Rohm BA2903YFV-ME2 Automotive ground sense comparator Datasheet

Comparator series
Automotive
Ground Sense Comparators
BA2903Yxxx-M, BA2901Yxx-M
●Key Specifications
 Wide operating supply voltage
single supply :
split supply :
 Very low supply current
BA2903Yxxx-M
BA2901Yxx-M
 Low input bias current :
 Low input offset current :
 Operating temperature range :
●General Description
Automotive series BA2903Yxxx-M/BA2901Yxx-M,
integrate two or four independent high gain voltage
comparator.
Some features are the wide operating voltage that is 2
to 36V and low supply current. BA2903Yxxx-M,
BA2901Yxx-M are manufactured for automotive
requirements of car navigation system, car audio, etc.
.
●Features
 Operable with a single power supply
 Wide operating supply voltage
 Standard comparator pin-assignments
 Input and output are operable ground sense
 Internal ESD protection circuit
 Wide temperature range
●Packages
SOP8
SOP14
SSOP-B8
SSOP-B14
MSOP8
+2.0V to +36V
±1.0V to ±18V
0.6mA(Typ.)
0.8mA(Typ.)
50nA(Typ.)
5nA(Typ.)
-40℃ to +125℃
W(Typ.) x D(Typ.) x H(Max.)
5.00mm x 6.20mm x 1.71mm
8.70mm x 6.20mm x 1.71mm
3.00mm x 6.40mm x 1.35mm
5.00mm x 6.40mm x 1.35mm
2.90mm x 4.00mm x 0.90mm
●Selection Guide
Maximum Operating Temperature
+125℃
Supply Current
Dual
0.6mA
BA2903YF-M
BA2903YFV-M
BA2903YFVM-M
Quad
0.8mA
BA2901YF-M
BA2901YFV-M
Automotive
●Block Diagram
VCC
VOUT
+IN
-IN
VEE
Fig.1 Simplified schematic (one channel only)
○Product structure：Silicon monolithic integrated circuit
○This product is not designed protection against radioactive rays.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
● Pin Configuration
(Top View)
(Top View)
OUT1
1
- IN1
2
+IN1
3
VEE
4
CH1
CH2
SSOP-B8
SOP8
1
14
OUT3
OUT1 2
13
OUT4
VCC
3
12
VEE
- IN1
4
11
+IN4
+IN1
5
10
- IN4
- IN2
6
9
+IN3
+IN2
7
8
- IN3
OUT2
8
VCC
7
OUT2
6
- IN2
5
+ IN2
CH1
CH4
CH2
CH3
SOP14
MSOP8
SSOP-B14
Package
SOP8
SSOP-B8
MSOP8
SOP14
SSOP-B14
BA2903YF-M
BA2903YFV-M
BA2903YFVM-M
BA2901YF-M
BA2901YFV-M
●Ordering Information
B
A
2
9
0
x
Y
x
x
x
-
Package
F
: SOP8
SOP14
FV : SSOP-B8
: SSOP-B14
FVM : MSOP8
Part Number
BA2903Yxxx
BA2901Yxx
M
x
x
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SOP14/
SSOP-B8/SSOP-B14)
TR: Embossed tape and reel
(MSOP8)
M: Automotive (car navigation
system, car audio, etc.)
●Line-up
Topr
Operating
Supply
Voltage
Dual/Quad
Dual
-40℃ to +125℃
+2.0V ~ +36V
Package
Orderable
Part Number
SOP8
Reel of 2500
BA2903YF-ME2
SSOP-B8
Reel of 2500
BA2903YFV-ME2
MSOP8
Reel of 3000
BA2903YFVM-MTR
SOP14
Reel of 2500
BA2901YF-ME2
SSOP-B14
Reel of 2500
BA2901YFV-ME2
Quad
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Supply Voltage
VCC-VEE
+36
V
SOP8
Power dissipation
Pd
780
SSOP-B8
690*2*6
MSOP8
5903*6
SOP14
*4*6
SSOP-B14
Differential Input Voltage *7
1*6
mW
610
8705*6
Vid
+36
Input Common-mode Voltage Range
Vicm
(VEE-0.3) to (VEE+36)
V
Operating Temperature Range
Topr
-40 to +125
℃
Storage Temperature Range
Tstg
-55 to +150
℃
Tjmax
+150
℃
Maximum junction Temperature
V
Note : Absolute maximum rating item indicates the condition which must not be exceeded.
Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause
deterioration of characteristics.
*1
To use at temperature above Ta＝25℃ reduce 6.2mW/℃.
*2
To use at temperature above Ta＝25℃ reduce 5.5mW/℃.
*3
To use at temperature above Ta＝25℃ reduce 4.8mW/℃.
*4
To use at temperature above Ta＝25℃ reduce 4.9mW/℃.
*5
To use at temperature above Ta＝25℃ reduce 7.0mW/℃.
*6
Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
*7
The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
●Electrical Characteristics
○BA2903Yxxx-M (Unless otherwise specified VCC=+5V, VEE=0V)
Limits
Temperature
Parameter
Symbol
range
Min.
Typ.
25℃
2
Input Offset Voltage *8
Vio
Full range
25℃
5
Input Offset Current *8
Iio
Full range
25℃
50
Input Bias Current *8
Ib
Full range
Input Common-mode
Vicm
25℃
0
Voltage Range
25℃
88
100
Large Signal Voltage Gain
AV
Full range
74
25℃
0.6
Supply Current
ICC
Full range
-
Max.
7
15
50
200
250
500
VCC-1.5
1
2.5
Unit
mV
VOUT=1.4V
VCC=5 to 36V, VOUT=1.4V
nA
VOUT=1.4V
nA
VOUT=1.4V
V
dB
mA
Output Sink Current *9
IOL
25℃
6
16
-
mA
Output Saturation Voltage
(Low level output voltage)
VOL
25℃
Full range
-
150
-
400
700
mV
Output Leakage Current
(High level output voltage)
25℃
-
0.1
-
Ileak
Full range
-
-
1
25℃
-
1.3
-
Response Time
μA
μs
Tre
Full range
*8
*9
-
0.4
Conditions
-
VCC=15V, VOUT=1.4 to 11.4V
RL=15kΩ, VRL=15V
VOUT=open
VOUT=open, VCC=36V
VIN+=0V, VIN-=1V
VOL=1.5V
VIN+=0V, VIN-=1V
IOL=4mA
VIN+=1V, VIN-=0V
VOH=5V
VIN+=1V, VIN-=0V
VOH=36V
RL=5.1[kΩ],VRL=5[V],
VIN=100[mVp-p],
overdrive=5[mV]
RL=5.1[kΩ],VRL=5[V],VIN=TTL
Logic Swing, VREF=1.4[V]
Absolute value
Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
○BA2901Yxx-M
(Unless otherwise specified VCC=+5V, VEE=0V)
Limits
Temperature
Parameter
Symbol
range
Min.
Typ.
25℃
2
Input Offset Voltage *10
Vio
Full range
25℃
5
Input Offset Current *10
Iio
Full range
25℃
50
*10
Input Bias Current
Ib
Full range
Input Common-mode
Vicm
25℃
0
Voltage Range
25℃
88
100
Large Signal Voltage Gain
AV
Full range
74
25℃
0.8
Supply Current
ICC
Full range
Output Sink Current *11
Output Saturation Voltage
(Low level output voltage)
Output Leakage Current
(High level output voltage)
Response Time
IOL
VOL
Ileak
VCC-1.5
2
2.5
25℃
6
16
-
25℃
Full range
25℃
Full range
-
150
0.1
-
400
700
1
25℃
-
1.3
-
Unit
-
0.4
-
Conditions
mV
VOUT=1.4V
VCC=5 to 36V, VOUT=1.4V
nA
VOUT=1.4V
nA
VOUT=1.4V
V
dB
mA
mA
mV
μA
μs
Tre
Full range
*10
*11
Max.
7
15
50
200
250
500
VCC=15V, VOUT=1.4 to 11.4V
RL=15kΩ, VRL=15V
VOUT=open
VOUT=open, VCC=36V
VIN+=0V, VIN-=1V,
VOL=1.5V
VIN+=0V, VIN-=1V
IOL=4mA
VIN+=1V, VIN-=0V, VOH=5V
VIN+=1V, VIN-=0V, VOH=36V
RL=5.1[kΩ],VRL=5[V],
VIN=100[mVp-p],
overdrive=5[mV]
RL=5.1[kΩ],VRL=5[V],VIN=TTL
Logic Swing, VREF=1.4[V]
Absolute value
Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
Description of electrical characteristics
Described below are descriptions of the relevant electrical terms.
