Datasheet Operational Amplifiers Low Noise Operational Amplifiers BA2107G BA2115xxx General Description Key Specification The BA2107/BA2115 are single and dual operational amplifier with high gain and high slew rate(4v/µs). The BA2107/BA2115 have good performance of input referred noise voltage(7 nV/ Hz ) and total harmonic distortion(0.008%). These are suitable for Audio applications. Wide Operating Supply Voltage (split supply): Operating Temperature Range: Slew Rate: Total Harmonic Distortion : Input Referred Noise Voltage : Features Packages High Voltage Gain Low Input Referred Noise Voltage Low Total Harmonic Distortion Wide Operating Supply Voltage SSOP5 SOP8 SOP-J8 MSOP8 ±1.0V to ±7.0V -40°C to +85°C 4V/µs(Typ) 0.008%(Typ) 7 nV/ Hz (Typ) W(Typ)xD(Typ) xH(Max) 2.90mm x 2.80mm x 1.25mm 5.00mm x 6.20mm x 1.71mm 4.90mm x 6.00mm x 1.65mm 2.90mm x 4.00mm x 0.90mm Application Audio Application Potable Equipment Consumer Electronics Simplified Schematic VCC VCC －IN -IN VOUT OUT ＋IN +IN VEE VEE Figure 1. Simplified Schematic ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･00 ○This product is not designed protection against radioactive rays. 1/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Pin Configuration SSOP5 +IN 1 VEE 2 -IN 3 5 VCC Pin No. Pin Name 1 +IN1 2 VEE 3 -IN1 4 OUT 5 VCC Pin No. Pin Name 1 OUT1 2 -IN1 3 +IN1 4 VEE 5 +IN2 6 -IN2 7 OUT2 8 VCC + - 4 OUT SOP8, SOP-J8, MSOP8 OUT1 1 -IN1 2 +IN1 3 VEE 4 8 VCC 7 OUT2 CH1 - + 6 -IN2 CH2 + - 5 +IN2 Package SSOP5 SOP8 SOP-J8 MSOP8 BA2107G BA2115F BA2115FJ BA2115FVM Ordering Information B A 2 1 x x Part Number BA2107G BA2115xxx x x x - Package G : SSOP5 F : SOP8 FJ : SOP-J8 FVM : MSOP8 xx Packaging and forming specification E2: Embossed tape and reel (SOP8/SOP-J8) TR: Embossed tape and reel (SSOP5/MSOP8) Line-up Operating Temperature Range -40°C to +85°C Operating Supply Voltage (split supply) ±1.0V to ±7.0V www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 Supply Current (Typ) 3.5mA Slew Rate (Typ) 4V/µs 2/31 Orderable Part Number Package SSOP5 Reel of 3000 BA2107G-TR SOP8 Reel of 2500 BA2115F-E2 SOP-J8 Reel of 2500 BA2115FJ-E2 MSOP8 Reel of 3000 BA2115FVM-TR TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Absolute Maximum Ratings (TA=25℃) ○BA2107, BA2115 Parameter Symbol Supply Voltage VCC-VEE Power Dissipation Differential Input Voltage PD (Note 5) Ratings Unit +14 V SSOP5 0.67 (Note 1,4) SOP8 0.78 (Note 2,4) SOP-J8 0.67 (Note 1,4) MSOP8 0.59 (Note 3,4) W C +14 V VICM (VEE-0.3) to (VEE+14) V II -10 mA Operating Supply Voltage Vopr 2 to 14(±1 to ±7) V Operating Temperature Topr -40 to +85 ℃ Tstg -55 to 150 ℃ TJmax +150 ℃ Input Common-mode Voltage Range (Note 6) Input Current Storage Temperature Maximum Junction Temperature (Note 1) (Note 2) (Note 3) (Note 4) (Note 5) To use at temperature above TA＝25℃ reduce 5.4mW/℃ To use at temperature above TA＝25℃ reduce 6.2mW/℃ To use at temperature above TA＝25℃ reduce 4.8mW/℃ Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (copper foil area less than 3%). The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input terminal voltage is set to more than VEE. (Note 6) An excessive input current will flow when input voltages of more than VCC+0.6V or less than