9 E8 E7 E6 E5 E4 E3 E2 E1 E0 ~SYNC t SYSREF 10632-046 ADC VINA– JESD204B TEST PATTERN 8-BIT OCTET1 VINA+ A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 ADC TEST PATTERN 16-BIT OCTET0 (MSB) AD6673 Figure 50. AD6673 Digital Processing of JESD204B Lanes Table 13. AD6673 JESD204B Typical Configurations M (No. of Converters), Register 0x71, Bits[7:0] 1 1 2 2 DATA FROM ADC L (No. of Lanes), Register 0x6E, Bit 0 1 2 1 2 FRAME ASSEMBLER (ADD TAIL BITS) F (Octets/Frame), Register 0x6F, Bits[7:0], Read Only 2 1 4 2 OPTIONAL SCRAMBLER 1 + x14 + x15 S (Samples/ADC/Frame), Register 0x74, Bits[4:0], Read Only 1 1 1 1 8B/10B ENCODER TO RECEIVER HD (High Density Mode), Register 0x75, Bit 7, Read Only 0 1 0 0 10632-047 JESD204B Configure Setting 0x11 0x12 0x21 0x22 (Default) Figure 51. AD6673 ADC Output Data Path Table 14. AD6673 JESD204B Configuration Using Register 0x3A Bit 0 Bit Name Enable internal SYSREF± buffer 1 SYSREF± enable 2 SYSREF± mode Description This bit controls the on-chip buffer for SYSREF±. By default, this bit is 0, which disables the buffer. If the AD6673 is configured for JESD204B Subclass 1 operation, the SYSREF signal is required to align the JESD204B link and this bit must be set to 1. To avoid a false trigger as a result of transients that are caused when enabling the buffer (particularly for oneshot SYSREF signal configuration), set this bit first and then, in a consecutive SPI register write, configure all remaining bits in Register 0x3A to the desired JESD204B link configuration, including keeping this bit at 1. A setting of 0 (default) gates the SYSREF signal so that the internal logic is not affected by an external SYSREF signal. Set this bit to 0 when in Subclass 0, that is, when the SYSREF signal is not used. If using Subclass 1 with one-shot SYSREF± mode, enable the buffer while the SYSREF signal is established; however, it is recommended that the buffer be disabled during normal operation. If using Subclass 1 with continuous SYSREF± mode, keep the buffer enabled for normal operation. This bit can be used to enable the circuitry that uses the SYSREF± input signal and must be on to enable Subclass 1 operation. Set this bit to 1 when using JESD204B Subclass 1 operation. This bit is self clearing after a valid SYSREF± occurs when the SYSREF± mode bit (Register 0x3A, Bit 2) is set to 1 (configured for one-shot SYSREF± operation). The SYSREF signal is still used in some digital circuitry even if this bit is 0. To disable the SYSREF± signal internally, Register 0x3A, Bit 0 must be set to 0. This bit is used in Subclass 1 operation to define one-shot or continuous SYSREF± mode. To configure continuous (or gapped periodic) SYSREF± mode, this bit is set to 0. For one-shot operation, this bit is set to 1. In one-shot mode, it is recommended that the SYSREF buffer be disabled after the SYSREF signal has occurred by setting Register 0x3A[0] to 0. Rev. C | Page 31 of 45 AD6673 Data Sheet Bit 3 Bit Name Realign on SYSREF±; for Subclass 1 only 4 Realign on SYNCINB±; for Subclass 1 only Description When this bit is set to 1 and an active SYSREF signal occurs, the internal clock alignment for the JESD204B timing is forced. Setting this bit is only recommended for one-shot mode and must be done only prior to initially establishing a link. This bit resets the JESD204B link on the active SYSREF signal and requires additional clock alignment register writes after realignment to properly set up the timing margin over temperature. See the Synchronization section for the clock alignment procedure. For continuous SYSREF± mode, this bit must be set to 0 during normal operation. When this bit is set to 1 and an active SYNC occurs, the internal clock alignment for the JESD204B timing is forced. An active SYNC requires an SYNCINB± input to be logic low for at least four consecutive LMFCs. Table 15. AD6673 JESD204B Frame Alignment Monitoring and Correction Replacement Characters Character to be Replaced Last octet in frame repeated from previous frame Last octet in frame repeated from previous frame Last octet in frame repeated from previous frame Last octet in frame equals D28.7 Last octet in frame equals D28.3 Last octet in frame equals D28.7 Last Octet in Multiframe No Yes Not applicable No Yes Not applicable Frame and Lane Alignment Monitoring and Correction Frame alignment monitoring and correction is part of the JESD204B specification. The 11-bit word requires two octets to transmit all the data. The two octets (MSB and LSB), where F = 2, make up a frame. During normal operating conditions, frame alignment is monitored via alignment characters, which are inserted under certain conditions at the end of a frame. Table 15 summarizes the conditions for character insertion along with the expected characters under the various operation