Rohm BD622X-E Dc brush motor drivers (18v max.) Datasheet

Datasheet
DC Brush Motor Drivers (18V max.)
BD622xxx Series
●General Description
These H-bridge drivers are full bridge drivers for brush
motor applications. Each IC can operate at a power
supply voltage range of 6V to 15V, with output currents
of up to 2A. MOS transistors in the output stage allow
PWM speed control.The integrated VREF voltage
control function allows direct replacement of deprecated
motor driver ICs. These highly efficient H-bridge driver
ICs facilitate low-power consumption design.
●Key Specifications
■ Supply Voltage Range:
■ Maximum Output Current:
■ Output ON resistance:
■ PWM Input frequency range:
■ Standby current:
■ Operating temperature range:
●Packages
SOP8
HSOP25
HRP7
●Features
„ Built-in, selectable one channel or two channels
configuration
„ VREF voltage setting pin enables PWM duty control
„ Cross-conduction prevention circuit
„ Four protection circuits provided: OCP, OVP, TSD and
UVLO
●Applications
VTR; CD/DVD players; audio-visual equipment; optical
disc drives; PC peripherals; OA equipments
18V(Max.)
0.5A / 1.0A / 2.0A
1.5Ω / 1.5Ω / 1.0Ω
20 to 100kHz
0μA (Typ.)
-40 to 85℃
(Typ.)
(Typ.)
(Max.)
5.00mm x 6.20mm x 1.71mm
13.60mm x 7.80mm x 2.11mm
9.395mm x 10.540mm x 2.005mm
SOP8 (Pd=0.69W)
HRP7 (Pd=1.60W)
HSOP25 (Pd=1.45W)
*Pd : Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board.
●Ordering Information
B
D
6
2
2
x
x
x
x
-
Package
F
: SOP8
FP
: HSOP25
HFP : HRP7
Part Number
xx
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/HSOP25)
TR: Embossed tape and reel
(HRP7)
●Lineup
Voltage Rating
(Max.)
Channels
1ch
18V
Output current
(Max.)
0.5A
SOP8
Reel of 2500
BD6220F-E2
1.0A
SOP8
Reel of 2500
BD6221F-E2
HSOP25
Reel of 2000
BD6222FP- E2
HRP7
Reel of 2000
BD6222HFP-TR
2.0A
2ch
Orderable
Part Number
Package
0.5A
HSOP25
Reel of 2000
BD6225FP-E2
1.0A
HSOP25
Reel of 2000
BD6226FP-E2
○Product structure：Silicon monolithic integrated circuit
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Datasheet
BD622xxx Series
●Block diagrams / Pin Configurations / Pin Descriptions
BD6220F/BD6221F
VREF
6
FIN
4
RIN
5
DUTY
Table1 BD6220F/BD6221F
PROTECT
3
VCC
2
VCC
CTRL
8
1
7
OUT1
OUT2
GND
VCC
OUT2
VCC
VREF
FIN
Fig.2
Name
Function
1
OUT1
Driver output
2
VCC
Power supply
3
VCC
Power supply
4
FIN
Control input (forward)
5
RIN
Control input (reverse)
6
VREF
Duty setting pin
7
OUT2
Driver output
8
GND
Ground
GND
Fig.1 BD6220F / BD6221F
OUT1
Pin
Note: Use all VCC pin by the same voltage.
RIN
SOP8 (TOP VIEW)
BD6222HFP
Table 2 BD6222HFP
VREF
1
DUTY
PROTECT
7
FIN
3
RIN
5
VCC
CTRL
4
FIN
2
6
GND
OUT1
OUT2
GND
Fig.3 BD6222HFP
Pin
Name
Function
1
VREF
Duty setting pin
2
OUT1
Driver output
3
FIN
4
GND
Ground
5
RIN
Control input (reverse)
6
OUT2
Driver output
7
VCC
Power supply
FIN
GND
Ground
Control input (forward)
VCC
OUT2
RIN
GND
FIN
OUT1
VREF
Fig.4 HRP7 (TOP VIEW)
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Datasheet
BD622xxx Series
●Block diagrams / Pin Configurations / Pin Descriptions- Continued
BD6222FP
Table 3 BD6222FP
VREF 17
DUTY
PROTECT
21
22
FIN 20
CTRL
RIN 19
RNF
8
6
FIN
1
2
12 13
GND
GND
OUT1
OUT2
Fig.5 BD6222FP
OUT1
OUT1
NC
NC
NC
GND
NC
NC
VCC
VCC
VCC
FIN
GND
GND
RNF
RNF
NC
NC
NC
OUT2
OUT2
Fig.6
Name
Function
1,2
OUT1
Driver output
6
GND
Small signal ground
7,8
RNF
Power stage ground
12,13
OUT2
17
VREF
19
RIN
Control input (reverse)
20
FIN
Control input (forward)
21
VCC
Power supply
22,23
VCC
Power supply
FIN
GND
Ground
VCC
23
7
Pin
VCC
Driver output
Duty setting pin
Note: All pins not described above are NC pins.