Please note that item names, symbols, and their meanings may differ from those on another manufacturer’s documents.
1.Absolute maximum ratings
The absolute maximum ratings are values that should never be exceeded, since doing so may result in deterioration
of electrical characteristics or damage to the part itself as well as peripheral components.
1.1 Power supply voltage (VCC-VEE)
Expresses the maximum voltage that can be supplied between the positive and negative power supply terminals
without causing deterioration of the electrical characteristics or destruction of the internal circuitry.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be supplied between the non-inverting and inverting terminals without
damaging the IC.
1.3 Input common-mode voltage range (Vicm)
Signifies the maximum voltage that can be supplied to non-inverting and inverting terminals without causing
deterioration of the electrical characteristics or damage to the IC itself. Normal operation is not guaranteed within the
input common-mode voltage range of the maximum ratings – use within the input common-mode voltage range of
the electric characteristics instead.
1.4 Operating and storage temperature ranges (Topr, Tstg)
The operating temperature range indicates the temperature range within which the IC can operate. The higher the
ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range
of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics.
1.5 Power dissipation (Pd)
Indicates the power that can be consumed by a particular mounted board at ambient temperature (25℃).
For packaged products, Pd is determined by maximum junction temperature and the thermal resistance.
2.Electrical characteristics
2.1 Input offset voltage (Vio)
Signifies the voltage difference between the non-inverting and inverting terminals. It can be thought of as the input
voltage difference required for setting the output voltage to 0V.
2.2 Input offset current (Iio)
Indicates the difference of the input bias current between the non-inverting and inverting terminals.
2.3 Input bias current (Ib)
Denotes the current that flows into or out of the input terminal, it is defined by the average of the input bias current at
the non-inverting terminal and the input bias current at the inverting terminal.
2.4 Input common-mode voltage range (Vicm)
Indicates the input voltage range under which the IC operates normally.
2.5 Large signal voltage gain (AV)
The amplifying rate (gain) of the output voltage against the voltage difference between the non-inverting and
inverting terminals, it is (normally) the amplifying rate (gain) with respect to DC voltage.
AV = (output voltage fluctuation) / (input offset fluctuation)
2.6 Circuit current (ICC)
Indicates the current of the IC itself that flows under specific conditions and during no-load steady state.
2.7
Output sink current (IOL)
Denotes the maximum current that can be output under specific output conditions.
2.8 Output saturation voltage low level output voltage (VOL)
Signifies the voltage range that can be output under specific output conditions.
2.9 Output leakage current, High level output current (Ileak)
Indicates the current that flows into the IC under specific input and output conditions.
2.10 Response time (Tre)
The interval between the application of input and output conditions.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
●Typical Performance Curves
○BA2903Yxxx-M
1000
1. 6
800
SUPPLY CURRENT [mA]
POWER DISSIPATION [mW]
.
