High Reliability Serial EEPROMs I2C BUS BR24□□□□family BR24T□□□□Series No.11001EAT21 ●Description 2 BR24T□□□-W series is a serial EEPROM of I C BUS interface method ●Features 2 1) Completely conforming to the world standard I C BUS. All controls available by 2 ports of serial clock (SCL) and serial data(SDA) 2) Other devices than EEPROM can be connected to the same port, saving microcontroller port 3) 1.7V~5.5V single power source action most suitable for battery use 4) 1.7V~5.5Vwide limit of action voltage, possible FAST MODE 400KHz action 5) Page write mode useful for initial value write at factory shipment 6) Auto erase and auto end function at data write 7) Low current consumption 8) Write mistake prevention function Write (write protect) function added Write mistake prevention function at low voltage 9) DIP-T8/SOP8/SOP-J8/SSOP-B8/TSSOP-B8/TSSOP-B8J/MSOP8/VSON008X2030 various packages 10) Data rewrite up to 1,000,000 times 11) Data kept for 40 years 12) Noise filter built in SCL / SDA terminal 13) Shipment data all address FFh ●BR24T series Capacity Bit format Type Power source Voltage DIP-T8 SOP8 SOP-J8 SSOP-B8 TSSOP-B8 TSSOP-B8J MSOP8 VSON008 X2030 1Kbit 128×8 BR24T01-W 1.7~5.5V ● ● ● ● ● ● ● ● 2Kbit 256×8 BR24T02-W 1.7~5.5V ● ● ● ● ● ● ● ● 4Kbit 512×8 BR24T04-W 1.7~5.5V ● ● ● ● ● ● ● ● 8Kbit 1K×8 BR24T08-W 1.7~5.5V ● ● ● ● ● ● ● ● 16Kbit 2K×8 BR24T16-W 1.7~5.5V ● ● ● ● ● ● ● ● 32Kbit 4K×8 BR24T32-W 1.7~5.5V ● ● ● ● ● ● ● ● 64Kbit 8K×8 BR24T64-W 1.7~5.5V ● ● ● ● ● ● ● ● 128Kbit 16K×8 BR24T128-W 1.7~5.5V ● ● ● ● ● ● ● ● 256Kbit 32K×8 BR24T256-W 1.7~5.5V ● ● ● ● ● 512Kbit 64K×8 BR24T512-W 1.7~5.5V ☆ ☆ ☆ ☆ ☆ 1024Kbit 128K×8 BR24T1M-W 1.7~5.5V ☆ ☆ ☆ ☆:Developing www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●Absolute maximum ratings (Ta=25℃) Parameter Symbol Impressed voltage VCC Ratings Unit -0.3~+6.5 V Number of data rewrite times *1 450 (SOP8)*1 450 (SOP-J8)*2 Data hold years *1 300 (SSOP-B8)*3 Permissible dissipation 330 (TSSOP-B8)*4 Pd *5 310 (TSSOP-B8J) ●Memory cell characteristics (Ta=25℃, Vcc=1.7~ 5.5V) Limits Parameter Unit Min. Typ. Max 1,000,000 - - Times 40 - - Years *1Not 100% TESTED mW 310 (MSOP8) *6 300 (VSON008X2030) *7 ●Recommended operating conditions 800 (DIP-T8)*8 Storage temperature range Action temperature range Tstg -65~+150 ℃ Parameter Topr -40~+85 ℃ *9 Terminal voltage ‐ Junction temperature *10 Tjmax *1,*2 *3,*7 *4 *5, *6 *8 *9 *10 -0.3~Vcc+1.0 150 V ℃ Symbol Ratings Power source voltage Vcc 1.7~5.5 Input voltage VIN Unit V 0~Vcc When using at Ta=25℃ or higher 4.5mW to be reduced per 1℃. When using at Ta=25℃ or higher 3.0mW to be reduced per 1℃. When using at Ta=25℃ or higher 3.3mW to be reduced per 1℃. When using at Ta=25℃ or higher 3.1mW to be reduced per 1℃. When using at Ta=25℃ or higher 8.1mW to be reduced per 1℃. The Max value of Terminal Voltage is not over 6.5V. When the pulse width is 50ns or less, the Min value of Terminal Voltage is not under -1.0V. (BR24T16/32/64/128/256/512/1M-W) the Min value of Terminal Voltage is not under -0.8V. (BR24T01/02/04/08-W) Junction temperature at the storage condition. ●Electrical characteristics (Unless otherwise specified, Ta=-40~+85℃, VCC=1.7~5.5V) Limits Parameter Symbol Unit Min. Typ. Max. “H” input voltage 1 VIH1 0.7Vcc *2 - Vcc+1.0 V Conditions “L” input voltage 1 VIL1 -0.3 - 0.3Vcc V “L” output voltage 1 VOL1 - - 0.4 V IOL=3.0mA, 2.5V≦Vcc≦5.5V (SDA) “L” output voltage 2 VOL2 - - 0.2 V IOL=0.7mA, 1.7V≦Vcc<2.5V (SDA) Input leak current ILI -1 - 1 µA VIN=0~Vcc Output leak current ILO -1 - 1 µA - - 2.0 - - 2.5 - - 4.5 - - 0.5 VOUT=0~Vcc (SDA) Vcc=5.5V,fSCL=400kHz, tWR=5ms, Byte write, Page write BR24T01/02/04/08/16/32/64-W Vcc=5.5V,fSCL=400kHz, tWR=5ms, Byte write, Page write BR24T128/256-W Vcc=5.5V,fSCL=400kHz, tWR=5ms, Byte write, Page write BR24T512/1M-W Vcc=5.5V,fSCL=400kHz Random read, current read, sequential read BR24T01/02/04/08/16/32/64/128/256-W Vcc=5.5V,fSCL=400kHz Random read, current read, sequential read BR24T512/1M-W Vcc=5.5V, SDA・SCL=Vcc A0,A1,A2=GND,WP=GND BR24T01/02/04/08/16/32/64/128/256-W Vcc=5.5V, SDA・SCL=Vcc A0, A1, A2=GND, WP=GND BR24T512/1M-W ICC1 Current consumption at action mA ICC2 Standby current mA - - 2.0 - - 2.0 - - 3.0 ISB µA ○ Radiation resistance design is not made. *1 BR24T512/1M-W is a target value because it is developing. *2 When the pulse width is 50ns or less, it is -1.0V. (BR24T16/32/64/128/256/512/1M-W) When the pulse width is 50ns or less, it is -0.8V. (BR24T01/02/04/08-W) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●Action timing characteristics (Unless otherwise specified, Ta=-40~+85℃, VCC=1.7~5.5V) Limits Parameter Symbol Min. Typ. Max. Unit SCL frequency fSCL - - 400 kHz Data clock “HIGH“ time tHIGH 0.6 - - µs Data clock “LOW“ time tLOW 1.2 - - µs SDA, SCL rise time *1 tR - - 1.0 µs SDA, SCL fall time *1 tF - - 1.0 µs Start condition hold time tHD:STA 0.6 - - µs Start condition setup time tSU:STA 0.6 - - µs Input data hold time tHD:DAT 0 - - ns Input data setup time tSU:DAT 100 - - ns Output data delay time tPD 0.1 - 0.9 µs Output data hold time tDH 0.1 - - µs tSU:STO 0.6 - - µs Bus release time before transfer start tBUF 1.2 - - µs Internal write cycle time tWR - - 5 ms Stop condition setup time Noise removal valid period (SDA, SCL terminal) tI - - 0.1 µs WP hold time tHD:WP 1.0 - - µs WP setup time tSU:WP 0.1 - - µs WP valid time tHIGH:WP 1.0 - - µs *1 Not 100% TESTED. Condition Input data level:VIL=0.2×Vcc VIH=0.8×Vcc Input data timing refarence level: 0.3×Vcc/0.7×Vcc Output data timing refarence level: 0.3×Vcc/0.7×Vcc Rise/Fall time : ≦20ns ●Sync data input / output timing tR tF SCL tHIGH 30% 30% 30% 30% 70% 70% 70% 70% 70% tLOW tHD:DAT SDA (input) 70% 70% 70% 30% tPD tBUF DATA(n) DATA(1) tSU:DAT 70% D0 D1 70% ACK ACK tWR tDH 30% SDA (output) 70% 70% 30% 30% tSU:WP ○Input read at the rise edge of SCL ○Data output in sync with the fall of SCL Fig.1-(a) Sync data input / output timing 70% tHD:STA DATA(n) DATA(1) D1 tSU:STA tHD:WP STOP CONDITION Fig.1-(d) WP timing at write execution 70% 70% 30% tSU:STO D0 ACK ACK 70% tWR tHIGH:WP 70% 30% 70% 30% STOP CONDITION START CONDITION Fig.1-(b) Start-stop bit timing D0 write data (n-th address) ACK 70% Fig.1-(e) WP timing at write cancel 70% 70% tWR STOP CONDITION START CONDITION Fig.1-(c) Write cycle timing www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●Block diagram *2 A0 1 1Kbit~1024Kbit EEPROM array 8 Vcc 7 WP *1 A0 1 A1 2 A2 3 GND 4 BR24T01-W BR24T02-W BR24T04-W BR24T08-W BR24T16-W BR24T32-W BR24T64-W BR24T128-W BR24T256-W BR24T512-W BR24T1M-W 8bit *2 A1 Address decoder 2 *17bit 13bit 8bit 14bit 9bit 15bit 10bit 16bit 11bit 17bit 12bit Word address register START *2 3 A2 Data register STOP Control circuit 6 SCL 5 SDA ACK * 1 Power source voltage detection High voltage generating circuit 4 GND 7bit: BR24T01-W 8bit: BR24T02-W 9bit: BR24T04-W 10bit: BR24T08-W 11bit: BR24T16-W 12bit: BR24T32-W 13bit: BR24T64-W 14bit: BR24T128-W 15bit: BR24T256-W 16bit: BR24T512-W 17bit: BR24T1M-W *2 8 Vcc 7 WP 6 SCL 5 SDA A0= Don't use : BR24T04-W, BR24T1M-W A0, A1=Don't use: BR24T08-W A0, A1, A2=Don't use: BR24T16-W Fig.2 Block diagram ●Pin assignment and description Terminal Input/ BR24T01-W Name Output BR24T02-W BR24T04-W BR24T08-W Slave address setting BR24T32/64/ 128/256/512-W BR24T16-W Slave address Don’t use* setting Slave address setting Don’t use* A0 Input A1 Input A2 Input GND Reference voltage of all input / output, 0V SCL - Input/ output Input WP Input Write protect terminal Vcc - Connect the power source. SDA Slave address setting Don’t use* Slave address setting BR24T1M-W Don’t use* Slave address setting Serial data input serial data output Serial clock input *Pins not used as device address may be set to any of ‘H’, 'L', and 'Hi-Z'. ●Characteristic data (The following values are Typ. ones.) 4 L INPUT VOLTAGE : VIL1(V) Ta=-40℃ Ta=25℃ Ta=85℃ 3 SPEC 2 1 Ta=-40℃ Ta=25℃ Ta=85℃ 5 4 L OUTPUT VOLTAGE : VOL1(V) 5 H INPUT VOLTAGE : VIH1(V) 1 6 6 3 2 1 SPEC 0 1 2 3 4 5 SUPPLY VOLTAGE : Vcc(V) 0 6 1 2 3 4 5 6 0.6 SPEC 0.4 0.2 1 0.8 0.6 Ta=-40℃ Ta=25℃ Ta=85℃ 0.4 0.2 0 0 3 4 5 6 L OUTPUT CURRENT : IOL(mA) Fig.6 'L' output voltage VOL2-IOL(Vcc=2.5V) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2 3 4 5 L OUTPUT CURRENT : IOL(mA) 6 1.2 OUTPUT LEAK CURRENT : I LO(uA) INPUT LEAK CURRENT : ILI(uA) Ta=-40℃ Ta=25℃ Ta=85℃ 2 1 Fig.5 'L' output voltage VOL1-IOL(Vcc=1.7V) SPEC L OUTPUT VOLTAGE : VOL2(V) 0 1.2 1 0.2 Fig.4 'L' input voltage VIL1 (A0,A1,A2,SCL,SDA,WP) 1 0 SPEC 0.4 SUPPLY VOLTAGE : Vcc(V) Fig.3 'H' input voltage VIH1 (A0,A1,A2,SCL,SDA,WP) 0.8 0.6 0 0 0 Ta=-40℃ Ta=25℃ Ta=85℃ 0.8 0 1 2 3 4 5 SUPPLYVOLTAGE : Vcc(V) Fig.7 Input leak current ILI (A0,A1,A2,SCL,WP) 4/21 6 SPEC 1 0.8 0.6 Ta=-40℃ Ta=25℃ Ta=85℃ 0.4 0.2 0 0 1 2 3 4 5 SUPPLY VOLTAGE : Vcc(V) 6 Fig.8 Output leak current ILO(SDA) 2011.03 - Rev.A Technical Note BR24T□□□□Series ●Characteristic data (The following values are Typ. ones.) 3.5 2.5 2 Ta=-40℃ Ta=25℃ Ta=85℃ 1 0.5 2 1 2 3 4 5 Ta=-40℃ Ta=25℃ Ta=85℃ 1.5 1 0.5 0 0 0 CURRENT CONSUMPTION AT WRITING : Icc1(mA) 1.5 5 SPEC 2.5 CURRENT CONSUMPTION AT WRITING : Icc1(mA) CURRENT CONSUMPTION AT WRITING : Icc1(mA) 6 3 SPEC 0 6 1 SUPPLY VOLTAGE : Vcc(V) 2 3 4 5 The plan for inserting data. (BR24T512/1M-W) 4 3 2 1 0 6 0 1 2 SUPPLY VOLTAGE : Vcc(V) Fig.9 Current consumption at WRITE operation ICC1 (fscl=400kHz BR24T01/02/04/08/16/32/64-W) Fig.10 Current consumption at WRITE operation Icc1 (fscl=400kHz BR24T128/256-W) 0.6 0.1 0.4 0.3 STANBY CURRENT : ISB(uA) 0.2 The plan for inserting data. (BR24T512/1M-W) 0.5 CURRENT CONSUMPTION AT READING : Icc2(mA) CURRENT CONSUMPTION AT READING : Icc2(mA) Ta=-40℃ Ta=25℃ Ta=85℃ 0.3 0.2 0.1 0 0 1 2 3 4 5 0 2 5 1.5 1 0.5 4 5 1000 SPEC 100 Ta=-40℃ Ta=25℃ Ta=85℃ 10 1 0 1 2 0.9 Ta=-40℃ Ta=25℃ Ta=85℃ 0.6 0.3 0 0 1 2 3 4 5 6 START CONDITION HOLD TIME : tHD : STA(us) 1.2 3 4 5 SPEC 0.2 0 3 4 5 6 SUPPLY VOLTAGE : Vcc(V) 1.1 SPEC Ta=-40℃ Ta=25℃ Ta=85℃ 0.4 0.2 0.9 0.7 SPEC 0.5 Ta=-40℃ Ta=25℃ Ta=85℃ 0.3 0.1 -0.1 0 0 1 2 3 4 5 0 6 1 2 3 4 5 6 Fig.20 Start Condition Setup Time tSU : STA 50 SPEC 0 -50 Ta=-40℃ Ta=25℃ Ta=85℃ -100 -150 -200 5 2 Fig.17 Data clock High Period tHIGH 0.6 INPUT DATA HOLD TIME : tHD :DAT(ns) Ta=-40℃ Ta=25℃ Ta=85℃ 4 1 SUPPLY VOLTAGE : Vcc(V) -50 3 Ta=-40℃ Ta=25℃ Ta=85℃ 0.4 Fig.19 Start Condition Hold Time tHD : STA 0 2 6 SUPPLY VOLTAGE : Vcc(V) SPEC 1 5 0.6 6 0.8 50 0 4 Fig.16 SCL frequency fSCL SUPPLY VOLTAGE : Vcc(V) -150 3 0.8 1 Fig.18 Data clock Low Period tLOW -100 2 SUPPLY VOLTAGE : Vcc(V) SUPPLY VOLTAGE : Vcc(V) Fig.15 Stanby