Note: Use all VCC pin by the same voltage.
RIN
NC
VREF
NC
NC
NC
HSOP25 (TOP VIEW)
BD6225FP / BD6226FP
VREFA
DUTY
9
Table 4 BD6225FP / BD6226FP
PROTECT
24
VCC
Pin
Name
25
VCC
1
OUT1A
FINA 11
CTRL
RINA 10
GND
20
VREFB 21
DUTY
1
OUT1A
6
OUT2A
3
RNFA
PROTECT
12
VCC
13
VCC
14
OUT1B
19
OUT2B
16
RNFB
FINB 23
CTRL
RINB 22
GND
8
FIN
GND
Fig.7 BD6225FP / BD6226FP
OUT1A
NC
RNFA
NC
NC
OUT2A
GND
NC
GND
VREFA
RINA
FINA
VCC
VCC
Fig.8
VCC
VCC
FINB
RINB
VREFB
GND
GND
OUT2B
NC
NC
RNFB
NC
OUT1B
Function
Driver output
3
RNFA
6
OUT2A
Power stage ground
8
GND
9
VREFA
10
RINA
Control input (reverse)
11
FINA
Control input (forward)
12
VCC
Power supply
13
VCC
Power supply
14
OUT1B
Driver output
16
RNFB
19
OUT2B
20
GND
21
VREFB
22
RINB
Control input (reverse)
23
FINB
Control input (forward)
24
VCC
Power supply
25
VCC
Power supply
FIN
GND
Ground
Driver output
Small signal ground
Duty setting pin
Power stage ground
Driver output
Small signal ground
Duty setting pin
Note: All pins not described above are NC pins.
Note: Use all VCC pin by the same voltage.
HSOP25 (TOP VIEW)
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Datasheet
BD622xxx Series
●Absolute Maximum Ratings (Ta=25℃, All voltages are with respect to ground)
Parameter
Symbol
Ratings
Unit
Supply voltage
VCC
18
V
Output current
IOMAX
0.5 *1 / 1.0 *2 / 2.0 *3
A
VIN
-0.3 to VCC
V
Operating temperature
TOPR
-40 to +85
℃
Storage temperature
TSTG
-55 to +150
℃
Pd
0.687 *4 / 1.6 *5 / 1.45 *6
W
Tjmax
150
℃
All other input pins
Power dissipation
Junction temperature
*1 BD6220 / BD6225. Do not exceed Pd or ASO.
*2 BD6221 / BD6226. Do not exceed Pd or ASO.
*3 BD6222.
Do not exceed Pd or ASO.
*4 SOP8 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 5.5mW/℃ above 25℃.
*5 HRP7 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 12.8mW/℃ above 25℃.
*6 HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 11.6mW/℃ above 25℃.
●Recommended Operating Ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Supply voltage
VCC
6 to 15
V
VREF voltage
VREF
3 to 15
V
●Electrical Characteristics (Unless otherwise specified, Ta=25℃ and VCC=VREF=12V)
Limits
Parameter
Symbol
Unit
Min.
Min.
Min.
