DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D189 BY614 Miniature high-voltage soft-recovery rectifier Product specification Supersedes data of May 1996 1996 Sep 26 Philips Semiconductors Product specification Miniature high-voltage soft-recovery rectifier BY614 FEATURES DESCRIPTION • Glass passivated Miniature glass package, using a high temperature alloyed construction. • High maximum operating temperature • Low leakage current This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. The package is designed to be used in an insulating medium such as resin, oil or SF6 gas. • Excellent stability • Soft-recovery switching characteristics k handbook, halfpage a • Very compact construction. MAM162 APPLICATIONS The cathode lead is marked with a black band. • Miniature high-voltage assemblies such as voltage multipliers. Fig.1 Simplified outline (SOD61H2) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VRSM non-repetitive peak reverse voltage − 2200 V VRRM repetitive peak reverse voltage − 2200 V VRW working reverse voltage − 2000 V VR continuous reverse voltage − 2000 V IF(AV) average forward current − 50 mA IFRM repetitive peak forward current − 500 mA IFSM non-repetitive peak forward current − 1 Tstg storage temperature −65 +150 °C Tj junction temperature −65 +150 °C 1996 Sep 26 averaged over any 20 ms period; PCB mounting (see Fig.5); Tamb = 65 °C; see Fig.2; see also Fig.3 t ≤ 10 ms; half sinewave; Tj = Tj max prior to surge; VR = VRWmax 2 A Philips Semiconductors Product specification Miniature high-voltage soft-recovery rectifier BY614 ELECTRICAL CHARACTERISTICS Tj = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. − − MAX. UNIT VF forward voltage IR reverse current VR = VRWmax; Tj = 120 °C − − 3 µA Qr recovery charge when switched from IF = 100 mA to VR ≥ 100 V and dIF/dt = −200 mA/µs; see Fig.6 − − 1 nC tf fall time when switched from IF = 100 mA to VR ≥ 100 V and dIF/dt = −200 mA/µs; see Fig.6 100 − − ns trr reverse recovery time when switched from IF = 100 mA to VR ≥ 100 V and dIF/dt = −200 mA/µs; see Fig.6 − − 300 ns Cd diode capacitance VR = 0 V; f = 1 MHz − 2 − pF IF = 50 mA; Tj = Tj max; see Fig.4 6 V THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point lead length = 10 mm 100 K/W Rth j-a thermal resistance from junction to ambient note 1 155 K/W Note 1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.5. For more information please refer to the “General Part of associated Handbook”. 1996 Sep 26 3 Philips Semiconductors Product specification Miniature high-voltage soft-recovery rectifier BY614 GRAPHICAL DATA MBH389 80 MBH390 1000 handbook, halfpage handbook, halfpage IF(AV) (mA) a = 3 2.5 2 1.57 1.42 P (mW) 60 40 500 20 0 0 0 40 80 160 120 Tamb (°C) 0 50 a = 1.57; δ = 0.5; VR = VRWmax; device mounted as shown in Fig.5. a = IF(RMS)/IF(AV); δ = 0.5; VR = VRWmax. Fig.2 Fig.3 Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage). IF(AV) (mA) 100 Maximum steady state power dissipation (forward plus leakage losses) as a function of average forward current. MBH402 200 handbook, halfpage 50 handbook, halfpage 25 IF (mA) 7 50 100 2 3 0 0 10 VF (V) 20 MGA200 Dotted line: Tj = 150 °C. Solid line: Tj = 25 °C. Dimensions in mm. Fig.4 Forward current as a function of maximum forward voltage. 1996 Sep 26 Fig.5 Device mounted on a printed-circuit board. 4 Philips Semiconductors Product specification Miniature high-voltage soft-recovery rectifier BY614 handbook, halfpage I F dI F dt t rr 10% t Qr 90% IR tf MGD569 Fig.6 Reverse recovery definitions. 1996 Sep 26 5 Philips Semiconductors Product specification Miniature high-voltage soft-recovery rectifier BY614 PACKAGE OUTLINE k a 0.6 handbook, full pagewidth 3 max 2.2 max 32.5 min 3 max 32.5 min MGD602 Dimensions in mm. The marking band indicates the cathode. Fig.7 SOD61H2. DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Sep 26 6