bq34z110 www.ti.com SLUSB55 – JUNE 2012 Wide Range Fuel Gauge with Impedance Track™ for Lead-Acid Batteries Check for Samples: bq34z110 FEATURES 1 • • • • • • • • Supports Lead-Acid Chemistries Capacity Estimation Using Patented Impedance Track™ Technology for Batteries from 4 V to 64 V – Aging Compensation – Self-Discharge Compensation Supports Battery Capacities Above 65 Ahr Supports Charge and Discharge Currents Above 32 A External NTC Thermistor Support Supports Two-Wire I2C and HDQ Single Wire Communication Interfaces with Host System SHA-1/HMAC Authentication One- or Four-LED Direct Display Control Five-LED and Higher Display Through Port Expander • Reduced Power Modes (Typical Battery Pack Operating Range Conditions) – Normal Operation: < 140 µA Average – Sleep: < 64 µA Average – Full Sleep: < 19 µA Average Package: 14-Pin TSSOP APPLICATIONS • • • • • Light Electric Vehicles Power Tools Medical Instrumentation Uninterruptable Power Supplies (UPS) Mobile Radios DESCRIPTION The Texas Instruments bq34z110 is a fuel gauge solution that works independently of battery series-cell configurations, and supports Lead-Acid battery chemistries. Batteries from 4 V to 64 V can be supported through an external voltage translation circuit that can be controlled automatically to reduce system power consumption. The bq34z110 device provides several interface options, including an I2C™ slave, an HDQ slave, one or four direct LEDs, and an Alert output pin. Additionally, the bq34z110 provides support for an external port expander for more than four LEDs. ORDERING INFORMATION TA PART NUMBER PACKAGE (TSSOP) TUBE TAPE AND REEL –40°C to 85°C bq34z110PW or bq34z110PWR 14-Pin PW PWR 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Impedance Track is a trademark of Texas Instruments. I2C is a trademark of NXP B.V Corporation. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2012, Texas Instruments Incorporated PRODUCT PREVIEW • • 23 bq34z110 SLUSB55 – JUNE 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. PIN DETAILS PIN-OUT DIAGRAM PRODUCT PREVIEW P2 1 14 P3/SDA VEN 2 13 P4/SCL P1 3 12 P5/HDQ BAT 4 11 P6/TS CE 5 10 SRN REGIN 6 9 SRP REG25 7 8 VSS Figure 1. bq34z110 Pin-Out Diagram Table 1. bq34z110 External Pin Functions PIN NAME PIN NUMBER TYPE (1) P2 1 O LED 2 or Not Used (connect to Vss) VEN 2 O Active High Voltage Translation Enable. This signal is optionally used to switch the input voltage divider on/off to reduce the power consumption (typ 45 uA) of the divider network. P1 3 O LED 1 or Not Used (connect to Vss). This pin is also used to drive an LED for single-LED mode. Use a small signal N-FET (Q1) in series with the LED as shown on Figure 9. BAT 4 I Translated Battery Voltage Input (1) 2 DESCRIPTION CE 5 I Chip Enable. Internal LDO is disconnected from REGIN when driven low. REGIN 6 P Internal integrated LDO input. Decouple with a 0.1-µF ceramic capacitor to Vss. REG25 7 P 2.5-V Output voltage of the internal integrated LDO. Decouple with 1-µF ceramic capacitor to Vss VSS 8 P Device ground SRP 9 I Analog input pin connected to the internal coulomb-counter peripheral for integrating a small voltage between SRP and SRN where SRP is nearest the BAT– connection. SRN 