CD54AC161, CD74AC161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS239C – SEPTEMBER 1998 – REVISED MARCH 2003 D D D D D D CD54AC161 . . . F PACKAGE CD74AC161 . . . E OR M PACKAGE (TOP VIEW) Internal Look-Ahead for Fast Counting Carry Output for n-Bit Cascading Synchronous Counting Synchronously Programmable SCR-Latchup-Resistant CMOS Process and Circuit Design Exceeds 2-kV ESD Protection per MIL-STD-883, Method 3015 CLR CLK A B C D ENP GND description/ordering information 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC RCO QA QB QC QD ENT LOAD The ’AC161 devices are 4-bit binary counters. These synchronous, presettable counters feature an internal carry look-ahead for application in high-speed counting These devices are fully programmable; that is, they can be preset to any number between 0 and 9 or 15. Presetting is synchronous; therefore, setting up a low level at the load input disables the counter and causes the outputs to agree with the setup data after the next clock pulse, regardless of the levels of the enable inputs. The clear function is asynchronous. A low level at the clear (CLR) input sets all four of the flip-flop outputs low, regardless of the levels of the CLK, load (LOAD), or enable inputs. The carry look-ahead circuitry provides for cascading counters for n-bit synchronous applications without additional gating. Instrumental in accomplishing this function are ENP, ENT, and a ripple-carry output (RCO). Both ENP and ENT must be high to count, and ENT is fed forward to enable RCO. Enabling RCO produces a high-level pulse while the count is maximum (9 or 15, with QA high). This high-level overflow ripple-carry pulse can be used to enable successive cascaded stages. Transitions at ENP or ENT are allowed, regardless of the level of CLK. The counters feature a fully independent clock circuit. Changes at control inputs (ENP, ENT, or LOAD) that modify the operating mode have no effect on the contents of the counter until clocking occurs. The function of the counter (whether enabled, disabled, loading, or counting) is dictated solely by the conditions meeting the stable setup and hold times. ORDERING INFORMATION PDIP – E –55°C 55°C to 125°C ORDERABLE PART NUMBER PACKAGE† TA SOIC – M Tube CD74AC161E Tube CD74AC161M Tape and reel CD74AC161M96 TOP-SIDE MARKING CD74AC161E AC161M CDIP – F Tube CD54AC161F3A CD54AC161F3A † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CD54AC161, CD74AC161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS239C – SEPTEMBER 1998 – REVISED MARCH 2003 FUNCTION TABLE INPUTS OUTPUTS CLR CLK ENP ENT LOAD A,B,C,D Qn RCO L X X X X X L L H ↑ X X l l L L H ↑ X X l h H Note 1 H ↑ h h h X Count Note 1 H X l X h X Note 1 H X X l h X qn qn L FUNCTION Reset (clear) Parallel load Count Inhibit H = high level, L = low level, X = don’t care, h = high level one setup time prior to the CLK low-to-high transition, l = low level one setup time prior to the CLK low-to-high transition, q = the state of the referenced output prior to the CLK low-to-high transition, and ↑ = CLK low-to-high transition. NOTE 1: The RCO output is high when ENT is high and the counter is at terminal count (HHHH). 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CD54AC161, CD74AC161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS239C – SEPTEMBER 1998 – REVISED MARCH 2003 logic diagram (positive logic) LOAD ENT ENP 9 10 15 LD† 7 RCO CK† CLK CLR A B C D 2 1 CK LD R M1 G2 1, 2T/1C3 G4 3D 4R 3 M1 G2 1, 2T/1C3 G4 3D 4R 4 M1 G2 1, 2T/1C3 G4 3D 4R 5 M1 G2 1, 2T/1C3 G4 3D 4R 6 14 13 12 11 QA QB QC QD † For simplicity, routing of complementary signals LD and CK is not shown on this overall logic diagram. The uses of these signals are shown on the logic diagram of the D/T flip-flops. