SBAS311 − MARCH 2004 − 1MHz for ADS1206 − 4MHz for ADS1207 Selectable High-Impedance Buffered Input 2% Internal, 2.5V Reference Voltage High-Current Output Driver Power Supply 3.3V or 5V Low Power : 3mW (typ) DESCRIPTION D D D D D D Alternate Source for AD7740 D −40°C to +85°C Operating Temperature Range APPLICATIONS D Galvanic Isolation Measurement D High Voltage Measurement D Low-Cost Analog-to-Digital Conversion D Motor Control D Industrial Process Control D Instrumentation D Smart Transmitters D Portable Instruments The ADS1206 and ADS1207 are a low-cost, high-performance, synchronous voltage-to-frequency converters (VFC). Both devices can operate from a single 3.0V to 3.6V or 4.5V to 5.5V power supply, consuming only 1mA. The output signal is synchronous with the input clock, CLKIN. The clock input is TTL- and CMOScompatible and the onboard clock generator can also accept an external crystal or resonator. The maximum input clock frequency for the ADS1206 is 1MHz and for the ADS1207 is 4MHz. The clock divider on the ADS1207 scales the input frequency to 2MHZ, which permits the core to operate at the higher rate. The high-impedance input is ideal for direct connection to high-impedance transducers or high-voltage resistive dividers. Counting output pulses over a 4ms period results in an effective 12-bit resolution for the ADS1206 using a 1MHz input clock. For the ADS1207 using a 4MHz input clock, the same result occurs over a 2ms period. Both devices are designed for use in medium-resolution measurements. They are available in an 8-lead VSSOP package. REFIN/OUT 1kΩ VIN x1 Modulator Reference Voltage 2.5V Buffer FOUT −2 ADS1207 Only BUF CLKOUT CLKIN Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. !"#$ !&'&( ) *+) ,- ) *+) -) , * -,+ . )) - - , )*) ) -) . $/ ' + ) -) ) ,- ) ) . Copyright 2004, Texas Instruments Incorporated www.ti.com PRODUCT PREVIEW FEATURES D Syncronous Operation D Frequency Set By External Clock D Maximum Input Frequency: www.ti.com SBAS311 − MARCH 2004 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) PRODUCT MAXIMUM INTEGRAL LINEARITY ERROR (%FS) MAXIMUM GAIN ERROR (%) PACKAGELEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE ADS1206 ±0.012 ±0.7 VSSOP-8 DGK −40°C to +85°C ADS1207 ±0.012 ±0.7 VSSOP-8 DGK −40°C to +85°C PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY TBD ADS1206IDGKT Tape and Reel, 250 TBD ADS1206IDGKR Tape and Reel, 2000 TBD ADS1207IDGKT Tape and Reel, 250 TBD ADS1207IDGKR Tape and Reel, 2000 (1) For the most current package and ordering information, refer to our web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS PRODUCT PREVIEW over operating free-air temperature range unless otherwise noted(1) ADS1204 UNIT −0.3 to 7 V Analog Input Voltage with Respect to GND GND − 0.3 to VDD + 0.3 V Reference Input Voltage with Respect to GND GND − 0.3 to VDD + 0.3 V Digital Input Voltage with Respect to GND GND − 0.3 to VDD + 0.3 V −20 to 20 mA Supply Voltage, GND to VDD Input Current to Any Pin Except Supply Power Dissipation See Dissipation Rating Table Operating Virtual Junction Temperature Range, TJ −40 to +150 °C Operating Free-Air Temperature Range, TA −40 to +85 °C Storage Temperature Range, TSTG −65 to +150 °C Lead Temperature (1.6mm or 1/16-inch from case for 10s) +260 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS PARAMETER MIN 3.0 4.5 TBD 0 0.1 TBD TBD −40 Low-Voltage Levels 5V Logic Levels Supply Voltage, GND to VDD Reference Input Voltage BUF = 0 BUF = 1 ADS1206 ADS1207 Analog Inputs External Clock Operating Junction Temperature Range, TJ (1) with reduced accuracy, minimum clock can go up to 500kHz. NOM 5 2.5 MAX 3.6 5.5 VDD