modes. If lane synchronization is enabled, the replacement character value depends on whether the octet is at the end of a frame or at the end of a multiframe. Based on the operating mode, the receiver can ensure that it is still synchronized to the frame boundary by correctly receiving the replacement characters. Digital Outputs and Timing The AD6673 has differential digital outputs that power up by default. The driver current is derived on-chip and sets the output current at each output equal to a nominal 4 mA. Each output presents a 100 Ω dynamic internal termination to reduce unwanted reflections. Place a 100 Ω differential termination resistor at each receiver input to result in a nominal 300 mV peak-to-peak swing at the receiver (see Figure 52). Alternatively, single-ended 50 Ω termination can be used. When single-ended termination is used, the termination voltage should be DRVDD/2; otherwise, ac coupling capacitors can be used to terminate to any singleended voltage. Replacement Character K28.7 K28.3 K28.7 K28.7 K28.3 K28.7 VRXCM DRVDD 100Ω DIFFERENTIAL 0.1µF TRACE PAIR SERDOUTx+ 100Ω OR RECEIVER SERDOUTx– 0.1µF OUTPUT SWING = VOD (SEE TABLE 3) VCM = Rx VCM 10632-048 Lane Synchronization On On Off On On Off Figure 52. AC-Coupled Digital Output Termination Example The AD6673 digital outputs can interface with custom ASICs and FPGA receivers, providing superior switching performance in noisy environments. Single point-to-point network topologies are recommended with a single differential 100 Ω termination resistor placed as close to the receiver logic as possible. The common mode of the digital output automatically biases itself to half the supply of the receiver (that is, the common-mode voltage is 0.9 V for a receiver supply of 1.8 V) if dc-coupled connecting is used (see Figure 53). For receiver logic that is not within the bounds of the DRVDD supply, use an ac-coupled connection. Simply place a 0.1 µF capacitor on each output pin and derive a 100 Ω differential termination close to the receiver side. DRVDD 100Ω DIFFERENTIAL TRACE PAIR SERDOUTx+ 100Ω RECEIVER SERDOUTx– OUTPUT SWING = VOD (SEE TABLE 3) VCM = DRVDD/2 Figure 53. DC-Coupled Digital Output Termination Example Rev. C | Page 32 of 45 10632-049 Scrambling Off Off Off On On On Data Sheet AD6673 Using the SPI port, the user can provide a threshold above which the FD output is active. Bit 0 of Register 0x45 enables the fast detect feature. Register 0x47 to Register 0x4B allow the user to set the threshold levels. As long as the signal is below the selected threshold, the FD output remains low. In this mode, the magnitude of the data is considered in the calculation of the condition, but the sign of the data is not considered. The threshold detection responds identically to positive and negative signals outside the desired range (magnitude). If there is no far-end receiver termination, or if there is poor differential trace routing, timing errors may result. To avoid such timing errors, it is recommended that the trace length be less than six inches, and that the differential output traces be close together and at equal lengths. Figure 54 shows an example of the digital output (default) data eye and time interval error (TIE) jitter histogram and bathtub curve for the AD6673 lane running at 5 Gbps. Additional SPI options allow the user to further increase the output driver voltage swing of all four outputs to drive longer trace lengths (see Register 0x15 in Table 17). The power dissipation of the DRVDD supply increases when this option is used. See the Memory Map section for more details. ADC OVERRANGE (OR) The ADC overrange indicator is asserted when an overrange is detected on the input of the ADC. The overrange condition is determined at the output of the ADC pipeline and, therefore, is subject to a latency of 36 ADC clock cycles. An overrange at the input is indicated by this bit 36 clock cycles after it occurs. The format of the output data is twos complement by default. To change the output data format to offset binary, see the Memory Map section (Register 0x14 in Table 17). GAIN SWITCHING ADC OVERRANGE AND GAIN CONTROL The AD6673 includes circuitry that is useful in applications either where large dynamic ranges exist, or where gain ranging amplifiers are employed. This circuitry allows digital thresholds to be set such that an upper threshold and a lower threshold can be programmed. In receiver applications, it is desirable to have a mechanism to reliably determine when the converter is about to be clipped. The standard overflow indicator provides delayed information on the state of the analog input that is of limited value in preventing clipping. Therefore, it is helpful to have a programmable threshold below full scale that allows time to reduce the gain