Type-C USB Power Delivery Controller BM92T10MWV General Description Applications BM92T10 is a full function Type-C USB-PD controller that supports USB Power Delivery using base-band communication. It is compatible with USB Type-C specification rev1.1 and USB Power Delivery specification rev2.0. BM92T10 includes support for the PD policy engine and communicates with an Embedded Controller or the SoC via host interface. It supports SOP, SOP’, SOP’’ and SOP’’’ signaling, allowing it to communicate with cable marker ICs, support alternate modes and protocol adapters. Consumer Applications Laptop PCs, Tablet PCs, Desktop PCs Key Specifications VBUS Voltage Range: Power Sink Voltage Range: Power Source Voltage Range: Power Consumption at Low Power: Operating Temperature Range: 4.75V to 20V 4.75V to 20V 4.75V to 20V 0.4m W (Typ) -30°C to +105°C Package Features USB Type-C Spec 1.1 compatible USB PD Spec 2.0 compatible (BMC-PHY) Two channel power path control using N-channel MOSFET drivers with back flow prevention Type C cable orientation detection Built-in VCONN Switch and VCONN controller Direct VBUS powered operation Supports Deep-Sleep-Mode (PC Application) Supports DFP/UFP/DRP mode. Supports Dead Battery operation. Supports analog audio headphone detection SMBus Interface for Host Communication EC-less Operation (Auto mode) UQFN40V5050A W (Typ) x D (Typ) x H (Max) 5.00mm x 5.00mm x 1.00mm Typical Application Circuit(s) Charger Power VBUS Power Supply For Prov (5V) HSSW SGND SGND SGND SGND SGND VSVR 5V (3.3V～5.0V) SGND SGND SGND SGND VEX VSVR S1_DRV_G2 S1_DRV_SRC S1_DRV_G1 VCONN_IN S2_DRV_G2 S2_DRV_SRC VB S2_DRV_G1 DSCHG VCONN VDDIO (1.7V～3.6V) VDDIO SMDATA SGND SMCLK CC1 CC1 CC2 CC2 GPIO0（VIN_EN) EC-I/F GPIO1（ALERT#) GPO2/VDIV(BST_EN) USB Type-C Receptacle BM92T10MWV UQFN40V5050A XCLPOFF1 XCLPOFF2 GPO3/FB(HSSWEN) GPIO7(UPSCLK） SCK SI GPIO6(UPSDO） GPIO5(UPSDIN） SO GPIO4(UPSCS） CSB SPI-IF VCCIN DBGMODDT D+ CSENSEN CSENSEP IDSEL/ATST1 VCCIN LDO15ACAP LDO28CAP LDO15DCAP GND GND GND To direct USB-PHY EPAD D- DBGRSTCK VSTR/ATST2 XRST VCCIN RX1+/RX1RX2+/RX2- SGND To direct USB-3.x PHY TX1+/TX1TX2+/TX2- VCCIN SGND GND GND SGND Figure A. Typical Application Circuit 〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays www.rohm.com TSZ02201- 0232AA000180 -1-2 © 2015 ROHM Co., Ltd. All rights reserved. 1/27 TSZ22111 • 14 • 001 30, Jul.2015, Rev.001 BM92T10MWV Contents Contents ........................................................................................................................................................................................ 2 Notation ......................................................................................................................................................................................... 3 Reference ...................................................................................................................................................................................... 3 1 Introduction ............................................................................................................................................................................ 4 2 Pin Description ...................................................................................................................................................................... 5 3 Pin Configuration................................................................................................................................................................... 7 4 Package Dimensions ............................................................................................................................................................. 8 5 Electrical Characteristics ...................................................................................................................................................... 9 5.1 Absolute Maximum Ratings ................................................................................................................................................. 9 5.2 Recommended Operating Conditions ................................................................................................................................ 10 5.3 Circuit Current Characteristics ........................................................................................................................................... 