Mitsubishi CM900DU-24NF High power switching use Datasheet

MITSUBISHI IGBT MODULES
CM900DU-24NF
HIGH POWER SWITCHING USE
CM900DU-24NF
● IC ................................................................... 900A
● VCES ......................................................... 1200V
● Insulated
Type
● 2-elements in a pack
APPLICATION
UPS & General purpose inverters, etc
OUTLINE DRAWING & CIRCUIT DIAGRAM
Dimensions in mm
A,B HOUSING Type
(J. S. T. Mfg. Co. Ltd)
A : VHR-2N
B : VHR-5N
150
137.5±0.25
42
14 14
Tc measured point
(The side of Cu
12 2
base plate)
34.6 +1.0
–0.5
4
E1
PPS
10.5
E2
E2
1.9 ±0.2
14 14 14 14 14 14
42
42
L A B E L
34.6 +1.0
–0.5
E2 G2
9-M6 NUTS 12
C2
C2E1
E2
C1
C1
G1 E1
18
15.7
5.5
C1
25.1
8-f6.5
MOUNTING HOLES
G1
G2
B
129.5
166
C1
C2E1
C2
A
21
11 19
38±0.25 42.5±0.25 38±0.25
74±0.25
74±0.25
15.7
Tc measured point
(The side of Cu
base plate)
CIRCUIT DIAGRAM
Mar. 2003
MITSUBISHI IGBT MODULES
CM900DU-24NF
HIGH POWER SWITCHING USE
MAXIMUM RATINGS (Tj = 25°C)
Symbol
VCES
VGES
IC
ICM
IE (Note 1)
IEM (Note 1)
PC (Note 3)
Tj
Tstg
Viso
Parameter
Collector-emitter voltage
Gate-emitter voltage
Collector current
Emitter current
Maximum collector dissipation
Junction temperature
Storage temperature
Isolation voltage
—
Torque strength
—
Weight
Conditions
G-E Short
C-E Short
TC = 25°C
Pulse
TC = 25°C
Pulse
TC = 25°C
Ratings
1200
±20
900
1800
900
1800
2550
–40 ~ +150
–40 ~ +125
2500
3.5 ~ 4.5
3.5 ~ 4.5
1400
(Note 2)
(Note 2)
Main terminal to base plate, AC 1 min.
Main Terminal M6
Mounting holes M6
Typical value
Unit
V
V
A
A
W
°C
°C
V
N•m
N•m
g
ELECTRICAL CHARACTERISTICS (Tj = 25°C)
Symbol
Parameter
Test conditions
ICES
Collector cutoff current
VGE(th)
Gate-emitter threshold voltage IC = 90mA, VCE = 10V
IGES
Gate leakage current
VCE(sat)
Collector-emitter saturation voltage
R(lead)
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
trr (Note 1)
Qrr (Note 1)
VEC(Note 1)
Rth(j-c)Q
Rth(j-c)R
Rth(c-f)
Rth(j-c’)Q
Rth(j-c’)R
RG
Module lead resistance
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Reverse recovery charge
Emitter-collector voltage
Thermal
resistance*1
Contact thermal resistance
Thermal resistance
External gate resistance
VCE = VCES, VGE = 0V
VGE = VCES, VCE = 0V
Tj = 25°C
IC = 900A, VGE = 15V
Tj = 125°C
Ic = 900A, terminal-chip
VCE = 10V
VGE = 0V
VCC = 600V, IC = 900A, VGE = 15V
VCC = 600V, IC = 900A
VGE1 = VGE2 = 15V
RG = 0.35Ω, Inductive load switching operation
IE = 900A
IE = 900A, VGE = 0V
IGBT part (1/2 module)
FWDi part (1/2 module)
Case to fin, Thermal compound applied*2 (1/2 module)
Tc measured point is just under the chips (IGBT part)
Tc measured point is just under the chips (FWDi part)
Min.
—
Limits
Typ.
—
Max.
1
6
7
8
V
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.35
—
1.8
2.0
0.143
—
—
—
4800
—
—
—
—
—
50
—
—
—
0.016
—
—
—
0.5
2.5
—
—
140
16
3
—
600
200
800
300
500
—
3.4
0.049
0.078
—
0.021*3
0.034*3
2.2
µA
Unit
mA
V
mΩ
nF
nC
ns
ns
µC
V
°C/W
Ω
Note 1. IE, VEC, trr, Qrr, die/dt represent characteristics of the anti-parallel, emitter to collector free-wheel diode. (FWDi).
2. Pulse width and repetition rate should be such that the device junction temp. (Tj) does not exceed Tjmax rating.
3. Junction temperature (Tj) should not increase beyond 150°C.
*1 : Tc measured point is indicated in OUTLINE DRAWING.
*2 : Typical value is measured by using Shin-etsu Silicone “G-746”.
*3 : If you use this value, Rth(f-a) should be measured just under the chips.