Conditions
Supply current (1ch)
ICC
0.8
1.3
2.5
mA
Forward / Reverse / Brake
Supply current (2ch)
ICC
1.3
2.0
3.5
mA
Forward / Reverse / Brake
Stand-by current
ISTBY
-
0
10
µA
Stand-by
Input high voltage
VIH
2.0
-
-
V
Input low voltage
VIL
-
-
0.8
V
Input bias current
IIH
30
50
100
µA
VIN=5.0V
Output ON resistance *1
RON
1.0
1.5
2.5
Ω
IO=0.25A, vertically total
Output ON resistance *2
RON
1.0
1.5
2.5
Ω
IO=0.5A, vertically total
Output ON resistance *3
RON
0.5
1.0
1.5
Ω
IO=1.0A, vertically total
VREF bias current
IVREF
-10
0
10
µA
VREF=VCC
Carrier frequency
FPWM
20
25
35
kHz
VREF=9V
Input frequency range
FMAX
20
-
100
kHz
FIN / RIN
*1 BD6220 / BD6225
*2 BD6221 / BD6226
*3 BD6222
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Datasheet
BD622xxx Series
●Typical Performance Curves (Reference data)
2.5
2.0
Circuit Current: Icc [mA]
Circuit Current: Icc [mA]
85°C
25°C
-40°C
1.5
1.0
2.0
85°C
25°C
-40°C
1.5
1.0
0.5
6
9
12
15
6
18
9
15
18
Supply Voltage: Vcc [V]
Supply Voltage: Vcc [V]
Fig.10 Supply current (2ch)
Fig.9 Supply current (1ch)
400
Input Bias Current: IIH [µA] _
1.5
Internal Logic: H/L [-] _
12
1.0
-40°C
25°C
85°C
0.5
-40°C
25°C
85°C
0.0
-0.5
85°C
25°C
-40°C
300
200
100
0
1
1.2
1.4
1.6
1.8
2
Input Voltage: VIN [V]
6
12
18
Input Voltage: VIN [V]
Fig.12 Input bias current
Fig.11 Input threshold voltage
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Datasheet
BD622xxx Series
●Typical Performance Curves (Reference data) - Continued
1.0
_
-40°C
25°C
85°C
5
Switching Duty: D [Ton/T]
Input Bias Current: IVREF [μA]
10
0
-5
-10
0.8
0.6
0.4
-40°C
25°C
85°C
0.2
0.0
0
6
12
18
0
Input Voltage: VREF [V]
0.4
0.6
0.8
1
Input Voltage: VREF / VCC [V]
Fig.14 VREF - DUTY(VCC=12V)
Fig.13 VREF input bias current
9
40
85°C
25°C
-40°C
Internal signal: Release [V] _
Oscillation Frequency: F PWM [kHz]
0.2
30
20
10
85°C
25°C
-40°C
6
3
0
6
9
12
15
18
Supply Voltage: VCC [V]
4.5
5
5.5
Supply Voltage: VCC [V]
Fig.15 VCC - Carrier frequency
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Fig.16 Under voltage lock out
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Datasheet
BD622xxx Series
●Typical Performance Curves(Reference data) - Continued
1.5
-40°C
25°C
85°C
28
1.0
Internal Logic: H/L [-]
Internal signal: Release [V]
35
21
14
0.5
0.0
7
0
-0.5
20
24
28
32
125
Supply Voltage: VCC [V]
150
175
Junction Temperature: Tj [°C]
Fig.18 Thermal shutdown
Fig.17 Over voltage protection
1.5
1.5
85°C
25°C
-40°C
85°C
25°C
-40°C
1.0
Internal Logic: H/L [-]
Internal Logic: H/L [-]
200
0.5
0.0
1.0
0.5
0.0
-0.5
-0.5
2
2.5
3
3.5
1
4
1.5
1.75
2
Load Current / Iomax: Normalized
Load Current / Iomax: Normalized
Fig.19 Over current protection (H side)
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Fig.20 Over current protection (L side)
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Datasheet
BD622xxx Series
●Typical Performance Curves (Reference data) - Continued
0.8
85°C
25°C
-40°C
Output Voltage: VCC-VOUT [V]
Output Voltage: VCC-VOUT [V]
0.4
0.3
0.2
0.1
85°C
25°C
-40°C
0.6
0.4
0.2
0
0
0
0.1
0.2
0.3
0.4
0
0.5
0.2
0.6
0.8
1
Output Current: IOUT [A]
Output Current: IOUT [A]
Fig.22 Output high voltage (BD6221/26)
Fig.21 Output high voltage (BD6220/25)
2
0.4
85°C
25°C
-40°C
Output Voltage:VCC-VOUT [V]
Output Voltage: VCC-VOUT [V]
0.4
0.3
0.2
0.1
-40°C
25°C
85°C
1.5
1
0.5
0
0
0
0.1
0.2
0.3
0.4
0
0.5
0.2
0.3
0.4
0.5
Output Current: IOUT [A]
Output Current: IOUT [A]
