BLF888B; BLF888BS UHF power LDMOS transistor Rev. 2 — 12 July 2013 Product data sheet 1. Product profile 1.1 General description A 650 W LDMOS RF power transistor for broadcast transmitter applications and industrial applications. The excellent ruggedness of this device makes it ideal for digital and analog transmitter applications. Table 1. Application information RF performance at VDS = 50 V unless otherwise specified. Mode of operation f PL(AV) PL(M) Gp (MHz) (W) (W) D IMD3 IMDshldr PAR (dBc) (dB) 34 - - - 31[1] 8.2 [2] (dB) (%) (dBc) RF performance in a common source 860 MHz narrowband test circuit 2-tone, class-AB DVB-T (8k OFDM) f1 = 860; f2 = 860.1 858 250 120 - 21 21 46 33 RF performance in a common source 470 MHz to 860 MHz broadband test circuit DVB-T (8k OFDM) 858 120 - 20 32 - 32 [1] 8.0 [2] [1] Measured [dBc] with delta marker at 4.3 MHz from center frequency. [2] PAR (of output signal) at 0.01 % probability on CCDF; PAR of input signal = 9.5 dB at 0.01 % probability on CCDF. 1.2 Features and benefits Excellent ruggedness Optimum thermal behavior and reliability, Rth(j-c) = 0.15 K/W High power gain High efficiency Designed for broadband operation (470 MHz to 860 MHz) Internal input matching for high gain and optimum broadband operation Excellent reliability Easy power control Compliant to Restriction of Hazardous Substances (RoHS) Directive 2002/95/EC 1.3 Applications Communication transmitter applications in the UHF band Industrial applications in the UHF band BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol BLF888B (SOT539A) 1 drain1 2 drain2 3 gate1 4 gate2 5 1 2 1 5 3 3 4 5 4 [1] source 2 sym117 BLF888BS (SOT539B) 1 drain1 2 drain2 3 gate1 4 gate2 5 source 1 2 1 5 3 3 4 5 4 [1] 2 sym117 [1] Connected to flange. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BLF888B - flanged balanced LDMOST ceramic package; 2 mounting holes; 4 leads SOT539A BLF888BS - earless flanged balanced LDMOST ceramic package; 4 leads SOT539B 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). BLF888B_BLF888BS Product data sheet Symbol Parameter Conditions Min Max Unit VDS drain-source voltage - 104 V VGS gate-source voltage 0.5 +11 V Tstg storage temperature 65 +150 C Tj junction temperature - 200 C All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 2 of 17 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Rth(j-c) [1] Conditions Typ thermal resistance from junction to case Tcase = 80 C; PL(AV) = 125 W [1] Unit 0.15 K/W Rth(j-c) is measured under RF conditions. 6. Characteristics Table 6. DC characteristics Tj = 25 C; per section unless otherwise specified. Symbol Parameter Conditions V(BR)DSS drain-source breakdown voltage Min Typ Max Unit VGS = 0 V; ID = 2.4 mA [1] 104 - - V [1] 1.4 1.9 2.4 V VGS(th) gate-source threshold voltage VDS = 10 V; ID = 240 mA IDSS drain leakage current VGS = 0 V; VDS = 50 V - - 2.8 A IDSX drain cut-off current VGS = VGS(th) + 3.75 V; VDS = 10 V - 38 - A IGSS gate leakage current VGS = 10 V; VDS = 0 V - - 280 nA - 120 - m - 210 - pF RDS(on) drain-source on-state resistance VGS = VGS(th) + 3.75 V; ID = 8.5 A [1] Ciss input capacitance VGS = 0 V; VDS = 50 V; f = 1 MHz [2] Coss output capacitance VGS = 0 V; VDS = 50 V; f = 1 MHz - 67 - pF Crss reverse transfer capacitance VGS = 0 V; VDS = 50 V; f = 1 MHz - 1.35 - pF [1] ID is the drain current. [2] Capacitance values without internal matching. Table 7. RF characteristics RF characteristics in NXP production narrowband test circuit; Tcase = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 2-Tone, class-AB VDS BLF888B_BLF888BS Product data sheet drain-source voltage [1] - 50 - V - 1.3 IDq quiescent drain current - A PL(AV) average output power f1 = 860 MHz; f2 = 860.1 MHz 250 - - W Gp power gain f1 = 860 MHz; f2 = 860.1 MHz 20 21 - dB D drain efficiency f1 = 860 MHz; f2 = 860.1 MHz 42 46 - % IMD3 third-order intermodulation distortion f1 = 860 MHz; f2 = 860.1 MHz - 34 30 dBc All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 3 of 17 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor Table 7. RF characteristics …continued RF characteristics in NXP production narrowband test circuit; Tcase = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit DVB-T (8k OFDM), class-AB VDS drain-source voltage IDq quiescent drain current PL(AV) average output power f = 858 MHz Gp power gain f = 858 MHz D drain efficiency f = 858 MHz IMDshldr intermodulation distortion shoulder f = 858 MHz [2] f = 858 MHz [3] PAR [1] peak-to-average ratio - 50 - V - 1.3 - A 120 - - W 20 21 - dB 30 33 - % - 31 27 dBc - 8.2 - dB [1] Idq for total device [2] Measured [dBc] with delta marker at 4.3 MHz from center frequency. [3] PAR (of output signal) at 0.01 % probability on CCDF; PAR of input signal = 9.5 dB at 0.01 % probability on CCDF. 001aao006 400 Coss (pF) 300 200 100 0 0 20 40 60 VDS (V) VGS = 0 V; f = 1 MHz. Fig 1. BLF888B_BLF888BS Product data sheet Output capacitance as a function of drain-source voltage; typical values per section All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 4 of 17 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor 7. Application information 7.1 Narrowband RF figures 7.1.1 2-Tone 001aao018 24 Gp (dB) 22 Gp 20 60 ηD (%) 001aao019 24 50 Gp (dB) 22 40 20 30 18 0 IMD3 (dBc) -10 Gp -20 ηD 18 -30 IMD3 16 20 16 -40 14 10 14 -50 12 0 100 200 300 0 400 500 PL(AV) (W) 12 0 VDS = 50 V; IDq = 1.3 A; measured in a common source narrowband 860 MHz test circuit. Fig 2. 2-Tone power gain and drain efficiency as function of load power; typical values BLF888B_BLF888BS Product data sheet 100 200 300 -60 400 500 PL(AV) (W) VDS = 50 V; IDq = 1.3 A; measured in a common source narrowband 860 MHz test circuit. Fig 3. 2-Tone power gain and third order intermodulation distortion as load power; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 5 of 17 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor 7.1.2 DVB-T 001aao020 24 Gp (dB) 22 Gp 20 0 IMDshldr (dBc) -10 001aao021 12 PAR (dB) 10 60 ηD (%) 50 PAR 40 -20 8 -30 6 16 -40 4 20 14 -50 2 10 -60 300 400 PL(AV) (W) 0 18 IMDshldr 12 0 100 200 0 VDS = 50 V; IDq = 1.3 A; measured in a common source narrowband 860 MHz test circuit. Fig 4. DVB-T power gain and intermodulation distortion shoulder as function of load power; typical values ηD 30 100 0 300 400 PL(AV) (W) 200 VDS = 50 V; IDq = 1.3 A; measured in a common source narrowband 860 MHz test circuit. Fig 5. DVB-T peak-to-average ratio and drain efficiency as function of load power; typical values 7.2 Broadband RF figures 7.2.1 DVB-T 001aao022 24 Gp (dB) -10 IMDshldr (dBc) Gp 20 001aao023 9.5 PAR (dB) 50 ηD (%) -20 8.5 40 -30 7.5 30 -40 6.5 20 PAR ηD 16 IMDshldr 12 8 400 500 600 700 -50 800 900 f (MHz) 5.5 400 DVB-T power gain and intermodulation distortion shoulder as function of frequency; typical values BLF888B_BLF888BS Product data sheet 600 700 10 800 900 f (MHz) PL(AV =120 W; VDS = 50 V; IDq = 1.3 A; measured in a common source broadband test circuit as described in Section 8. PL(AV =120 W; VDS = 50 V; IDq = 1.3 A; measured in a common source broadband test circuit as described in Section 8. Fig 6. 