VEE-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 3/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Electrical Characteristics ○BA2107 (Unless otherwise specified Parameter Input Offset Voltage (Note 7) VCC=+2.5V, VEE=-2.5V, TA=25℃) Limits Symbol Unit Min Typ Max Condition VIO - 1 6 mV VOUT=0V, VICM=0V IIO - 2 200 nA VOUT=0V, VICM=0V IB - 150 400 nA VOUT=0V, VICM=0V ICC - 1.8 3.0 mA Av=0dB, RL=∞, +IN=0V 4.5 4.8 - - 11.6 - - 15.5 - 0.5 0.2 - - 0.4 - - 0.5 - ISOURCE - 1.4 - mA ISINK - 90 - mA Av 60 80 - dB VICM ±1.5 - - V RL≧10kΩ, VOUT=2.5±2V VICM=2.5V (VEE+1.0V) - (VCC-1.0V) Common-mode Rejection Ratio CMRR 60 74 - dB VICM=-1.5V to +1.5V Power Supply Rejection Ratio PSRR 60 80 - dB VEE=0V, VCC=2V to 16V SR - 4 - V/μs Av=0dB, +IN=2VP-P Input Offset Current Input Bias Current (Note 7) (Note 8) Supply Current Maximum Output Voltage(High) Maximum Output Voltage(Low) Output Source Current Output Sink Current Large Signal Voltage Gain Input Common-mode Voltage Range Slew Rate Gain Bandwidth Product VOH VOL V V RL≧2.5kΩ, VOHmin=VCC-0.5V RL≧10kΩ, VCC=12V, VEE=0V VRL=6V, VOH=VCC-0.4V RL≧10kΩ, VCC=16V, VEE=0V VRL=8V, VOH=VCC-0.5V RL≧2.5kΩ, VOLmin=VEE+0.5V RL≧10kΩ, VCC=12V, VEE=0V VRL=6V, VOL=VEE+0.4V RL≧10kΩ, VCC=16V, VEE=0V VRL=8V, VOL=VEE+0.5V - GBW - 12 - MHz f=10kHz Unity Gain Frequency fT - 3.4 - MHz 0dB cross frequency Input Referred Noise Voltage VN - 7 - nV/ Hz RS=600Ω, DIN-AUDIO - 0.9 - μVrms RS=600Ω, DIN-AUDIO - 0.008 - Total Harmonic Distortion THD+N ％ Av=20dB, f=1kHz, DIN-AUDIO (Note 7) Absolute value (Note 8) Current direction: Since first input stage is composed with PNP transistor, input bias current flows out from IC. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 4/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx ○BA2115 (Unless otherwise specified Parameter Datasheet VCC=+2.5V, VEE=-2.5V, TA=25℃) Limits Symbol Min Typ Max Unit Condition Input Offset Voltage (Note 9) VIO - 1 6 mV VOUT=0V, VICM=0V Input Offset Current (Note 9) IIO - 2 200 nA VOUT=0V, VICM=0V IB - 150 400 nA ICC - 3.5 5 mA 4.5 4.8 - - 11.6 - - 15.5 - 0.5 0.2 - - 0.4 - - 0.5 - ISOURCE - 1.4 - mA VOUT=0V, VICM=0V Av=0dB, RL=∞, All Op-Amps +IN=0V RL≧2.5kΩ, VOHmin=VCC-0.5V RL≧10kΩ, VCC=12V, VEE=0V VRL=6V, VOH=VCC-0.4V RL≧10kΩ, VCC=16V, VEE=0V VRL=8V, VOH=VCC-0.5V RL≧2.5kΩ, VOLmin=VEE+0.5V RL≧10kΩ, VCC=12V, VEE=0V VRL=6V, VOL=VEE+0.4V RL≧10kΩ, VCC=16V, VEE=0V VRL=8V, VOL=VEE+0.5V - ISINK - 90 - mA AV 60 80 - dB Input Bias Current (Note 10) Supply Current Maximum Output Voltage(High) Maximum Output Voltage(Low) Output Source Current Output Sink Current VOH VOL V V VICM ±1.5 - - V RL≧10kΩ, VOUT=±2V VICM=0V (VEE+1.0V) - (VCC-1.0V) Common-mode Rejection Ratio CMRR 60 74 - dB VICM=-1.5V to +1.5V Power Supply Rejection Ratio PSRR 60 80 - dB VEE=0V, VCC=2V to 14V Large Signal Voltage Gain Input Common-mode Voltage Range Slew Rate Gain Bandwidth Product Unity Gain Frequency Input Referred Noise Voltage Total Harmonic Distortion Channel Separation SR - 4 - V/μs Av=0dB, +IN=2VPP GBW - 12 - MHz f=10kHz fT - 3.4 - MHz 0dB cross frequency - 7 - nV/ Hz RS=600Ω, DIN-AUDIO - 0.9 - μVrms RS=600Ω, DIN-AUDIO THD+N - 0.008 - ％ Av=20dB, f=1kHz, DIN-AUDIO CS - 100 - dB Av=40dB VN (Note 9) Absolute value (Note 10) Current direction: Since first input stage is composed with PNP transistor, input bias current flows out from IC. