DS9638 www.ti.com SNLS389D – MAY 1998 – REVISED APRIL 2013 DS9638 RS-422 Dual High Speed Differential Line Driver Check for Samples: DS9638 FEATURES DESCRIPTION • • • • • • • • The DS9638 is a Schottky, TTL compatible, dual differential line driver designed specifically to meet the EIA Standard RS-422 specifications. It is designed to provide unipolar differential drive to twisted pair or parallel wire transmission lines. The inputs are TTL compatible. The outputs are similar to totem pole TTL outputs, with active pull-up and pulldown. The device features a short circuit protected active pull-up with low output impedance and is specified to drive 50Ω transmission lines at high speed. The mini-DIP provides high package density. 1 2 • • • • • Single 5V Supply Schottky Technology TTL and CMOS Compatible Inputs Output Short Circuit Protection Input Clamp Diodes Complementary Outputs Minimum Output Skew (<1.0 ns typical) 50 mA Output Drive Capability for 50Ω Transmission Lines Meets EIA RS-422 Specifications Propagation Delay of Less Than 10 ns “Glitchless” Differential Output Delay Time Stable with VCC and Temperature Variations (<2.0 ns typical) (See Figure 4 ) Extended Temperature Range Connection Diagram Figure 1. 8-Lead PDIP or CDIP or SOIC (Top View) See P or NAB0008A or D Package 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated DS9638 SNLS389D – MAY 1998 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Storage Temperature Range Lead Temperature Ceramic DIP −65°C to +175°C Molded DIP and SO-8 −65°C to +150°C CDIP (Soldering, 60 sec.) 300°C PDIP (Soldering, 10 sec.) Maximum Power Dissipation at 25°C (3) 265°C CDIP Package 1300 mW PDIP Package 930 mW SOIC Package 810 mW −0.5V to 7V VCC Lead Potential to Ground −0.5V to +7V Input Voltage (1) (2) (3) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be verified. They are not meant to imply that the devices should be operated at these limits. The tables of “Electrical Characteristics provide conditions for actual device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Derate CDIP package 8.7 mW/°C above 25°C; derate PDIP package 7.5 mW/°C above 25°C; derate SOIC package 6.5 mW°C above 25°C. Recommended Operating Conditions DS9638M Supply Voltage (VCC) Min Typ 4.5 5.0 Output Current LOW (IOL ) 2 Min Typ Max 5.5 4.75 5.0 5.25 V −50 mA 50 mA 70 °C −50 Output Current HIGH (IOH ) Operating Temperature (T A) DS9638C Max −55 25 50 40 125 0 Submit Documentation Feedback 25 Units Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS9638 DS9638 www.ti.com SNLS389D – MAY 1998 – REVISED APRIL 2013 Electrical Characteristics (1) (2) Over recommended operating temperature and supply voltage ranges, unless otherwise specified Symbol Parameter VIH Input Voltage HIGH VIL Input Voltage LOW Conditions Min Typ Max Units 2.0 V 0°C to +70°C 0.8 −55°C to +125°C 0.5 VIC Input Clamp Voltage V CC = Min, II = −18 mA VOH Output Voltage HIGH VCC = Min, VIH = VIH Min, VIL = VIL Max −1.0 IOH = −10 mA 2.5 IOH = −40 mA 2.0 V −1.2 V 3.5 V VOL Output Voltage LOW V CC = Min, VIH = VIH Min, V IL = VIL Max, IOL = 40 mA 0.5 V II Input Current at Maximum Input Voltage V CC = Max, VI Max = 5.5V 50 μA IIH Input Current HIGH V CC = Max, VIH = 2.7V 25 μA IIL Input Current LOW V CC = Max, VIL = 0.5V −200 μA IOS Output Short Circuit Current V CC = Max, VO = 0V (2) −50 −150 mA VT, V T Terminated Output Voltage See Figure 2 2.0 VT–V T Output Balance 0.4 V VOS, V OS Output Offset Voltage 3.0 V VOS–V OS Output Offset Balance 0.4 V IX Output Leakage Current T A = 25°C −0.25V < VX < 5.5V 100 μA ICC Supply Current (Both Drivers) VCC = 5.5V, All input at 0V, No Load 65 mA V 45 Unless otherwise specified min/max limits apply across the −55°C to +125°C temperature range for the DS9638M and across the 0°C to +70°C range for the DS9638C. All typicals are given for VCC = 5V and TA = 25°C. All currents into the device pins are positive; all currents out of the device pins are negative. All voltages are referenced to ground unless otherwise specified. (1) (2) Switching Characteristics VCC = 5.0V, TA = 25°C. Symbol tPHL Parameter Propagation Delay tPLH Conditions CL = 15 pF RL = 100Ω, See Figure 3 Min Typ Max Units 10 20 ns 10 20 ns tf Fall Time, 90%–10% 10 20 ns tr Rise Time, 10%–90% 10 20 ns tPO–tPO Skew Between Outputs A/A and B/B 1.0 ns Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS9638 3 DS9638 SNLS389D – MAY 1998 – REVISED APRIL 2013 www.ti.com Figure 2. Equivalent Circuit DC Test Circuit Figure 3. Terminated Output Voltage and Output Balance (1) The pulse generator has the following characteristics: CL includes probe and jig capacitance. PRR = 500 kHz, tW = 100 ns, tr ≤ 5.0 ns, ZO = 50Ω. Figure 4. AC Test Circuit and Voltage Waveform 4 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS9638 DS9638 www.ti.com SNLS389D – MAY 1998 – REVISED APRIL 2013 Typical Characteristics Figure 5. Typical Delay Characteristics (a) Figure 6. Typical Delay Characteristics (b) Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS9638 5 DS9638 SNLS389D – MAY 1998 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision C (April 2013) to Revision D • 6 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 5 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS9638 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS9638CM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 DS963 8CM DS9638CM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS963 8CM DS9638CMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS963 8CM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DS9638CMX/NOPB Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 5.4 2.0 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS9638CMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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