500 Fig 7. DVB-T peak-to-average ratio and drain efficiency as function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 6 of 17 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor 7.3 Impedance information drain 1 gate 1 Zi ZL gate 2 drain 2 001aan207 Fig 8. Definition of transistor impedance Table 8. Typical push-pull impedance Simulated Zi and ZL device impedance; impedance info at VDS = 50 V and PL(AV) = 120 W (DVB-T). f BLF888B_BLF888BS Product data sheet Zi ZL MHz 300 0.617 j1.715 4.792 + j0.947 325 0.635 j1.355 4.707 + j0.994 350 0.655 j1.026 4.619 + j1.035 375 0.677 j0.721 4.528 + j1.069 400 0.702 j0.435 4.435 + j1.097 425 0.731 j0.164 4.340 + j1.118 450 0.762 + j0.096 4.243 + j1.134 475 0.798 + j0.347 4.147 + j1.143 500 0.839 + j0.592 4.049 + j1.146 525 0.884 + j0.833 3.952 + j1.144 550 0.936 + j1.072 3.855 + j1.136 575 0.995 + j1.310 3.759 + j1.123 600 1.063 + j1.549 3.663 + j1.105 625 1.141 + j1.791 3.569 + j1.083 650 1.230 + j2.037 3.477 + j1.055 675 1.334 + j2.289 3.385 + j1.024 700 1.456 + j2.548 3.296 + j0.989 725 1.599 + j2.814 3.209 + j0.949 750 1.768 + j3.090 3.123 + j0.907 775 1.971 + j3.376 3.039 + j0.861 800 2.214 + j3.671 2.958 + j0.812 825 2.510 + j3.975 2.879 + j0.761 850 2.873 + j4.282 2.801 + j0.706 875 3.320 + j4.584 2.726 + j0.650 900 3.875 + j4.865 2.654 + j0.591 925 4.562 + j5.095 2.583 + j0.530 950 5.409 + j5.223 2.514 + j0.467 975 6.426 + j5.166 2.448 + j0.403 1000 7.587 + j4.807 2.384 + j0.337 All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 7 of 17 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor 7.4 Reliability 001aao024 107 Years 106 (1) (2) (3) (4) (5) (6) 105 104 103 (7) (8) (9) (10) (11) 102 10 1 0 2 4 6 8 10 12 14 16 18 20 IDS(DC) (A) TTF (0.1 % failure fraction). The reliability at pulsed conditions can be calculated as follows: TTF (0.1 %) 1 / . (1) Tj = 100 C (2) Tj = 110 C (3) Tj = 120 C (4) Tj = 130 C (5) Tj = 140 C (6) Tj = 150 C (7) Tj = 160 C (8) Tj = 170 C (9) Tj = 180 C (10) Tj = 190 C (11) Tj = 200 C Fig 9. BLF888B_BLF888BS Product data sheet BLF888B; BLF888BS electromigration (IDS(DC), total device) All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 8 of 17 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor 8. Test information Table 9. List of components For test circuit, see Figure 10, Figure 11 and Figure 12. Component Description Value B1, B2 semi rigid coax 25 ; 49.5 mm Remarks UT-090C-25 (EZ 90-25) C1 multilayer ceramic chip capacitor 12 pF [1] C2, C3, C4, C5, C6 multilayer ceramic chip capacitor 8.2 pF [1] C7 multilayer ceramic chip capacitor 6.8 pF [2] C8 multilayer ceramic chip capacitor 2.7 pF [2] C9 multilayer ceramic chip capacitor 2.2 pF [2] C10, C13, C14 multilayer ceramic chip capacitor 100 pF [3] C11, C12 multilayer ceramic chip capacitor 10 pF [2] C15, C16 multilayer ceramic chip capacitor 4.7 F, 50 V C17, C18, C23, C24 multilayer ceramic chip capacitor 100 pF C19, C20 multilayer ceramic chip capacitor 10 F, 50 V C21, C22 electrolytic capacitor 470 F; 63 V C30 multilayer ceramic chip capacitor 10 pF [4] C31 multilayer ceramic chip capacitor 9.1 pF [4] C32 multilayer ceramic chip capacitor 3.9 pF [4] C33, C34, C35 multilayer ceramic chip capacitor 100 pF [4] C36, C37 multilayer ceramic chip capacitor 4.7 F, 50 V L1 microstrip - [5] (W L) 15 mm 13 mm - [5] (W L) 5 mm 26 mm - [5] (W L) 2 mm 49.5 mm (W L) 1.7 