Fig.24 High side body diode (BD6220/25)
Fig.23 Output high voltage (BD6222)
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Datasheet
BD622xxx Series
●Typical Performance Curves (Reference data) - Continued
2
-40°C
25°C
85°C
Output Voltage:VCC-VOUT [V]
Output Voltage:VCC-VOUT [V]
2
1.5
1
0.5
0
-40°C
25°C
85°C
1.5
1
0.5
0
0
0.2
0.4
0.6
0.8
1
0
Output Current: IOUT [A]
0.4
0.8
1.2
1.6
Output Current: IOUT [A]
Fig.26 High side body diode (BD6222)
Fig.25 High side body diode (BD6221/26)
1.2
0.4
85°C
25°C
-40°C
Output Voltage: VOUT [V]
85°C
25°C
-40°C
Output Voltage: VOUT [V]
2
0.3
0.2
0.1
0.9
0.6
0.3
0
0
0
0.1
0.2
0.3
0.4
0
0.5
0.4
0.6
0.8
1
Output Current: IOUT [A]
Output Current: IOUT [A]
Fig.28 Output low voltage (BD6221/26)
Fig.27 Output low voltage (BD6220/25)
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Datasheet
BD622xxx Series
●Typical Performance Curves (Reference data) - Continued
2
85°C
25°C
-40°C
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
1.2
0.9
0.6
0.3
-40°C
25°C
85°C
1.5
1
0.5
0
0
0
0.4
0.8
1.2
1.6
2
0
0.1
Output Current: IOUT [A]
0.2
0.3
0.4
Output Current: IOUT [A]
Fig.30 Low side body diode (BD6220/25)
Fig.29 Output low voltage (BD6222)
2
2
-40°C
25°C
85°C
Output Voltage: VOUT [V]
-40°C
25°C
85°C
Output Voltage: VOUT [V]
0.5
1.5
1
0.5
1.5
1
0.5
0
0
0
0.2
0.4
0.6
0.8
0
1
0.8
1.2
1.6
2
Output Current: IOUT [A]
Output Current: IOUT [A]
Fig.32 Low side body diode (BD6222)
Fig.31 Low side body diode (BD6221/26)
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Datasheet
BD622xxx Series
●Functional Descriptions
1)
Operation modes
Table 5 Logic table
FIN
RIN
VREF
OUT1
OUT2
a
L
L
X
Hi-Z*
Hi-Z*
b
H
L
VCC
H
L
Forward (OUT1 > OUT2)
c
L
H
VCC
L
H
Reverse (OUT1 < OUT2)
d
H
H
X
L
L
Brake (stop)
e
PWM
f
L
L
g
PWM
H
h
VCC
PWM
PWM
H
VCC
VCC
i
H
L
Option
j
L
H
Option
Stand-by (idling)
__________
H
__________
PWM
PWM
Forward (PWM control mode A)
H
Reverse (PWM control mode A)
L
Forward (PWM control mode B)
__________
PWM
VCC
Operation
__________
L
Reverse (PWM control mode B)
PWM
__________
H
__________
PWM
PWM
Forward (VREF control)
H
Reverse (VREF control)
* Hi-Z : all output transistors are off. Please note that this is the state of the connected diodes,
which differs from that of the mechanical relay.
X : Don’t care
a) Stand-by mode
Stand-by operates independently with the VREF pin voltage. In stand-by mode, all internal circuits are turned off,
including the output power transistors. Motor output goes to high impedance. When the system is switched to
stand-by mode while the motor is running, the system enters an idling state because of the body diodes. However,
when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the
high state for at least 50µs before shutting down all circuits.
b) Forward mode
This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low.
When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. To operate
in this mode, connect the VREF pin to the VCC pin.
c) Reverse mode
This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high.
When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. To operate
in this mode, connect the VREF pin to the VCC pin.
d) Brake mode
This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode because
the internal control circuit is operating in the brake mode. Please switch to stand-by mode (rather than the brake
mode) to save power and reduce consumption.