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 5/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VCC / VEE) Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Power dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25℃ (normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics (1) Input Offset Voltage (VIO) Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting terminals. (3) Input Bias Current (IB) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) Supply Current (ICC) Indicates the current that flows within the IC under specified no-load conditions. (5) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL) Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. (6) Output Source Current/ Output Sink Current (Isource / Isink) The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. (7) Large Signal Voltage Gain (Av) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage) / (Differential Input voltage) (8) Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. (9) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 6/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet (10) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation) (11) Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. (12) Gain Bandwidth (GBW) The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave. (13) Unity gain frequency (fT) Indicates a frequency where the voltage gain of operational amplifier is 1. (14) Input Referred Noise Voltage (VN) Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. (15) Total harmonic distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. (16) Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 7/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Typical Performance Curves ○BA2107 1.0 . 4 SUPPLY CURRENT [mA] POWER DISSIPATION [W] 0.8 BA2107G 0.6 0.4 0.2 0.0 0 25 50 75 85 3 -40℃ 25℃ 2 85℃ 1 0 100 125 0 AMBIENT TEMPERATURE [℃] Figure 2. Derating Curve 5 10 SUPPLY VOLTAGE [V] Figure 3. Supply Current - Supply Voltage 3 4 2 3 OUTPUT VOLTAGE [V] SUPPLY CURRENT [mA] 15 5.0V 14.0V 2 2.0V 1 VOH 1 0 -1 VOL -2 0 -3 -50 -25 0 25 50 75 100 0.1 AMBIENT TEMPERATURE [℃] 1 10 100 1000 LOAD LOADRESISTANCE RESISTANCE[kΩ] [kΩ] 10000 Figure 5. Output Voltage - Load Resistance (VCC/VEE=+2.5V/-2.5V) Figure 4. Supply Current - Ambient Temperature (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 8/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet ○BA2107 10 10 6 VOH OUTPUT VOLTAGE [V] OUTPUT VOLTAGE [V] 6 2 -2 VOL -6 -10 VOH 2 -2 VOL -6 -10 ±1 ±2 ±3 ±4 ±5 ±6 ±7 SUPPLY VOLTAGE [V] ±8 -50 3.0 0 2.5 -0.5 2.0 VOH 1.5 1.0 100 Figure 7. Output Voltage - Ambient Temperature (VCC/VEE=+7.0V/-7.0V, RL=10kΩ) OUTPUT VOLTAGE [V] OUTPUT VOLTAGE [V] Figure 6. Output Voltage - Supply Voltage (RL=10kΩ) -25 0 25 50 75 AMBIENT TEMPERATURE [℃] -1 -1.5 VOL -2 -2.5 0.5 -3 0.0 0.0 0 0.4 0.8 1.2 1.6 2.0 OUTPUT SOURCE CURRENT [mA] 2 4 6 8 OUTPUT SINK CURRENT [mA] 10 Figure 9. Output Voltage - Output Sink Current (VCC/VEE=+2.5V/-2.5V) Figure 8. Output Voltage - Output Source Current (VCC/VEE=+2.5V/-2.5V) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 9/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet 6 3 4 2 INPUT OFFSET VOLTAGE [mV] INPUT OFFSET VOLTAGE [mV] ○BA2107 2 0 -2 -4 ±7.0V ±2.5V 1 0 ±1.0V -1 -2 -3 -6 ±1 ±2 ±3 ±4 ±5 ±6 ±7 SUPPLY VOLTAGE [V] -50 ±8 Figure 10. Input Offset Voltage - Supply Voltage (VICM=0V, VOUT=0V) -25 0 25 50 75 AMBIENT TEMPERATURE [°C] 100 Figure 11. Input Offset Voltage - Ambient Temperature (VICM=0V, VOUT=0V) 250 25℃ 200 INPUT BIAS CURRENT [nA] INPUT BIAS CURRENT [nA] . 