BA2903YF-M
BA2903YFV-M
BA2903YFVM-M
600
400
200
1. 4
1. 2
1. 0
-40℃
0. 8
0. 6
25℃
0. 4
125℃
0. 2
0. 0
0
0
25
50
75
100
125
0
150
AMBIENT TEMPERATURE [℃]
MAXIMUM OUTPUT VOLTAGE [mV]
SUPPLY CURRENT [mA]
1.4
1.2
1.0
36V
2V
0.6
0.4
0.2
0.0
-50
-25
0
25
50
30
40
Fig.3
Supply Current – Supply Voltage
1.6
5V
20
SUPPLY VOLTAGE [V]
Fig.2
Derating Curve
0.8
10
75
100 125 150
200
150
125℃
100
25℃
50
-40℃
0
0
AMBIENT TEMPERATURE [℃]
10
20
30
40
SUPPLY VOLTAGE [V]
Fig.5
Maximum Output Voltage – Supply Voltage
(IOL=4mA)
Fig.4
Supply Current – Ambient
Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
200
2
1.8
2V
OUTPUT VOLTAGE [V]
MAXIMUM OUTPUT VOLTAGE [mV]
○BA2903Yxxx-M
150
100
5V
36V
50
1.6
1.4
125℃
1.2
1
25℃
0.8
0.6
0.4
-40℃
0.2
0
0
-50 -25
0
25
50
75
0
100 125 150
2
AMBIENT TEMPERATURE [℃]
6
8
10
12
14
16
18
20
OUTPUT SINK CURRENT [mA]
Fig.7
Output Voltage – Output Sink Current
(VCC=5V)
Fig.6
Maximum Output Voltage – Ambient Temperature
(IOL=4mA)
8
30
5V
INPUT OFFSET VOLTAGE [mV]
40
OUTPUT SINK CURRENT [mA]
4
36V
20
2V
10
6
4
-40℃
2
0
25℃
125℃
-2
-4
-6
-8
0
-50
-25
0
25
50
75
100 125 150
0
AMBIENT TEMPERATURE [℃]
10
20
30
40
SUPPLY VOLTAGE [V]
Fig.8
Output Sink Current – Ambient Temperature
(VOUT=1.5V)
Fig.9
Input Offset Voltage – Supply Voltage
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
8
160
6
140
4
5V
INPUT BIAS CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
○BA2903Yxxx-M
36V
2
0
2V
-2
-4
-6
120
-40℃
100
80
60
25℃
40
125℃
20
0
-8
-50
-25
0
25
50
75
0
100 125 150
5
AMBIENT TEMPERATURE [℃]
20
25
30
35
Fig.11
Input Bias Current – Supply Voltage
160
50
140
40
INPUT OFFSET CURRENT[nA]
INPUT BIAS CURRENT [nA]
15
SUPPLY VOLTAGE [V]
Fig.10
Input Offset Voltage – Ambient
Temperature
120
100
36V
80
60
40
5V
2V
20
10
30
20
-40℃
10
0
-10
125℃
25℃
-20
-30
-40
-50
0
-50
-25
0
25
50
75
100 125 150
0
10
20
30
40
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.13
Input Offset Current – Supply Voltage
Fig.12
Input Bias Current – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
○BA2903Yxxx-M
LARGE SINGAL VOLTAGE GAIN [dB]
INPUT OFFSET CURRENT [nA]
50
40
30
20
2V
10
5V
0
-10
36V
-20
-30
-40
-50
-50
-25
0
25
50
75
140
130
125℃
25℃
120
110
100
-40℃
90
80
70
60
100 125 150
0
10
AMBIENT TEMPERATURE [℃]
COMMON MODE REJECTION RATIO [dB]
LARGE SINGAL VOLTAGE GAIN [dB]
130
36V
110
15V
5V
90
80
70
60
-50
-25
0
25
50
75
40
Fig.15
Large Signal Voltage Gain
– Supply Voltage
140
100
30
SUPPLY VOLTAGE [V]
Fig.14
Input Offset Current
– Ambient Temperature
120
20
100 125 150
160
140
120
125℃
100
80
-40℃
25℃
60
40
0
AMBIENT TEMPERATURE [℃]
10
20
30
40
SUPPLY VOLTAGE [V]
Fig.16
Large Signal Voltage Gain
– Ambient Temperature
Fig.17
Common Mode Rejection Ratio
– Supply Voltage
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
6
150
INPUT OFFSET VOLTAGE [mV]
COMMON MODE REJECTION RATIO [dB]
○BA2903Yxxx-M
125
36V
100
75
5V
2V
50
25
-40℃
4
25℃
125℃
2
0
-2
-4
-6
0
-50
-25
0
25
50
75
-1
100 125 150
1
2
3
4
5