10 5.4 Digital Pin DC Characteristics ............................................................................................................................................ 11 5.5 Power supply management................................................................................................................................................ 12 5.5.1 Outline ............................................................................................................................................................................ 12 5.5.2 Electrical Characteristics ................................................................................................................................................ 13 5.6 CC_PHY ............................................................................................................................................................................ 14 5.6.1 Outline ............................................................................................................................................................................ 14 5.6.2 Electrical Characteristics ................................................................................................................................................ 16 Table 5-6. CC_PHY Characteristics .............................................................................................................................................. 16 5.7 Voltage detection ............................................................................................................................................................... 17 5.7.1 Outline ............................................................................................................................................................................ 17 5.7.2 Electrical Characteristics ................................................................................................................................................ 17 Table 5-7. Voltage Detection characteristics ................................................................................................................................. 17 5.8 VBUS Discharge ................................................................................................................................................................ 18 5.8.1 Outline ............................................................................................................................................................................ 18 5.8.2 Electrical Characteristics ................................................................................................................................................ 18 Table 5-8. VBUS Discharge Characteristics.................................................................................................................................. 18 5.9 Power FET Gate Driver (SINK & SOURCE) ...................................................................................................................... 19 5.9.1 Outline ............................................................................................................................................................................ 19 5.9.2 Electrical Characteristics ................................................................................................................................................ 19 Table 5-9. Power FET Gate Driver Characteristics ....................................................................................................................... 19 5.10 Power On Sequence ...................................................................................................................................................... 20 5.11 Power Off Sequence ...................................................................................................................................................... 21 5.12 I/O Equivalence Circuit ................................................................................................................................................... 22 6 Application Example ........................................................................................................................................................... 