250 -40℃ 150 85℃ 100 50 ±1.0V 200 ±2.5V 150 ±7.0V 100 50 0 0 ±1 ±2 ±3 ±4 ±5 ±6 ±7 SUPPLY VOLTAGE [V] Figure 12. Input Bias Current - Supply Voltage (VICM=0V, VOUT=0V) -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] Figure 13. Input Bias Current - Ambient Temperature (VICM=0V, VOUT=0V) ±8 (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 10/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet 40 40 30 30 INPUT OFFSET CURRENT [nA] INPUT OFFSET CURRENT [nA] . ○BA2107 20 25℃ -40℃ 10 0 85℃ -10 -20 -30 -40 20 10 0 ±2.5V ±7.0V -10 -20 -30 -40 ±1 ±2 ±3 ±4 ±5 ±6 ±7 SUPPLY VOLTAGE [V] ±8 -50 Figure 14. Input Offset Current - Supply Voltage (VICM=0V, VOUT=0V) 25℃ 85℃ 0 -2 -4 LARGE SIGNAL VOLTAGE GAIN [dB] . -40℃ -6 -2.5 100 150 4 2 -25 0 25 50 75 AMBIENT TEMPERATURE [℃] Figure 15. Input Offset Current - Ambient Temperature (VICM=0V, VOUT=0V) 6 INPUT OFFSET VOLTAGE [mV] ±1.0V -1.5 -0.5 0.5 1.5 2.5 COMMON MODE INPUT VOLTAGE [V] 125 100 75 50 25 0 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [°C] 100 Figure 17. Large Signal Voltage Gain - Ambient Temperature (VCC/VEE=+2.5V/-2.5V) Figure 16. Input Offset Voltage - Common Mode Input Voltage (VCC/VEE=+2.5V/-2.5V, VOUT=0V) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 11/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet ○BA2107 125 100 75 50 25 0 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [°C] 150 125 100 . COMMON MODE REJECTION RATIO [dB] . POWER SUPPLY REJECTION RATIO[dB] 150 75 50 25 0 100 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [°C] Figure 19. Power Supply Rejection Ratio - Ambient Temperature (VCC/VEE=+2.5V/-2.5V) 7 7 6 6 SLEW RATE H-L [V/μs] SLEW RATE L-H [V/μs] Figure 18. Common Mode Rejection Ratio - Ambient Temperature (VCC/VEE=+2.5V/-2.5V) 5 -40℃ 4 25℃ 3 100 85℃ 2 1 5 25℃ -40℃ 4 85℃ 3 2 1 0 0 ±1 ±2 ±3 ±4 ±5 ±6 SUPPLY VOLTAGE[V] ±7 ±8 ±1 ±2 ±3 ±4 ±5 ±6 SUPPLY VOLTAGE [V] ±7 ±8 Figure 21. Slew Rate H-L - Supply Voltage Figure 20. Slew Rate L-H - Supply Voltage (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 12/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet INPUT REFFERD NOISE VOLTAGE [nV/√Hz] ○BA2107 TOTAL HARMONIC DISTORTION [%] 1 0.1 20kHz 0.01 1kHz 20Hz 0.001 0.01 0.1 1 OUTPUT VOLTAGE [Vrms] 10 Phase 20 10 0 10 100 1000 FREQUENCY [Hz] 10000 Figure 23. Equivalent Input Noise Voltage - Frequency (VCC/VEE=2.5V/-2.5V) 0 Gain -60 30 -90 20 -120 10 PHASE [deg] . -30 40 GAIN [dB] . 