INPUT VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.18
Common Mode Rejection Ratio
– Ambient Temperature
Fig.19
Input Offset Voltage – Input Voltage
(VCC=5V)
200
5
RESPONSE TIME (LOW TO HIGH)[us]
POWER SUPPLY REJECTION RATIO [dB]
0
180
160
140
120
100
80
60
-50
-25
0
25
50
75
100 125 150
4
3
2
125℃
25℃
-40℃
1
0
-100
-80
-60
-40
-20
0
OVER DRIVE VOLTAGE [mV]
AMBIENT TEMPERATURE [℃]
Fig.21
Response Time (Low to High) – Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
Fig.20
Power Supply Rejection Ratio
– Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
○BA2903Yxxx-M
10
RESPONSE TIME (HIGH TO LOW)[us]
RESPONSE TIME (LOW TO HIGH)[us]
5
4
3
5mV
overdrive
20mV
overdrive
100mV
2
overdrive
1
0
8
6
4
125℃
25℃
-40℃
2
0
-50
-25
0
25
50
75
100 125 150
0
20
40
60
80
100
OVER DRIVE VOLTAGE [mV]
AMBIENT TEMPERATURE [℃]
Fig.22
Response Time (Low to High)
– Ambient Temperature (VCC=5V, VRL=5V,
RL=5.1kΩ)
Fig.23
Response Time (High to Low)
– Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
RESPONSE TIME (HIGH TO LOW)[us]
10
8
6
5mV
overdrive
20mV
4
overdrive
100mV
overdrive
2
0
-50
-25
0
25
50
75
100 125 150
AMBIENT TEMPERATURE [℃]
Fig.24
Response Time (High to Low)
– Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ02201-0RFR1G200550-1-2
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
○BA2901Yxx-M
2.0
800
SUPPLY CURRENT [mA]
POWER DISSIPATION [mW]
1000
BA2901YFV-M
600
BA2901YF-M
400
200
0
0
25
50
75
100
125
-40℃
1.5
1.0
25℃
0.5
125℃
0.0
150
0
10
AMBIENT TEMPERATURE [℃ ]
36V
5V
2V
0.5
0.0
0
25
50
75
100 125 150
MAXIMUM OUTPUT VOLTAGE [mV]
SUPPLY CURRENT [mA]
1.5
-25
40
Fig.26
Supply Current – Supply Voltage
2.0
-50
30
SUPPLY VOLTAGE [V]
Fig.25
Derating Curve
1.0
20
200
150
125℃
100
25℃
50
-40℃
0
0
10
AMBIENT TEMPERATURE [℃]
20
30
40
SUPPLY VOLTAGE [V]
Fig.27
Supply Current – Ambient Temperature
Fig.28
Maximum Output Voltage – Supply Voltage
(IOL=4mA)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
200
2
1.8
2V
OUTPUT VOLTAGE [V]
MAXIMUM OUTPUT VOLTAGE [mV]
○BA2901Yxx-M
150
100
5V
36V
50
1.6
1.4
125℃
1.2
1
25℃
0.8
0.6
0.4
-40℃
0.2
0
0
-50 -25
0
25
50
75
0
100 125 150
2
AMBIENT TEMPERATURE [℃]
6
8
10
12
14
16
18
20
OUTPUT SINK CURRENT [mA]
Fig.30
Output Voltage – Output Sink Current
(VCC=5V)
Fig.29
Maximum Output Voltage – Ambient Temperature
(IOL=4mA)
8
30
5V
INPUT OFFSET VOLTAGE [mV]
40
OUTPUT SINK CURRENT [mA]
4
36V
20
2V
10
6
4
-40℃
2
0
25℃
125℃
-2
-4
-6
-8
0
-50
-25
0
25
50
75
100 125 150
0
AMBIENT TEMPERATURE [℃]
10
20
30
40
SUPPLY VOLTAGE [V]
Fig.31
Output Sink Current – Ambient Temperature
(VOUT=1.5V)
Fig.32
Input Offset Voltage – Supply Voltage
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
8
160
6
140
4
5V
INPUT BIAS CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
○BA2901Yxx-M
36V
2
0
2V
-2
-4
-6
120
-40℃
100
80
60
25℃
40
125℃
20
0
-8
-50
-25
0
25
50
75
0
100 125 150
5
AMBIENT TEMPERATURE [℃]
20
25
30
35
Fig.34
Input Bias Current – Supply Voltage
160
50
140
40
INPUT OFFSET CURRENT[nA]
INPUT BIAS CURRENT [nA]