25 6.1 Selection of Components Externally connected ................................................................................................................. 25 7 Function Description ........................................................................................................................................................... 25 8 Application Circuits for Different Firmware Types ........................................................................................................... 25 9 Operational Notes ................................................................................................................................................................ 26 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV Notation Category Notation Description Unit V Volt (Unit of voltage) A Ampere (Unit of current) Ω, Ohm Ohm (Unit of resistance) F Farad (Unit of capacitance) deg., degree degree Celsius (Unit of Temperature) Hz Hertz (Unit of frequency) s (lower case) second (Unit of time) min minute (Unit of time) b, bit bit (Unit of digital data) B, byte 1 byte = 8 bits M, mega-, mebi- 2 M, mega-, million- 10 = 1,000,000 K, kilo-, kibi- 2 k, kilo- 10 = 1,000 Unit prefix 20 = 1,048,576 (used with “bit” or “byte”) 6 10 (used with “Ω” or “Hz”) = 1,024 (used with “bit” or “byte”) 3 (used with “Ω” or “Hz”) m, milli- 10 -3 μ, micro- 10 -6 n, nano- 10 -9 p, pico- 10 -12 xxh, xxH Hexadecimal number. “x”: any alphanumeric of 0 to 9 or A to F. xxb Binary number; “b” may be omitted. “x”: a number, 0 or 1 “_” is used as a nibble (4-bit) delimiter. (eg. “0011_0101b” = “35h”) Address #xxh Address in a hexadecimal number. “x”: any alphanumeric of 0 to 9 or A to F. Data bit[n] n-th single bit in the multi-bit data. bit[n:m] Bit range from bit[n] to bit[m]. “H”, High High level (over VIH or VOH) of logic signal. “L”, Low Low level (under VIL or VOL) of logic signal. “Z”, “Hi-Z” High impedance state of 3-state signal. Numeric value Signal level Reference Name Reference Document Release Date Publisher USB Type-C “USB Type-C Specification Release 1.1” Apr. 3, 2015 USB.org USB PD “Power Delivery Specification Revision2.0 Version1.0” Aug. 11, 2014 USB.org SMBus “System Management Bus (SMBus) Specification Version 2.0” Aug. 3, 2000 System Management Implementers Forum www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 1 Introduction BM92T10 is a full function Type-C USB-PD controller that supports USB Power Delivery using base-band communication. It is compatible with USB Type-C specification rev1.1 and USB Power Delivery specification rev2.0 BM92T10 includes the following functional blocks: Type-C Physical Layer (base-band PHY), BMC encoder / decoder, USB-PD Protocol engine, two N-ch MOSFET switch drivers to control two MOSFETS each, OVP FET and SMBus interface for communicating with the host controller. It requires an external embedded controller that includes Device Policy Manager and GPIOs for Type-C USB-PD operation. BM92T10 is able to operate independently in an AC adapter or in a dead battery condition where the embedded controller is not operational. BM92T10 includes an EEPROM, enabling code updates via the SPI interface during prototyping phase. BM92T10 controller comes in four variations depending on Technical Note for their circuit design. Please refer for additional details S2_DRV_G1 S2_DRV_SRC S2_DRV_G2 S1_DRV_G1 S1_DRV_SRC S1_DRV_G2 GND VEX GPO2/VDIV GPO3/FB Figure 1-1 shows the block diagram. CSENSEN SMCLK NchFET Switch Driver CSENSEP SMDATA SMbus XCLPOFF1 Type-C Physical Layer XCLPOFF2 Device Policy Manager VDDIO GPIO1 CC1 GPIO0 BB PD Physical Layer VCONN_IN DBGMODDT Protocol CC2 LDO15DCAP SPI I/F EEPROM LDO28CAP DBGRSTCK GPIO7 (UPSCLK) GPIO6 (UPSDO) Type-C USBPD GPIO5 (UPSDIN) GPIO4 (UPSCS) VB GND DSCHG VSVR VCCIN XRST IDSEL/ATST1 VSTR/ATST2 GND LDO15ACAP Figure 1-1. Block Diagram www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 2 Pin Description Table 2-1. Pin Description PKG PIN # Pin Name BLOCK I/O Type 1 GND GND I GND Ground 2 VSTR/ATST2 TEST/Debug IO Analog 3 IDSEL/ATST1 TEST/Debug I Analog 4 XRST Interface I Digital 5 VCCIN USB-PD O Analog 6 VSVR POWER I Power 7 DSCHG Interface IO Analog Analog TEST/ Debug Pin2 SMBus ID (device address) selection “H”:1Ah, “L”:18h /Debug Pin1 Digital block Reset Internal Power supply (For internal use, need to connect