operation ISB (fscl=400kHz BR24T512/1M-W) SPEC 1 0 6 1.5 0.5 1 INPUT DATA SET UP TIME : tSU: DAT(ns) 3 Ta=-40℃ Ta=25℃ Ta=85℃ 1 Fig.14 Stanby operation ISB (fscl=400kHz BR24T01/02/04/08/16/32/64/128/256-W) START CONDITION SET UP TIME : tSU:STA(us) 2 1.5 SUPPLY VOLTAGE : Vcc(V) 0.1 1 SPEC 2 0 6 DATA CLK H TIME : tHIGH(us) SCL FREQUENCY : fscl(kHZ) The plan for inserting data. (BR24T512/1M-W) 2 0 DATA CLK L TIME : tLOW(us) 4 10000 0 INPUT DATA HOLD TIME : tHD: STA(ns) 3 Fig.13 Current consumption at READ operation ICC2 (fscl=400kHz BR24T512/1M-W) 2.5 STANBY CURRENT : ISB(uA) 1 SUPPLY VOLTAGE : Vcc(V) SUPPLY VOLTAGE : Vcc(V) Fig.12 Current consumption at READ operation ICC2 (fscl=400kHz BR24T01/02/04/08/16/32/64/128/256-W) 6 0 0 6 5 2.5 0.6 0.4 4 Fig.11 Current consumption at WRITE operation Icc1 (fscl=400kHz BR24T512/1M-W) SPEC 0.5 3 SUPPLY VOLTAGE : Vcc(V) 6 -200 SUPPLY VOLTAGE : Vcc(V) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 200 SPEC 100 0 Ta=-40℃ Ta=25℃ Ta=85℃ -100 -200 0 0 Fig.21 Input Data Hold Time tHD : DAT(HIGH) 300 1 2 3 4 5 SUPPLY VOLTAGE : Vcc(V) Fig.22 Input Data Hold Time tHD : DAT(LOW) 5/21 1 2 3 4 5 6 6 SUPPLY VOLTAGE : Vcc(V) Fig.23 Input Data Setup Time tSU: DAT(HIGH) 2011.03 - Rev.A Technical Note BR24T□□□□Series ●Characteristic data (The following values are Typ. ones.) 200 SPEC 100 0 Ta=-40℃ Ta=25℃ Ta=85℃ -100 -200 0 1 2 3 4 5 6 2.0 Ta=-40℃ Ta=25℃ Ta=85℃ 1.5 SPEC 1.0 0.5 SPEC 0.0 0 1 2 SUPPLY VOLTAGE : Vcc(V) 4 5 6 SPEC 0.5 0.0 2 3 4 5 0 SPEC 1 Ta=-40℃ Ta=25℃ Ta=85℃ 0.5 0 2 2 3 4 5 6 0.2 0.1 SPEC 1 2 3 4 5 6 SUPPLY VOLTAGE : Vcc(V) Fig.29 Internal writing cycle time tWR 0.6 Ta=-40℃ Ta=25℃ Ta=85℃ 0.5 0.4 0.3 0.2 0.1 SPEC 0 0 4 Ta=-40℃ Ta=25℃ Ta=85℃ 0 NOISE REDUCTION EFECTIVE TIME : tl(SDA H)(us) NOISE REDUCTION EFECTIVE TIME : tl(SCL L)(us) 0.3 3 6 0 1 0.6 2 5 3 SUPPLY VOLTAGE : Vcc(V) Ta=-40℃ Ta=25℃ Ta=85℃ 1 4 4 Fig.28 BUS open time before transmission tBUF 0.6 0 3 6 SUPPLY VOLTAGE : Vcc(V) 0.4 2 5 1 Fig.27 Stop condition setup time tSU:STO 0.5 1 SPEC 0 1 SPEC 0.0 6 1.5 -0.5 0 0.5 SUPPLY VOLTAGE : Vcc(V) INTERNAL WRITING CYCLE TIME : tWR(ms) Ta=-40℃ Ta=25℃ Ta=85℃ 1.0 SPEC 1.0 Fig.26 'H' Data output delay time tPD1 2 2.0 1.5 Ta=-40℃ Ta=25℃ Ta=85℃ 1.5 SUPPLY VOLTAGE : Vcc(V) BUS OPEN TIME BEFORE TRANSMISSION : tBUF(us) STOP CONDITION SETUP TIME : tsu:STO(us) 3 2.0 Fig.25 'L' Data output delay time tPD0 Fig.24 Input Data setup time tSU : DAT(LOW) NOISE REDUCTION EFECTIVE TIME : tl(SCL H) (us) OUTPUT DATA DELAY TIME : tPD(us) OUTPUT DATA DELAY TIME : tPD(us) INPUT DATA SET UP TIME : tSU : DAT(ns) 300 5 0 6 1 2 3 4 5 Ta=-40℃ Ta=25℃ Ta=85℃ 0.5 0.4 0.3 0.2 0.1 SPEC 0 6 0 1 2 3 4 5 6 SUPPLY VOLTAGE : Vcc(V) SUPPLY VOLTAGE : Vcc(V) Ta=-40℃ Ta=25℃ Ta=85℃ 0.5 0.4 0.3 0.2 SPEC 0.1 0 0.2 SPEC 1.0 WP SET UP TIME : tSU : WP(us) WP DATA HOLD TIME : tHD : WP(us) NOISE REDUCTION EFFECTIVE TIME : tl(SAD L)(us) Fig.32 Noise resuction efecctive time tl(SDA H) 1.2 0.6 Ta=-40℃ Ta=25℃ Ta=85℃ 0.8 0.6 0.4 0.2 1 2 3 4 5 6 SPEC 0.0 Ta=-40℃ Ta=25℃ Ta=85℃ -0.1 -0.2 -0.3 -0.4 -0.5 0 0 1 2 3 4 5 SUPPLYVOLTAGE : Vcc(V) SUPPLY VOLTAGE : Vcc(V) Fig.33 Noise reduction efective time tl(SDA L) 0.1 -0.6 0.0 0 WP EFFECTIVE TIME : tHIGH : WP(us) SUPPLY VOLATGE : Vcc(V) Fig.31 Noise reduction efective time tl(SCL L) Fig.30 Noise reduction efection time tl(SCL H) Fig.34 WP data hold time tHD:WP 1 2 3 4 5 6 6 SUPPLY VOLTAGE : Vcc(V) Fig.35 WP setup time tSU : WP 1.2 SPEC 1.0 0.8 Ta=-40℃ Ta=25℃ Ta=85℃ 0.6 0.4 0.2 0.0 0 1 2 3 4 5 6 SUPPLYVOLTAGE : Vcc(V) Fig.36 WP efective time tHIGH : WP www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●I2C BUS communication 2 ○I C BUS data communication 2 I C BUS data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long, 2 and acknowledge is always required after each byte. I C BUS carries out data transmission with plural devices connected by 2 communication lines of serial data (SDA) and serial clock (SCL). Among devices, there are “master” that generates clock and control communication start and end, and “slave” that is controlled by address peculiar to devices. EEPROM becomes “slave”. And the device that outputs data to bus during data communication is called “transmitter”, and the device that receives data is called “receiver”. SDA 1-7 SCL S START ADDRESS condition 8 9 R/W ACK 1-7 8 1-7 9 DATA ACK 8 DATA 9 ACK P STOP condition Fig.37 Data transfer timing ○Start condition (Start bit recognition) ・Before executing each command, start condition (start bit) where SDA goes from 'HIGH' down to 'LOW' when SCL is 'HIGH' is necessary. ・This IC always detects whether SDA and SCL are in start condition (start bit) or not, therefore, unless this confdition is satisfied, any command is executed. ○Stop condition (stop bit recongnition) ・Each command can be ended by SDA rising from 'LOW' to 'HIGH' when stop condition (stop bit), namely, SCL is 'HIGH' ○Acknowledge (ACK) signal ・This acknowledge (ACK) signal is a software rule to show whether data transfer has been made normally or not. In master and slave, the device (µ-COM at slave address input of write command, read command, and this IC at data output of read command) at the transmitter (sending) side releases the bus after output of 8bit data. ・The device (this IC at slave address input of write command, read