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CD54AC161, CD74AC161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS239C – SEPTEMBER 1998 – REVISED MARCH 2003 logic symbol, each D/T flip-flop LD (Load) M1 TE (Toggle Enable) G2 1, 2T/1C3 G4 CK (Clock) D (Inverted Data) 3D R (Inverted Reset) 4R Q (Output) logic diagram, each D/T flip-flop (positive logic) CK LD TE LD† TG TG LD† Q TG TG CK† D TG CK† R † The origins of LD and CK are shown in the logic diagram of the overall device. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CK† TG CK† CD54AC161, CD74AC161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS239C – SEPTEMBER 1998 – REVISED MARCH 2003 typical clear, preset, count, and inhibit sequence The following sequence is illustrated below: 1. Clear outputs to zero (asynchronous) 2. Preset to binary 12 3. Count to 13, 14, 15, 0, 1, and 2 4. Inhibit CLR LOAD A Data Inputs B C D CLK ENP ENT QA Data Outputs QB QC QD RCO 12 13 14 15 0 1 Count 2 Inhibit Preset Async Clear POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 CD54AC161, CD74AC161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS239C – SEPTEMBER 1998 – REVISED MARCH 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V Input clamp current, IIK (VI < 0 V or VI > VCC) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 V or VO > VCC) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous output current, IO (VO > 0 V or VO < VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 3): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4) TA = 25°C VCC VIH Supply voltage High-level input voltage –55°C to 125°C –40°C to 85°C UNIT MIN MAX MIN MAX MIN MAX 1.5 5.5 1.5 5.5 1.5 5.5 VCC = 1.5 V VCC = 3 V 1.2 1.2 1.2 2.1 2.1 2.1 VCC = 5.5 V VCC = 1.5 V 3.85 3.85 0.3 0.9 0.9 0.9 VI VO Input voltage 0 Output voltage 0 IOH IOL High-level output current –24 Low-level output current 24 ∆t/∆v Input transition rise or fall rate 1.65 VCC = 1.5 V to 3 V VCC = 3.6 V to 5.5 V 3.85 0.3 Low-level input voltage VCC = 3 V VCC = 5.5 V V 0.3 VIL VCC VCC 1.65 0 V 1.65 VCC VCC V –24 –24 mA 24 24 mA 50 50 50 20 20 20 0 VCC VCC V 0 0 V ns NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CD54AC161, CD74AC161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS239C – SEPTEMBER 1998 – REVISED MARCH 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN IOH = –50 µA VOH VI = VIH or VIL IOH = –4 mA IOH = –24 mA IOH = –50 mA† IOH = –75 mA† IOL = 50 µA VOL II ICC VI = VIH or VIL VI = VCC or GND VI = VCC or GND, –55°C to 125°C TA = 25°C MAX MIN –40°C to 85°C MAX MIN 1.5 V 1.4 1.4 1.4 2.9 3V 2.9 2.9 4.5 V 4.4 4.4 4.4 3V 2.58 2.4 2.48 4.5 V 3.94 3.7 3.8 5.5 V – 3.85 – 5.5 V – – 3.85 UNIT MAX V 1.5 V 0.1 0.1 0.1 3V 0.1 0.1 0.1 4.5 V 0.1 0.1 0.1 V IOL = 12 mA IOL = 24 mA IOL = 50 mA† 3V 0.36 0.5 0.44 4.5 V 0.36 0.5 0.44 5.5 V – 1.65 – IOL = 75 mA† 5.5 V – – 1.65 5.5 V ±0.1 ±1 ±1 µA 8 160 80 µA 10 10 10 IO = 0 5.5 V Ci pF † Test one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage to minimize power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 CD54AC161, CD74AC161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS239C – SEPTEMBER 1998 – REVISED MARCH 2003 timing requirements over recommended operating free-air temperature range (unless otherwise noted) VCC –55°C to 125°C MIN fclock Clock frequency CLK high or low tw Pulse duration CLR low A, B, C, or D tsu ↑ Setup time, time before CLK↑ LOAD A, B, C, or D th Hold time time, after CLK↑ ↑ ENP or ENT trec Recovery time, CLR↑ ↑ before CLK↑ ↑ POST OFFICE BOX 655303 MAX MIN UNIT MAX 1.5 V 7 