before the clip occurs. In addition, because input signals can have significant slew rates, latency of this function is of concern. HEIGHT1: EYE DIAGRAM 400 1 3 – 6000 200 TJ@BER1: BATHTUB 2 – 300 – 1–2 1–4 5000 100 1–6 0 4000 BER HITS 1–8 3000 –100 1–10 2000 –200 –300 1–12 1000 1–14 EYE: TRANSITION BITS OFFSET: –0.0072 –400 UIs: 8000; 999992 TOTAL: 8000.999992 –200 –100 0 TIME (ps) 100 0 200 –10 0 TIME (ps) 10 1–16 –0.5 0.78 UI 0 UIs Figure 54. AD6673 Digital Outputs Data Eye, Histogram, and Bathtub, External 100 Ω Terminations at 5 Gbps Rev. C | Page 33 of 45 0.5 10632-050 VOLTAGE (mV) PERIOD1: HISTOGRAM 7000 1 One such use is to detect when an ADC is about to reach full scale with a particular input condition. The result is to provide an indicator that can be used to quickly insert an attenuator that prevents ADC overdrive. AD6673 Data Sheet Fast Threshold Detection (FDA and FDB) detect lower threshold register is a 16-bit register that is compared with the signal magnitude at the output of the ADC. This comparison is subject to the ADC pipeline latency but is accurate in terms of converter resolution. The lower threshold magnitude is defined by The FD indicator is asserted if the input magnitude exceeds the value programmed in the fast detect upper threshold registers, located in Register 0x47 and Register 0x48. The selected threshold register is compared with the signal magnitude at the output of the ADC. The fast upper threshold detection has a latency of 4 clock cycles. The approximate upper threshold magnitude is defined by Lower Threshold Magnitude (dBFS) = 20 log (Threshold Magnitude/216) The dwell time can be programmed from 1 to 65,535 sample clock cycles by placing the desired value in the fast detect dwell time registers, located in Register 0x4B and Register 0x4C. Upper Threshold Magnitude (dBFS) = 20 log (Threshold Magnitude/216) The FD indicators are not cleared until the signal drops below the lower threshold for the programmed dwell time. The lower threshold is programmed in the fast detect lower threshold registers, located at Register 0x49 and Register 0x4A. The fast The operation of the upper threshold and lower threshold registers, along with the dwell time registers, is shown in Figure 55. UPPER THRESHOLD DWELL TIME LOWER THRESHOLD DWELL TIME FDA OR FDB Figure 55. Threshold Settings for FDA and FDB Signals Rev. C | Page 34 of 45 TIMER COMPLETES BEFORE SIGNAL RISES ABOVE LT 10632-051 MIDSCALE TIMER RESET BY RISE ABOVE LT Data Sheet AD6673 DC CORRECTION Because the dc offset of the ADC may be significantly larger than the signal being measured, a dc correction circuit is included to null the dc offset before measuring the power. The dc correction circuit can also be switched into the main signal path; however, this may not be appropriate if the ADC is digitizing a time-varying signal with significant dc content, such as GSM. DC CORRECTION BANDWIDTH The dc correction circuit is a high-pass filter with a programmable bandwidth (ranging between 0.29 Hz and 2.387 kHz at 245.76 MSPS). The bandwidth is controlled by writing to the 4-bit dc correction bandwidth select register, located at Register 0x40, Bits[5:2]. The following equation can be used to compute the bandwidth value for the dc correction circuit: DC CORRECTION READBACK The current dc correction value can be read back in Register 0x41 and Register 0x42 for each channel. The dc correction value is a 16-bit value that can span the entire input range of the ADC. DC CORRECTION FREEZE Setting Bit 6 of Register 0x40 freezes the dc correction at its current state and continues to use the last updated value as the dc correction value. Clearing this bit restarts dc correction and adds the currently calculated value to the data. DC CORRECTION (DCC) ENABLE BITS Setting Bit 1 of Register 0x40 enables dc correction for use in the output data signal path. DC_Corr_BW = 2−k−14 × fCLK/(2 × π) where: k is the 4-bit value programmed in Bits[5:2] of Register 0x40 (values between 0 and 13 are valid for k). fCLK is the AD6673 ADC sample rate in hertz. Rev. C | Page 35 of 45 AD6673 Data Sheet SERIAL PORT INTERFACE (SPI) The AD6673 SPI allows the user to configure the converter for specific functions or operations through a structured register space provided inside the ADC. The SPI gives the user added flexibility and customization, depending on the application. Addresses are accessed via the serial port and can be written to or read from via the port. Memory is organized into bytes that can be further divided into fields. These fields are documented in the Memory Map section. For detailed operational information, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. CONFIGURATION USING THE SPI Three pins define the SPI of this ADC: the SCLK pin, the SDIO pin, and the CS pin (see