capacitor to GND 5V SVR INPUT and SPDSRC_FET_SRC voltage Discharge NMOS Drain 8 GND GND I GND Ground 9 VB POWER I Power Power Source from VBUS 10 GPIO4 (Ext mode: UPSCS) Interface I/O (O) Digital VCCIN General purpose I/O port 4 /(Ext mode: SPI Chip Select) 11 GPIO5 (Ext mode: UPSDIN) Interface I/O (I) Digital VCCIN General purpose I/O port 5 /(Ext mode: SPI DATA IN) 12 GPIO6 (Ext mode: UPSDO) Interface I/O (O) Digital VCCIN General purpose I/O port 6 /(Ext mode: SPI DATA OUT) 13 GPIO7 (Ext mode: UPSCLK) Interface I/O (IO) Digital VCCIN General purpose I/O port 7 /(Ext mode: SPI CLK INPUT) 14 DBGRSTCK TEST IO Digital VDDIO Test for logic 15 DBGMODDT TEST IO Digital VDDIO Test for logic 16 GPIO0 Interface IO Digital VDDIO General purpose I/O port 0 VIN_EN 17 GPIO1 Interface IO Digital VDDIO General purpose I/O port 1 ALERT# 18 VDDIO POWER I Power 19 SMDATA Interface IO Digital VDDIO SMBus Data 20 SMCLK Interface I Digital VDDIO SMBus Clock www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/27 Power System VCCIN Description Note Refer to Technical Note Refer to Technical Note Refer to Technical Note Refer to Technical Note Refer to Technical Note Refer to Technical Note Interface Voltage (3.3V) TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV PKG PIN # Pin Name BLOCK I/O Type 21 S2_DRV_G1 FET Gate Control O Analog 22 S2_DRV_SRC FET Gate Control I Analog Power System Description Power Path FET Gate Control SPDSNK_G1 Power Path FET BG/SRC Voltage SPDSNK_SRC 23 S2_DRV_G2 FET Gate Control O Analog 24 S1_DRV_G1 FET Gate Control O Analog 25 S1_DRV_SRC FET Gate Control I Analog Power Path FET Gate Control SPDSNK_G2 Power Path FET Gate Control SPDSRC_G1 Power Path FET BG/SRC Voltage SPDSRC_SRC Power Path FET Gate Control 26 S1_DRV_G2 FET Gate Control O Analog 27 GND GND I GND Ground 28 VEX POWER 29 GPO2/VDIV Interface GPO3/FB Interface Power Digital /Analog Digital /Analog VCCIN 30 I O /IO O /IO Extension Power Input General purpose Output port 2 BST_EN function General purpose Output port 3 HSSWEN function Current Sense Voltage Input Negative / Pin 29,30 Configuration 31 CSENSEN CDET I Analog VCCIN SPDSRC_G2 VCCIN Note Refer to Technical Note Refer to Technical Note Refer to Technical Note Refer to Technical Note Refer to Technical Note Refer to Technical Note *(Pin31,Pin32)=(H,H):GPO mode, other case: Current Sense mode. Current Sense Voltage Input Positive / Pin 29,30 Configuration 32 CSENSEP CDET I Analog VCCIN *(Pin31,Pin32)=(H,H):GPO mode, other case: Current Sense mode. Disable Clamper of CC1 33 XCLPOFF1 CCPHY I Analog VCCIN 34 XCLPOFF2 CCPHY I Analog VCCIN 35 CC1 CCPHY IO Analog 36 VCONN_IN CCPHY I Analog 37 CC2 CCPHY IO Analog 38 LDO15DCAP POWER O Analog 39 LDO28CAP POWER O Analog 40 LDO15ACAP POWER O Analog www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/27 L:Dead-battery not support Open: Dead-battery support Disable Clamper of CC2 L:Dead-battery not support Open: Dead-battery support Configuration channel 1 for Type-C Input power for VCONN Configuration channel 2 for Type-C Internal LDO 1.5V for Digital Need Capacitor Internal LDO 2.8V for Analog Need Capacitor Internal LDO 1.5V for Analog Need Capacitor TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV GPO2/VDIV VEX GND S1_DRV_G2 S1_DRV_SRC S1_DRV_G1 S2_DRV_G2 S2_DRV_SRC S2_DRV_G1 Pin Configuration 30 29 28 27 26 25 24 23 22 21 GPO3/FB CSENSEN 31 20 SMCLK CSENSEP 32 19 SMDATA XCLPOFF1 33 18 VDDIO XCLPOFF2 34 17 GPIO1 CC1 35 16 GPIO0 VCONN_IN 36 15 DBGMODDT CC2 37 14 DBGRSTCK LDO15DCAP 38 13 GPIO7(UPSCLK) LDO28CAP 39 12 GPIO6(UPSDO) LDO15ACAP 40 11 GPIO5(UPSDIN) 6 7 8 9 10 VB GPIO4(UPSCS) IDSEL/ATST1 5 GND VSTR/ATST2 4 DSCHG 3 VSVR 2 VCCIN 1 GND BM92T10MWV UQFN40PIN TOP VIEW XRST 3 Figure 3-1. Pin configuration www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 4 Package Dimensions Ordering Information B M 9 2 T Part Number 1 0 M W V - Package MWV:UQFN40V5050A E2 Packaging and forming specification E2: Embossed tape and reel Lot No. M92T10 Figure 4-1. UQFN40V5050A Package Dimensions www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5 Electrical Characteristics 5.1 Absolute Maximum Ratings Table 5-1. Absolute Maximum Ratings （Ta=25℃） Parameter Symbol Rating Unit VIN1 -0.3 to +28 V VIN2 -0.3 to +6.0 V VIN3 -1.0 to+6.0 V VIN4 -0.3 to +6.0 V Vdiff -0.3 to +6.0 V Pd 2.61 W *3 Operating Temperature Range Topr -30 to +105 