15
SUPPLY VOLTAGE [V]
Fig.33
Input Offset Voltage – Ambient
Temperature
120
100
36V
80
60
40
5V
2V
20
10
30
20
-40℃
10
0
-10
125℃
25℃
-20
-30
-40
-50
0
-50
-25
0
25
50
75
100 125 150
0
10
20
30
40
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [ ℃]
Fig.36
Input Offset Current – Supply Voltage
Fig.35
Input Bias Current – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
○BA2901Yxx-M
LARGE SINGAL VOLTAGE GAIN [dB]
INPUT OFFSET CURRENT [nA]
50
40
30
20
2V
10
5V
0
-10
36V
-20
-30
-40
-50
-50
-25
0
25
50
75
140
130
125℃
25℃
120
110
100
-40℃
90
80
70
60
100 125 150
0
10
AMBIENT TEMPERATURE [ ℃]
COMMON MODE REJECTION RATIO [dB]
LARGE SINGAL VOLTAGE GAIN [dB]
130
36V
110
15V
5V
90
80
70
60
-50
-25
0
25
50
75
40
Fig.38
Large Signal Voltage Gain
– Supply Voltage
140
100
30
SUPPLY VOLTAGE [V]
Fig.37
Input Offset Current
– Ambient Temperature
120
20
100 125 150
160
140
120
125℃
100
80
-40℃
25℃
60
40
0
AMBIENT TEMPERATURE [℃]
10
20
30
40
SUPPLY VOLTAGE [V]
Fig.39
Large Signal Voltage Gain
– Ambient Temperature
Fig.40
Common Mode Rejection Ratio
– Supply Voltage
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
6
150
INPUT OFFSET VOLTAGE [mV]
COMMON MODE REJECTION RATIO [dB]
○BA2901Yxx-M
125
36V
100
75
5V
2V
50
25
-40℃
4
25℃
125℃
2
0
-2
-4
-6
0
-50
-25
0
25
50
75
-1
100 125 150
0
2
3
4
5
INPUT VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.41
Common Mode Rejection Ratio
– Ambient Temperature
Fig.42
Input Offset Voltage – Input Voltage
(VCC=5V)
200
5
RESPONSE TIME (LOW TO HIGH)[us]
POWER SUPPLY REJECTION RATIO [dB]
1
180
160
140
120
100
80
60
-50
-25
0
25
50
75
100 125 150
4
3
2
25℃
-40℃
125℃
1
0
-100
-80
-60
-40
-20
0
OVER DRIVE VOLTAGE [mV]
AMBIENT TEMPERATURE [ ℃]
Fig.44
Response Time (Low to High) – Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
Fig.43
Power Supply Rejection Ratio
– Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
○BA2901Yxx-M
10
RESPONSE TIME (HIGH TO LOW)[us]
RESPONSE TIME (LOW TO HIGH)[us]
5
4
3
5mV
overdrive
20mV
overdrive
100mV
2
overdrive
1
0
-50
-25
0
25
50
75
8
6
4
125℃
25℃
-40℃
2
0
100 125 150
0
20
40
60
80
100
OVER DRIVE VOLTAGE [mV]
AMBIENT TEMPERATURE [℃]
Fig.45
Response Time (Low to High)
– Ambient Temperature (VCC=5V, VRL=5V,
RL=5.1kΩ)
Fig.46
Response Time (High to Low)
– Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
RESPONSE TIME (HIGH TO LOW)[us]
10
8
6
5mV
overdrive
20mV
4
overdrive
100mV
overdrive
2
0
-50
-25
0
25
50
75
100 125 150
AMBIENT TEMPERATURE [℃]
Fig.47
Response Time (High to Low)
– Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
●Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θja℃/W.The temperature of IC inside the package can be estimated by this
thermal resistance. Fig.48(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below
θja = (Tjmax-Ta) / Pd
℃/W
・・・・・ (Ⅰ)
Derating curve in Fig.48(b) indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Fig.49(c),(d) show a derating curve for an example of BA2903Yxxx-M and
BA2901Yxx-M.
