High Performance BGA Cooling Solutions w/ superGRIP™ Attachment ATS PART # ATS-X50330P-C1-R0 FT Features & Benefits » » Designed for 33 x 33 mm BGA components » Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked » Strong, uniform attachment force helps achieve maximum performance from phase-changing TIMs » » Eliminates the need to drill mounting holes in the PCB » Comes standard with clean break, reworkable, Chomerics T-766 phase change material Requires minimal space around the component’s perimeter; ideal for densely populated PCBs W Assembly comes standard with a high performance maxiFLOW™ heat sink which maximizes convection (air) cooling L H Thermal Performance *Image above is for illustration purposes only. Air Velocity Thermal Resistance FT/MIN M/S °C/W (UNDUCTED FLOW) °C/W (DUCTED FLOW) 200 1.0 2.7 2.1 300 1.5 2.1 400 2.0 1.9 500 2.5 1.7 600 3.0 1.5 700 3.5 1.4 800 4.0 1.4 Product Details LENGTH WIDTH HEIGHT FIN TIP to FIN TIP INTERFACE MATERIAL FINISH 33 mm 33 mm 17.5 mm 58.2 mm Chomerics T766 BLUE-ANODIZED Notes: 1) 2) 3) 4) 5) 6) Length and width dimensions refer to the size of the component. Dimensions of the heat sink are subject to tolerances of up to .99 mm in order to accommodate the clip assembly Thermal performance data are provided for reference only. Actual performance may vary by application ATS reserves the right to update or change its products without notice to improve the design or performance Additional tooling fees may be required Typical lead time is a minimum of 4-6 weeks Contact ATS to learn about custom options available For more information, to find a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe). REV0_042109