degree *4 Storage Temperature Range Tstg -55 to +125 degree Maximum Supply Voltage1 (VB, VEX, DSCHG, S2_DRV_G1, S2_DRV_G2,S2_DRV_SRC, S1_DRV_G1,S1_DRV_SRC, S1_DRV_G2 ) Maximum Supply Voltage2 (VDDIO) Maximum Supply Voltage3 (VSVR, DBGRSTCK, DBGMODDT, GPIO0, GPIO1, SMDATA, SMCLK, VCONN_IN) Maximum Supply Voltage4 (VSTR/ATST2, IDSEL/ATST1, XRST, VCCIN, GPIO4, GPIO5,GPIO6,GPIO7, GPO2/VDIV, GPO3/FB, CSENSEN, CSENSEP, XCLPOFF1, XCLPOFF2, CC1, CC2, LDO15DCAP, LDO28CAP, LDO15ACAP,) Maximum different Voltage (S2_DRV_G1-S2_DRV_SRC, S2_DRV_G2-S2_DRV_SRC, S1_DRV_G1-S1_DRV_SRC, S1_DRV_G2-S1_DRV_SRC) Power Dissipation Conditions *1 *2 *1 When the DSCHG pin is applied voltage should by way of resistance more than 120Ω (4W). *2 The different voltage between S*DRV_G* and S*DRV_SRC is defined “Symbol Vdiff”. S*_DRV_G*=S*_DRV_SRC+5.8V (typ.) *3 This value is the permissible loss using a ROHM specification board (74.2 x 74.2 x 1.6tmm, 4 layered board mounting). At the time of PCB mounting the permissible loss varies with the size and material of board. When using more than at Ta=25℃, it is reduced 26.1 mW per 1℃.（Caution）Use in excess of this value may result in damage to the device. Moreover, normal operation is not protected. *4 Target spec. Power Dissipation [W] 3 PDMAX=2.61W 2.5 θja = 38.3 ℃/W 2 1.5 1 0.5 0 0 25 50 75 100 Ambient Temperature [°C] 125 150 Figure 5-1. Power Dissipation www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5.2 Recommended Operating Conditions Table 5-2. Recommended Operating Conditions (Ta=25°C) Item Symbol Range Unit VB, VEX 4.75 ～ 20 V VSVR Voltage VSVR 3.1 ～ 5.5 V VDDIO Voltage VDDIO 1.7 ～ 5.5 V VCONN_IN Input Voltage VCONN 4.75 ～ 5.5 V VB, VEX Voltage Conditions *2 *2 *2 target design 5.3 Circuit Current Characteristics Table 5-3. Common Characteristics Electrical Characteristics (Ta=25°C, VSVR=3.3V, VB=open, VEX=open, VDDIO=3.3V) Limit Item Symbol Unit Min Typ Conditions Max [Circuit Current] Unattached current Attached current Idd_unatt 0.4 mW @VSVR=3.3V Idd_att 3.5 mW @VSVR=3.3V www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5.4 Digital Pin DC Characteristics Table5-4. Digital Pin DC Characteristics Electrical Characteristics (Ta=25°C, VSVR=3.3V, VB=open, VEX=open, VDDIO=3.3V, VCCIN=VSVR) Limit Item Symbol Unit Min [Digital characteristics Power: VDDIO] (Input Digital Pins: SMCLK, DBGRSTCK) Typ Comment Max Input leak current (SMCLK, SMDATA) (Input/ Output Pins: GPIO0, GPIO1, SMDATA, DBGMODDT ) 0.8× VDDIO+0 VIH1 V VDDIO .3 0.2× VIL1 -0.3 V VDDIO IIC1 μA Power: VDDIO -5 0 5 Input "H" level (other Digital input) VIH2 0.8× VDDIO - VDDIO+0 .3 V Input "L" level VIL2 -0.3 - 0.2× VDDIO V IIC2 -1 0 1 μA Power: VDDIO VOL SMDATA - - 0.4 V IOL=350uA Max Output Voltage when “L” (other Digital output) VOL1 - - 0.3 V Source=1mA OFF Leakage Current (other Digital output) IIOFF1 -3 - 3 μA VIN=VDDIO Input "H" level (SMCLK, SMDATA) Input "L" level (SMCLK, SMDATA) (other Digital input) Input leak current (other Digital input) SMDATA pin "L" level voltage [Digital characteristics Power: VCCIN] (Input Digital Pins: XRST) (Input/ Output Pins:GPIO4, GPIO5, GPIO6, GPIO7) (Output Pins: GPO2/VDIV, GPO3/FB) Input "H" level (XRST,GPIOs) VIH3 0.8× VCCIN - VCCIN+0. 3 V Input "H" level(XRST,GPIOs) VIH3 0.8× VCCIN - VCCIN+0. 3 V Input "L" level (XRST,GPIOs) VIL3 -0.3 - 0.2× VDDIO V Input leak current (XRST,GPIOs) IIC3 -5 0 5 μA Input "H" level (other Digital input) VIH4 0.8× VDDIO - VDDIO+0 .3 V Input "L" level VIL4 -0.3 - 0.2× VDDIO V IIC4 -1 0 1 μA Output Voltage when “L” (other Digital output) VOL2 - - 0.3 V Source=1mA OFF Leakage Current (other Digital output) IIOFF2 -3 - 3 μA VIN=VCCIN CSENSEP=CSENS EN=VCCIN (other Digital input) Input leak current (other Digital input) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/27 Power: VCCIN Power: VCCIN TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5.5 Power supply management 5.5.1 Outline This LSI has a power selector. It select the lowest power supply voltage from VSVR, VEX, or VB for low power consumption. Internal Power Supply (VCCIN) gives priority in order of VSVR, VEX, and VB. VCCIN supplied from the power selector is used to LSI main power source. LDOs (for internal only) are supplied from VCCIN, and output each internal supply voltage. Each power supply input have UVLO (2.8Vtyp) and OVLO (VSVR: 6.4Vtyp, VEX/VB: 6.4/15.0/28.0Vtyp).And