Mar. 2003
MITSUBISHI IGBT MODULES
CM900DU-24NF
HIGH POWER SWITCHING USE
PERFORMANCE CURVES
TRANSFER CHARACTERISTICS
(TYPICAL)
OUTPUT CHARACTERISTICS
(TYPICAL)
VGE = 20V
1400
1000
11V
800
600
10V
400
8V
200
0
2
4
6
9V
8
1400
1200
1000
800
600
400
0
10
Tj = 25°C
Tj = 125°C
200
0
4
8
12
16
20
COLLECTOR-EMITTER VOLTAGE VCE (V)
GATE-EMITTER VOLTAGE VGE (V)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
5
10
VGE = 15V
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE (sat) (V)
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE (sat) (V)
12V
1200
0
4
3
2
1
Tj = 25°C
Tj = 125°C
0
0
104
EMITTER CURRENT IE (A)
VCE = 10V
1600
15V
13V
COLLECTOR CURRENT (A)
1600
1800
Tj = 25°C
200 400 600 800 1000 1200 1400 1600 1800
8
6
IC = 900A
4
IC = 1800A
2
IC = 360A
0
6
8
10
12
14
16
18
GATE-EMITTER VOLTAGE VGE (V)
FREE-WHEEL DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
CAPACITANCE–VCE
CHARACTERISTICS
(TYPICAL)
20
103
7
5
3
2
103
7
5
3
2
102
Tj = 25°C
COLLECTOR CURRENT IC (A)
CAPACITANCE Cies, Coes, Cres (nF)
COLLECTOR CURRENT IC (A)
1800
Tj = 25°C
Tj = 125°C
0
1
2
3
4
EMITTER-COLLECTOR VOLTAGE VEC (V)
7
5
3
2
102
Cies
7
5
3
2
101
7
5
3
2
100
Coes
Cres
7
5
3
2
VGE = 0V
10–1 –1
10 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
COLLECTOR-EMITTER VOLTAGE VCE (V)
Mar. 2003
MITSUBISHI IGBT MODULES
CM900DU-24NF
HIGH POWER SWITCHING USE
103
td(off)
SWITCHING TIMES (ns)
7
5
tf
td(on)
3
2
102
7
Conditions:
5
VCC = 600V
3 VGE = ±15V
tr
RG = 0.35Ω
2
Tj = 125°C
Inductive load
101 1
10
2 3
5 7 102
2
3
5 7 103
REVERSE RECOVERY TIME trr (ns)
REVERSE RECOVERY CURRENT lrr (A)
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL)
REVERSE RECOVERY CHARACTERISTICS
OF FREE-WHEEL DIODE
(TYPICAL)
103
7
5
Irr
3
2
trr
102
7
5
Conditions:
VCC = 600V
VGE = ±15V
RG = 1Ω
Tj = 25°C
Inductive load
3
2
101 1
10
COLLECTOR CURRENT IC (A)
2
3
3
2
10–1
7
5
3
2
7
5
3
2
10–2
10–2
7
5
3
2
7
5
3
2
Single Pulse
TC = 25°C
20
10–3
10–5 2 3 5 710–4 2 3 5 7 10–3
10–3
8
4
0
1000 2000 3000 4000 5000 6000 7000
IC-ESW
(TYPICAL)
RG-ESW
(TYPICAL)
103
7
5
3
2
ESW (mJ/pulse)
ESW (mJ/pulse)
VCC = 600V
12
GATE CHARGE QG (nC)
Esw(on)
2 3
VCC = 400V
16
TMIE (s)
Conditions:
VCC = 600V
VGE = ±15V
Tj = 125°C
102 RG = 0.35Ω
7 Inductive load
5
3
Esw(off)
2
100 1
10
IC = 900A
0
103
7
5
3
2
101
7
5
3
2
5 7 103
3
GATE CHARGE
CHARACTERISTICS
(TYPICAL)
GATE-EMITTER VOLTAGE VGE (V)
NORMALIZED TRANSIENT
THERMAL IMPEDANCE Zth (j–c) (°C/W)
10–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100 2 3 5 7 101
101
7 IGBT part:
5 Per unit base = Rth(j–c) = 0.049°C/ W
3 FWDi part:
2 Per unit base = Rth(j–c) = 0.078°C/ W
100
10–1
2
EMITTER CURRENT IE (A)
TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
(IGBT part & FWDi part)
7
5
3
2
5 7 102
5 7 102
IC (A)
2 3
5 7 103
Esw(off)
102
7
5
3
2
Esw(on)
Conditions:
VCC = 600V
VGE = ±15V
Tj = 125°C
IC = 900A
Inductive load
101
7
5
3
2
100
0
0.5
1
1.5
2
2.5
RG (Ω)
Mar. 2003
MITSUBISHI IGBT MODULES
CM900DU-24NF
HIGH POWER SWITCHING USE
RG-Err
(TYPICAL)
IC-Err
(TYPICAL)
102
7
5
103
7
5
3
2
2
Err (mJ/pulse)
Err (mJ/pulse)
3
Err
101
7
5
3
2
Conditions:
VCC = 600V
VGE = ±15V
Tj = 125°C
RG = 0.35Ω
Inductive load
100 1
10
2 3
5 7 102
IE (A)
2 3
5 7 103
102
7
5
3
2
Err
Conditions:
VCC = 600V
VGE = ±15V
Tj = 125°C
IC = 900A
Inductive load
101
7
5
3
2
100
0
0.5
1
1.5
2
2.5
RG (Ω)
Mar. 2003
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