command, and µ-COM at data output of read command) at the receiver (receiving) side sets SDA 'LOW' during 9 clock cycles, and outputs acknowledge signal (ACK signal) showing that it has received the 8bit data. ・This IC, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ACK signal) 'LOW'. ・Each write action outputs acknowledge signal (ACK signal) 'LOW', at receiving 8bit data (word address and write data). ・ Each read action outputs 8bit data (read data), and detects acknowledge signal (ACK signal) 'LOW'. When acknowledge signal (ACK signal) is detected, and stop condition is not sent from the master (µ-COM) side, this IC continues data output. When acknowledge signal (ACK signal) is not detected, this IC stops data transfer, and recognizes stop cindition (stop bit), and ends read action. And this IC gets in status. ○Device addressing ・Output slave address after start condition from master. ・The significant 4 bits of slave address are used for recognizing a device type. The device code of this IC is fixed to '1010'. ・Next slave addresses (A2 A1 A0 --- device address) are for selecting devices, and plural ones can be used on a same bus according to the number of device addresses. ・The most insignificant bit (R/W --- READ / WRITE ) of slave address is used for designating write or read action, and is as shown below. Setting R / W to 0 ------- write (setting 0 to word address setting of random read) Setting R / W to 1 ------- read BR24T01-W,BR24T02-W BR24T04-W BR24T08-W Maximum number of Connected buses Slave address Type 1 1 1 0 0 0 1 1 1 0 0 0 A2 A2 A2 A1 A1 P1 A0 P0 P0 ―― R/W ―― R/W ―― R/W ―― BR24T16-W 1 0 1 0 P2 P1 P0 R/W BR24T32-W,BR24T64-W,BR24T128-W, BR24T256-W,BR24T512-W 1 0 1 0 A2 A1 A0 R/W BR24T1M-W 1 0 1 0 A2 A1 P0 ―― ―― R/W 8 4 2 1 8 4 P0~P2 are page select bits. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●Write Command ○Write cycle ・Arbitrary data is written to EEPROM. When to write only 1 byte, byte write is normally used, and when to write continuous data of 2 bytes or more, simultaneous write is possible by page write cycle. The maximum number of write bytes is specified per device of each capacity. Up to 256 arbitrary bytes can be written.(In the case of BR24T1M-W) S T A R T SDA LINE W R I T E SLAVE ADDRESS WORD ADDRESS WA 7 1 0 1 0 A2 A1 A0 WA 0 SDA LINE W R I T E SLAVE ADDRESS SDA L IN E W R I T E SLAVE ADDRESS (BR24T01/02/04/08/16-W) 2nd WORD ADDRESS SDA LINE W R I T E SLAVE ADDRESS 1 0 1 0 15 14 R A / C W K 注) D7 D A TA (n +1 5 ) D0 D0 *1 As for WA12, BR24T32-W becomes Don't care. As for WA13, BR24T32/64-W becomes Don't care. As for WA14, BR24T32/64/128-W becomes Don't care. As for WA15, BR24T32/64/128/256-W becomes Don't care. *2 As for BR24T128/256-W becomes (n+63) As for BR24T512-W becomes (n+127) As for BR24T1M-W becomes (n+255) A C K A C K 2nd WORD ADDRESS(n) D7 0 13 12 11 A C K Fig.41 Page write cycle S T O P *2 DATA(n) WA *1 As for WA7, BR24T01-W becomes Don't care. As for BR24T01/02-W becomes (n+7) S T O P (BR24T01/02/04/08/16-W) WA WA WA WA WA 0 A2 A1 A0 0 D A TA (n) A C K 1st WORD ADDRESS(n) *1 *2 A C K *2 WA 0 Fig.40 Page write cycle S T A R T As for WA12, BR24T32-W becomes Don't care. As for WA13, BR24T32/64-W becomes Don't care. As for WA14, BR24T32/64/128-W becomes Don't care. As for WA15, BR24T32/64/128/256-W becomes Don't care. (BR24T32/64/128/256/512/1M-W) R A / C *1 W K 注) *1 D0 D7 A C K A C K W ORD A D D R E S S (n ) WA 7 1 0 1 0 A 2A 1A 0 S T O P DATA WA 0 *1 Fig.39 Byte write cycle S T A R T A C K WAWA WA WAWA 15 14 13 12 11 R A / C W K As for WA7, BR24T01-W becomes Don't care. D0 1st WORD ADDRESS 1 0 1 0 A2 A1 A0 Note) D7 A C K Fig.38 Byte write cycle S T A R T DATA R A / C W K Note) S T O P DATA(n+31) D0 A C K D0 A C K A C K (BR24T32/64/128/256/512/1M-W) Note) *1 In BR24T16-W, A2 becomes P2. *2 In BR24T08/16-W, A1 becomes P1. *3 In BR24T04/08/16/1M-W A0 becomes P0. *1 *2 *3 1 0 1 0 A 2A 1A 0 Fig.42 Difference of slave address of each type www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ・During internal write execution, all input commands are ignored, therefore ACK is not sent back. ・Data is written to the address designated by word address (n-th address) ・By issuing stop bit after 8bit data input, write to memory cell inside starts. ・When internal write is started, command is not accepted for tWR (5ms at maximum). ・By page write cycle, the following can be written in bulk : Up to 8Byte (BR24T01-W, BR24T02-W) Up to 16Byte (BR24T04-W, BR24T08-W, BR24T16-W) Up to 32Byte (BR24T32-W, BR24T64-W) Up to 64Byte (BR24T128-W, BR24T256-W) Up to 128Byte (BR24T512-W) Up to 256Byte (BR24T1M-W) And when data of the maximum bytes or higher is sent, data from the first byte is overwritten. (Refer to "Internal address increment" of "Notes on page write cycle" in P10.) ・As for page write cycle of BR24T01-W and BR24T02-W, after the significant 4 bits (in the case of BR24T01-W) of word address, or the significant 5 bits (in the case of BR24T02-W) of word address are designated arbitrarily, by continuing data input of 2 bytes or more, the address of insignificant 3 bits is incremented internally, and data up to 8 bytes can be written. ・As for page write command of BR24T04-W, BR24T08-W and BR24T16-W, after page select bit ’P0’(in the case of