DS92LV3241, DS92LV3242 www.ti.com SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 DS92LV3241/DS92LV3242 20-85 MHz 32-Bit Channel Link II Serializer / Deserializer Check for Samples: DS92LV3241, DS92LV3242 FEATURES APPLICATIONS • • 1 2 • • • • • • • • • Wide Operating Range Embedded Clock SER/DES – Up to 32-bit Parallel LVCMOS Data – 20 to 85 MHz Parallel Clock – Up to 2.72 Gbps Application Data Paylod Selectable Serial LVDS Bus Width – Dual Lane Mode (20 to 50 MHz) – Quad Lane Mode (40 to 85 MHz) Simplified Clocking Architecture – No Separate Serial Clock Line – No reference Clock Required – Receiver Locks to Random Data On-Chip Signal Conditioning for Robust Serial Connectivity – Transmit Pre-Emphasis – Data Randomization – DC-Balance Encoding – Receive Channel Deskew – Supports up to 10m CAT-5 at 2.7 Gbps Integrated LVDS Terminations Built-in AT-SPEED BIST for End-to-End System Testing AC-Coupled Interconnect for Isolation and Fault Protection > 4KV HBM ESD Protection Space-Saving 64-pin TQFP Package Full Industrial Temperature Range : -40° to +85°C • • • Industrial Imaging (Machine-Vision) and Control Security & Surveillance Cameras and Infrastructure Medical imaging Up to 30 bits per Pixel, VGA to HD Video Transport and Display DESCRIPTION The DS92LV3241 (SER) serializes a 32-bit data bus into 2 or 4 (selectable) embedded clock LVDS serial channels for a data payload rate up to 2.72 Gbps over cables such as CATx, or backplanes FR-4 traces. The companion DS92LV3242 (DES) deserializes the 2 or 4 LVDS serial data channels, de-skews channel-to-channel delay variations and converts the LVDS data stream back into a 32-bit LVCMOS parallel data bus. On-chip data Randomization/Scrambling and DC balance encoding and selectable serializer Preemphasis ensure a robust, low-EMI transmission over longer, lossy cables and backplanes. The Deserializer automatically locks to incoming data without an external reference clock or special sync patterns, providing an easy “plug-and-lock” operation. By embedding the clock in the data payload and including signal conditioning functions, the ChannelLink II SerDes devices reduce trace count, eliminate skew issues, simplify design effort and lower cable/connector cost for a wide variety of video, control and imaging applications. A built-in ATSPEED BIST feature validates link integrity and may be used for system diagnostics. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009–2013, Texas Instruments Incorporated DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 www.ti.com Block Diagram PLL TxCLKIN CDR/PLL RxCLKOUT High-Speed Serial Data 100: differential pairs RxOUT0 LVCMOS RxIN1 RxIN2+ Decoding, Alignment TxOUT1 TxOUT2+ Serial-to-Parallel RxIN0 RxIN1 + TxOUT1+ Cable Deskew TxOUT0 - Parallel-to-Serial LVCMOS TxIN15 TxIN16 RxIN0+ TxOUT0+ DC Balance Encoder TxIN0 RxOUT15 RxOUT16 RxOUT31 TxIN31 TxOUT2 - RxIN2 RxIN3 + TxOUT3+ BIST PDB R_FB BISTEN MODE VSEL PRE BIST TxOUT3 Control LOCK RxIN3 REN R_FB PDB Pre-Emp Control Tx - SERIALIZER Rx - DESERIALIZER Mode Diagrams DS92LV3242 TxOUT0N RxIN0N TxOUT1P RxIN1P R R D RT = 100: RT = 100: R D RT = 100: QUAD RxIN1N RT = 100: TxIN QUAD TxOUT1N 32 RxIN0P RT = 100: TxOUT0P RT = 100: D RT = 100: D RT = 100: DS92LV3241 R (LVCMOS Input) MODE = L (Dual Mode) 32 RxOUT (LVCMOS Output) RxCLKOUT (20 MHz to 50 MHz) TxCLKIN (20 MHz to 50 MHz) Tx - SERIALIZER Rx - DESERIALIZER Figure 1. 