10 I Analog input pin connected to the internal coulomb-counter peripheral for integrating a small voltage between SRP and SRN where SRN is nearest the PACK– connection. Pack thermistor voltage sense (use 103AT-type thermistor) P6/TS 11 I P5/HDQ 12 I/O P4/SCL 13 I Slave I2C serial communication clock input. Use with a 10-K pull-up resistor (typical). Also used for LED 4 in the four-LED mode. P3/SDA 14 I/O Open drain slave I2C serial communication data line. Use with a 10-kΩ pull-up resistor (typical). Also used for LED 3 in the four-LED mode. Open drain HDQ Serial communication line (slave) I = Input, O = Output, P = Power, I/O = Digital input/output Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): bq34z110 bq34z110 www.ti.com SLUSB55 – JUNE 2012 TYPICAL IMPLEMENTATION PACK + Protection FETs n Series cells ** CE BAT VEN P1 P2 REG25 P3/DAT I2C PROG ** P4/CLK P5/HDQ Protection and Balancing Solution P6/TS SRP Sense Resistor SRN PRODUCT PREVIEW REGIN VSS HDQ COMM ALERT PACK – ** optional to reduce divider power consumption Figure 2. bq34z110 Typical Implementation THERMAL INFORMATION bq34z110 THERMAL METRIC (1) TSSOP (14-Pins) θJA, High K Junction-to-ambient thermal resistance 103.8 θJC(top) Junction-to-case(top) thermal resistance 31.9 θJB Junction-to-board thermal resistance 46.6 ψJT Junction-to-top characterization parameter 2.0 ψJB Junction-to-board characterization parameter 45.9 θJC(bottom) Junction-to-case(bottom) thermal resistance N/A (1) UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): bq34z110 3 bq34z110 SLUSB55 – JUNE 2012 www.ti.com ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range (unless otherwise noted) (1) VALUE PARAMETER MIN UNIT MAX VREGIN Regulator Input Range –0.3 5.5 V VCC Supply Voltage Range –0.3 2.75 V VIOD Open-drain I/O pins (SDA, SCL, HDQ) –0.3 5.5 V VBAT Bat Input pin –0.3 5.5 V VI Input Voltage range to all other pins (P1, P2, SRP, SRN) –0.3 VCC + 0.3 V 1.5 kV Human-body model (HBM), BAT pin ESD 2 kV TA Operating free-air temperature range –40 85 °C TF Functional temperature range –40 100 °C (1) Human-body model (HBM), all other pins Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS PRODUCT PREVIEW TA = 25ºC, CLDO25 = 1 µF, and VREGIN = 3.6 V (unless otherwise noted) PARAMETER CONDITIONS VREGIN Supply Voltage CREGIN External input capacitor for internal LDO between REGIN and VSS CLDO25 External output capacitor for internal LDO between VCC and VSS ICC Normal operating-mode current ISLP MAX UNIT No operating restrictions MIN 2.7 TYP 4.5 V No FLASH writes 2.45 2.7 V 0.1 μF 1 μF Gas Gauge in NORMAL mode, ILOAD > Sleep Current 140 μA SLEEP operating-mode current Gas Gauge in SLEEP mode, ILOAD < Sleep Current 64 μA ISLP+ FULL SLEEP operating-mode current Gas Gauge in FULL SLEEP mode, ILOAD < Sleep Current 19 μA VOL Output voltage, low (SCL, SDA, HDQ) IOL = 3 mA VOH(PP) Output voltage, high IOH = –1 mA VCC – 0.5 V VOH(OD) Output voltage, high (SDA, SCL, HDQ) External pull-up resistor connected to VCC VCC – 0.5 V VIL Input voltage, low –0.3 0.6 V VIH(OD) Input voltage, high (SDA, SCL, HDQ) 1.2 6 V VA1 Input voltage range (TS) VSS – 0.05 1 V 5 V 0.125 V 0.3 μA Nominal capacitor values specified. Recommend a 10% ceramic X5R type capacitor located close to the device. 