BAT54 Series Small signal Schottky diodes Main product characteristics IF 300 mA VRRM 40 V C (typ) 7 pF Tj (max) 150° C BAT54ZFILM (Single) SOD-123 BAT54JFILM (Single) SOD-323 Features and benefits ■ Low conduction and reverse losses ■ Negligible switching losses ■ Low forward and reverse recovery times ■ Extremely fast switching ■ Surface mount device ■ Low capacitance diode BAT54KFILM (Single) SOD-523 BAT54FILM (Single) SOT-23 BAT54AFILM (Common anode) BAT54SFILM (Series) Description The BAT54 series uses 40 V Schottky barrier diodes packaged in SOD- 23, SOD-323, SOD-523, SOT-23, SOT-323, or SOT-666. BAT54CFILM (Common cathode) Order codes BAT54WFILM (Single) Part Number Marking BAT54FILM D86 BAT54SFILM D88 BAT54CFILM D87 BAT54AFILM D84 BAT54WFILM D73 BAT54SWFILM D78 BAT54CWFILM D77 BAT54AWFILM D74 BAT54JFILM 86 BAT54KFILM 86 BAT54-07P6FILM P4 BAT54-09P6FILM Q4 BAT54ZFILM D72 July 2006 SOT-323 BAT54CWFILM (Common cathode) BAT54AWFILM (Common anode) BAT54SWFILM (Series) BAT54-07P6FILM (2 parallel diodes) SOT-666 BAT54-09P6FILM (2 opposite diodes) Configurations in top view Rev 9 1/13 www.st.com Characteristics BAT54 Series 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Symbol VRRM IF Parameter Value Unit Repetitive peak reverse voltage 40 V Continuous forward current 300 mA 1 A IFSM Surge non repetitive forward current Tstg Storage temperature range -65 to +150 °C Tj Operating junction temperature range -40 to +150 °C TL Maximum soldering temperature 260 °C Value Unit Table 2. Thermal parameters Symbol Rth(j-a) tp = 10 ms Sinusoidal Parameter SOT-23, SOD-123 500 SOT-323, SOD-323, 550 SOD-523, SOT-666 600 °C/W Junction to ambient(1) 1. Epoxy printed circuit board with recommended pad layout Table 3. Symbol IR(1) VF(2) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 100° C Forward voltage drop Tj = 25° C Min. Typ Max. Unit 1 VR = 30 V µA 100 IF = 0.1 mA 240 IF = 1 mA 320 IF = 10 mA 400 IF = 30 mA 500 IF = 100 mA 900 mV 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % Table 4. Dynamic characteristics Symbol Parameter Test conditions C Diode capacitance VR = 1 V, F = 1 MHz trr Reverse recovery time IF = 10 mA, IR = 10 mA, Tj = 25° C Irr = 1 mA, RL = 100 Ω 2/13 Min. Typ Max. Unit 7 10 pF 5 ns BAT54 Series Figure 1. 0.35 Characteristics Average forward power dissipation Figure 2. versus average forward current P(W) 0.35 δ=0.05 δ=0.2 0.30 0.30 0.25 0.25 0.20 0.20 0.15 0.15 T 0.10 0.05 δ=tp/T IF(AV)(A) T 0.10 0.05 δ=tp/T tp tp T amb (°C) 0.00 0.00 0.00 0.05 Figure 3. 1.E+02 IF(AV)(A) δ=1 δ=0.5 δ=0.1 Average forward current versus ambient temperature (δ = 1) 0.10 0.15 0.20 0.25 0.30 0.35 Reverse leakage current versus reverse applied voltage (typical values) 0 25 Figure 4. 50 75 100 125 150 Reverse leakage current versus junction temperature IR[T j] / IR[T j=25°C] IR(µA) 1.E+04 VR=3V Tj=100°C 1.E+03 1.E+01 1.E+02 Tj=50°C 1.E+00 1.E+01 Tj=25°C 1.E-01 1.E+00 T j(°C) VR(V) 1.E-02 0 Figure 5. 