BR24T04-W), after page select bit ’P0,P1’(in the case of BR24T08-W), after page select bit ’P0,P1,P2’(in the case of BR24T16-W) of slave address are designated arbitrarily, by continuing data input of 2 bytes or more, the address of insignificant 4 bits is incremented internally, and data up to 16 bytes can be written. ・As for page write cycle of BR24T32-W and BR24T64-W, after the significant 7 bits (in the case of BR24T32-W) of word address, or the significant 8 bits (in the case of BR24T64-W) of word address are designated arbitrarily, by continuing data input of 2 bytes or more, the address of insignificant 5 bits is incremented internally, and data up to 32 bytes can be written. ・As for page write cycle of BR24T128-W and BR24T256-W, after the significant 8 bits (in the case of BR24T128-W) of word address, or the significant 9 bits (in the case of BR24T256-W) of word address are designated arbitrarily, by continuing data input of 2 bytes or more, the address of insignificant 6 bits is incremented internally, and data up to 64 bytes can be written. ・As for page write cycle of BR24T512-W after the significant 9 bits of word address is designated arbitrarily, by continuing data input of 2 bytes or more, the address of insignificant 7 bits is incremented internally, and data up to 128 bytes can be written. ・As for page write cycle of BR24T1M-W after page select bit ’P0’ and the significant 8 bit of word address are designated arbitrarily, by continuing data input of 2 bytes or more, the address of insignificant 8 bits is incremented internally, and data up to 256 bytes can be written. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ○Notes on page write cycle List of numbers of page write Number of Pages 8Byte Product number BR24T01-W BR24T02-W 16Byte 32Byte 64Byte 128Byte 256Byte BR24T04-W BR24T08-W BR24T16-W BR24T32-W BR24T64-W BR24T128-W BR24T256-W BR24T512-W BR24T1M-W The above numbers are maximum bytes for respective types. Any bytes below these can be written. In the case BR24T256-W, 1 page=64bytes, but the page write cycle time is 5ms at maximum for 64byte bulk write. It does not stand 5ms at maximum × 64byte=320ms(Max.) ○Internal address increment Page write mode (in the case of BR24T16-W) 0Eh WA7 WA4 WA3 WA2 WA1 WA0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 0 0 0 0 0 0 0 1 1 0 1 1 0 1 1 0 0 1 0 Significant bit is fixed. No digit up Increment For example, when it is started from address 0Eh, therefore, increment is made as below, 0Eh→0Fh→00h→01h・・・ which please note. ※0Eh・・・0E in hexadecimal, therefore, 00001110 becomes a binary number. ○Write protect (WP) terminal ・Write protect (WP) function When WP terminal is set Vcc (H level), data rewrite of all addresses is prohibited. When it is set GND (L level), data rewrite of all address is enabled. Be sure to connect this terminal to Vcc or GND, or control it to H level or L level. Do not use it open. In the case of use it as an ROM, it is recommended to connect it to pull up or Vcc. At extremely low voltage at power ON / OFF, by setting the WP terminal 'H', mistake write can be prevented. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●Read Command ○Read cycle Data of EEPROM is read. In read cycle, there are random read cycle and current read cycle. Random read cycle is a command to read data by designating address, and is used generally. Current read cycle is a command to read data of internal address register without designating address, and is used when to verify just after write cycle. In both the read cycles, sequential read cycle is available, and the next address data can be read in succession. S T A R T SDA LINE W R I T E SLAVE ADDRESS S T A R T WORD ADDRESS(n) R A *1 / C WK Note) SLAVE ADDRESS S T O P DATA(n) *1 WA 0 WA 7 1 0 1 0 A2A1A0 R E A D D7 1 0 1 0 A2A1A0 A C K R A / C WK A C K As for WA7,BR24T01-W become Don’t care. D0 Fig.43 Random read cycle (BR24T01/02/04/08/16-W) S T A R T SDA LINE W R I T E SLAVE ADDRESS 1 0 WAWAWAWAWA WA 15 14 13 12 11 0 R A / C WK Note) 2nd WORD ADDRESS(n) 1st WORD ADDRESS ( ) 1 0 A2 A1 A0 S T A R T A C K *1 R E A D SLAVE ADDRESS 10 1 0 DATA(n) D7 A2 A1A0 A C K S T O P D0 R A / C W K A C K *1 As for WA12, BR24T32-W become Don’t care. As for WA13, BR24T32/64-W become Don’t care. As for WA14, BR24T32/64/128-W become Don’t care. As for WA15, BR24T32/64/128/256-W become Don’t care. Fig.44 Random read cycle (BR24T32/64/128/256/512/1M-W) S T A R T SDA LINE R E A D SLAVE ADDRESS 1 0 1 0 A2A1A0 S T O P DATA(n) D7 D0 A C K R A / C WK Note) *1 As for WA7, BR24T01-W becomes Don't care. *2 As for BR24T01/02-W becomes (n+7) Fig.45 Current read cycle S T A R T SDA LINE R E A D SLAVE ADDRESS 1 0 1 0 A2 A1A0 D0 R A / C W K Note) DATA(n+x) DATA(n) D7 S T O P D7 A C K D0 A C K A C K *1 As for WA12, BR24T32-W becomes Don't care. As for WA13, BR24T32/64-W becomes Don't care. As for WA14, BR24T32/64/128-W becomes Don't care. As for WA15, BR24T32/64/128/256-W becomes Don't care. *2 As for BR24T128/256-W becomes (n+63) As for BR24T512-W becomes (n+127) As for BR24T1M-W becomes (n+255) Fig.46 Sequential read cycle (in the case of current read cycle) ・In random read cycle, data of designated word address can be read. ・When the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle), data of