VREF VDD − 0.2 1 4 105 UNIT V V V V V MHz MHz °C DISSIPATION RATING TABLE BOARD Low-K(2) PACKAGE TA ≤ 25°C POWER RATING DGK High-K(3) DGK TA = 70°C POWER RATING TA = 85°C POWER RATING 469.6mW DERATING FACTOR ABOVE TA = 25°C(1) 3.756mW/°C 300.5mW 244.2mW 691.4mW 5.531mW/°C 442.5mW 359.5mW (1) This is the inverse of the traditional junction-to-ambient thermal resistance (Rq JA). Thermal resistances are not production tested and are for informational purposes only. (2) The JEDEC Low-K (1s) board design used to derive this data was a 3-inch x 3-inch, two-layer board with 2-ounce copper traces on top of the board. (3) The JEDEC High-K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and ground planes and 2-ounce copper traces on the top and bottom of the board. 2 www.ti.com SBAS311 − MARCH 2004 ELECTRICAL CHARACTERISTICS Over recommended operating free-air temperature range at −40°C to +85°C, VDD = 5V or VDD = 3V, VREF = internal +2.5V, CLKIN = 1MHz, unless otherwise noted. ADS1206I, ADS1207I MIN TYP(1) MAX UNITS BUF = 1 ±0.012 % FSR BUF = 0 ±0.018 % FSR TBD % FSR mV PARAMETER DC Accuracy INL Integral linearity error(2) DNL Differential nonlinearity(3) VOS Offset error TCVOS GERR Offset error drift Gain error(4) TCGERR Gain error drift TEST CONDITIONS BUF = 0, VIN = 0V ±7 ±35 BUF = 1, VIN = 0.1V ±7 ±35 mV 5 20 µV/°C ±0.1 ±0.7 % FSR Referenced to VREF Noise PSRR Power-supply rejection ratio 20 ppm/°C TBD µVrms 4.5V < VDD < 5.5V 55 dB 3.0V < VDD < 3.6V 65 dB FSR Full-scale range Input capacitance Input current BUF = 0 0 BUF = 1 0.1 BUF = 0 3 BUF = 1 3 BUF = 0 8 10 5 100 BUF = 1 Differential input resistance Bandwidth V V pF pF 100 Differential input capacitance BW VREF VDD − 0.2 PRODUCT PREVIEW Analog Input µA nA kΩ 1 pF FS sinewave, −3dB, BUF = 0 TBD MHz FS sinewave, −3dB, BUF = 1 TBD MHz Output Signal FOUT Output frequency span ADS1206I 0.1 0.9 CLKIN ADS1207I 0.05 0.45 CLKIN Voltage Reference Output VOUT Reference voltage output 2.3 2.5 Initial accuracy dVOUT/dT PSRR Power-supply rejection ratio % ±50 ppm/°C 100 f =10Hz to 10kHz, CL = 10µF TBD µVPP µVrms −70 dB VDD = 4.5V to 5.5V VDD = 3.0V to 3.6V Reference output resistance Turn-on settling time V ±8 f = 0.1Hz to 10Hz, CL = 10µF Output voltage temperature drift Output voltage noise 2.7 to 0.1% at CL = 0 −60 dB 1 kΩ 30 µs Voltage Reference Input VREF Reference voltage input Reference input capacitance Reference input current TBD 2.5 VDD V 5 pF ±200 µA (1) All typical values are at TA = +25°C. (2) Integral nonlinearity is defined as the maximum deviation of the line through the end points of the transfer curve for VIN = 0V to VREF or 0.1V to VDD − 0.2V, expressed either as the number of LSBs or as a percent of measured input range. (3) Ensured by design. (4) Maximum values, including temperature drift, are ensured over the full specified temperature range. (5) Applicable for 5.0V nominal supply: VDD (min) = 4.5V and VDD (max) = 5.5V. (6) Applicable for 3.0V nominal supply: VDD (min) = 3.0V and VDD (max) = 3.6V. 3 www.ti.com SBAS311 − MARCH 2004 ELECTRICAL CHARACTERISTICS (continued) Over recommended operating free-air temperature range at −40°C to +85°C, VDD = 5V or VDD = 3V, VREF = internal +2.5V, CLKIN = 1MHz, unless otherwise noted. PARAMETER Digital Inputs(5) TEST CONDITIONS ADS1206I, ADS1207I MIN TYP(1) MAX Logic family VIH VIL High-level input voltage IIN CI Input current UNITS CMOS 0.7×VDD −0.3 Low-level input voltage VDD+0.3 0.3×VDD ±1 VI = VDD or GND Input capacitance 5 V V µA pF Digital Outputs(5) PRODUCT PREVIEW Logic family VOH High-level output voltage VOL IO Low-level output voltage CO CL Output capacitance Output sink current CMOS VDD = 