3.3 V ± 0.3 V 64 73 5 V ± 0.5 V 90 103 8 1.5 V 69 61 3.3 V ± 0.3 V 7.7 6.8 5 V ± 0.5 V 5.5 4.8 1.5 V 63 55 3.3 V ± 0.3 V 7 6.1 5 V ± 0.5 V 5 4.4 1.5 V 63 55 3.3 V ± 0.3 V 7 6.1 5 V ± 0.5 V 5 4.4 1.5 V 75 66 3.3 V ± 0.3 V 8.4 7.4 5 V ± 0.5 V 6 5.3 1.5 V 0 0 3.3 V ± 0.3 V 0 0 5 V ± 0.5 V 0 0 1.5 V 0 0 3.3 V ± 0.3 V 0 0 5 V ± 0.5 V 0 0 1.5 V 75 66 3.3 V ± 0.3 V 8.4 7.4 6 5.3 5 V ± 0.5 V 8 –40°C to 85°C • DALLAS, TEXAS 75265 MHz ns ns ns ns CD54AC161, CD74AC161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS239C – SEPTEMBER 1998 – REVISED MARCH 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax VCC MIN 3.3 V ± 0.3 V 64 73 5 V ± 0.5 V 90 103 ENT RCO CLR 209 – MHz 190 23.4 6 21 16.7 4.3 15.2 – 207 – 188 3.3 V ± 0.3 V 5.9 23.1 5.9 5 V ± 0.5 V 4.2 16.5 4.2 – 129 – 3.3 V ± 0.3 V 3.6 14.4 3.7 13.1 5 V ± 0.5 V 2.6 10.3 2.7 9.4 – 207 – 188 3.3 V ± 0.3 V 5.9 23.1 5.9 21 5 V ± 0.5 V 4.2 16.5 4.2 15 1.5 V RCO 8 6 1.5 V Any Q UNIT MAX 4.3 1.5 V tpd – 3.3 V ± 0.3 V 1.5 V Any Q MIN 7 5 V ± 0.5 V CLK MAX –40°C to 85°C 1.5 V 1.5 V RCO –55°C to 125°C 21 15 117 – 207 – 3.3 V ± 0.3 V 5.9 23.1 5.9 21 5 V ± 0.5 V 4.2 16.5 4.2 15 TEST CONDITIONS TYP ns 188 operating characteristics, TA = 25°C PARAMETER Cpd Power dissipation capacitance No load POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 66 UNIT pF 9 CD54AC161, CD74AC161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS239C – SEPTEMBER 1998 – REVISED MARCH 2003 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 R1 = 500 Ω From Output Under Test Open GND R2 = 500 Ω CL = 50 pF (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND tw VCC NOTE: When VCC = 1.5 V, R1 and R2 = 1 kΩ. 50% VCC Input 50% VCC LOAD CIRCUIT 0V VOLTAGE WAVEFORMS PULSE DURATION VCC CLR Input VCC Reference Input 50% VCC 50% VCC 0V 0V tsu trec VCC Data Input 50% 10% 50% VCC CLK 0V th 90% 90% tr VCC 50% VCC 50% VCC tPLH tPHL 0V In-Phase Output 50% 10% 90% 90% tr tPHL Out-of-Phase Output tf VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES VOLTAGE WAVEFORMS RECOVERY TIME Input VCC 50% VCC 10% 0 V 90% tPLH 50% VCC 10% tf 50% 10% VCC Output Control VOH Output 50% VCC Waveform 1 10% VOL S1 at 2 × V CC tf (see Note B) 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES 50% VCC 50% VCC 0V tPLZ tPZL 50% VCC tPZH Output Waveform 2 S1 at Open (see Note B) 50% VCC ≈VCC VOL + 0.3 V VOL tPHZ VOH VOH – 0.3 V ≈0 V VOLTAGE WAVEFORMS OUTPUT ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns. Phase relationships between waveforms are arbitrary. D. For clock inputs, fmax is measured with the input duty cycle at 50%. E. The outputs are measured one at a time with one input transition per measurement. F. tPLH and tPHL are the same as tpd. G. tPZL and tPZH are the same as ten. H. tPLZ and tPHZ are the same as tdis. I. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type CD54AC161F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD74AC161E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74AC161EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74AC161M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC161M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC161M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC161M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC161ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC161MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74AC161M96 Package Package Pins Type Drawing SOIC D 16 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 6.5 10.3 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74AC161M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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