TI CD74HC243MTE4 High-speed cmos logic quad-bus transceiver with three-state output Datasheet

[ /Title
(CD74
HCT24
2,
CD74
HC243
,
CD74
HCT24
3)
/Subject
(High
Speed
CMOS
Logic
Quad-
Data sheet acquired from Harris Semiconductor
SCHS168D
November 1997 - Revised October 2003
CD54HC243, CD74HC243,
CD54HCT243, CD74HCT243
High-Speed CMOS Logic
Quad-Bus Transceiver with Three-State Outputs
Features
Description
• Typical Propagation Delay (A to B, B to A) of 7ns at
VCC = 5V, CL = 15pF, TA = 25oC
The ’HC243 and ’HCT243 silicon-gate CMOS three-state
bidirectional noninverting buffers are intended for two-way
asynchronous communication between data buses. They
have high-drive-current outputs that enable high-speed operation when driving large bus capacitances. These circuits
possess the low power dissipation of CMOS circuits and
have speeds comparable to low-power Schottky TTL circuits.
They can drive 15 LSTTL loads.
• Three-State Outputs
• Buffered Inputs
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55oC to 125oC
The states of the output-enable (OEB, OEA) inputs
determine both the direction of flow (A to B, B to A), and the
three-state mode.
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
Ordering Information
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
PART NUMBER
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
Pinout
CD54HC243, CD54HCT243
(CERDIP)
CD74HC243, CD74HCT243
(PDIP, SOIC)
TOP VIEW
OEB 1
14 VCC
NC 2
13 OEA
A0 3
12 NC
A1 4
11 B0
A2 5
10 B1
A3 6
9 B2
GND 7
8 B3
TEMP. RANGE
(oC)
CD54HC243F3A
-55 to 125
14 Ld CERDIP
CD54HCT243F3A
-55 to 125
14 Ld CERDIP
CD74HC243E
-55 to 125
14 Ld PDIP
CD74HC243M
-55 to 125
14 Ld SOIC
CD74HC243MT
-55 to 125
14 Ld SOIC
CD74HC243M96
-55 to 125
14 Ld SOIC
CD74HCT243E
-55 to 125
14 Ld PDIP
CD74HCT243M
-55 to 125
14 Ld SOIC
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel of
250.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
PACKAGE
1
CD54HC243, CD74HC243, CD54HCT243, CD74HCT243
Functional Diagram
‘HC243, ‘HCT243
A0
A1
3
11
4
10
5
9
B1
A2
B2
6
8
A3
OEB
OEA
B0
B3
1
DIRECTION
SELECT LOGIC
13
TRUTH TABLE
HC, HCT243 SERIES
CONTROL INPUTS
DATA PORT STATUS
OEB
OEA
An
Bn
H
H
O
I
L
H
Z
Z
H
L
Z
Z
L
L
I
O
H= High Voltage Level
L= Low Voltage Level
I= Input
O= Output (Same Level as Input)
Z= High Impedance
To prevent excess currents in the High Z modes all I/O terminals should be terminated with 10kΩ
to 1MΩ resistors.
2
CD54HC243, CD74HC243, CD54HCT243, CD74HCT243
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, IO
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±70mA
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
SYMBOL
VI (V)
VIH
-
25oC
IO (mA) VCC (V)
-40oC TO 85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-6
4.5
3.98
-
-
3.84
-
3.7
-
V
-7.8
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
6
4.5
-
-
0.26
-
0.33
-
0.4
V
7.8
6
-
-
0.26
-
0.33
-
0.4
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or
VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
Low Level Output
Voltage
TTL Loads
VOL
VIH or
VIL
-
-
3
CD54HC243, CD74HC243, CD54HCT243, CD74HCT243
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
SYMBOL
VI (V)
II
VCC or
GND
-
Quiescent Device
Current
ICC
VCC or
GND
Three-State Leakage
Current
IOZ
High Level Input
Voltage
25oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
6
-
-
±0.1
-
±1
-
±1
µA
0
6
-
-
8
-
80
-
160
µA
VIL or
VIH
-
6
-
-
±0.5
-
±0.5
-
±10
µA
VIH
-
-
4.5 to
5.5
2
-
-
2
-
2
-
V
Low Level Input
Voltage
VIL
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
High Level Output
Voltage
CMOS Loads
VOH
VIH or
VIL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-6
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
6
4.5
-
-
0.26
-
0.33
-
0.4
V
PARAMETER
Input Leakage
Current
IO (mA) VCC (V)
-40oC TO 85oC
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or
VIL
Low Level Output
Voltage
TTL Loads
II
VCC to
GND
-
5.5
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆ICC
(Note 2)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
Three-State Leakage
Current
IOZ
VIL or
VIH
-
5.5
-
-
±0.5
-
±5.0
-
±10
µA
Input Leakage
Current
Quiescent Device
Current
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
An, Bn
1.1
OEA, OEB
0.6
NOTE: Unit Load is ∆ICC limit specified in DC Electrical
Specifications table, e.g., 360µA max at 25oC.