incremented last read address (n)-th address, i.e., data of the (n+1)-th address is output. ・When ACK signal 'LOW' after D0 is detected, and stop condition is not sent from master (µ-COM) side, the next address data can be read in succession. ・Read cycle is ended by stop condition where 'H' is input to ACK signal after D0 and SDA signal is started at SCL signal 'H' . ・When 'H' is not input to ACK signal after D0, sequential read gets in, and the next data is output. Therefore, read command cycle cannot be ended. When to end read command cycle, be sure input stop condition to input 'H' to ACK signal after D0, and to start SDA at SCL signal 'H'. ・Sequential read is ended by stop condition where 'H' is input to ACK signal after arbitrary D0 and SDA is started at SCL signal 'H'. Note) *1 *2 *3 *1 *2 *3 1 0 1 0 A2 A1A0 In BR24T16-W, A2 becomes P2. In BR24T08/16-W, A1 becomes P1. In BR24T08/16/1M-W, A0 becomes P0. Fig.47 Difference of slave address of each type www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●Software reset Software reset is executed when to avoid malfunction after power on, and to reset during command input. Software reset has several kinds, and 3 kinds of them are shown in the figure below. (Refer to Fig.48-(a), Fig.48-(b), Fig.48-(c).) In dummy clock input area, release the SDA bus ('H' by pull up). In dummy clock area, ACK output and read data '0' (both 'L' level) may be output from EEPROM, therefore, if 'H' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices. Dummy clock×14 SCL 1 2 Start×2 13 Normal command 14 SDA Normal command Fig.48-(a) The case of dummy clock +START+START+ command input SCL Start Dummy clock×9 Start 1 2 8 Normal command 9 SDA Normal command Fig.48-(b) The case of START +9 dummy clocks +START+ command input Start×9 SCL 1 2 3 7 8 Normal command 9 SDA Normal command SD Fig.48-(c) START×9+ command input ※Start command from START input. ●Acknowledge polling During internal write execution, all input commands are ignored, therefore ACK is not sent back. During internal automatic write execution after write cycle input, next command (slave address) is sent, and if the first ACK signal sends back 'L', then it means end of write action, while if it sends back 'H', it means now in writing. By use of acknowledge polling, next command can be executed without waiting for tWR = 5ms. When to write continuously, R / W = 0, when to carry out current read cycle after write, slave address R / W = 1 is sent, and if ACK signal sends back 'L', then execute word address input and data output and so forth. During internal write, ACK = HIGH is sent back. First write command S T A R T Write command S T O P S T Slave A R address T S T Slave A R address T A C K H A C K H … tWR Second write command … S T Slave A R address T A C K H S T Slave A R address T A C K L Word address A C K L Data A C K L S T O P tWR After completion of internal write, ACK=LOW is sent back, so input next word address and data in succession. Fig.49 Case to continuously write by acknowledge polling www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●WP valid timing (write cancel) WP is usually fixed to 'H' or 'L', but when WP is used to cancel write cycle and so forth, pay attention to the following WP valid timing. During write cycle execution, in cancel valid area, by setting WP='H', write cycle can be cancelled. In both byte write cycle and page write cycle, the area from the first start condition of command to the rise of clock to taken in D0 of data(in page write cycle, the first byte data) is cancel invalid area. WP input in this area becomes Don't care. The area from the rise of SCL to take in D0 to input the stop condition is cancel valid area. And, after execution of forced end by WP, standby status gets in. ・Rise of SDA ・Rise of D0 taken clock SCL SDA SCL D1 D0 ACK SDA S T Slave A R address T A C Word K address L ACK Enlarged view Enlarged view SDA D0 A C D7 D6 D5 D4 D3 D2 D1 D0 K L WP cancel invalid area A C K L Data A C K L S T O P WP cancel valid area tWR WP cancel invalid area WP Data is not written. Fig.50 WP valid timing ●Command cancel by start condition and stop condition During command input, by continuously inputting start condition and stop condition, command can be cancelled. (Fig.51) However, in ACK output area and during data read, SDA bus may output 'L', and in this case, start condition and stop condition cannot be input, so reset is not available. Therefore, execute software reset. And when command is cancelled by start, stop condition, during random read cycle, sequential read cycle, or current read cycle, internal setting address is not determined, therefore, it is not possible to carry out current read cycle in succession. When to carry out read cycle in succession, carry out random read cycle. SCL SDA 1 0 1 0 Start condition Stop condition Fig.51 Case of cancel by start, stop condition during slave address input www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 13/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●I/O peripheral circuit ○Pull up resistance of SDA terminal SDA is NMOS open drain, so requires pull up resistance. As for this resistance value (RPU), select an appropriate value to this resistance value from microcontroller VIL, IL, and