Table 16). The SCLK (serial clock) pin is used to synchronize the read and write data presented from/to the ADC. The SDIO (serial data input/output) pin is a dual-purpose pin that allows data to be sent and read from the internal ADC memory map registers. The CS (chip select bar) pin is an active low control that enables or disables the read and write cycles. Table 16. Serial Port Interface Pins Pin SCLK SDIO CS Function Serial Clock. The serial shift clock input, which is used to synchronize serial interface, reads and writes. Serial Data Input/Output. A dual-purpose pin that typically serves as an input or an output, depending on the instruction being sent and the relative position in the timing frame. Chip Select Bar. An active low control that gates the read and write cycles. The falling edge of CS, in conjunction with the rising edge of SCLK, determines the start of the framing. An example of the serial timing and its definitions can be found in Figure 56 and Table 5. Other modes involving CS are available. CS can be held low indefinitely, which permanently enables the device; this is called streaming. CS can stall high between bytes to allow for additional external timing. When CS is tied high, SPI functions are placed in a high impedance mode. This mode turns on any SPI pin secondary functions. All data is composed of 8-bit words. The first bit of each individual byte of serial data indicates whether a read or write command is issued. This allows the SDIO pin to change direction from an input to an output. In addition to word length, the instruction phase determines whether the serial frame is a read or write operation, allowing the serial port to be used both to program the chip and to read the contents of the on-chip memory. If the instruction is a readback operation, performing a readback causes the SDIO pin to change direction from an input to an output at the appropriate point in the serial frame. Data can be sent in MSB first mode or in LSB first mode. MSB first is the default on power-up and can be changed via the SPI port configuration register. For more information about this and other features, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. HARDWARE INTERFACE The pins described in Table 16 comprise the physical interface between the user programming device and the serial port of the AD6673. The SCLK pin and the CS pin function as inputs when using the SPI interface. The SDIO pin is bidirectional, functioning as an input during write phases and as an output during readback. The SPI interface is flexible enough to be controlled by either FPGAs or microcontrollers. One method for SPI configuration is described in detail in the AN-812 Application Note, Microcontroller-Based Serial Port Interface (SPI) Boot Circuit. Do not activate the SPI port during periods when the full dynamic performance of the converter is required. Because the SCLK signal, the CS signal, and the SDIO signal are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD6673 to prevent these signals from transitioning at the converter inputs during critical sampling periods. During an instruction phase, a 16-bit instruction is transmitted. Data follows the instruction phase, and its length is determined by the W0 and the W1 bits. Rev. C | Page 36 of 45 Data Sheet AD6673 SPI ACCESSIBLE FEATURES Table 17 provides a brief description of the general features that are accessible via the SPI. These features are described in detail in the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. The AD6673 part-specific features are described in the Memory Map Register Description section. Table 17. Features Accessible Using the SPI Feature Name Mode Clock Offset Test I/O Output Mode Output Phase Output Delay VREF Description Allows the user to set either power-down mode or standby mode Allows the user to access the DCS via the SPI Allows the user to digitally adjust the converter offset Allows the user to set test modes to have known data on output bits Allows the user to set up outputs Allows the user to set the output clock polarity Allows the user to vary the DCO delay Allows the user to set the reference voltage tDS tS tHIGH tH tCLK tDH tLOW CS SDIO DON’T CARE DON’T CARE R/W W1 W0 A12 A11 A10 A9 A8 A7 D5 Figure 56. Serial Port Interface Timing Diagram Rev. C | Page 37 of 45 D4 D3 D2 D1 D0 DON’T CARE 10632-052 SCLK DON’T CARE AD6673 Data Sheet MEMORY MAP READING THE MEMORY MAP REGISTER TABLE Logic Levels Each row in the memory map register table has eight bit locations. The memory map is roughly divided into three sections: the chip configuration registers (Address 0x00 to Address 0x02); the channel index and transfer registers (Address 0x05 and Address 0xFF); and the ADC functions registers, including setup, control, and test (Address 0x08 to Address 