LSIの 消 費
力 [W]
Power dissipation
of 電
LSI
Pd (max)
θja=(Tjmax-Ta)/Pd ℃/W
θja2 < θja1
P2
周囲温度 Ta [℃]
Ambient temperature
θ' ja2
P1
θ ja2
Tj ' (max) Tj (max)
θ' ja1
θ ja1
Chip surfaceチップ
temperature
表面温度 Tj [℃]
0
消費電力Pd[W]
P [W]
Power dissipation
25
50
75
100
125
150
Ambient temperature
周 囲 温 度 Ta [℃ ]
(a) Thermal resistance
(b) Derating curve
Fig.48 Thermal resistance and derating curve
1000
1000
800
POWER DISSIPATION [mW]
POWER DISSIPATION [mW]
BA2903YF-M(12)
BA2903YFV-M(13)
BA2903YFVM-M(14)
600
400
200
0
800
BA2901YFV-M(15)
600
BA2901YF-M(16)
400
200
0
0
25
50
75
100
125
150
0
AMBIENT TEMPERATURE [℃]
25
50
75
100
125
150
AMBIENT TEMPERATURE [℃ ]
(c) BA2903Y
(d) BA2901Y
(12)
(13)
(14)
(15)
(16)
UNIT
6.2
5.5
4.8
7.0
4.9
mW/℃
When using the unit above Ta=25℃, subtract the value above per degree℃.
Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm(cooper foil area below 3%) is mounted.
Fig. 49 Derating curve
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TSZ02201-0RFR1G200550-1-2
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
Test Circuit 1 Null Method
VCC,VEE,EK,Vicm Unit：V
Parameter
VF
S1
S2
S3
Vcc
VEE
EK
Vicm
Calculation
Input Offset Voltage
VF1
ON
ON
ON
5～36
0
-1.4
0
1
Input Offset Current
VF2
OFF
OFF
ON
5
0
-1.4
0
2
VF3
OFF
ON
5
0
-1.4
0
VF4
ON
OFF
5
0
-1.4
0
ON
ON
15
0
-1.4
0
15
0
-11.4
0
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
ON
ON
3
4
- Calculation 1. Input Offset Voltage (Vio)
| VF1 |
[V]
Vio =
1 + Rf / Rs
2. Input Offset Current (Iio)
| VF2－VF1 |
Iio =
[A]
Ri ×(1 + Rf / Rs)
3. Input Bias Current (Ib)
| VF4－VF3 |
Ib =
[A]
2×Ri× (1 + Rf / Rs)
4. Large Signal Voltage Gain (AV)
Av = 20×Log
ΔEK×(1+Rf /Rs)
|VF5-VF6|
[dB]
Rf=50kΩ
500kΩ
VCC
SW1
0.1μF
EK
+15V
Rs=50Ω
Ri=10kΩ
Ri=10kΩ
500kΩ
DUT
NULL
SW3
Rs=50Ω
Vicm
1000pF
V
RL
SW2
50kΩ
VF
VEE
-15V
Fig.50 Test circuit1 (one channel only)
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
Test Circuit 2: Switch Condition
SW No.
Supply Current
SW
1
SW
2
SW
3
SW
4
SW
5
SW
6
SW
7
OFF
OFF
OFF
OFF
OFF
OFF
OFF
Output Sink Current
VOL=1.5V
OFF
ON
ON
OFF
OFF
OFF
ON
Saturation Voltage
IOL=4mA
OFF
ON
ON
OFF
ON
ON
OFF
Output Leakage Current
VOH=36V
OFF
ON
ON
OFF
OFF
OFF
ON
Response Time
RL=5.1kΩ, VRL=5V
ON
OFF
ON
ON
OFF
OFF
OFF
SW6
SW7
VCC
A
－
＋
SW1
SW2
SW3
SW4
VEE
VIN-
SW5
RL
V
A
VRL
VIN+
VOL/VOH
Fig.51 Test Circuit 2 (one channel only)
Input wave
VIN
Input wave
入力電圧波形
VIN
入力電圧波形
+100mV
0V
overdrive voltage
overdrive voltage
0V
VOUT
-100mV
Output wave
VOUT
出力電圧波形
VCC
Output wave
出力電圧波形
VCC
VCC/2
VCC/2
0V
0V
Tre (LOW to HIGH)
Tre (HIGH to LOW)
Fig.52 Response Time
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
Example of circuit
○Reference voltage is Vin-
VCC
Vin
Pull Up
Voltage
電圧
+
Reference voltage
基準電圧
Vout
-
Reference Voltage
Time
時間
Vref
VEE
Voltage
Input voltage wave
入力電圧波形
電圧
High
While input voltage is bigger than reference voltage,
output voltage is high. While input voltage is smaller
than reference voltage, output voltage is low.