10 1.E-01 5 10 15 20 25 30 Junction capacitance versus reverse applied voltage (typical values) C(pF) 0 Figure 6. 1.E+00 25 50 75 100 125 150 Forward voltage drop versus forward current (typical values) IFM(A) Tj=100°C F=1MHz VOSC=30mVRMS Tj=25°C 1.E-01 1.E-02 Tj=50°C Tj=25°C 1.E-03 VR(V) VFM(V) 1 1 10 Tj=-40 °C 100 1.E-04 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 3/13 Characteristics Figure 7. 600 BAT54 Series Thermal resistance junction to ambient versus copper surface under each lead - epoxy FR4 with recommended pad layout, eCU = 35 µm (SOD-323) Rth(j-a) (°C/W) Figure 8. 1.E+00 Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, eCU = 35 µm (SOD-323) Zth(j-a) /Rth(j-a) Single pulse SOD323 Epoxy FR4 eCU=35 µm 500 1.E-01 400 1.E-02 300 SCU(mm²) tP(s) 200 0 5 Figure 9. 1.E+00 10 15 20 25 Epoxy FR4 SCU=2.25 mm² eCU=35 µm 30 35 40 45 50 Relative variation of thermal impedance junction to ambient versus pulse duration aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23) Zth(j-a) /Rth(j-a) 1.E-03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, eCU = 35 µm (SOD-523) 1.E+00 Single pulse SOT23 Zth(j-a) /Rth(j-a) Single pulse SOD523 1.E-01 1.E-01 1.E-02 Alumine substrate 10 x 8 x 0.5 mm tP(s) 1.E-02 1.E-03 1.E-02 1.E-01 tP(s) 1.E+00 1.E+01 1.E+02 Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, eCU = 35 µm (SOT-666) 1.E+00 Zth(j-a) /Rth(j-a) Single pulse SOT666 1.E-01 tP(s) 1.E-02 1.E-03 4/13 1.E-02 1.E-01 Epoxy FR4 eCU=35 µm 1.E+00 1.E+01 1.E-03 1.E-03 1.E-02 1.E-01 Epoxy FR4 eCU=35 µm 1.E+00 1.E+01 BAT54 Series 2 Ordering information scheme Ordering information scheme BAT54 xx xx FILM Signal Schottky diodes VRRM = 40 V Configuration No letter = Single diode A = Common anode C = Common cathode S = Series diodes 07 = Parallel diodes 09 = Opposite diodes Package Blank = SOT-23 J = SOD-323 W = SOT-323 K = SOD-523 P6 = SOT-666 Z = SOD-123 Packing FILM = Tape and reel 5/13 Package information 3 BAT54 Series Package information Epoxy meets UL94, V0 Table 5. SOD-123 dimensions Dimensions Ref. H Millimeters Inches A2 A1 b Min. A E D A c Max. Min. 1.45 Max. 0.057 A1 0 0.1 0 0.004 A2 0.85 1.35 0.033 0.053 b 0.55 Typ. 0.022 Typ. c 0.15 Typ. 0.039 Typ. D 2.55 2.85 0.1 0.112 E 1.4 1.7 0.055 0.067 G 0.25 H 3.55 G 0.01 3.95 Figure 12. SOD-123 footprint (dimensions in mm) 4.45 0.65 0.97 6/13 2.51 0.97 0.14 0.156 BAT54 Series Package information Table 6. SOD-323 dimensions Dimensions Ref. H Millimeters Inches A1 Min. b A E A D c Q1 L Max. Min. 1.17 Max. 0.046 A1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 D 1.52 1.8 0.06 0.071 E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106 L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 Figure 13. SOD-323 footprint (dimensions in mm) 3.20 0.54 1.06 1.08 1.06 7/13 Package information Table 7. BAT54 Series SOD-523 dimensions Dimensions E Ref. 0.15 M C A B E1 B D 2xb 0.20 M C A B A Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.50 0.60 0.70 0.020 0.024 0.028 E 1.50 1.60 1.70 0.059 0.063 0.067 E1 1.10 1.20 1.30 0.043 0.047 0.051 D 0.70 0.80 0.90 0.028 0.031 0.035 b 0.25 0.35 0.010 0.014 c 0.07 0.20 0.003 0.008 L 0.15 0.25 0.006 L1 0.10 0.20 0.004 8° R0.1 A c SEATING PLANE C 7° L L1 Figure 14. SOD-523 footprint (dimensions in mm) 0.7 0.3 2 8/13 0.20 0.008 0.010 0.008 BAT54 Series Table 8. Package information SOT-23 dimensions Dimensions Ref. Millimeters A Inches Min. Max. Min. Max. A 0.89 1.4 0.035 0.055 A1 0 0.1 0 0.004 B 0.3 0.51 0.012 0.02 c 0.085 0.18 0.003 0.007 D 2.75 3.04 0.108 0.12 e 0.85 1.05 0.033 0.041 e1 1.7 2.1 0.067 0.083 E 1.2 1.6 0.047 0.063 H 2.1 2.75 0.083 0.108 E e B D e1 S A1 L c H L 0.6 typ. S 0.35 0.65 0.024 typ. 0.014 0.026 Figure 15. SOT-23 footprint (dimensions in mm) 0.95 0.61 1.26 0.73 3.25 9/13 Package information BAT54 Series Table 9. SOT-323 dimensions Dimensions Ref. A E Millimeters Min. e Typ. Inches Max. Min. Typ. Max. A 0.8 1.1 0.031 0.043 A1 0.0 0.1 0.0 0.004 b 0.25 0.4 0.010 0.016 c 0.1 0.26 0.004 0.010 D 1.8 2.0 2.2 0.071 0.079 0.086 E 1.15 1.25 1.35 0.045 0.049 0.053 D b A1 e c θ L 0.65 0.026 H 1.8 2.1 2.4 0.071 0.083 0.094 L 0.1 0.2 0.3 0.004 0.008 0.012 q 0 30° 0 H Figure 16. SOT-323 footprint (dimensions in mm) 0.95 1.0 0.8 10/13 0.50 2.9 30° BAT54 Series Package information Table 10. SOT-666 dimensions Dimensions b1 Ref. Millimeters Inches L1 Min. L3 Typ. Max. Min. Typ. Max. A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 b D E1 0.27 0.34 0.007 0.011 0.013 A L2 E A3 e 0.50 0.020 L1 0.19 0.007 L2 0.10 0.30 0.004 0.012 e L3 0.10 0.004 Figure 17. SOT-666 footprint (dimensions in mm) 0.50 0.62 2.60 0.99 0.30 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 11/13 Ordering information 4 5 12/13 BAT54 Series Ordering information Part Number Marking Package Weight Base qty Delivery mode BAT54FILM D86 SOT-23 Single 10 mg 3000 Tape and reel BAT54SFILM D88 SOT-23 Serial 10 mg 3000 Tape and reel BAT54CFILM D87 SOT-23 Common cathode 10 mg 3000 Tape and reel BAT54AFILM D84 SOT-23 Common anode 10 mg 3000 Tape and reel BAT54WFILM D73 SOT-323 Single 6 mg 3000 Tape and reel BAT54SWFILM D78 SOT-323 Serial 6 mg 3000 Tape and reel BAT54CWFILM D77 SOT-323 Common cathode 6 mg 3000 Tape and reel BAT54AWFILM D74 SOT-323 Common anode 6 mg 3000 Tape and reel BAT54JFILM 86 SOD-323 5 mg 3000 Tape and reel BAT54KFILM 86 SOD-523 1.4 mg 3000 Tape and reel BAT54-07P6FILM P4 SOT-666 Parallel 2.9 mg 3000 Tape and reel BAT54-09P6FILM Q4 SOT-666 Opposite 2.9 mg 3000 Tape and reel BAT54ZFILM D72 SOD-123 10 mg 3000 Tape and reel Revision history Date Revision Description of Changes Jun-1999 8 Last update. 24-Jul-2006 9 BAT54, A, C, S and BAT54J / W / AW / CW /SW datasheets merged. ECOPACK statement added. SOD123, SOD-523 and SOT-666 packages added. BAT54 Series Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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