0xA8). An explanation of logic level terminology follows: The memory map register table (see Table 18) documents the default hexadecimal value for each hexadecimal address shown. The column with the heading Bit 7 (MSB) is the start of the default hexadecimal value given. For example, Address 0x14, the output mode register, has a hexadecimal default value of 0x01. This means that Bit 0 = 1, and the remaining bits are 0s. This setting is the default output format value, which is twos complement. For more information on this function and others, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. This document details the functions controlled by Register 0x00 to Register 0x25. The remaining registers, Register 0x3A and Register 0x59, are documented in Table 18. Open and Reserved Locations All address and bit locations that are not included in Table 18 are not currently supported for this device. Unused bits of a valid address location should be written with 0s. Writing to these locations is required only when part of an address location is open (for example, Address 0x18). If the entire address location is open (for example, Address 0x13), do not write to this address location. Default Values After the AD6673 is reset, critical registers are loaded with default values. The default values for the registers are given in the memory map register table, Table 18. • • “Bit is set” is synonymous with “bit is set to Logic 1” or “writing Logic 1 for the bit.” “Clear a bit” is synonymous with “bit is set to Logic 0” or “writing Logic 0 for the bit.” Transfer Register Map Address 0x09, Address 0x0B, Address 0x14, Address 0x18, and Address 0x3A to Address 0x4C are shadowed. Writes to these addresses do not affect part operation until a transfer command is issued by writing 0x01 to Address 0xFF, setting the transfer bit. This allows these registers to be updated internally and simultaneously when the transfer bit is set. The internal update takes place when the transfer bit is set, and then the bit autoclears. Channel-Specific Registers Some channel setup functions, such as the signal monitor thresholds, can be programmed to a different value for each channel. In these cases, channel address locations are internally duplicated for each channel. These registers and bits are designated in Table 18 as local. These local registers and bits can be accessed by setting the appropriate Channel A or Channel B bits in Register 0x05. If both bits are set, the subsequent write affects the registers of both channels. In a read cycle, only Channel A or Channel B should be set to read one of the two registers. If both bits are set during an SPI read cycle, the part returns the value for Channel A. Registers and bits designated as global in Table 18 affect the entire part and the channel features for which independent settings are not allowed between channels. The settings in Register 0x05 do not affect the global registers and bits. Rev. C | Page 38 of 45 Data Sheet AD6673 MEMORY MAP REGISTER TABLE All address and bit locations that are not included in Table 18 are not currently supported for this device. Table 18. Memory Map Registers Reg Addr (Hex) 0x00 0x01 Register Name Global SPI config CHIP ID Bit 7 (MSB) 0 0x02 Chip info 0x05 Channel index 0x08 PDWN modes 0x09 Global clock Reserved 0x0A PLL status PLL locked status 0x0B Global clock divider 0x0D Test control register Bit 6 LSB first Bit 5 Soft reset Bit 4 1 Bit 3 1 Bit 2 Soft reset Bit 1 LSB first Bit 0 (LSB) 0 AD6673 8-bit CHIP ID is 0xBA Speed grade 00 = 250 MSPS JTX in standby; 0 = 204B core is unaffected in standby; 1 = 204B core is powered down except for PLL during standby Clock selection: 00 = Nyquist clock 10 = RF clock divide by 4 11 = clock off External PDWN mode; 0= PDWN is full power down; 1= PDWN puts device in standby User test mode cycle; 00 = repeat pattern (User Pattern 1, 2, 3, 4, 1, 2, 3, 4, 1, …); 10 = single pattern (User Pattern 1, 2, 3, 4, then all zeros) [LOCAL] Reserved for chip die revision currently 0x0 SPI write to SPI write ADC A path to ADC B path Chip power modes; JESD204B power 00 = normal mode modes; (power up); 00 = normal mode 01 = power-down mode, (power up); digital datapath clocks 01 = power-down disabled, digital datapath mode: PLL off, serializer held in reset; most analog off, clocks stopped, paths powered off; digital held in reset; 10 = standby mode; 10 = standby mode: PLL digital datapath clocks on, serializer off, clocks disabled, digital datapath stopped, digital held in held in reset, some reset analog paths powered off [LOCAL] Clock duty cycle stabilizer enable 204B link is ready Clock divider ratio relative to the encode Clock divide phase relative to the clock; encode clock; 0x00 = divide by 1; 0x0 = 0 input clock cycles delayed; 0x01 = divide by 2; 