30 1 Figure 22. Total Harmonic Distortion - Output Voltage (VCC/VEE=2.5V/-2.5V, RL=2kΩ 80kHz-LPF, TA=25℃) 50 40 -150 0 -180 2 3 4 5 6 7 10 10 10 10 10 10 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 FREQUENCY [Hz] Figure 24. Voltage Gain - Frequency (VCC/VEE=2.5V/-2.5V, Av=40dB, RL=10kΩ) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 13/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Typical Performance Curves 7 6 BA2115F 0.8 -40℃ SUPPLY CURRENT [mA]. POWER DISSIPATION [W] . ○BA2115 1.0 BA2115FJ 0.6 0.4 BA2115FVM 0.2 0.0 0 85 25 50 75 100 AMBIENT TEMPERATURE [℃] 5 25℃ 4 85℃ 3 2 1 0 0 125 15 Figure 26. Supply Current - Supply Voltage Figure 25. Derating Curve 7 3 6 2 VOH 14.0V 5 OUTPUT VOLTAGE [V] SUPPLY CURRENT [mA] 5 10 SUPPLY VOLTAGE [V] 4 3 5.0V 3.0V 2 1 0 -1 VOL -2 1 -3 0 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [℃] 0.1 100 1 10 100 1000 LOAD RESISTANCE [kΩ] 10000 Figure 28. Output Voltage - Load Resistance (VCC/VEE=+2.5V/-2.5V) Figure 27. Supply Current - Ambient Temperature (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 14/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet ○BA2115 10 10 8 8 VOH 6 OUTPUT VOLTAGE [V] OUTPUT VOLTAGE [V] 6 4 2 0 -2 -4 VOL -6 2 0 -2 -4 -8 -10 -10 ±2 ±3 ±4 ±5 ±6 SUPPLY VOLTAGE [V] ±7 VOL -6 -8 ±1 VOH 4 -50 ±8 0.0 2.5 -0.5 1.5 1.0 0.5 SUPPLY CURRENT [mA]. OUTPUT VOLTAGE [V] 3.0 VOH 100 Figure 30. Maximum Output Voltage - Ambient Temperature (VCC/VEE=+7V/-7V, RL=10kΩ) Figure 29. Maximum Output Voltage - Supply Voltage (RL=10kΩ) 2.0 -25 0 25 50 75 AMBIENT TEMPERATURE [℃] 0.0 -1.0 -1.5 VOL -2.0 -2.5 -3.0 0.0 0.4 0.8 1.2 1.6 2.0 OUTPUT SOURCE CURRENT [mA] 0 2 4 6 8 SUPPLY VOLTAGE [V] 10 Figure 32. Maximum Output Voltage - Output Sink Current (VCC/VEE=+2.5V/-2.5V) Figure 31. Maximum Output Voltage - Output Source Current (VCC/VEE=+2.5V/-2.5V) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 15/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet 6 3 4 2 INPUT OFFSET VOLTAGE [mV] INPUT OFFSET VOLTAGE [mV] ○BA2115 2 0 -2 -4 ±7.0V 0 -1 ±1.5V ±2.5V -2 -3 -6 ±1 ±2 ±3 ±4 ±5 ±6 ±7 -50 ±8 -25 0 25 50 75 100 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 33. Input Offset Voltage - Supply Voltage (VICM=0V, VOUT=0V) Figure 34. Input Offset Voltage - Ambient Temperature (VICM=0V, VOUT=0V) 250 . .. 250 ±1.5V 25℃ 200 INPUT BIAS CURRENT [nA] INPUT BIAS CURRENT [nA] 1 -40℃ 150 85℃ 100 50 0 200 ±2.5V 150 ±7.0V 100 50 0 ±1 ±2 ±3 ±4 ±5 ±6 SUPPLY VOLTAGE [V] ±7 ±8 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] Figure 36. Input Bias Current - Ambient Temperature (VICM=0V, VOUT=0V) Figure 35. Input Bias Current - Supply Voltage (VICM=0V, VOUT=0V) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 16/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet 40 40 30 30 INPUT OFFSET CURRENT [nA] INPUT OFFSET CURRENT [nA] . ○BA2115 20 -40℃ 10 25℃ 0 85℃ -10 -20 -30 20 ±1.5V 10 0 -10 ±1 -20 -30 ±2 ±3 ±4 ±5 ±6 SUPPLY VOLTAGE [V] ±7 -50 ±8 0 25 50 75 100 Figure 38. Input Offset Current - Ambient Temperature (VICM=0V, VOUT=0V) 150 LARGE SIGNAL VOLTAGE GAIN [dB] . 20 INPUT OFFSET VOLTAGE [mV] -25 AMBIENT TEMPERATURE [℃] Figure 37. Input Offset Current - Supply Voltage (VICM=0V, VOUT=0V) 15 10 5 0 85℃ -10 ±7.0V -40 -40 -5 ±2.5V 25℃ -40℃ -15 125 100 75 50 25 0 -20 -2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 -50 2.5 COMMON MODE INPUT VOLTAGE [V] -25 0 25 50 75 AMBIENT TEMPERATURE [°C] 100 Figure 40. Large Signal Voltage Gain - Ambient Temperature (VCC/VEE=+2.5V/-2.5V) Figure 39. Input Offset Voltage - Common Mode Input Voltage (VCC/VEE=+2.5V/-2.5V, VOUT=0V) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 17/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet 150 POWER SUPPLY REJECTION RATIO [dB] . COMMON MODE REJECTION RATIO [dB] . ○BA2115 125 100 75 50 25 0 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [°C] 150 125 100 75 50 25 0 100 -50 7 6 6 SLEW RATE H-L [V/μs] SLEW RATE L-H [V/μs] 25 50 75 100 Figure 42. Power Supply Rejection Ratio - Ambient Temperature (VCC/VEE=+2.5V/-2.5V) 7 5 -40℃ 4 85℃ 0 AMBIENT TEMPERATURE [°C] Figure 41. Common Mode Rejection Ratio - Ambient Temperature (VCC/VEE=+2.5V/-2.5V) 3 -25 25℃ 2 -40℃ 5 25℃ 4 85℃ 3 2 1 1 0 0 ±1 ±2 ±3 ±4 ±5 ±6 SUPPLY VOLTAGE[V] ±7 ±1 ±8 ±2 ±3 ±4 ±5 ±6 SUPPLY VOLTAGE [V] ±7 ±8 Figure 44. Slew Rate H-L - Supply Voltage Figure 43. Slew Rate L-H - Supply Voltage (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 18/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet ○BA2115 INPUT REFFERD NOISE VOLTAGE [nV/√Hz] TOTAL HARMONIC DISTORTION [%] 1 0.1 20kHz 0.01 1kHz 20Hz 0.001 0.01 0.1 1 OUTPUT VOLTAGE [Vrms] Phase 20 10 0 10 100 1000 10000 FREQUENCY [Hz] Figure 46. Equivalent Input Noise Voltage - Frequency (VCC/VEE=2.5V/-2.5V) 0 Gain -60 30 -90 20 -120 10 PHASE [deg] . -30 40 GAIN [dB] . 30 1 10 Figure 45. Total Harmonic Distortion - Output Voltage (VCC/VEE=2.5V/-2.5V, RL=3kΩ 80kHz-LPF, TA=25℃) 50 40 -150 0 -180 2 3 4 5 6 1.E+07 7 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 10 10 10 10 10 10 FREQUENCY [Hz] Figure 47. Voltage Gain - Frequency (VCC/VEE=2.5V/-2.5V, Av=40dB, RL=10kΩ) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 19/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Application Information NULL method condition for Test Circuit 1 VCC, VEE, EK, VICM Unit: V Parameter VF S1 S2 S3 VCC VEE EK VICM calculation Input Offset Voltage VF1 ON ON OFF 2.5 -2.5 0 0 1 Input Offset Current VF2 OFF OFF OFF 2.5 -2.5 0 0 2 VF3 OFF ON VF4 ON OFF OFF 2.5 -2.5 0 0 3 ON ON ON 2.5 -2.5 -1.0 0 1.5 -2.5 1.0 0 ON ON OFF 1.5 -3.5 -1.0 0 3.5 -1.5 1.0 0 ON ON OFF 0.75 -1.25 0 0 7.0 -7.0 0 0 Input Bias Current VF5 Large Signal Voltage Gain VF6 VF7 Common-mode Rejection Ratio (Input common-mode Voltage Range) VF8 VF9 Power Supply Rejection Ratio VF10 -Calculation1. Input Offset Voltage (Vio) VIO = 2. Input Offset Current (Iio) IIO = 3. Input Bias Current (Ib) IB = 4. Large Signal Voltage Gain (Av) AV = 20Log ΔEK × (1+RF/RS) |VF5-VF6| 5. Common-mode Rejection Ration (CMRR) 6. Power Supply Rejection Ratio (PSRR) |VF1| 1+RF/RS 4 5 6 [V] |VF2-VF1| [A] RI ×(1+RF/RS) |VF4-VF3| 2 × RI ×(1+RF/RS) [A] [dB] CMRR = 20Log ΔVICM × (1+RF/RS) [dB] |VF8-VF7| PSRR = 20Log ΔVCC × (1+ RF/RS) [dB] |VF10 – VF9| 0.1µF RF=50kΩ SW1 +15V EK RS=50Ω 0.1µF 500kΩ VCC RI=10kΩ 500kΩ DUT NULL SW3 RS=50Ω 1000pF RI=10kΩ VF RL VICM 50kΩ SW2 -15V VEE Figure 48. Test circuit1 (one channel only) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 20/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Switch Condition for Test Circuit 2 SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13 SW14 Supply Current OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage(High) OFF OFF ON OFF OFF ON OFF Maximum Output Voltage(Low) OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF Output Source Current OFF OFF ON OFF OFF ON Output Sink Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON Slew Rate OFF