BAT74 Schottky barrier double diode Rev. 03 — 19 April 2010 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier double diode with an integrated guard ring for stress protection. Two electrically isolated Schottky barrier diodes, encapsulated in a small SOT143B Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits Low forward voltage Guard-ring protected Small SMD plastic package 1.3 Applications Ultra high-speed switching Voltage clamping Protection circuits Blocking diodes 1.4 Quick reference data Table 1. Symbol Quick reference data Parameter Conditions Min Typ Max Unit Per diode IF forward current - - 200 mA VR reverse voltage - - 30 V VF forward voltage - - 800 mV IF = 100 mA 2. Pinning information Table 2. Pinning Pin Description 1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 2) 4 anode (diode 1) Simplified outline 4 1 Graphic symbol 3 4 2 1 3 2 006aaa434 BAT74 NXP Semiconductors Schottky barrier double diode 3. Ordering information Table 3. Ordering information Type number BAT74 Package Name Description Version - plastic surface-mounted package; 4 leads SOT143B 4. Marking Table 4. Marking codes Type number Marking code[1] BAT74 *L4 [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode VR reverse voltage - 30 V IF forward current - 200 mA IFRM repetitive peak forward current - 300 mA IFSM non-repetitive peak forward tp < 10 ms current - 600 mA Ptot total power dissipation - 230 mW Tj junction temperature - 125 °C Tamb ambient temperature −65 +125 °C Tstg storage temperature −65 +150 °C tp ≤ 1 s; δ ≤ 0.5 Tamb ≤ 25 °C Double diode operation reverse voltage VR BAT74_3 Product data sheet IF forward current IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 - 30 V [1] - 60 V [2] - 110 mA - 200 mA [1] Series connection. [2] If both diodes are in forward operation at the same moment, total device current is max. 110 mA. If one diode is in reverse operation and the other is in forward operation at the same moment, total device current is max. 200 mA. All information provided in this document is subject to legal disclaimers. Rev. 03 — 19 April 2010 © NXP B.V. 2010. All rights reserved. 2 of 10 BAT74 NXP Semiconductors Schottky barrier double diode 6. Thermal characteristics Table 6. Symbol Rth(j-a) [1] Thermal characteristics Parameter Conditions Min Typ Max Unit - - 500 K/W Min Typ Max Unit - - 240 mV - - 320 mV IF = 10 mA - - 400 mV IF = 30 mA - - 500 mV thermal resistance from junction to ambient in free air [1] Refer to SOT143B standard mounting conditions. 7. Characteristics Table 7. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions forward voltage IF = 0.1 mA Per diode VF IF = 1 mA [1] IF = 100 mA IR reverse current VR = 25 V Cd diode capacitance VR = 1 V; f = 1 MHz trr [1] BAT74_3 Product data sheet reverse recovery time [2] [3] - - 800 mV - - 2 μA - - 10 pF - - 5 ns Temperature coefficient of forward voltage −0.6 %/K. [2] Pulse test: tp = 300 μs; δ = 0.02. [3] When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA. All information provided in this document is subject to legal disclaimers. Rev. 03 — 19 April 2010 © NXP B.V. 2010. All rights reserved. 3 of 10 BAT74 NXP Semiconductors Schottky barrier double diode msa892 103 IF (mA) msa893 103 IR (μA) (1) (2) (3) 102 (1) 102 (2) 10 10 1 10−1 (1) (2) (3) 1 0 0.4 0.8 VF (V) 1.2 (3) 10−1 0 (1) Tamb = 125 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (3) Tamb = 25 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. VR (V) 30 Reverse current as a function of reverse voltage; typical values msa894 300 Cd (pF) Ptot (mW) 10 200 5 100 0 10 20 VR (V) 0 30 f = 1 MHz; Tamb = 25 °C Fig 3. 20 msa891 15 0 10 Product data sheet 75 Tamb (°C) 150 Standard footprint Diode capacitance as a function of reverse voltage; typical values BAT74_3 0 Fig 4. Power derating curve All information provided in this document is subject to legal disclaimers. Rev. 03 — 19 April 2010 © NXP B.V. 2010. All rights reserved. 4 of 10 BAT74 NXP Semiconductors Schottky barrier double diode 8. Test information tr tp t D.U.T. 10 % + IF IF RS = 50 Ω SAMPLING OSCILLOSCOPE trr t Ri = 50 Ω V = VR + IF × RS (1) 90 % VR mga881 input signal output signal (1) IR = 1 mA Fig 5. Reverse recovery time test circuit and waveforms 9. Package outline 3.0 2.8 1.1 0.9 1.9 4 2.5 2.1 3 0.45 0.15 1.4 1.2 1 2 0.88 0.78 0.48 0.38 0.15 0.09 1.7 Dimensions in mm Fig 6. 04-11-16 Package outline BAT74 (SOT143B) 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number BAT74 [1] BAT74_3 Product data sheet Package SOT143B Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 10000 -215 -235 For further information and the availability of packing methods, see Section 14. All information provided in this document is subject to legal disclaimers. Rev. 03 — 19 April 2010 © NXP B.V. 2010. All rights reserved. 5 of 10 BAT74 NXP Semiconductors Schottky barrier double diode 11. Soldering 3.25 0.6 (3×) 0.5 (3×) 1.9 solder lands 0.7 0.6 (3×) (3×) solder resist 2 solder paste 3 occupied area 0.7 0.6 Dimensions in mm 0.75 0.95 0.9 1 Fig 7. sot143b_fr Reflow soldering footprint BAT74 (SOT143B) 4.45 2.2 1.2 (3×) 1.425 (3×) solder lands solder resist 4.6 2.575 occupied area Dimensions in mm 1.425 preferred transport direction during soldering 1 1.2 Fig 8. BAT74_3 Product data sheet sot143b_fw Wave soldering footprint BAT74 (SOT143B) All information provided in this document is subject to legal disclaimers. Rev. 03 — 19 April 2010 © NXP B.V. 2010. All rights reserved. 6 of 10 BAT74 NXP Semiconductors Schottky barrier double diode 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BAT74_3 20100419 Product data sheet - BAT74_2 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • • • • • • • Legal texts have been adapted to the new company name where appropriate. Section 1.1 “General description”: amended Table 1 “Quick reference data”: added Section 4 “Marking”: updated Section 8 “Test information”: added Figure 5: enhanced Figure 6: superseded by minimized package outline drawing Section 10 “Packing information”: added Section 11 “Soldering”: added Section 13 “Legal information”: updated BAT74_2 20010905 Product specification - BAT74_1 BAT74_1 19960319 Product specification - - BAT74_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 19 April 2010 © NXP B.V. 2010. All rights reserved. 7 of 10 BAT74 NXP Semiconductors Schottky barrier double diode 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. BAT74_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 19 April 2010 © NXP B.V. 2010. All rights reserved. 8 of 10 BAT74 NXP Semiconductors Schottky barrier double diode Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BAT74_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 19 April 2010 © NXP B.V. 2010. All rights reserved. 9 of 10 BAT74 NXP Semiconductors Schottky barrier double diode 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 Packing information . . . . . . . . . . . . . . . . . . . . . 5 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 19 April 2010 Document identifier: BAT74_3