0x1 = 1 input clock cycles delayed; 0x02 = divide by 3; 0x2 = 2 input clock cycles delayed; … … 0x7 = divide by 8; 0x7 = 7 input clock cycles delayed using a CLKDIV_DIVIDE_RATIO > 0 (Divide Ratio > 1) causes the DCS to be automatically enabled Data output test generation mode; Short Long 0000 = off (normal mode); pseudopseudo0001 = midscale short; random random 0010 = positive full scale; number number 0011 = negative full scale; generator generator 0100 = alternating checker board; reset; reset; 0101 = PN sequence long; 0 = short 0 = long 0110 = PN sequence short; PRN PRN 0111 = 1/0 word toggle; enabled; enabled; 1000 = user test mode (use with Register 0x0D, Bit 7 1 = short 1 = long and User Pattern 1, 2, 3, 4); PRN held PRN held 1001 to 1110 = unused; in reset in reset 1111 = ramp output [LOCAL] [LOCAL] [LOCAL] Rev. C | Page 39 of 45 Default 0x18 Notes 0xBA Read only 0x00 0x03 0x00 0x01 0x00 0x00 DCS enabled if clock divider enabled Read only AD6673 Reg Addr (Hex) 0x10 Register Name Offset adjust (local) 0x14 Output mode 0x15 CML output adjust 0x18 ADC VREF 0x19 User Test Pattern 1 L User Test Pattern 1 M User Test Pattern 2 L User Test Pattern 2 M User Test Pattern 3 L User Test Pattern 3 M User Test Pattern 4 L User Test Pattern 4 M PLL low encode 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x20 0x21 0x24 0x25 Data Sheet Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB) Offset adjust in LSBs from +31 to −32 (twos complement format); 01 1111 = adjust output by +31; 01 1110 = adjust output by +30; … 00 0001 = adjust output by +1; 00 0000 = adjust output by 0 (default); … 10 0001 = adjust output by −31; 10 0000 = adjust output by −32 [LOCAL] Digital datapath output Invert ADC Disable JTX CS bits assignment (in data format select (DFS) data; output conjunction with Register 0x72) (local); 0 = normal from ADC 000 = {overrange||underrange, valid} 00 = offset binary; (default); 001 = {overrange||underrange} 01 = twos complement 1= 010 = {overrange||underrange, blank} [LOCAL] inverted 011 = {blank, valid} [LOCAL] 100 = {blank, blank} All others = {overrange||underrange, valid} JESD204B CML differential output drive level adjustment; 000 = 81% of nominal (that is, 478 mV); 001 = 89% of nominal (that is, 526 mV); 010 = 98% of nominal (that is, 574 mV); 011 = nominal [default] (that is, 588 mV); 110 = 126% of nominal (that is, 738 mV) Main reference full-scale VREF adjustment; 0 1111 = internal 2.087 V p-p; … 0 0001 = internal 1.772 V p-p; 0 0000 = internal 1.75 V p-p (default); 1 1111 = internal 1.727 V p-p; … 1 0000 = internal 1.383 V p-p User Test Pattern 1 LSB; use in conjunction with Register 0x0D and Register 0x61 Default 0x00 0x01 0x03 0x00 0x00 User Test Pattern 1 MSB 0x00 User Test Pattern 2 LSB 0x00 User Test Pattern 2 MSB 0x00 User Test Pattern 3 LSB 0x00 User Test Pattern 3 MSB 0x00 User Test Pattern 4 LSB 0x00 User Test Pattern 4 MSB 0x00 00 = for lane speeds > 2 Gbps; 01 = for lane speeds < 2 Gbps 0x00 BIST MISR_LSB BIST MISR_MSB 0x00 0x00 Rev. C | Page 40 of 45 Notes Read only Read only Data Sheet Reg Addr (Hex) 0x3A Register Name SYNCINB±/ SYSREF± CTRL 0x3C NSR CTRL 0x3E NSR tuning 0x40 DCC CTRL 0x41 DCC value LSB DCC value MSB Fast detect control 0x42 0x45 0x47 0x48 0x49 0x4A 0x4B 0x4C 0x5E FD upper threshold FD upper threshold FD lower threshold FD lower threshold FD dwell time FD dwell time 204B quick config AD6673 Bit 7 (MSB) Bit 6 Freeze dc correction; 0= calculate; 1 = freeze value Bit 5 Bit 4 Realign on SYNCINB±; for Subclass 1 only: 0 = normal mode; 1 = realign lanes on every active SYNCINB± Bit 3 Realign on SYSREF±; for Subclass 1 only: 0 = normal mode; 1= realign lanes on every active SYSREF±; use with one-shot SYSREF in Subclass 1 mode Bit 2 SYSREF± mode; 0= continuous reset clock dividers; 1 = sync on next SYSREF± rising edge only Bit 1 SYSREF± enable; 0= disabled; 1= enabled NOTE: This bit will self-clear after SYSREF if SYSREF± mode = 1 Bit 0 (LSB) Enable internal SYSREF± buffer; 0 = buffer disabled, external SYSREF± pin ignored; 1 = buffer enabled, use external SYSREF± signal Bandwidth NSR enable mode; 0 = 22%; 1 = 33% Noise shaped requantizer tuning frequency; selects the center frequency of the noise transfer function (NTF); 57 possible tuning words (TW) exist; each step is 0.5% of the ADC sample rate Enable DC correction bandwidth select; DCC correction bandwidth is 2387.32 Hz/reg value; there are 14 possible values; 0000 = 2387.32 Hz; 0001 = 1193.66 Hz; 1101 = 0.29 Hz DC Correction Value[7:0] DC Correction Value[15:8] Force value of FDA/FDB pins; if force pins is true, this value is output on FD pins Fast Detect Upper Threshold[7:0] Pin function; 0 = fast detect; 1= overrange Force FDA/FDB pins; 0= normal function; 1 = force to value Default 0x00 0x00 0x1C 0x00 0x00 0x00 Enable fast detect