VOL-IOL characteristics of this IC. If RPU is large, action frequency is limited. The smaller the RPU, the larger the consumption current at action. ○Maximum value of RPU The maximum value of RPU is determined by the following factors. ①SDA rise time to be determined by the capacitance (CBUS) of bus line of RPU and SDA should be tR or below. And AC timing should be satisfied even when SDA rise time is late. A to be determined by input leak total (IL) of device connected to bus at output of 'H' to ②The bus electric potential ○ SDA bus and RPU should sufficiently secure the input 'H' level (VIH) of microcontroller and EEPROM including recommended noise margin 0.2Vcc. VCC-ILRPU-0.2 VCC ≧ VIH 0.8 VCC VIH RPU IL Ex.) VCC =3V IL=10µA VIH=0.7 VCC from② 0 .8 3 0 .7 3 RPU 10 10 6 Microcontroller BR24TXX RPU SDA terminal A IL 300 [kΩ] IL Bus line capacity CBUS Fig.52 I/O circuit diagram ○ Minimum value of RPU The minimum value of RPU is determined by the following factors. When IC outputs LOW, it should be satisfied that VOLMAX=0.4V and IOLMAX=3mA. VCC VOL IOL RPU VCC VOL RPU IOL ②VOLMAX= should secure the input 'L' level (VIL) of microcontroller and EEPROM including recommended noise margin 0.1Vcc. VOLMAX ≦ VIL-0.1 VCC Ex.) VCC =3V, VOL=0.4V, IOL=3mA, microcontroller, EEPROM VIL=0.3Vcc 3 0 .4 from① RPU 3 10 3 867[Ω] And VOL=0.4[V] VIL=0.3×3 =0.9[V] Therefore, the condition ② is satisfied. ○Pull up resistance of SCL terminal When SCL control is made at CMOS output port, there is no need, but in the case there is timing where SCL becomes 'Hi-Z', add a pull up resistance. As for the pull up resistance, one of several kΩ ~ several ten kΩ is recommended in consideration of drive performance of output port of microcontroller. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 14/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●Cautions on microcontroller connection ○RS 2 In I C BUS, it is recommended that SDA port is of open drain input/output. However, when to use CMOS input / output of tri state to SDA port, insert a series resistance Rs between the pull up resistance Rpu and the SDA terminal of EEPROM. This is controls over current that occurs when PMOS of the microcontroller and NMOS of EEPROM are turned ON simultaneously. Rs also plays the role of protection of SDA terminal against surge. Therefore, even when SDA port is open drain input/output, Rs can be used. ACK RPU SCL RS SDA 'H' output of microcontroller EEPROM Microcontroller 'L' output of EEPROM Over current flows to SDA line by 'H' output of microcontroller and 'L' output of EEPROM. Fig.53 I/O circuit diagram Fig.54 Input / output collision timing ○Maximum value of Rs The maximum value of Rs is determined by the following relations. ①SDA rise time to be determined by the capacity (CBUS) of bus line of Rpu and SDA should be tR or below. And AC timing should be satisfied even when SDA rise time is late. A to be determined by Rpu and Rs the moment when EEPROM outputs 'L' to SDA bus ②The bus electric potential ○ sufficiently secure the input 'L' level (VIL) of microcontroller including recommended noise margin 0.1Vcc. VCC VOL VOL 0.1VCC VIL VCC RPU RS RPU RS A RS VOL VCC VOL RPU 1.1VCC VIL IOL Ex)VCC=3V VIL=0.3VCC VOL=0.4V RPU=20kΩ Bus line capacity CBUS VIL RS EEPROM Micro controller Fig.55 I/O Circuit Diagram 0 . 3 3 0 . 4 0 . 1 3 20 103 1 . 1 3 0 . 3 3 1.67[kΩ] ○Minimum value of Rs The minimum value of Rs is determined by over current at bus collision. When over current flows, noises in power source line, and instantaneous power failure of power source may occur. When allowable over current is defined as I, the following relation must be satisfied. Determine the allowable current in consideration of impedance of power source line in set and so forth. Set the over current to EEPROM 10mA or below. RPU RS VCC I RS 'L'output RS VCC I Over current I EX) VCC=3V I=1mA 'H' output RS Microcontroller EEPROM 300 [Ω] Fig.56 I/O circuit diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3 10 10 3 15/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●I2C BUS input / output circuit ○Input (A0, A1, A2, SCL, WP) Fig.57 Input pin circuit diagram ○Input / output (SDA) Fig.58 Input / output pin circuit diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 16/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●Notes on power ON At power on, in IC internal circuit and set, Vcc rises through unstable low voltage area, and IC inside is not completely reset, and malfunction may occur. To prevent this, functions of POR circuit and LVCC circuit are equipped. To assure the action, observe the following conditions at power on. 1. Set SDA = 'H' and SCL ='L' or 'H’ 2. Start power source so as to satisfy the recommended conditions of tR, tOFF, and Vbot for operating POR circuit. tR VCC Recommended conditions of tR, tOFF,Vbot tR tOFF Vbot 0 Fig.59 tOFF Vbot 10ms or below 10ms or larger 0.3V or below 100msor below 10msor larger 0.2V or below Rise waveform diagram 3. Set SDA and SCL so as not to become 'Hi-Z'. When the above conditions 1 and 2 cannot be observed, take the following countermeasures. a) In the case when the above condition 1 cannot be observed. When SDA becomes 'L' at power on . →Control SCL and SDA as shown below, to make SCL