OFF OFF ON OFF Gain Bandwidth Product OFF ON OFF OFF ON OFF OFF ON ON ON OFF OFF OFF OFF ON OFF OFF ON ON OFF OFF OFF Equivalent Input Noise Voltage ON OFF OFF OFF ON OFF ON OFF OFF OFF OFF ON OFF OFF Input voltage SW4 R2 SW5 ● VH VCC － SW1 SW2 VL SW3 RS SW7 SW9 SW8 SW10 SW11 SW12 SW13 SW14 Output voltage R1 VIN- 90% SR=ΔV/Δt VH VEE C RL VIN+ ΔV CL 10% VOUT VRL VL Δt Output wave t Figure 50. Slew Rate Input Waveform Figure 49. Test Circuit 2 (each Op-Amp) R2=100kΩ R2=100kΩ VCC R1=1kΩ t Input wave ＋ SW6 OFF VCC R1=1kΩ OTHER CH V VIN R1//R2 VEE OUT1 =0.5Vrms V R1//R2 OUT2 VEE CS=20×log 100×OUT1 OUT2 Figure 51. Test circuit 3(Channel Separation) (VCC=+2.5V, VEE=-2.5V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 21/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Power Dissipation Power dissipation(total loss) indicates the power that can be consumed by IC at TA=25℃(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θJA℃/W.The temperature of IC inside the package can be estimated by this thermal resistance. Figure 52. (a) shows the model of thermal resistance of the package. Thermal resistance θJA, ambient temperature TA, maximum junction temperature TJMAX, and power dissipation Pd can be calculated by the equation below: θJA = (TJMAX-TA) / PD ℃/W ・・・・・ (Ⅰ) Derating curve in Figure 52. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 53. (c),(d) show a derating curve for an example of BA2107,BA2115. Power Dissipation of LSI [W] PD(max) θJA=(TJmax-TA)/ PD °C/W P2 Ambient Temperature TA [ °C ] θJA2 < θJA1 θ’JA2 P1 θJA2 TJ’max θ’JA1 0 Chip Surface Temperature TJ [ °C ] 25 50 TJmax θJA1 75 100 125 150 Ambient Temperature TA [ °C ] (b) Derating Curve (a) Thermal Resistance Figure 52. Thermal Resistance and Derating Curve 1.0 POWER DISSIPATION [W] . POWER DISSIPATION [W] 1.0 0.8 BA2107G(Note 11) 0.6 0.4 0.2 BA2115F(Note 12) BA2115FJ(Note 11) 0.6 0.4 BA2115FVM(Note 13) 0.2 0.0 0.0 0 0 25 50 75 100 125 AMBIENT TEMPERATURE [℃] (Note 12) 6.2 (Note 13) 4.8 25 50 75 100 125 AMBIENT TEMPERATURE [℃] (d)BA2115 (c)BA2107 (Note 11) 5.4 0.8 Unit mW/℃ When using the unit above TA=25℃, subtract the value above per ℃. Permissible dissipation is the value. Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted. Figure 53. Derating Curve www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 22/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Application Example ○Voltage Follower Voltage gain is 0 dB. This circuit controls output voltage (OUT) equal input voltage (IN), and keeps OUT with stable because of high input impedance and low output impedance. OUT is shown next expression. OUT=IN VCC OUT IN VEE Figure 54. Voltage Follower Circuit ○Inverting Amplifier R2 For inverting amplifier, Vi(b) Derating curve voltage gain decided R1 and R2, and phase reversed voltage is output. OUT is shown next expression. OUT=-(R2/R1)・IN Input impedance is R1. VCC IN R1 OUT R1//R2 VEE Figure 55. Inverting Amplifier Circuit ○Non-inverting Amplifier R1 R2 VCC OUT For non-inverting amplifier, IN is amplified by voltage gain decided R1 and R2, and phase is same with IN. OUT is shown next expression. OUT=(1 + R2/R1)・IN This circuit performs high input impedance because Input impedance is operational amplifier’s input Impedance. IN