output Fast Detect Upper Threshold[14:8] Fast Detect Lower Threshold[7:0] Fast Detect Lower Threshold[14:8] 0x00 0x00 0x00 0x00 0x00 Fast Detect Dwell Time[7:0] 0x00 Fast Detect Dwell Time[15:8] 0x00 Quick configuration register, always reads back 0x00; 0x11 = M = 1, L = 1; one converter, one lane; second converter is not automatically powered down; 0x12 = M = 1, L = 2; one converter, two lanes; second converter is not automatically powered down; 0x21 = M = 2, L = 1; two converters, one lane; 0x22 = M = 2, L = 2; two converters, two lanes 0x00 Rev. C | Page 41 of 45 Notes Always reads back 0x00 AD6673 Reg Addr (Hex) 0x5F Data Sheet Register Name 204B Link CTRL 1 Bit 7 (MSB) 0x60 204B Link CTRL 2 Reserved; set to 0 Bit 6 Tail bits: If CS bits are not enabled, 0 = extra bits are 0; 1 = extra bits are 9-bit PN Reserved; set to 0 0x61 204B Link CTRL 3 Reserved; set to 0 Reserved; set to 0 0x62 204B Link CTRL 4 204B Link CTRL 5 204B DID config 204B BID config 204B LID config 0 204B LID config 1 204B parameters SCR/L 0x63 0x64 0x65 0x66 0x67 0x6E 0x6F 0x70 0x71 0x72 204B parameters, F 204B parameters, K 204B parameters, M 204B parameters, CS/N Bit 5 JESD204B test sample enabled Bit 4 Reserved; set to 1 Reserved; set to 0 Test data injection point; 01 = 10-bit data at 8b/10b output; 10 = 8-bit data at scrambler input Bit 3 Bit 2 ILAS mode; 01 = ILAS normal mode enabled; 11 = ILAS always on, test mode Bit 1 Reserved; set to 1 Bit 0 (LSB) Powerdown JESD204B link; set high while configuring link parameters Invert logic of JESD204B bits JESD204B test mode patterns; 0000 = normal operation (test mode disabled); 0001 = alternating checker board; 0010 = 1/0 word toggle; 0011 = PN sequence PN23; 0100 = PN sequence PN9; 0101= continuous/repeat user test mode; 0110 = single user test mode; 0111 = reserved; 1000 = modified RPAT test sequence, must be used with JTX_TEST_GEN_SEL = 01 (output of 8b/10b); 1100 = PN sequence PN7; 1101 = PN sequence PN15; other settings are unused Reserved Default 0x14 0x00 0x00 0x00 Reserved 0x00 JESD204B DID value 0x00 JESD204B BID value 0x00 Lane 0 LID value 0x00 Lane 1 LID value 0x01 JESD204B lanes (L); 0 = 1 lane; 1 = 2 lanes JESD204B scrambling (SCR); 0= disabled; 1= enabled 0x81 JESD204B number of octets per frame (F); calculated value [Note that this value is in x – 1 format] 0x01 JESD204B number of frames per multiframe (K); set value of K per JESD204B specifications, but also must be a multiple of 4 octets [Note that this value is in x – 1 format] JESD204B number of converters (M); 0 = 1 converter; 1 = 2 converters ADC converter resolution (N), Number of control bits 0xA = 11-bit converter (N = 11) (CS); 00 = no control bits (CS = 0); 01 = 1 control bit (CS = 1); 10 = 2 control bits (CS = 2) 0x1F Rev. C | Page 42 of 45 Notes 0x01 0x0A Read Only Data Sheet Reg Addr (Hex) 0x73 0x74 0x75 0x76 0x77 0x78 0x79 0x82 Register Name 204B parameters, subclass/Np 204B parameters, S 204B parameters, HD and CF 204B RESV1 204B RESV2 204B CHKSUM0 204B CHKSUM1 204B Lane Assign 1 AD6673 Bit 7 (MSB) Bit 6 Bit 5 JESD204B subclass; 0x0 = Subclass 0; 0x1 = Subclass 1 (default) Reserved; set to 1 JESD204B HD value; read only Bit 4 Bit 3 Bit 2 Bit 1 JESD204B N’ value; 0xF = N’ = 16 Bit 0 (LSB) Default 0x2F JESD204B samples per converter frame cycle (S); read only [Note that this value is in x – 1 format] 0x20 JESD204B control words per frame clock cycle per link (CF); read only 0x00 Reserved Field Number 1 Reserved Field Number 2 JESD204B serial checksum value for Lane 0 Notes Read Only 0x00 0x00 JESD204B serial checksum value for Lane 1 Reserved; set to 1 00 = assign Logical Lane 0 to Physical Lane A [default]; 01 = assign Logical Lane 0 to Physical Lane B Reserved; Reserved; set to 1 set to 1 0x83 204B Lane Assign 2 0x8B 204B LMFC offset 0xA8 204B preemphasis 0xEE Internal digital clock delay Enable internal clock delay 0xEF Internal digital clock delay Enable internal clock delay 0xF3 Internal digital clock alignment 0xFF Device update (global) Reserved; set to 0 00 = assign Logical Lane 1 to Physical Lane A; 01 = assign Logical Lane 1 to Physical Lane B (default) Local multiframe clock (LMFC) phase offset value; reset value for LMFC phase counter when SYSREF is asserted; used for deterministic delay applications JESD204B preemphasis enable option (consult factory for more detail); set value to 0x04 for preemphasis off; set value to 0x14 for preemphasis on Use incrementing values from 0 to 7 to increase Set to 0 Set to 0 Set to 0 internal digital clock delay; for internal data latching purposes, this does not affect external timing Set to 0 Set to 0 Set to 0 Force manual realignment on Lane 1, self clearing Lane 1 alignment complete Use incrementing values from 0 to 7 to increase internal digital clock delay; for internal data