4
CD54HC243, CD74HC243, CD54HCT243, CD74HCT243
Switching Specifications
PARAMETER
HC TYPES
Propagation Delay Data
to Outputs
Output High-Z, to High Level
to Low Level
Output High Level,
Output Low Level to High-Z
Output Transition Times
Input tr, tf = 6ns
SYMBOL
TEST
CONDITIONS
tPLH, tPHL
CL = 50pF
tPZL, tPZH
tPHZ, tPLZ
tTLH, tTHL
25oC
-40oC TO 85oC -55oC TO 125oC
VCC (V)
TYP
MAX
MAX
MAX
UNITS
2
-
90
115
135
ns
4.5
-
18
23
27
ns
CL = 15pF
5
7
-
-
-
ns
CL = 50pF
6
-
15
20
23
ns
CL = 50pF
2
-
150
190
225
ns
CL = 50pF
4.5
-
30
38
45
ns
CL = 15pF
5
12
-
-
-
ns
CL = 50pF
6
-
26
33
38
ns
CL = 50pF
2
-
150
190
225
ns
CL = 50pF
4.5
-
30
38
45
ns
CL = 15pF
5
12
-
-
-
ns
CL = 50pF
6
-
26
33
38
ns
2
-
60
75
90
ns
4.5
-
12
15
18
ns
CL = 50pF
6
-
10
13
15
ns
Input Capacitance
CI
-
-
-
10
10
10
pF
Three-State Output
Capacitance
CO
-
-
-
20
20
20
pF
Power Dissipation
Capacitance
(Notes 3, 4)
CPD
-
5
80
-
-
-
pF
4.5
-
22
28
33
ns
CL = 15pF
5
9
-
-
-
ns
CL = 50pF
4.5
-
34
43
51
ns
CL = 15pF
5
14
-
-
-
ns
CL = 50pF
4.5
-
35
44
53
ns
CL = 15pF
5
14
-
-
-
ns
CL = 50pF
4.5
-
12
15
18
ns
HCT TYPES
Propagation Delay Data to
Outputs
tPLH, tPHL
Output High-Z to High Level
to Low Level
tPZH, tPZL
Output High Level,
Output Low Level to High-Z
tPHZ, tPLZ
Output Transition Times
tTLH, tTHL
CL = 50pF
Input Capacitance
CI
-
-
-
10
10
10
pF
Three-State Output
Capacitance
CO
-
-
-
20
20
20
pF
Power Dissipation
Capacitance
(Notes 3, 4)
CPD
-
5
91
-
-
-
pF
NOTES:
3. CPD is used to determine the dynamic power consumption, per channel.
4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
5
CD54HC243, CD74HC243, CD54HCT243, CD74HCT243
Test Circuits and Waveforms
tr = 6ns
tf = 6ns
90%
50%
10%
INPUT
GND
tTLH
tPHL
6ns
10%
2.7
1.3
OUTPUT LOW
TO OFF
90%
OUTPUT HIGH
TO OFF
50%
OUTPUTS
DISABLED
FIGURE 3. HC THREE-STATE PROPAGATION DELAY
WAVEFORM
OTHER
INPUTS
TIED HIGH
OR LOW
OUTPUT
DISABLE
IC WITH
THREESTATE
OUTPUT
GND
1.3V
tPZH
90%
OUTPUTS
ENABLED
OUTPUTS
ENABLED
0.3
10%
tPHZ
tPZH
3V
tPZL
tPLZ
50%
OUTPUTS
ENABLED
6ns
GND
10%
tPHZ
tf
OUTPUT
DISABLE
tPZL
tPLZ
OUTPUT HIGH
TO OFF
6ns
tr
VCC
90%
tPLH
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
6ns
OUTPUT LOW
TO OFF
1.3V
10%
INVERTING
OUTPUT
FIGURE 1. HC AND HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
50%
tTLH
90%
tPLH
tPHL
GND
tTHL
90%
50%
10%
INVERTING
OUTPUT
3V
2.7V
1.3V
0.3V
INPUT
tTHL
OUTPUT
DISABLE
tf = 6ns
tr = 6ns
VCC
1.3V
OUTPUTS
DISABLED
OUTPUTS
ENABLED
FIGURE 4. HCT THREE-STATE PROPAGATION DELAY
WAVEFORM
OUTPUT
RL = 1kΩ
CL
50pF
VCC FOR tPLZ AND tPZL
GND FOR tPHZ AND tPZH
NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL = 1kΩ to
VCC, CL = 50pF.
FIGURE 5. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
6
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
8409001CA
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HC243F
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HC243F3A
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HCT243F3A
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
CD74HC243E
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC243EE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC243M
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC243M96
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC243M96E4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC243M96G4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC243ME4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC243MG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC243MT
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC243MTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC243MTG4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT243E
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT243EE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT243M
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT243ME4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT243MG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CD74HC243M96
Package Package Pins
Type Drawing
SOIC
D
14
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
6.5
9.0
2.1
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74HC243M96
SOIC
D
14
2500
346.0
346.0
33.0
Pack Materials-Page 2
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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