mm 3.5 mm L2 microstrip L3, L32 microstrip Kemet C1210X475K5RAC-TU or capacitor of same quality. [2] TDK C570X7R1H106KT000N or capacitor of same quality. TDK C4532X7R1E475MT020U or capacitor of same quality. L4 microstrip - [5] L5 microstrip - [5] (W L) 2 mm 9.5 mm - [5] (W L) 5 mm 13 mm - [5] (W L) 2 mm 11 mm [5] (W L) 2 mm 3 mm L30 microstrip L31 microstrip L33 microstrip - R1, R2 wire resistor 10 R3, R4 SMD resistor 5.6 R5, R6 wire resistor 100 R7, R8 potentiometer 10 k 0805 [1] American technical ceramics type 800R or capacitor of same quality. [2] American technical ceramics type 800B or capacitor of same quality. [3] American technical ceramics type 180R or capacitor of same quality. [4] American technical ceramics type 100A or capacitor of same quality. [5] Printed-Circuit Board (PCB): Taconic RF35; r = 3.5 F/m; height = 0.762 mm; Cu (top/bottom metallization); thickness copper plating = 35 m. BLF888B_BLF888BS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 9 of 17 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors BLF888B_BLF888BS Product data sheet +VG1(test) R7 C19 Rev. 2 — 12 July 2013 C21 C11 C34 L32 L30 C5 C3 C8 L4 B2 C10 50 Ω B1 C31 R4 C15 L2 C1 C32 L33 C13 L3 L1 L31 C30 C2 C4 C35 C6 C7 C9 C12 C37 C14 C16 C22 R6 C23 C18 R2 C24 +VD2(test) 001aao025 C20 R8 10 of 17 © NXP B.V. 2013. All rights reserved. See Table 9 for a list of components. Fig 10. Class-AB common source broadband amplifier; VD1(test), VD2(test), VG1(test) and VG2(test) are drain and gate test voltages UHF power LDMOS transistor +VG2(test) BLF888B; BLF888BS All information provided in this document is subject to legal disclaimers. +VD1(test) L5 R3 50 Ω C33 R1 C17 R5 C36 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor L3 L32 L5 L30 L1 50 mm L2 L31 L33 L4 L31 L2 L1 L30 L5 L32 L3 105 mm 001aao026 See Table 9 for a list of components. Fig 11. Printed-Circuit Board (PCB) for class-AB common source amplifier 49.6 mm 44 mm +VG1(test) +VD1(test) R1 C17 R5 C23 R7 C36 + C19 C21 C11 R3 C34 C33 50 Ω C10 C1 C30 C32 C3 C7 C5 C9 C15 C13 50 Ω C31 C35 C2 C4 C6 C14 C8 C12 4 mm C16 R4 C22 C37 R6 C20 R2 R8 - C24 C18 + +VG2(test) +VD2(test) 6.3 mm 24.3 mm 27 mm 36.8 mm 001aao027 See Table 9 for a list of components. Fig 12. Component layout for class-AB common source amplifier BLF888B_BLF888BS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 11 of 17 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor 9. Package outline Flanged balanced ceramic package; 2 mounting holes; 4 leads SOT539A D A F D1 U1 B q C w2 M C M H1 1 c 2 E1 p H U2 5 L 3 A E w1 M A M B M 4 w3 M b Q e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A mm 4.7 4.2 inches b c D D1 e E E1 11.81 0.18 31.55 31.52 9.50 13.72 11.56 0.10 30.94 30.96 9.30 9.53 9.27 F H H1 L 1.75 17.12 25.53 3.48 1.50 16.10 25.27 2.97 p Q q 3.30 3.05 2.26 2.01 35.56 U1 U2 w1 41.28 10.29 0.25 41.02 10.03 w2 w3 0.51 0.25 0.374 0.375 0.069 0.674 1.005 0.137 0.130 0.089 0.185 0.465 0.007 1.242 1.241 1.625 0.405 1.400 0.010 0.020 0.010 0.540 0.366 0.365 0.059 0.634 0.995 0.117 0.120 0.079 0.165 0.455 0.004 1.218 1.219 1.615 0.395 Note 1. millimeter dimensions are derived from the original inch dimensions. 2. recommended screw pitch dimension of 1.52 inch (38.6 mm) based on M3 screw. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 10-02-02 12-05-02 SOT539A Fig 13. Package outline SOT539A BLF888B_BLF888BS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 12 of 17 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor Earless flanged balanced ceramic package; 4 leads SOT539B D A F 5 D1 D U1 H1 w2 1 c D 2 E1 U2 H E L 3 4 w3 b Q e 0 5 10 mm scale Dimensions Unit(1) w2 w3 0.25 0.25 max 0.185 0.465 0.007 1.242 1.241 0.374 0.375 0.069 0.674 1.005 0.137 0.089 1.275 0.405 0.54 inches nom 0.01 min 0.165 0.455 0.004 1.218 1.219 0.366 0.365 0.059 0.634 0.995 0.117 0.079 1.265 0.395 0.01 mm max nom min A b E E1 4.7 11.81 0.18 31.55 31.52 c D D1 9.5 9.53 e 4.2 11.56 0.10 30.94 30.96 9.3 9.27 F H H1 L Q U1 U2 1.75 17.12 25.53 3.48 2.26 32.39 10.29 1.50 16.10 25.27 2.97 2.01 32.13 10.03 13.72 Note 1. millimeter dimensions are derived from the original inch dimensions. Outline version References IEC JEDEC JEITA sot539b_po European projection Issue date 12-05-02 13-05-24 SOT539B Fig 14. Package outline SOT539B BLF888B_BLF888BS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 13 of 17 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor 10. Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 11. Abbreviations Table 10. Abbreviations Acronym Description CCDF Complementary Cumulative Distribution Function DVB Digital Video Broadcast DVB-T Digital Video Broadcast - Terrestrial LDMOS Laterally Diffused Metal-Oxide Semiconductor LDMOST Laterally Diffused Metal-Oxide Semiconductor Transistor OFDM Orthogonal Frequency Division Multiplexing PAR Peak-to-Average power Ratio RF Radio Frequency SMD Surface Mounted Device TTF Time-To-Failure UHF Ultra High Frequency VSWR Voltage Standing-Wave Ratio 12. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes BLF888B_BLF888BS v.2 20130712 Product data sheet - Modifications: BLF888B_BLF888BS v.1 BLF888B_BLF888BS Product data sheet • • BLF888B_BLF888BS v.1 The package outline Figure 14 is updated. Translation disclaimer added to the legal text. 20111017 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 - © NXP B.V. 2013. All rights reserved. 14 of 17 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BLF888B_BLF888BS Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 15 of 17 BLF888B; BLF888BS NXP Semiconductors UHF power LDMOS transistor Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 13.4 Licenses ICs with DVB-T or DVB-T2 functionality Use of this product in any manner that complies with the DVB-T or the DVB-T2 standard may require licenses under applicable patents of the DVB-T respectively the DVB-T2 patent portfolio, which license is available from Sisvel S.p.A., Via Sestriere 100, 10060 None (TO), Italy, and under applicable patents of other parties. 13.5 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BLF888B_BLF888BS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 July 2013 © NXP B.V. 2013. All rights reserved. 16 of 17 NXP Semiconductors BLF888B; BLF888BS UHF power LDMOS transistor 15. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 7.1.1 7.1.2 7.2 7.2.1 7.3 7.4 8 9 10 11 12 13 13.1 13.2 13.3 13.4 13.5 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 5 Narrowband RF figures . . . . . . . . . . . . . . . . . . 5 2-Tone. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DVB-T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Broadband RF figures . . . . . . . . . . . . . . . . . . . 6 DVB-T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Impedance information . . . . . . . . . . . . . . . . . . . 7 Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Handling information. . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 12 July 2013 Document identifier: BLF888B_BLF888BS