0.47 0.4 VA2 Input voltage range (BAT) VSS – 0.125 VA3 Input voltage range (SRP, SRN) VSS – 0.125 ILKG Input leakage current (I/O pins) tPUCD Power-up communication delay 4 250 Submit Documentation Feedback V ms Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): bq34z110 bq34z110 www.ti.com SLUSB55 – JUNE 2012 POWER-ON RESET TA = –40°C to 85°C; Typical Values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS VIT+ Positive-going battery voltage input at REG25 VHYS Power-on reset hysteresis MIN TYP MAX UNIT 2.05 2.20 2.31 V 45 115 185 mV MIN NOM MAX UNIT 2.5 2.7 LDO REGULATOR TA = 25°C, CLDO25 = 1 µF, VREGIN = 3.6 V (unless otherwise noted) (1) PARAMETER VREG25 ISHORT (2) Regulator output voltage Short Circuit Current Limit TA= –40°C to 85°C 2.3 2.45 V ≤ VREGIN < 2.7 V (low battery), IOUT ≤ 3 mA TA = –40°C to 85°C 2.3 VREG25 = 0 V TA = –40°C to 85°C V 250 mA LDO output current, IOUT, is the sum of internal and external load currents. Assured by design. Not production tested. PRODUCT PREVIEW (1) (2) TEST CONDITION 2.7 V ≤ VREGIN ≤ 4.5 V, IOUT ≤ 16 mA INTERNAL TEMPERATURE SENSOR CHARACTERISTICS TA = –40°C to 85°C, 2.4 V < REG25 < 2.6 V; Typical Values at TA = 25°C and REG25 = 2.5 V (unless otherwise noted) PARAMETER GTEMP TEST CONDITIONS MIN Temperature sensor voltage gain TYP MAX –2 UNIT mV/°C LOW-FREQUENCY OSCILLATOR TA = –40°C to 85°C, 2.4 V < REG25 < 2.6 V; Typical Values at TA = 25°C and REG25 = 2.5 V (unless otherwise noted) PARAMETER f(LOSC) TEST CONDITIONS Operating frequency f(LEIO) Frequency error (1) (2) t(LSXO) Start-up time (3) (1) (2) (3) MIN TYP MAX UNIT 32.768 kHz TA = 0°C to 60°C –1.5% 0.25% 1.5% TA = –20°C to 70°C –2.5% 0.25% 2.5% TA = –40°C to 85°C –4% 0.25% 4% μs 500 The frequency drift is included and measured from the trimmed frequency at VCC = 2.5 V, TA = 25°C. The frequency error is measured from 32.768 kHz. The startup time is defined as the time it takes for the oscillator output frequency to be ±3%. HIGH-FREQUENCY OSCILLATOR TA = –40°C to 85°C, 2.4 V < REG25 < 2.6 V; Typical Values at TA = 25°C and REG25 = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS f(OSC) Operating frequency f(EIO) Frequency error (1) (2) t(SXO) (1) (2) (3) MIN TYP MAX 8.389 MHz TA = 0°C to 60°C –2% 0.38% TA = –20°C to 70°C –3% 0.38% 3% TA = –40°C to 85°C –4.5% 0.38% 4.5% 2.5 5 Start-up time (3) UNIT 2% ms The frequency error is measured from 2.097 MHz. The frequency error is measured from 32.768 kHz. The startup time is defined as the time it takes for the oscillator output frequency to be ±3%. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): bq34z110 5 bq34z110 SLUSB55 – JUNE 2012 www.ti.com INTEGRATING ADC (COULOMB COUNTER) CHARACTERISTICS TA = –40°C to 85°C, 2.4 V < REG25 < 2.6 V; Typical Values at TA = 25°C and REG25 = 2.5 V (unless otherwise noted) PARAMETER V(SR) tSR_CONV TEST CONDITIONS Input voltage range, V(SRN) and V(SRP) V(SR) = V(SRN) – V(SRP) Conversion time Single conversion Resolution TYP –0.125 Input offset INL Integral nonlinearity error ZIN(SR) Effective input resistance (1) Ilkg(SR) Input leakage current (1) MAX UNIT 0.125 V 15 bits 1 14 VOS(SR) (1) MIN s 