Low
Time
Output voltage wave
出力電圧波形
○Reference voltage is Vin+
Voltage
電圧
Pull Up
VCC
Reference Voltage
Reference voltage
基準電圧
+
Vref
Vin
Vout
-
Time
時間
Voltage
VEE
Input voltage wave
入力電圧波形
High
While input voltage is smaller than reference
voltage, output voltage is high. While input voltage
is bigger than reference voltage, output voltage is
low.
Low
Time
Output voltage wave
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
●Operational Notes
1) Unused circuits
When there are unused circuits it is recommended that they be
connected as in Fig.53, setting the non-inverting input terminal to a
potential within the in-phase input voltage range (VICR).
VCC
Vicm
Please keep this potential in Vicm
VCC-1.5V＞Vicm＞VEE
2) Input terminal voltage
Applying VEE + 36V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, irrespective
of the supply voltage. However, this does not ensure normal circuit
operation. Please note that the circuit operates normally only when the
input voltage is within the common mode input voltage range of the
electric characteristics.
OPEN
+
－
VEE
Fig. 53 Disable circuit example
3) Power supply (single / dual)
The op-amp operates when the specified voltage supplied is between VCC and VEE. Therefore, the signal supply
op-amp can be used as a dual supply op-amp as well.
4) Power dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in
chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation
(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating
curves for more information.
5) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and
the power supply, or the output and GND may result in IC destruction.
6) Terminal short-circuits
When the output and VCC terminals are shorted, excessive output current may flow, resulting in undue heat generation
and, subsequently, destruction.
7) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
8) Radiation
This IC is not designed to withstand radiation.
9) IC handing
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezo resistance effects.
10) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the
power is turned off before inspection and removal. Furthermore, please take measures against ESD in the assembly
process as well as during transportation and storage.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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Datasheet
BA2903Yxxx-M, BA2901Yxx-M
●Physical Dimensions Tape and Reel Information
SOP8
<Tape and Reel information>
5.0±0.2
(MAX 5.35 include BURR)
6
5
6.2±0.3
4.4±0.2
0.3MIN
7
1 2
3
0.9±0.15
8
+6°
4° −4°
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
S
S
0.11
0.1
1.27
1pin
0.42±0.1
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SOP14
<Tape and Reel information>
8.7 ± 0.2
(MAX 9.05 include BURR)
8
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
0.3MIN
4.4±0.2
6.2±0.3
14
1
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
7
1.5±0.1
0.15 ± 0.1
0.4 ± 0.1
0.11
1.27
0.1
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SSOP-B8
<Tape and Reel information>
3.0±0.2
(MAX 3.35 include BURR)
8
7
6
5
Tape
Embossed carrier tape
Quantity
2500pcs
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.3MIN
6.4 ± 0.3
4.4 ± 0.2
Direction
of feed
2
3
4
0.1
1.15±0.1
1
0.15±0.1
S
(0.52)
0.65
0.1 S
+0.06
0.22 −0.04
0.08
1pin
M
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SSOP-B14
<Tape and Reel information>
5.0 ± 0.2
8
0.3Min.
4.4 ± 0.2
6.4 ± 0.3
14
1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
7
0.10
1.15 ± 0.1
0.15 ± 0.1
0.65
0.1
0.22 ± 0.1
1pin
Reel
(Unit : mm)
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Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0RFR1G200550-1-2
25.SEP.2012 Rev.001
Datasheet
BA2903Yxxx-M, BA2901Yxx-M
MSOP8
<Tape and Reel information>
2.8±0.1
4.0±0.2
8 7 6 5
0.6±0.2
+6°
4° −4°
0.29±0.15
2.9±0.1
(MAX 3.25 include BURR)
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1 2 3 4
1PIN MARK
1pin
+0.05
0.145 −0.03
0.475
0.08±0.05
0.75±0.05
0.9MAX
S
+0.05
0.22 −0.04
0.08 S
Direction of feed
0.65
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagrams
SOP8(TOP VIEW)
SSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
MSOP8(TOP VIEW)
SOP14(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SSOP-B14(TOP VIEW)
Part Number Marking
Product Name
LOT Number
BA2903Y
BA2901Y
F-M
FV-M
FVM-M
F-M
FV-M
Package Type
SOP8
SSOP-B8
MSOP8
SOP14
SSOP-B14
Marking
03YM
03YM
03YM
BA2901YFM
01YM
1PIN MARK
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Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001