PRELIMINARY CM1451 LCD & Camera EMI Filter Array with ESD Protection Features Product Description • • • The CM1451 is an inductor-capacitor (L-C) based EMI filter array with integrated ESD protection in CSP form factor. The CM1451-06 is configured in a 6 channel format. Each EMI filter channel of the CM1451 is implemented as a 5-pole L-C filter where the component values are 10pF-17nH-10pF-17nF-10pF. The CM1451's roll-off frequency at -10dB attenuation is 400MHz and can be used in applications where the data rates are as high as 120Mbps while providing greater than 35dB over the 800MHz to 2.7GHz frequency range. The parts integrate ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the Level 4 requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • High bandwidth, high RF rejection filter array Six channels of EMI filtering Utilizes Praetorian™ inductor-based design technology for true L-C filter implementation OptiGuard™ coating for improved reliability ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Better than 40dB of attenuation at 1GHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 3.006mm x 1.376mm footprint Chip Scale Package (CM1451-06CS/CP) Lead-free version available Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data phones in cell phones, PDAs or notebook computersWireless handsets / cell phones Wireless Handsets Handheld PCs/PDAs LCD and camera modules This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs) because of its small package format and easy-to-use pin assignments. In particular, the CM1451 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in wireless handsets. The CM1451 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1451 is available in a space saving, low profile Chip Scale Package with optional lead-free finishing. . Electrical Schematic L1 L2 FILTERn* FILTERn* C C C GND (Pins B1-Bn) 1 of 6 EMI Filtering + ESD Channels * See Package/Pinout Diagram for expanded pin information. © 2005 California Micro Devices Corp. All rights reserved. 01/29/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 1 PRELIMINARY CM1451 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 5 6 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 C1 C2 C3 C4 C5 C6 A GND B N516 GND B1 Orientation Marking C GND B2 B3 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 A1 A2 A3 A4 A5 A6 A1 CM1451-06CS/CP 15-Bump CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION PIN(s) NAME DESCRIPTION A1 FILTER1 Filter Channel 1 C1 FILTER1 Filter Channel 1 A2 FILTER2 Filter Channel 2 C2 FILTER2 Filter Channel 2 A3 FILTER3 Filter Channel 3 C3 FILTER3 Filter Channel 3 A4 FILTER4 Filter Channel 4 C4 FILTER4 Filter Channel 4 A5 FILTER5 Filter Channel 5 C5 FILTER5 Filter Channel 5 A6 FILTER6 Filter Channel 6 C6 FILTER6 Filter Channel 6 B1-B3 GND Device Ground Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 15 CSP CM1451-06CS N516 CM1451-06CP N516 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 01/29/05 PRELIMINARY CM1451 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS LTOT Total Channel Inductance (L1 + L2) 34 nH L1, L2 Inductance 17 nH CTOT Total Channel Capacitance (C1+ C2 + C3 ) C1, C2, C3 Capacitance At 2.5V DC, 1MHz, 30mV AC 24 30 36 pF At 2.5V DC, 1MHz, 30mV AC 8 10 12 pF fC Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω 200 MHz fC Roll-off Frequency at -10dB Attenuation ZSOURCE=50Ω, ZLOAD=50Ω 400 MHz VDIODE Diode Standoff Voltage IDIODE=10µA ILEAK Diode Leakage Current (reverse bias) VDIODE=+3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 VCL 5.5 V 100 5.6 -1.5 6.8 -0.8 nA 9.0 -0.4 V V ±30 kV ±15 kV +12 -7 V V Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 01/29/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 3 PRELIMINARY CM1451 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1) Figure 2. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) © 2005 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 01/29/05 PRELIMINARY CM1451 Performance Information (cont’d) AC Characteristics Figure 3. 2ns Rise and Fall Times of Signals Clocked at 75MHz through CM1451 Filter Array (Simulation) Figure 4. 2ns Rise and Fall Times of Signals Clocked at 50MHz through CM1451 Filter Array (Simulation) © 2005 California Micro Devices Corp. All rights reserved. 01/29/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 5 PRELIMINARY CM1451 Performance Information (cont’d) AC Characteristics Figure 5. 2ns Rise and Fall Times of Signals Clocked at 25MHz through CM1451 Filter Array (Simulation) © 2005 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 01/29/05 PRELIMINARY CM1451 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Soldering Maximum Temperature 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 6. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 7. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 8. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 01/29/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 7 PRELIMINARY CM1451 Mechanical Details CM1450-06CS/CP CSP Mechanical Specifications Mechanical Package Diagrams CM1451-06CS/CP devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW C1 C B Bumps 15 A Millimeters Nom Inches Max Min Nom 1 Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.600 0.670 0.739 0.0236 0.0264 0.0291 D2 0.394 0.445 0.495 0.0155 0.0175 0.0195 # per tape and reel A2 Custom CSP C2 Package Min B2 B1 B4 B3 PACKAGE DIMENSIONS Dim OptiGuardTM Coating A1 2 3 4 5 6 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1451CS/CP Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B 0 X A0 X K0 CM1451-06 2.96 X 1.33 X 0.6 3.10 X 1.45 X 0.74 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 9. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 01/29/05