'Dual Mode 2 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 DS92LV3241, DS92LV3242 www.ti.com SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 DS92LV3242 RxIN0N TxOUT1P RxIN1P (LVCMOS Input) RT = 100: D MODE = H (Quad Mode) D TxCLKIN (40 MHz to 85 MHz) R RxIN1N TxOUT2P RxIN2P TxOUT2N RxIN2N TxOUT3P RxIN3P TxOUT3N QUAD RT = 100: TxIN QUAD TxOUT1N 32 RT = 100: TxOUT0N R RT = 100: D RxIN0P RT = 100: RT = 100: D TxOUT0P R RT = 100: RT = 100: DS92LV3241 R 32 RxOUT (LVCMOS Output) RxCLKOUT (40 MHz to 85 MHz) RxIN3N Rx - DESERIALIZER Tx - SERIALIZER Figure 2. Quad Mode TxIN13 TxIN12 TxIN11 TxIN10 TxIN9 VSS VDD TxIN8 TxIN7 TxIN6 TxIN5 TxIN4 TxIN3 TxIN2 TxIN1 TxIN0 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 DS92LV3241 Pin Diagram IOVDD 49 32 VDD IOVSS 50 31 VSS TxIN14 51 30 TxOUT0+ TxIN15 52 29 TxOUT0- VDDPLL 53 28 TxOUT1+ VSSPLL 54 27 TxOUT1- VSSPLL 55 26 VDDA VDDPLL 56 25 VSSA TxIN16 57 24 TxOUT2+ TxIN17 58 23 TxOUT2- TxIN18 59 22 TxOUT3+ TxIN19 60 21 TxOUT3- TxIN20 61 20 VSEL TxIN21 62 19 PRE TxIN22 63 18 VDD TxIN23 64 17 VSS 8 9 10 11 12 13 14 15 16 TxIN29 TxIN30 TxIN31 TxCLKIN PDB BISTEN R_FB MODE RSVD 5 TxIN28 7 4 TxIN27 6 3 TxIN26 VSS 2 TxIN25 VDD 1 TxIN24 DS92LV3241 Figure 3. DS92LV3241 Pin Diagram- Top View 64-Pin TQFP (PAG Package) Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 Submit Documentation Feedback 3 DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 www.ti.com DS92LV3241 Serializer PIN DESCRIPTIONS Pin # Pin Name I/O, Type Description LVCMOS PARALLEL INTERFACE PINS 10–8, 5–1, 64–57, 52–51, 48–44. 41–33 TxIN[31:29], TxIN[28:24], TxIN[23:16], TxIN[15:14], TxIN[13:9], TxIN[8:0] I, LVCMOS Serializer Parallel Interface Data Input Pins. 11 TxCLKIN I, LVCMOS Serializer Parallel Interface Clock Input Pin. Strobe edge set by R_FB configuration pin. CONTROL AND CONFIGURATION PINS 12 PDB I, LVCMOS Serializer Power Down Bar (ACTIVE LOW) PDB = L; Device Disabled, Differential serial outputs are put into TRI-STATE stand-by mode, PLL is shutdown PDB = H; Device Enabled 15 MODE I, LVCMOS Dual or Quad mode select (ACTIVE H) MODE = L (default); Dual Mode, MODE = H; Quad Mode 19 PRE I, LVCMOS PRE-emphasis level select pin PRE = (RPRE > 12kΩ); Imax = [(1.2/R) x 20 x 2], Rmin = 12kΩ. PRE = H or floating; pre-emphasis is disabled. 