POR (power on reset) signal is generated from detection of LDO28OK, LDO15DOK, LDO15AOK, and VCCIN. UVLO /OVLO signal UVLO/OVLO Detection 0～20V 0～20V Power Selector with regulator VSVR VEX VB Internal Power Supply POR signal 5V 4.7μF VCCIN POR (2.6V) LDO28OK LDO (2.8V) LDO28CAP LDO15DOK LDO (1.5V) LDO15DCAP LDO15AOK LDO (1.5V) LDO15ACAP 1μF 1μF 1μF Internal Power Supply 3.3V VDDIO detection signal VDDIO DET Figure 5-2. Power Supply Management Block Diagram and Timing Chart www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5.5.2 Electrical Characteristics Table 5-5. Power Supply Management Characteristics Limit Item Symbol Unit Min Typ Comment Max [Analog characteristics] Unless otherwise specified Ta=25°C, GND=0V, Bypass Capacitor(VCCIN)=4.7μF, Bypass Capacitors(LDO28CAP, LDO15DCAP, LDO15ACAP) =1μF Input Analog Pins: VSVR, VEX, VB UVLO release voltage UVLO1H 2.8 V VSVR, VEX, VB=up UVLO detect voltage UVLO1L 2.7 V VSVR, VEX, VB=down OVLO detect voltage (5V mode) OVLO5 6.4 V VSVR, VEX, VB=up OVLO detect voltage (12V mode) OVLO12 15 V VEX, VB=up OVLO detect voltage (20V mode) OVLO20 28 V VEX, VB=up OVLO hysteresis voltage (5V mode) OVLO5hys - 240 - mV OVLO5-release voltage OVLO hysteresis voltage (12V mode) OVLO12hys - 580 - mV OVLO12-release voltage OVLO hysteresis voltage (20V mode) Power ON reset threshold voltage LDO28CAP output voltage LDO15DCAP output voltage LDO15ACAP output voltage OVLO20hys POR V28 V15D V15D - 580 2.6 2.8 1.5 1.5 - mV V V V V OVLO20-release voltage VCCIN=up No Load, VSVR=5V No Load, VSVR=5V No Load, VSVR=5V www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5.6 CC_PHY 5.6.1 Outline CC_PHY has below functions of USB Type-C. (Refer to USB Type-C Spec) - Defining Port Mode > DFP Mode Condition > UFP Mode Condition > DRP Mode Condition - DFP-to-UFP Attach / Detach Detection - Plug Orientation / Cable Twist Detection - USB Type-C VBUS Current Detection and Usage - VCONN (Supply for SOP’) Control - Base-Band Power Delivery Communication (BBPD communication) - Discovery and Configuration of Functional Extensions 5V VBUS MCU VBUS_MONI MCU [VCONNSW] Power Switch with OCP BB_PHY (BBPD Communication TX/RX) VCONN_IN CC1 Receptacle CC2 Control Logic XCALMP1OFF CC DET (CC Terminal Condition Monitor) UFP-CLAMP Rd GND Rd XCALMP2OFF GND PORT_CONT Figure 5-3. CC_PHY Block Diagram [PORT_CONT] This block chose the port mode according to the setting from MCU. (DFP) Variable current source is connected to CC terminal. These currents of each mode are 80μA±20%: Default Current, 180μA±8%: Medium Current and 330μA±8%: High Current. (UFP) Pull-down resistor (Rd=5.1kΩ±10%) is connected to CC terminal. (DRP) Changing DFP and UFP is repeated frequently. [CC_DET] CC_DET has functions of “Attach / Detach Detection”, “Plug Orientation / Cable Twist Detection”, “Discovery and detect extension mode” and “USB Type-C VBUS Current Detection”. Attach / Detach is detected with monitoring voltage of CC terminal. When the voltage of CC terminal become under a threshold voltage at DFP, attach is detected. Oppositely, when the voltage of CC terminal become over a threshold voltage, detach is detected. When the voltage of CC terminal become over a threshold voltage at UFP, attach is detected. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV Plug orientation and cable twist is detected from the relationship of two CC terminals. Because only one wire is connected to Rd, the difference between two CC terminals is generated. UFP can detect the maximum current of the power source by monitoring the voltage of CC terminal. It is possible to detect extension mode because DFP can detect Ra at Attach / Detach detection. [UFP_CLAMP] 1.1V Clamp is used for UFP emulation at dead-battery condition. [VBUS_MONI] UFP detect Attach / Detach by existence of VBUS voltage. VBUSDET detects Attach when VBUS voltage over the threshold voltage. And it detects Detach when VBUS under the threshold voltage. [VCONNSW] VCONNSW is the power switch for VCONN source. It has OCP (1.3Atyp) function. [BB_PHY] If Type-C controller supports BBPD, CC terminal can output BBPD communication signal. (Refer to BB_PHY) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5.6.2 Electrical Characteristics Table 5-6. CC_PHY Characteristics Limit Item Symbol Unit Min Typ Comment Max [PORT_CONT characteristics] Unless otherwise specified