latching purposes, this does not affect external timing Force manual realignment on Lane 0, self clearing Lane 0 alignment complete For more information on functions controlled in Register 0x00 to Register 0x25, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. Rev. C | Page 43 of 45 0x31 0x00 0x04 0x00 0x00 0x14 Transfer settings MEMORY MAP REGISTER DESCRIPTION 0x02 Typically not required See the Synchronization section for use See the Synchronization section for use See the Synchronization section for use AD6673 Data Sheet APPLICATIONS INFORMATION DESIGN GUIDELINES Before starting system level design and layout of the AD6673, it is recommended that the designer become familiar with these guidelines, which discuss the special circuit connections and layout requirements needed for certain pins. Power and Ground Recommendations When connecting power to the AD6673, use two separate 1.8 V power supplies. The power supply for AVDD can be isolated and for DVDD and DRVDD it can be tied together, in which case isolation between DVDD and DRVDD is required. Isolation can be achieved using a ferrite bead or an inductor of approximately 1 µH. An unfiltered switching regulator is not recommended for the DRVDD supply as it impacts the performance of the JESD204B serial transmission lines and may result in link problems. Alternately, the JESD204B PHY power (DRVDD) and analog (AVDD) supplies can be tied together, and a separate supply can be used for the digital outputs (DVDD). exposed (no solder mask) copper plane on the PCB to the AD6673 exposed paddle, Pin 0. The copper plane must have several vias to achieve the lowest possible resistive thermal path for heat dissipation to flow through the bottom of the PCB. Fill or plug these vias with nonconductive epoxy. To maximize the coverage and adhesion between the ADC and the PCB, overlay a silkscreen to partition the continuous plane on the PCB into several uniform sections. This provides several tie points between the ADC and the PCB during the reflow process. Using one continuous plane with no partitions guarantees only one tie point between the ADC and the PCB. See the evaluation board for a PCB layout example. For detailed information about the packaging and PCB layout of chip scale packages, refer to the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). VCM The designer can employ several different decoupling capacitors to cover both high and low frequencies. Locate these capacitors close to the point of entry at the PC board level and close to the pins of the part with minimal trace length. Each power supply domain must have local high frequency decoupling capacitors. This is especially important for DRVDD and AVDD to maintain analog performance. Decouple the VCM pin to ground with a 0.1 μF capacitor, as shown in Figure 29. For optimal channel-to-channel isolation, include a 33 Ω resistor between the AD6673 VCM pin and the Channel A analog input network connection, as well as between the AD6673 VCM pin and the Channel B analog input network connection. When using the AD6673, a single PCB ground plane is sufficient. With proper decoupling and smart partitioning of the PCB analog, digital, and clock sections, optimum performance is easily achieved. When the full dynamic performance of the converter is required, do not activate the SPI port during periods. Because the SCLK, CS, and SDIO signals are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD6673 to keep these signals from transitioning at the converter input pins during critical sampling periods. Exposed Paddle Thermal Heat Slug Recommendations It is mandatory that the exposed paddle on the underside of the ADC be connected to analog ground (AGND) to achieve the best electrical and thermal performance. Mate a continuous, SPI Port Rev. C | Page 44 of 45 Data Sheet AD6673 OUTLINE DIMENSIONS 0.30 0.25 0.20 PIN 1 INDICATOR 37 36 48 1 0.50 BSC TOP VIEW 0.80 0.75 0.70 0.50 0.40 0.30 5.60 SQ 5.50 13 BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.203 REF SEATING PLANE *5.70 EXPOSED PAD 24 PIN 1 INDICATOR 0.20 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. *COMPLIANT TO JEDEC STANDARDS MO-220-WKKD-2 WITH THE EXCEPTION OF THE EXPOSED PAD DIMENSION. 10-15-2015-D 7.10 7.00 SQ 6.90 Figure 57. 48-Lead Lead Frame Chip Scale Package [LFCSP] 7 mm × 7 mm Body and 0.75 mm Package Height (CP-48-13) Dimensions shown in millimeters ORDERING GUIDE Model1 AD6673BCPZ-250 AD6673BCPZRL7-250 AD6673-250EBZ 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 48-Lead Lead Frame Chip Scale Package [LFCSP] 48-Lead Lead Frame Chip Scale Package [LFCSP] Evaluation Board with AD6673-250 Z = RoHS Compliant Part. ©2012–2015 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10632-0-12/15(C) Rev. C | Page 45 of 45 Package Option CP-48-13 CP-48-13