10 ±0.007 µV ±0.034 % FSR 2.5 MΩ 0.3 µA Assured by design. Not tested in production. ADC (TEMPERATURE AND CELL MEASUREMENT) CHARACTERISTICS TA = –40°C to 85°C, 2.4 V < REG25 < 2.6 V; Typical Values at TA = 25°C and REG25 = 2.5 V (unless otherwise noted) PARAMETER VIN(ADC) tADC_CONV TEST CONDITIONS Input voltage range MIN TYP 0.05 Conversion time Resolution 14 PRODUCT PREVIEW VOS(ADC) Input offset ZADC1 Effective input resistance (TS) (1) MAX UNIT 1 V 125 ms 15 bits 1 ZADC2 Effective input resistance (BAT)(1) Ilkg(ADC) Input leakage current (1) bq34z110 not measuring cell voltage mV 8 MΩ 8 MΩ bq34z110 measuring cell voltage 100 KΩ 0.3 µA DATA FLASH MEMORY CHARACTERISTICS TA = –40°C to 85°C, 2.4 V < REG25 < 2.6 V; Typical Values at TA = 25°C and REG25 = 2.5 V (unless otherwise noted) PARAMETER Data retention tDR Flash-programming write cycles (1) tWORDPROG ICCPROG (1) TEST CONDITIONS (1) MIN TYP UNIT 10 Years 20,000 Cycles Word programming time (1) Flash-write supply current MAX (1) 5 2 ms 10 mA Assured by design. Not tested in production. HDQ COMMUNICATION TIMING CHARACTERISTICS TA = –40°C to 85°C, CREG = 0.47 μF, 2.45 V < VREGIN = VBAT < 5.5 V; typical values at TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 205 250 μs μs t(CYCH) Cycle time, host to bq34z110 190 t(CYCD) Cycle time, bq34z110 to host 190 t(HW1) Host sends 1 to bq34z110 0.5 50 μs t(DW1) bq34z110 sends 1 to host 32 50 μs t(HW0) Host sends 0 to bq34z110 86 145 μs t(DW0) bq34z110 sends 0 to host 80 145 μs t(RSPS) Response time, bq34z110 to host 190 950 μs t(B) Break time 190 t(BR) Break recovery time 40 t(RISE) HDQ line rising time to logic 1 (1.2 V) t(RST) HDQ Reset 6 1.8 Submit Documentation Feedback μs μs 950 ns 2.2 s Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): bq34z110 bq34z110 www.ti.com SLUSB55 – JUNE 2012 1.2V t(BR) t(B) t(RISE) (b) HDQ line rise time (a) Break and Break Recovery t(DW1) t(HW1) t(DW0) t(CYCD) t(HW0) t(CYCH) (d) Gauge Transmitted Bit (c) Host Transmitted Bit 1-bit R/W 7-bit address Break 8-bit data t(RSPS) (e) Gauge to Host Response PRODUCT PREVIEW Figure 3. Timing Diagrams I2C-COMPATIBLE INTERFACE TIMING CHARACTERISTICS TA = –40°C to 85°C, CREG = 0.47 μF, 2.45 V < VREGIN = VBAT < 5.5 V; typical values at TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 300 ns 300 ns tr SCL/SDA rise time tf SCL/SDA fall time tw(H) SCL pulse width (high) 600 ns tw(L) SCL pulse width (low) 1.3 μs tsu(STA) Setup for repeated start 600 ns td(STA) Start to first falling edge of SCL 600 ns tsu(DAT) Data setup time 100 ns th(DAT) Data hold time 0 ns tsu(STOP) Setup time for stop 600 ns tBUF Bus free time between stop and start 66 μs fSCL Clock frequency 400 tSU(STA) tw(H) tf tw(L) tr kHz t(BUF) SCL SDA td(STA) tsu(STOP) tf tr th(DAT) tsu(DAT) REPEATED START STOP START Figure 4. I2C-Compatible Interface Timing Diagrams Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): bq34z110 7 PACKAGE OPTION ADDENDUM www.ti.com 25-Jul-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) BQ34Z110PW PREVIEW TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ34Z110PWR PREVIEW TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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