TI1 DS3487 Quad tri-state line driver Datasheet

DS3487
www.ti.com
SNLS355C – MAY 1998 – REVISED APRIL 2013
DS3487 Quad TRI-STATE Line Driver
Check for Samples: DS3487
FEATURES
DESCRIPTION
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The DS3487 quad RS-422 driver features four
independent drivers which comply with EIA Standards
for the electrical characteristics of balanced voltage
digital interface circuits. The outputs are TRI-STATE
structures which are forced to a high impedance state
when the appropriate output control pin reaches a
logic zero condition. All input pins are PNP buffered
to minimize input loading for either logic one or logic
zero inputs.
1
2
Four Independent Drivers
TRI-STATE Outputs
Fast Propagation Times (typ 10 ns)
TTL Compatible
5V Supply
Output Rise and Fall Times Less than 15 ns
Pin Compatible with DS8924 and MC3487
Block and Connection Diagrams
Figure 1. Block Diagram
Figure 2. PDIP Package- Top View
See Package Number D0016A or NFG0016E
Truth Table (1)
Input
(1)
Control
Non-Inverting
Inverting
Input
Output
Output
H
H
H
L
L
H
L
H
X
L
Z
Z
L = Low logic state
H = High logic state
X = Irrelevant
Z = TRI-STATE (high impedance)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS3487
SNLS355C – MAY 1998 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
Supply Voltage
8V
Input Voltage
5.5V
−65°C to +150°C
Storage Temperature
Maximum Power Dissipation
(3)
at 25°C
PDIP Package
1476 mW
SOIC Package
1051 mW
Lead Temperature
(Soldering, 4 seconds)
(1)
260°C
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be verified. They are not meant to imply
that the devices should be operated at these limits. The table of “Electrical Characteristics” provides conditions for actual device
operation.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
Derate PDIP molded package 11.9 mW/°C above 25°C. Derate SOIC package 8.41 mW/°C above 25°C.
(2)
(3)
Operating Conditions
Min
Max
Units
4.75
5.25
V
0
+70
°C
Typ
Max
Units
0.8
V
Supply Voltage, VCC
DS3487
Temperature (TA)
DS3487
Electrical Characteristics (1) (2) (3) (4)
Parameter
Test Conditions
Min
VIL
Input Low Voltage
VIH
Input High Voltage
IIL
Input Low Current
V IL = 0.5V
−200
μA
IIH
Input High Current
VIH = 2.7V
50
μA
VIH = 5.5V
100
μA
VCL
Input Clamp Voltage
I CL = −18 mA
−1.5
V
VOL
Output Low Voltage
I OL = 48 mA
0.5
V
VOH
Output High Voltage
I OH = −20 mA
IOS
Output Short-Circuit Current
−140
mA
IOZ
Output Leakage Current
(TRI-STATE)
−100
μA
IOFF
Output Leakage Current Power OFF
2.0
VCC = 0V
Differential Output Voltage
|VT|– VT|
Difference in Differential Output Voltage
ICC
Power Supply Current
2
100
μA
VO = 6V
100
μA
VO = −0.25V
−100
μA
0.4
V
VO = 5.5V
VT
(3)
(4)
V
VO = 0.5V
Difference in Output Offset Voltage
(2)
2.5
−40
|VOS– VOS|
(1)
V
2.0
V
0.4
V
Active
50
80
mA
TRI-STATE
35
60
mA
Unless otherwise specified min/max limits apply across the 0°C to +70°C range for the DS3487. All typicals are given for VCC = 5V and
TA = 25°C.
All currents into device pins are positive, all currents out of device pins as negative. All voltages are referenced to ground unless
otherwise specified.
Only one output at a time should be shorted.
Symbols and definitions correspond to EIA RS-422, where applicable.
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS3487
DS3487
www.ti.com
SNLS355C – MAY 1998 – REVISED APRIL 2013
Switching Characteristics
VCC = 5V, TA = 25°C
Parameter
Test Conditions
Min
Typ
Max
Units
tPHL
Input to Output
10
15
ns
tPLH
Input to Output
10
15
ns
tTHL
Differential Fall Time
10
15
ns
tTLH
Differential Rise Time
10
15
ns
tPHZ
Enable to Output
RL = 200Ω, CL = 50 pF
17
25
ns
tPLZ
Enable to Output
RL = 200Ω, CL = 50 pF
15
25
ns
tPZH
Enable to Output
RL = ∞, CL = 50 pF, S1 Open
11
25
ns
tPZL
Enable to Output
RL = 200Ω, CL = 50 pF, S2 Open
15
25
ns
AC TEST CIRCUITS AND SWITCHING TIME WAVEFORMS
Input pulse: f = MHz, 50%; tr = tf ≤ 15 ns.
Figure 3. Propagation Delays
S1 and S2 closed except as noted.
CL includes probe and jig capacitance.
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS3487
3
DS3487
SNLS355C – MAY 1998 – REVISED APRIL 2013
www.ti.com
Input pulse: f = MHz, 50%; tr = tf ≤ 15 ns.
S1 = open for tPZH
S2 = open for tPZL
Figure 4. TRI-STATE Enable and Disable Delays
Input pulse: f = MHz, 50%; tr = tf ≤ 15 ns.
Figure 5. Differential Rise and Fall Times
4
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS3487
DS3487
www.ti.com
SNLS355C – MAY 1998 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 4
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS3487
5
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS3487M/NOPB
LIFEBUY
SOIC
D
16
48
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
DS3487M
DS3487MX/NOPB
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
DS3487M
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Dec-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DS3487MX/NOPB
Package Package Pins
Type Drawing
SOIC
D
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.5
B0
(mm)
K0
(mm)
P1
(mm)
10.3
2.3
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Dec-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS3487MX/NOPB
SOIC
D
16
2500
367.0
367.0
35.0
Pack Materials-Page 2
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