OFF
OFF
ON
M
OFF
OFF OFF
M
OFF OFF
a) Stand-by mode
ON
OFF
M
ON
b) Forward mode
ON
c) Reverse mode
OFF
M
OFF
ON
ON
d) Brake mode
Fig.33 Four basic operations (output stage)
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Datasheet
BD622xxx Series
e) f) PWM control mode A
The rotational speed of the motor can be controlled by the duty cycle of the PWM signal fed to the FIN pin or the
RIN pin. In this mode, the high side output is fixed and the low side output is switching, corresponding to the input
signal. The state of the output toggles between "L" and "Hi-Z".
The frequency of the input PWM signal can be between 20kHz and 100kHz. The circuit may not operate properly for
PWM frequencies below 20kHz and above 100kHz. Note that control may not be attained by switching on duty at
frequencies lower than 20kHz, since the operation functions via the stand-by mode. To operate in this mode,
connect the VREF pin to the VCC pin. In addition, establish a current path for the recovery current from the motor,
by connecting a bypass capacitor (10µF or higher is recommended) between VCC and ground.
ON
OFF
ON
M
OFF
OFF
M
ON
OFF
Control input : H
OFF
Control input : L
Fig.34 PWM control mode A operation (output stage)
FIN
RIN
OUT1
OUT2
Fig.35 PWM control mode A operation (timing chart)
g) h) PWM control mode B
The rotational speed of the motor can be controlled by the duty cycle of the PWM signal fed to the FIN pin or the
RIN pin. In this mode, the low side output is fixed and the high side output is switching, corresponding to the input
signal. The state of the output toggles between "L" and "H".
The frequency of the input PWM signal can be between 20kHz and 100kHz. The circuit may not operate properly for
PWM frequencies below 20kHz and above 100kHz. To operate in this mode, connect the VREF pin to the VCC pin.
In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF
or higher is recommended) between VCC and ground.
ON
OFF
ON
M
OFF
OFF
M
ON
OFF
Control input : H
OFF
Control input : L
Fig.36 PWM control mode B operation (output stage)
FIN
RIN
OUT1
OUT2
Fig.37 PWM control mode B operation (timing chart)
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Datasheet
BD622xxx Series
i) j) VREF control mode
The built-in VREF duty cycle conversion circuit provides a duty cycle corresponding to the voltage of the VREF pin
and the VCC voltage. The function offers the same level of control as the high voltage output setting function in
previous models. The duty cycle is calculated by the following equation.
DUTY ≈ VREF [V] / VCC [V]
For example, if VCC voltage is 12V and VREF pin voltage is 9V, the duty cycle is about 75 percent. However, please
note that the duty cycle might be limited by the range of the VREF pin voltage (Refer to the operating conditions,
shown on page 2). The PWM carrier frequency in this mode is 25kHz (nominal), and the switching operation is the
same as the PWM control modes. When operating in this mode, do not input a PWM signal to the FIN and RIN pins.
In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF
or more is recommended) between VCC and ground.
VCC
VREF
0
FIN
RIN
OUT1
OUT2
Fig.38 VREF control operation (timing chart)
2)
Cross-conduction protection circuit
In the full bridge output stage, when the upper and lower transistors are turned on at the same time during high to
low or low to high transition, an inrush current flows from the power supply to ground, resulting to a loss. This circuit
eliminates the inrush current by providing a dead time (about 400ns, nominal) during the transition.
3)
Output protection circuits
a) Under voltage lock out (UVLO) circuit
To ensure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage
malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 5.0V (nominal) or
below, the controller forces all driver outputs to high impedance. When the voltage rises to 5.5V (nominal) or above,
the UVLO circuit ends the lockout operation and returns the chip to normal operation.
b) Over voltage protection (OVP) circuit
When the power supply voltage exceeds 30V (nominal), the controller forces all driver outputs to high impedance.
The OVP circuit is released and its operation ends when the voltage drops back to 25V (nominal) or below. This
protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is
asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this
circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.
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Datasheet
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c) Thermal shutdown (TSD) circuit
The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175℃
nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is provided
in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset
temperature (150℃ nominal). Thus, it is a self-resetting circuit.
The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is
activated, and do not operate the IC in an environment where activation of the circuit is assumed.
d) Over current protection (OCP) circuit
To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors
the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an over
current, the controller forces all driver outputs to high impedance during the off time (290µs, nominal). The IC returns
to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this circuit
works independently for each channel.
