TOSHIBA TORX179P

TORX179P
FIBER OPTIC RECEIVING MODULE
TORX179P
FIBER OPTIC RECEIVING MODULE
FOR DIGITAL AUDIO INTERFACE
Unit: mm
l Conforms to JEITA Standard CP−1201 (For
Digital Audio Interface including Fiber Optic
inter−connections).
l Mini package type.
1. Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Storage Temperature
Tstg
−40 to 70
°C
Operating Temperature
Topr
−20 to 70
°C
Supply Voltage
VCC
−0.5 to 7
V
High Level Output Current
IOH
−1
mA
Low Level Output Current
IOL
5
mA
Soldering Temperature
Tsol
260 (Note 1)
°C
Note 1: Soldering time ≤ 10 seconds (At a distance of 1 mm from the package).
2. Recommended Operating Conditions
Characteristics
Supply Voltage
Symbol
Min
Typ.
Max
Unit
VCC
4.75
5.0
5.25
V
1
2001-08-31
TORX179P
3. Electrical and Optical Characteristics (Ta = 25°C, VCC = 5 V)
Characteristics
Symbol
Test Condition
(Note 2)
Min
Typ.
Max
Unit
0.1
―
12.8
Mb / s
Data Rate
NRZ Code
Transmission Distance
Using APF (Note 3),
Using TOTX179P
0.2
―
5
m
Pulse Width = 78 ns
Pulse Cycle = 156 ns
CL = 10 pF
Using TOTX179P
−25
―
25
ns
Pulse Width Distortion
(Note 4)
∆tw
Maximum Receivable
Power
(Note 5)
PMAX
12.8 Mb / s, Using APF
−14.5
―
―
dBm
Minimum Receivable
Power
(Note 5)
PMIN
12.8 Mb / s, Using APF
―
―
−24
dBm
Current Consumption
ICC
―
22
40
mA
High Level Output Voltage
VOH
3.6
4.0
―
V
Low Level Output Voltage
VOL
―
0.2
0.4
V
Note 2: When non−modulated signal (optical all high or all low level signal) is inputted, output signal is not stable.
When modulated optical high level signal is received, output signal is high. When modulated optical low level
signal is received, output signal is low. The duty factor must be maintained between 25 to 75%.
Note 3: All Plastic Fiber (970 / 1000 µm).
Note 4: Between input of transmitting module and output of TORX179P.
−9
Note 5: BER ≤ 10 , peak value.
4. Mechanical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Insertion Force
Using TOCP172, Initial value
―
―
39.2
N
Withdrawal Force
Using TOCP172, Initial value
5.9
―
39.2
N
2
2001-08-31
TORX179P
5. Application Circuit
6. Required Optical Fiber with Fiber Optic Connectors
TOCP172−□□B
7. Board layout hole pattern (for reference)
Unit: mm
Recommended PCB thickness: 1.6 mm
8. Precautions on Use
(1)
(2)
Maximum rating
The maximum ratings are the limit values which must not be exceeded during operation of device.
None of these rating value must not be exceeded. If the maximum rating value is exceeded, the
characteristics of devices may never be restored properly. In extreme cases, the device may be
permanently damages.
Soldering
Optical modules are comprised of internal semiconductor devices. However, in principle, optical
modules are optical components. During soldering, ensure that flux does not contact with the emitting
surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering.
Some optical modules come with a protective cap. The protective cap is used to avoid malfunction
when the optical module is not in use. Note that it is not dust or waterproof.
As mentioned before, optical modules are optical components. Thus, in principle, soldering where
there may be flux residue and flux removal after soldering is not recommended. Toshiba recommend
that soldering be performed without the optical module mounted on the board. Then, after the board
has been cleaned, the optical module should be soldered on to the board manually.
If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make
sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the
effects of flux. In such a cases, be sure to check the devices' reliability.
3
2001-08-31
TORX179P
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
Noise resistance
It is believed that the use of optical transfer devices improve noise resistance. In theory, optical fiber
is not affected by noise at all. However, receiving modules which handle signals whose level is
extremely small, are susceptible to noise.
TOSLINK improve noise resistance to use a conductive case. However, the current signal output by
the optical receiving modules' photodiode is extremely small. Thus, in some environments, shielding
the case may not achieve sufficient noise resistance.
First systems which incorporate TOSLINK, Toshiba recommend testing using the actual device to
check its noise resistance.
Use a simple noise filter on TOSLINK fiber optic transceiving module's power line. If the ripple in the
power supply used is significant, reinforce the filter.
The optical module is to be used in an area which is susceptible to radiated noise, increase the
shielding by covering the optical module and the power line filter with a metallic cover.
Vibration and shock
This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to
vibration and shock. In actual equipment, there are sometime cases in which vibration, shock, or
stress is applied to soldered parts or connected parts, resulting in lines cut. A care must be taken in
the design of equipment which will be subject to high levels of vibration.
Support pins
The TORX179P has support pins in order to fix itself to the PCB temporary. Please make the hole for
these pins in the PCB under the condition described in board layout hole pattern.
Attaching the fiber optic receiving module
Solder the fixed pins (pins 4 and 5) of the fiber optic receiving module TORX179P to the printed
circuit board in order to fix it to the board.
Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to
pour solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off
using cotton tips.
Protective cap
When the TORX179P is not in use, attach the protective cap.
Supply voltage
Use the supply voltage within the recommended operating condition (VCC = 5 ± 0.25 V). Make sure
that supply voltage does not exceed the maximum rating value of 7 V, even for an instant.
Output
If the receiver output is at low and is connected to the power supply, or if the output is high and is
connected to GND, the internal IC may be destroyed.
Soldering condition
Solder at 260°C or less for no more than ten seconds.
Precautions when disposing of devices and packing materials.
When disposing devices and packing materials, follow the procedures stipulated by local regulations
in order to protect the environment against contamination.
Precautions during use
Toshiba is continually working to improve the quality and the reliability of their products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical
sensitivity and their vulnerability to physical stress. It is the responsibility of the buyer, when
utilizing Toshiba products, to observe standards of safety, and to avoid situations in which the
malfunction or failure of a Toshiba product could cause loss of human life, bodily injury or damage to
property.
When developing equipment, please ensure that Toshiba products are used within the specified
operating ranges set forth in the most recent product specifications. Also, please keep in mind the
precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook.
4
2001-08-31
TORX179P
RESTRICTIONS ON PRODUCT USE
000707EAC
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
· Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes
are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the
products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with
domestic garbage.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.
5
2001-08-31