Ta=25°C, VSVR=VEX=VB=5V, VCONN_IN=5V, VDDIO=3.3V, GND=0V, Bypass Capacitor(VCCIN)=4.7μF, Bypass Capacitors(LDO28CAP, LDO15DCAP, LDO15ACAP) =1μF Input Analog Pins: CC1, CC2, VCONN_IN Pull up current 1 CCPUP1 64 80 96 μA Ta=-30～105°C Pull up current 2 CCPUP2 166 180 194 μA Ta=-30～105°C Pull up current 3 CCPUP3 304 330 356 μA Ta=-30～105°C Pull down resistor CCPDN 4.6 5.1 5.6 kΩ Ta=-30～105°C [UFP_CLAMP characteristics] Unless otherwise specified Ta=25°C, VSVR=VEX=VB=5V, VCONN_IN=5V, VDDIO=3.3V, GND=0V, Bypass Capacitor(VCCIN)=4.7μF, Bypass Capacitors(LDO28CAP, LDO15DCAP, LDO15ACAP) =1μF Input Analog Pins: CC1, CC2, VCONN_IN CCx terminal input impedance CCZin 126 kΩ CCx clamp voltage CCCLP 0.7 1.3 V Iin=80 to 330μA [VBUS MONI] Unless otherwise specified Ta=25°C, VSVR=VEX=VB=5V, VCONN_IN=5V, VDDIO=3.3V, GND=0V, Bypass Capacitor(VCCIN)=4.7μF, Bypass Capacitors(LDO28CAP, LDO15DCAP, LDO15ACAP) =1μF Input Analog Pins: CC1, CC2, VCONN_IN VBUS presence detection level CCVBDET 3.42 V [VCONNSW] Unless otherwise specified Ta=25°C, VSVR=VEX=VB=5V, VCONN_IN=5V, VDDIO=3.3V, GND=0V, Bypass Capacitor(VCCIN)=4.7μF, Bypass Capacitors(LDO28CAP, LDO15DCAP, LDO15ACAP) =1μF Input Analog Pins: CC1, CC2, VCONN_IN VCONN_IN to CCx resistance CCVCR 500 mΩ Overcurrent protection level CCVCOCP 1.1 A [BB_PHY] Unless otherwise specified Ta=25°C, VSVR=VEX=VB=5V, VCONN_IN=5V, VDDIO=3.3V, GND=0V, Bypass Capacitor(VCCIN)=4.7μF, Bypass Capacitors(LDO28CAP, LDO15DCAP, LDO15ACAP) =1μF Input Analog Pins: CC1, CC2, VCONN_IN TX BCM frequency fBBTX 300 kHz TX voltage output H level BBVOH 1.05 1.2 V TX voltage output L level BBVOL 0 75 mV RX voltage input H level BBVIH 0.6 0.65 V RX voltage input L level BBVIL 0.45 0.5 V www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5.7 Voltage detection 5.7.1 Outline VDET Block detects the voltage level of VBUS or VEX. It can detect follow conditions; (1) the voltage over the protection level, (2) the voltage over the setting range and (3) the voltage under the setting range. -VBUS or VEX voltage Detection for PDO of USB-PD spec. -OVP (over voltage protection) Detection: Vnom +20%typ -OVR (over voltage range) Detection: Vnom +5%typ -UVR (under voltage range) Detection: Vnom -5%typ VEX VBUS Voltage Selector + OVP Detection + OVR Detection + UVR Detection - Variable Reference Voltage Figure 5-4. Voltage Detection Block Diagram 5.7.2 Electrical Characteristics Table 5-7. Voltage Detection characteristics Limit Item Symbol Unit Min Typ Comment Max [VDET characteristics] Unless otherwise specified Ta=25°C, VSVR=VEX=VB=5V, VCONN_IN=VCCIN, VDDIO=3.3V, GND=0V, Bypass Capacitor(VCCIN)=4.7μF, Bypass Capacitors(LDO28CAP, LDO15DCAP, LDO15ACAP) =1μF, Vnom=5V Input Analog Pins: VEX, VB Over voltage protection detection rate OVP 17 20 23 % Standard voltage=Vnom Over voltage range detection rate OVR 3 5 7 % Standard voltage=Vnom Under voltage range detection rate UVR -7 -5 -3 % Standard voltage=Vnom www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5.8 VBUS Discharge 5.8.1 Outline NMOS switch is prepared for VBUS discharging. VBUS Line DSCHG discharge control GND Figure 5-5. VBUS Discharge Block Diagram 5.8.2 Electrical Characteristics Table 5-8. VBUS Discharge Characteristics Limit Item Symbol Unit Min Typ Comment Max [Discharge characteristics] Unless otherwise specified Ta=25°C, VSVR=VEX=VB=5V, VCONN_IN=VCCIN, VDDIO=3.3V, GND=0V, Bypass Capacitor(VCCIN)=4.7μF, Bypass Capacitors(LDO28CAP, LDO15DCAP, LDO15ACAP) =1μF Input Analog Pins: DSCHG Discharge Resistor RDSCHG 25 Ω www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5.9 Power FET Gate Driver (SINK & SOURCE) 5.9.1 Outline OUT S2_DRV_G2 OUT IN IN Charge pump IN IN S2_DRV_SRC S2_DRV_G1 S1_DRV_G2 OUT Charge pump Charge pump OUT Charge pump S1_DRV_G1 S1_DRV_SRC FET Gate Driver is the NMOS switch driver for power line switch. - External Nch-FET gate control: S1, S2 - One of two DC input selection Figure 5-6. Power FET Gate Driver Block Diagram 5.9.2 Electrical Characteristics Table 5-9. Power FET Gate Driver Characteristics Limit Item Symbol Unit Min Typ Comment Max [Discharge characteristics] Unless otherwise specified Ta=25°C, VSVR=VEX=VB=5V, VCONN_IN=VCCIN, VDDIO=3.3V, GND=0V, Bypass Capacitor(VCCIN)=4.7μF, Bypass Capacitors(LDO28CAP, LDO15DCAP, LDO15ACAP) =1μF Input Analog Pins: S1_DRV_SRC, S2_DRV_SRC Output Analog Pins: S1_DRV_G1, S1_DRV_G2, S2_DRV_G1, S2_DRV_G2 S1_DRV_G1 – S1_DRV_SRC FET control voltage between gate S1_DRV_G2 – S1_DRV_SRC VGS 6.0 V S2_DRV_G1 – S2_DRV_SRC and source S2_DRV_G2 – S2_DRV_SRC www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5.10 Power On Sequence 5.0V VSVR (VEX/VB) 2.8V 0V 5.0V 2.8V VCCIN 0V vccinuvlo 2.8V LDO28CAP 2.0V vref28ok ｕｖｌｏ LDO15A/DCAP 1.5V 0V ldo15ok H POR L (HW wake up complete) osc Start RAM End EEPROM Load U8_EN Figure 5-8. Power On Sequence www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5.11 Power Off Sequence 5.0V 2.8V VSVR (VEX/VB) 0V 5.0V 2.8V VCCIN 0V vccinuvlo 2.8V LDO28CAP vref28ok ｕｖｌｏ 1.5V LDO15A/DCAP 0V ldo15ok H POR L osc RAM Reset U8_EN Figure 5-9. Power Off Sequence www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 5.12 I/O Equivalence Circuit PIN No. 6 9 28 PIN Name Equivalent circuit diagram VSVR VB VEX Pin 7 DSCHG Pin 5 VCCIN Internal Circuit Pin 16 17 15 14 GPIO0(VIN_EN) GPIO1(ALERT#) DBGMODDT DBGRSTCK 10 11 12 13 GPIO4(UPSCS) GPIO5(UPSDIN) GPIO6(UPSDO) GPIO7(UPSCLK) 29 GPO2_VDIV VCCIN VDDIO VDDIO Pin VCCIN VDDIO Pin VCCIN GPIO4 GPIO5 GPIO6 GPIO7 Pin 30 GPO3_FB Pin 18 VDDIO Pin www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 I/O Interface Circuit 22/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 32 31 CSENSEP CSENSEN CSENSEN Pin CSENSEP Pin 19 21 SMDATA SMCLK VDDIO Pin 32 22 23 24 25 26 S2_DRV_G1 S2_DRV_SRC S2_DRV_G2 S1_DRV_G1 S1_DRV_SRC S1_DRV_G2 Pin Sx_DRV_G1 Sx_DRV_G2 Sx_DRV_SRC Pin 33 34 XCLPOFF1 XCLPOFF2 35 37 CC1 CC2 Pin Pin www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 36 VCONN_IN Pin 4 XRST VCCIN VCCIN Pin 38 40 LDO15DCAP LDO15ACAP Pin Internal Circuit 39 LDO28CAP Pin Internal Circuit 2 VSTR/ATST2 Pin 3 IDSEL/ATST1 Pin www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 24/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 6 Application Example Q1 Q2 Charger Power VBUS 10μF Q3 Q4 Power Supply For Prov (5V) Hi-side Switch SGND SGND 1μF 1μF 1kΩ 0.01 μF VSVR (3.3V～5.0V) SGND SGND 1μF SGND 1μF 1μF SGND SGND VSVR VEX S1_DRV_G2 VCONN_IN S1_DRV_SRC S2_DRV_G2 D1 S1_DRV_G1 S2_DRV_SRC S2_DRV_G1 VB DSCHG VCONN Voltage VDDIO (1.7V～3.6V) VDDIO SMDATA SGND 10 10 100 100 100 kΩ kΩ kΩ kΩ kΩ SMCLK 1μF CC1 CC1 CC2 CC2 GPIO0（VIN_EN) GPIO1（ALERT#) GPO2/VDIV(BST_EN) USB Type-C Receptacle BM92T10MWV UQFN40V5050A XCLPOFF1 XCLPOFF2 GPO3/FB(HSSWEN) GPIO7(UPSCLK） SCK SI GPIO6(UPSDO） GPIO5(UPSDIN） SO GPIO4(UPSCS） CSB SPI-IF VCCIN DBGMODDT CSENSEN CSENSEP VCCIN LDO15ACAP LDO28CAP GND LDO15DCAP GND GND EPAD DBGRSTCK 100 100 kΩ kΩ IDSEL/ATST1 VSTR/ATST2 XRST 0.01μF VCCIN 100 kΩ 100 kΩ SGND 100 100 100 100 100 100 100 100 100 kΩ kΩ kΩ kΩ kΩ kΩ kΩ kΩ kΩ VCCIN 1μF GND 1μF 1μF CVCCIN SGND GND SGND 6.1 Selection of Components Externally connected Item VCCIN Capacitance(*) Q1,Q2,Q3,Q4 Gate-Source Capacitance Symbol Min Typ Max Unit CVCCIN 2.2 4.7 10 μF CQx_gs 220p - 0.5μ F Comment (*)Please set the capacity of the condenser not to be less than the minimum in consideration of temperature properties, DC bias properties. 7 Function Description Please refer to the Technical Note 8 Application Circuits for Different Firmware Types Please refer to the Technical Note www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV 9 Operational Notes (1) Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. (2) Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. (3) Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. (4) Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. (5) Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. (6) Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. (7) Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. (8) Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. (9) Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 BM92T10MWV Operational Notes – continued (10) Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. (11) Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. (12) Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure xx. Example of monolithic IC structure (13) Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. (14) Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). (15) Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27/27 TSZ02201-0232AA000180 -1-2 30, Jul.2015, Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BM92T10MWV - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BM92T10MWV UQFN40V5050A 2500 2500 Taping inquiry Yes