14 R_FB I, LVCMOS Rising/Falling Bar Clock Edge Select R_FB = H; Rising Edge, R_FB = L; Falling Edge 20 VSEL I, LVCMOS VOD (Differential Output Voltage) Llevel Select VSEL = L; Low Swing, VSEL = H; High Swing 13 BISTEN I, LVCMOS BIST Enable BISTEN = L; BIST OFF, (default), normal operating mode. BISTEN = H; BIST Enabled (ACTIVE HIGH) 16 RSVD I, LVCMOS Reserved — MUST BE TIED LOW LVDS SERIAL INTERFACE PINS 22, 24, 28, 30 TxOUT[3:0]+ O, LVDS Serializer LVDS Non-Inverted Outputs(+) 21, 23, 27, 29 TxOUT[3:0]- O, LVDS Serializer LVDS Inverted Outputs(-) 7, 18, 32, VDD 42 VDD Digital Voltage supply, 3.3V 6, 17, 31, VSS 43 GND Digital ground 53, 56 VDDPLL VDD Analog Voltage supply, PLL POWER, 3.3V 54, 55 VSSPLL GND Analog ground, PLL GROUND 26 VDDA VDD Analog Voltage supply 25 VSSA GND Analog ground 49 IOVDD VDD Digital IO Voltage supply Connect to 1.8V typ for 1.8V LVCMOS interface Connect to 3.3V typ for 3.3V LVCMOS interface 50 IOVSS GND Digital IO ground POWER / GROUND PINS 4 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 DS92LV3241, DS92LV3242 www.ti.com SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 DS92LV3242 Pin Diagram R_FB RSVD RxOUT0 RxOUT1 RxOUT2 RxOUT3 RxOUT4 VSSPLL VDDPLL RxOUT5 RxOUT6 RxOUT7 RxOUT8 RxOUT9 RxOUT10 RxOUT11 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 Top View PDB 49 32 RxOUT12 REN 50 31 RxOUT13 RxIN0+ 51 30 RxOUT14 RxIN0- 52 29 RxOUT15 RxIN1+ 53 28 RxOUT16 RxIN1- 54 27 VSS VDDA 55 26 VDD DS92LV3242 VSSA 56 25 RxOUT17 RxIN2+ 57 24 RxOUT18 RxIN2- 58 23 RxOUT19 RxIN3+ 59 22 RxOUT20 RxIN3- 60 21 RxOUT21 VDD 61 20 RxOUT22 14 15 RxOUT24 VSS 16 13 RxOUT25 VDD 12 RxOUT26 9 VDD 11 8 VSS 10 7 RxOUT29 RxOUT27 6 RxOUT30 RxOUT28 5 RxOUT31 VDD 4 17 3 64 LOCK VDDPLL RxCLKOUT VSS 2 RxOUT23 18 VSSPLL 19 63 1 62 VDDPLL VSS VSSPLL Figure 4. DS92LV3242 Pin Diagram 64-Pin TQFP (PAG Package) Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 Submit Documentation Feedback 5 DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 www.ti.com DS92LV3242 Deserializer PIN DESCRIPTIONS Pin # Pin Name I/O, Type Description LVCMOS PARALLEL INTERFACE PINS 5–7, 10–14, 19–25, 28–32, 33–39, 42–46 RxOUT[31:29], RxOUT[28:24], RxOUT[23:17], RxOUT[16:12], RxOUT[11:5], RxOUT[4:0] O, LVCMOS Deserializer Parallel Interface Data Output Pins. 4 RxCLKOUT O, LVCMOS Deserializer Recovered Clock Output. Parallel data rate clock recovered from the embedded clock. 3 LOCK O, LVCMOS LOCK indicates the status of the receiver PLL LOCK = L; deserializer CDR/PLL is not locked, RxOUT[31:0] and RCLK are TRI-STATED LOCK = H; deserializer CDR/PLL is locked CONTROL AND CONFIGURATION PINS 48 R_FB I, LVCMOS Rising/Falling Bar Clock Edge Select R_FB = H; RxOUT clocked on rising edge R_FB = L; RxOUT clocked on falling edge 50 REN I, LVCMOS Deserializer Enable, DES Output Enable Control Input (ACTIVE HIGH) REN = L; disabled, RxOUT[31:0] and RxCLKOUT TRI-STATED, PLL still operational REN = H; Enabled (ACTIVE HIGH) 49 PDB I, LVCMOS Power Down Bar, Control Input Signal (ACTIVE LOW) PDB = L; disabled, RxOUT[31:0], RCLK, and LOCK are TRI-STATED in stand-by mode, PLL is shutdown PDB = H; Enabled 47 RSVD I, LVCMOS Reserved — MUST BE TIED LOW LVDS SERIAL INTERFACE PINS 51, 53, 57, 59 RxIN[0:3]+ I, LVDS Deserializer LVDS Non-Inverted Inputs(+) 52, 54, 58, 60 RxIN[0:3]- I, LVDS Deserializer LVDS Inverted Inputs(-) POWER / GROUND PINS 