4.5V, IOH = −100µA VDD = 4.5V, IOH = −2mA 4.44 V 2.5 VDD = 4.5V, IOH = 2mA 1.5V < VOL < VDD V 0.5 10 5 pF Load capacitance Digital Inputs(6) Logic family V mA 30 pF VDD+0.3 0.8 V ±1 nA LVCMOS and LVTTL VIH VIL High-level input Voltage Low-level input voltage VDD = 3.6V VDD = 3.0V IIN CI Input current VI = VDD or GND 2 −0.3 Input capacitance 5 V pF Digital Outputs(6) Logic family LVCMOS and LVTTL High-level output voltage VDD = 3V, IOH = −100µA VDD = 3V, IOH = −2mA VOL Low-level output voltage VDD = 3V, IOH = 100µA VDD = 3V, IOH = 2mA IO CO Output sink current 10 Output capacitance 5 VOH VDD−0.2 2.4 V V 0.2 0.4 CL Load capacitance Power Supply VDD IDD Power-supply voltage Supply current Power dissipation V V mA pF 30 pF V Low-voltage levels 3.0 3.6 5V logic levels 4.5 5.5 V 1.25 mA BUF = GND 0.9 BUF = VDD 1.1 1.5 mA VDD = 3.3V VDD = 5V 3.63 4.95 mW 5.5 7.5 mW (1) All typical values are at TA = +25°C. (2) Integral nonlinearity is defined as the maximum deviation of the line through the end points of the transfer curve for VIN = 0V to VREF or 0.1V to VDD − 0.2V, expressed either as the number of LSBs or as a percent of measured input range. (3) Ensured by design. (4) Maximum values, including temperature drift, are ensured over the full specified temperature range. (5) Applicable for 5.0V nominal supply: VDD (min) = 4.5V and VDD (max) = 5.5V. (6) Applicable for 3.0V nominal supply: VDD (min) = 3.0V and VDD (max) = 3.6V. 4 www.ti.com SBAS311 − MARCH 2004 PIN ASSIGNMENTS Terminal Functions TERMINAL VSSOP PACKAGE (TOP VIEW) CLKOUT 1 NAME BUF 8 NO. DESCRIPTION CLKOUT 1 Clock output CLKIN 2 Master clock input GND 3 Ground Reference voltage input or output CLKIN 2 7 FOUT REFIN/OUT 4 GND 3 6 VDD VIN 5 Analog input VIN VDD FOUT 6 Power supply, +3.3V or +5V nominal 7 Modulator output BUF 8 Buffered mode select REFIN/OUT 4 5 PARAMETER MEASUREMENT INFORMATION tC1 tD1 PRODUCT PREVIEW CLKIN tW1 FOUT tW2 tR1 tF1 Figure 1. Timing Diagram TIMING REQUIREMENTS: 5.0V over recommended operating free-air temperature range at −40°C to +85°C,, and VDD = 5V, unless otherwise noted. PARAMETER tC1 Input clock period tW1 tD1 Input clock high time tW2 tR1 FOUT high time MIN MAX UNITS ADS1206 1000 TBD ns ADS1207 250 TBD ns (tC1/2) − 100 TBD (tC1/2) + 100 TBD ns tC1 − 20 TBD tC1 + 20 TBD ns FOUT rising edge delay after input clock rising edge FOUT rise time ns ns tF1 FOUT fall time TBD TBD ns NOTE: Applicable for 5.0V nominal supply: VDD (min) = 4.5V and VDD (max) = 5.5V. All input signals are specified with tR = tF = 5ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. See timing diagram. TIMING REQUIREMENTS: 3.3V over recommended operating free-air temperature range at −40°C to +85°C,, and VDD = 3.3V, unless otherwise noted. PARAMETER tC1 Input clock period tW1 tD1 Input clock high time tW2 tR1 FOUT high time MIN MAX UNITS ADS1206 1000 TBD ns ADS1207 250 TBD ns (tC1/2) − 100 TBD (tC1/2) + 100 TBD ns tC1 − 8 TBD tC1 + 8 TBD ns FOUT rising edge delay after input clock rising edge FOUT rise time ns ns tF1 FOUT fall time TBD TBD ns NOTE: Applicable for 3.3V nominal supply: VDD (min) = 3.0V and VDD (max) = 3.6V. All input signals are specified with tR = tF = 5ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. See timing diagram. 5 PACKAGE OPTION ADDENDUM www.ti.com 25-Feb-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty ADS1206IDGKR PREVIEW MSOP DGK 8 2500 None Call TI Call TI ADS1206IDGKT PREVIEW MSOP DGK 8 250 None Call TI Call TI ADS1207IDGKR PREVIEW MSOP DGK 8 None Call TI Call TI ADS1207IDGKT PREVIEW MSOP DGK 8 None Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. 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