VEE Figure 56. Non-inverting Amplifier Circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 23/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the PD rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 24/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Operational Notes – continued 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B GND Parasitic Elements GND GND N Region close-by GND Figure 57. Example of monolithic IC structure 12. Unused Circuits It is recommended to apply the connection (see Figure 58.) and set the non-inverting input terminal at a potential within the Input Common-mode Voltage Range (VICM) for any unused circuit. Keep this potential in VICM 13. Input Voltage Applying VEE +36V to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. VCC VICM VEE Figure 58. Example of Application Circuit for Unused Op-amp 14. Power Supply(single/dual) The operational amplifier operates when the voltage supplied is between VCC and VEE. Therefore, the single supply operational amplifier can be used as dual supply operational amplifier as well. 15. IC Handling When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to the piezo effect. Be careful with the warp on the printed circuit board. 16. The IC Destruction Caused by Capacitive Load The IC may be damaged when VCC terminal and VEE terminal is shorted with the charged output terminal capacitor. When IC is used as an operational amplifier or as an application circuit where oscillation is not activated by an output capacitor, output capacitor must be kept below 0.1μF in order to prevent the damage mentioned above. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 25/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 SSOP5 26/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Physical Dimension Tape and Reel Information – continued Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 27/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 SOP-J8 28/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 MSOP8 29/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Marking Diagrams SSOP5(TOP VIEW) SOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number 1PIN MARK LOT Number SOP-J8(TOP VIEW) MSOP8(TOP VIEW) Product Name BA2107 BA2115 Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK Package Type G SSOP5 F SOP8 FJ SOP-J8 FVM MSOP8 Marking J0 2115 Land pattern data all dimensions in mm Land length Land width ≧ℓ 2 b2 PKG Land pitch e Land space MIE SSOP5 0.95 2.4 1.0 0.6 SOP8 1.27 4.60 1.10 0.76 SOP-J8 1.27 3.90 1.35 0.76 MSOP8 0.65 2.62 0.99 0.35 SOP8, SOP-J8, MSOP8 SSOP5 0.95 MIE b 2 1.0 2.4 e 0.95 0.6 ℓ 2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 30/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 BA2107G BA2115xxx Datasheet Revision History Date Revision 31.Oct.2012 11.Nov.2014 001 002 Changes New Release Change in format. Addtition of Input Current item of Absolute Maximum Ratings. (Page3) Correction of Derating Curbe of Figure 2. (Page8) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 31/31 TSZ02201-0RAR0G200090-1-2 11.Nov.2014 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BA2107G - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BA2107G SSOP5 3000 3000 Taping inquiry Yes