and SDA, 'H' and 'H'. VCC tLOW SCL SDA After Vcc becomes stable After Vcc becomes stable tDH tSU:DAT Fig.60 When SCL= 'H' and SDA= 'L' tSU:DAT Fig.61 When SCL='L' and SDA='L' b) In the case when the above condition 2 cannot be observed. →After power source becomes stable, execute software reset(P12). c) In the case when the above conditions 1 and 2 cannot be observed. →Carry out a), and then carry out b). ●Low voltage malfunction prevention function LVCC circuit prevents data rewrite action at low power, and prevents wrong write. At LVCC voltage (Typ. =1.2V) or below, it prevent data rewrite. ●Vcc noise countermeasures ○Bypass capacitor When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended to attach a bypass capacitor (0.1µF) between IC Vcc and GND. At that moment, attach it as close to IC as possible. And, it is also recommended to attach a bypass capacitor between board Vcc and GND. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 17/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●Notes for use (1) Described numeric values and data are design representative values, and the values are not guaranteed. (2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI. (3) Absolute maximum ratings If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, LSI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum ratings should not be impressed to LSI. (4) GND electric potential Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of GND terminal. (5) Terminal design In consideration of permissible loss in actual use condition, carry out heat design with sufficient margin. (6) Terminal to terminal shortcircuit and wrong packaging When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may destruct LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND owing to foreign matter, LSI may be destructed. (7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 18/21 2011.03 - Rev.A Technical Note BR24T□□□□Series ●Order part number B R 2 Part No. 4 T 1 Operating temperature/ Power source Voltage BUS type 24:I2C 2 Capacity 01=1K 02=2K 04=4K 08=8K 16=16K 32=32K -40℃~+85℃ 1.7V~5.5V 8 F V T 64=64K 128=128K 256=256K 512=512K 1M=1024K - W Package Blank :DIP-T8 F :SOP8 FJ :SOP-J8 FV : SSOP-B8 FVT : TSSOP-B8 FVJ : TSSOP-B8J FVM : MSOP8 NUX :VSON008X2030 Double Cell G Halogen Free E 2 Packaging and forming specification E2: Embossed tape and reel (SOP8, SOP8-J8, SSOP-B8, TSSOP-B8, TSSOP-B8J) TR: Embossed tape and reel (MSOP8, VSON008X2030) None: Tube (DIP-T8) DIP-T8 <Tape and Reel information> 9.3±0.3 Tube Quantity 2000pcs Direction of feed Direction of products is fixed in a container tube 5 6.5±0.3 8 Container 1 3.2±0.2 3.4±0.3 0.51Min. 4 7.62 0.3±0.1 0°−15° 2.54 0.5±0.1 ∗ Order quantity needs to be multiple of the minimum quantity. (Unit : mm) SOP8 <Tape and Reel information> 7 6 5 +6° 4° −4° 6.2±0.3 4.4±0.2 0.3MIN 8 1 2 3 0.9±0.15 5.0±0.2 (MAX 5.35 include BURR) Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.595 1.5±0.1 +0.1 0.17 -0.05 S S 0.11 0.1 1.27 1pin 0.42±0.1 Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. SOP-J8 <Tape and Reel information> 4.9±0.2 (MAX 5.25 include BURR) +6° 4° −4° 6 5 0.45MIN 7 3.9±0.2 6.0±0.3 8 1 2 3 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.545 0.2±0.1 0.175 1.375±0.1 S 1.27 0.42±0.1 0.1 S 1pin Reel (Unit : mm) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 19/21 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2011.03 - Rev.A Technical Note BR24T□□□□Series TSSOP-B8 <Tape and Reel information> 3.0 ± 0.1 (MAX 3.35 include BURR) 8 7 6 4±4 3000pcs 2 3 4 1PIN MARK E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1.0±0.2 0.5±0.15 6.4±0.2 4.4±0.1 1 +0.05 0.145 −0.03 S 0.1±0.05 1.2MAX Embossed carrier tape Quantity Direction of feed 0.525 1.0±0.05 Tape 5 0.08 S +0.05 0.245 −0.04 0.08 M Direction of feed 1pin 0.65 Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. TSSOP-B8J <Tape and Reel information> 3.0 ± 0.1 (MAX 3.35 include BURR) 8 7 5 Embossed carrier tape Quantity 2500pcs 2 3 4 1PIN MARK E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.95±0.2 0.45±0.15 3.0±0.1 4.9±0.2 +0.05 0.145 −0.03 0.525 S 0.1±0.05 0.85±0.05 Tape Direction of feed 1 1.1MAX 6 4±4 0.08 S +0.05 0.32 −0.04 0.08 M Direction of feed 1pin 0.65 Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. MSOP8 <Tape and Reel information> 2.8±0.1 4.0±0.2 8 7 6 5 0.6±0.2 +6° 4° −4° 0.29±0.15 2.9±0.1 (MAX 3.25 include BURR) Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1 2 3 4 1PIN MARK 1pin +0.05 0.145 −0.03 0.475 0.08±0.05 0.75±0.05 0.9MAX S +0.05 0.22 −0.04 0.08 S Direction of feed 0.65 Reel (Unit : mm) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 20/21 ∗ Order quantity needs to be multiple of the minimum quantity. 2011.03 - Rev.A Technical Note BR24T□□□-W Series VSON008X2030 <Tape and Reel information> 3.0±0.1 2.0±0.1 0.6MAX 1PIN MARK 0.25 TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) (0.12) +0.03 0.02 −0.02 1.5±0.1 4000pcs 0.5 1 4 8 5 1.4±0.1 0.3±0.1 C0.25 Embossed carrier tape Quantity Direction of feed S 0.08 S Tape 1pin +0.05 0.25 −0.04 Reel (Unit : mm) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 21/21 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2011.03 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A