Threshold
Iout
0
CTRL Input
ON
Internal status
OFF
mon.
ON
off timer
Monitor / Timer
Fig.39 Over current protection (timing chart)
●I/O equivalent circuit
VCC
FIN
RIN
VCC
VCC
OUT1
OUT2
OUT1
OUT2
GND
RNF
VCC
100k
10k
VREF
100k
GND
Fig.40 FIN / RIN
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Fig.41 VREF
Fig.42 OUT1 / OUT2
Fig.43 OUT1 / OUT2
(SOP8/HRP7)
(HSOP25)
14/19
TSZ02201-0P2P0B300080-1-2
25.Dec.2012 Rev.002
Datasheet
BD622xxx Series
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2)
Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
3) Power supply lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply
lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting
the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
4)
Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
5)
Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd).
Package Power dissipation
Power dissipation
: Pd (W)=(Tjmax－Ta)/θja
: Pc (W)=(Vcc－Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
6) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a
wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles
caught between the pins.
7)
Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8)
Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
9)
Capacitor between output and GND
If a large capacitor is connected between the output pin and GND pin, current from the charged capacitor can flow into
the output pin and may destroy the IC when the VCC or VIN pin is shorted to ground or pulled down to 0V. Use a
capacitor smaller than 10uF between output and GND.
10)
Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
11)
Switching noise
When the operation mode is in PWM control or VREF control, PWM switching noise may affect the control input pins
and cause IC malfunctions. In this case, insert a pull down resistor (10kΩ is recommended) between each control input
pin and ground.
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Datasheet
BD622xxx Series
12)
Regarding the input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin B
B
Pin A
N
P+
N
P+
P
N
E
Parasitic
element
N
P+
Parasitic element
B
P+
P
C
N
E
P substrate
GND
N
P substrate
GND
Parasitic element
GND
Parasitic
GND element
Other adjacent elements
Fig.44 Example of monolithic IC structure
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Datasheet
BD622xxx Series
●Physical Dimensions Tape and Reel Information
SOP8
<Tape and Reel information>
7
6
5
+6°
4° −4°
6.2±0.3
4.4±0.2
0.3MIN
8
1 2
3
0.9±0.15
5.0±0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
S
S
0.11
0.1
1.27
Direction of feed
1pin
0.42±0.1
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
HSOP25
<Tape and Reel information>
13.6 ± 0.2
(MAX 13.95 include BURR)
2.75 ± 0.1
0.3Min.
1
13
2000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.25 ± 0.1
1.95 ± 0.1
1.9 ± 0.1
Embossed carrier tape
Quantity
14
5.4 ± 0.2
7.8 ± 0.3
25
Tape
0.11
S
0.1 S
0.8
0.36 ± 0.1
12.0 ± 0.2
Direction of feed
1pin
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
HRP7
<Tape and Reel information>
1.905±0.1
0.8875
1 2
3 4
0.835±0.2
8.0±0.13
(7.49)
8.82±0.1
(6.5)
5 6 7
1.523±0.15
10.54±0.13
1.017±0.2
9.395±0.125
(MAX 9.745 include BURR)
Tape
Embossed carrier tape
Quantity
2000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
+5.5°
4.5° −4.5°
0.08±0.05
+0.1
0.27 -0.05
0.73±0.1
1.27
S
Direction of feed
0.08 S
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∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0P2P0B300080-1-2
25.Dec.2012 Rev.002
Datasheet
BD622xxx Series
●Marking Diagrams
SOP8(TOP VIEW)
HSOP25 (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
HRP7 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
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Part Number
Package
Part Number Marking
BD6220F
SOP8
6220
BD6221F
SOP8
6221
BD6222HFP
HRP7
BD6222HFP
BD6222FP
HSOP25
BD6222FP
BD6225FP
HSOP25
BD6222FP
BD6226FP
HSOP25
BD6222FP
TSZ02201-0P2P0B300080-1-2
25.Dec.2012 Rev.002
Datasheet
BD622xxx Series
●Revision History
Date
Revision
14.Mar.2012
001
25.Dec.2012
002
Changes
New Release
Improved the statement in all pages.
Deleted “Status of this document” in page 16.
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
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