9, 16, 17, 26, 61 VDD VDD Digital Voltage supply, 3.3V 8, 15, 18, 27, 62 VSS GND Digital Ground 55 VDDA VDD Analog LVDS Voltage supply, POWER, 3.3V 56 VSSA GND Analog LVDS GROUND 1, 40, 64 VDDPLL VDD Analog Voltage supply PLL VCO POWER, 3.3V 2, 41, 63 VSSPLL GND Analog ground, PLL VCO GROUND These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 6 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 DS92LV3241, DS92LV3242 www.ti.com SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) −0.3V to +4V Supply Voltage (VDD) LVCMOS Input Voltage −0.3V to (VDD +0.3V) LVCMOS Output Voltage −0.3V to (VDD +0.3V) LVDS Deserializer Input Voltage −0.3V to +3.9V LVDS Driver Output Voltage −0.3V to +3.9V Junction Temperature +125°C Storage Temperature −65°C to +150°C Lead Temperature (Soldering, 4 seconds) +260°C Maximum Package Power Dissipation Capacity Package Derating 1/θJA °C/W above +25°C θJA 35.7 °C/W (3) θJC 12.6 °C/W ESD Rating (HBM) (1) (2) (3) >4 kV “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. 4 Layer JEDEC Recommended Operating Conditions Min Nom Max Units 3.135 3.3 3.465 V 3.3V I/O Interface 3.135 3.3 3.465 V 1.8V I/O Interface 1.71 1.8 1.89 V −40 +25 Supply Voltage (VDD) Supply Voltage(IOVDD) (SER ONLY) Operating Free Air Temperature (TA) Input Clock Rate +85 °C Dual Mode 20 50 MHz Quad Mode 40 85 MHz 100 mVP-P Tolerable Supply Noise Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 Submit Documentation Feedback 7 DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 www.ti.com Electrical Characteristics (1) (2) Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions Min Typ Max Units LVCMOS DC SPECIFICATIONS VIH High Level Input Voltage Tx: IOVDD = 1.71V to 1.89V Rx Low Level Input Voltage IOVDD + 0.3 2.0 VDD GND 0.35 x IOVDD GND 0.8 V Tx: IOVDD = 3.135V to 3.465V VIL 0.65 x IOVDD Tx: IOVDD = 1.71V to 1.89V V Tx: IOVDD = 3.135V to 3.465V Rx VCL Input Clamp Voltage ICL = −18 mA IIN Input Current Tx: VIN = 0V or 3.465V(1.89V) IOVDD = 3.465V(1.89V) −10 +10 Rx: VIN = 0V or 3.465V −10 +10 VOH −0.8 IOH = −2mA (Dual) High Level Output Voltage VDD V GND 0.33 0.5 V VOUT = 0V (Dual) −22 −40 mA VOUT = 0V (Quad) −33 −70 mA +10 μA 440 (850) 525 (1000) mVP-P 1 50 mVP-P 1.25 1.50 V 4 50 mV IOH = −2mA (Quad) IOS Output Short Circuit Current IOZ TRI-STATE Output Current µA 3.0 IOH = −2mA (Dual) Low Level Output Voltage V 2.4 IOH = −2mA (Quad) VOL −1.5 PDB = 0V, VOUT = 0V or VDD −10 SERIALIZER LVDS DC SPECIFICATIONS VOD Output Differential Voltage No pre-emphasis, VSEL = L (VSEL = H) ΔVOD Output Differential Voltage Unbalance VSEL = L, No pre-emphasis VOS Offset Voltage VSEL = L, No pre-emphasis ΔVOS Offset Voltage Unbalance VSEL = L, No pre-emphasis IOS Output Short Circuit Current TxOUT[3:0] = 0V, PDB = VDD, VSEL = L, No pre-emphasis −2 −5 TxOUT[3:0] = 0V, PDB = VDD, VSEL = H, No pre-emphasis −6 −10 PDB = 0V, TxOUT[3:0] = 0V OR VDD −15 ±1 +15 µA PDB = VDD, TxOUT[3:0] = 0V OR VDD −15 ±1 +15 µA Internal differential output termination between differential pairs 90 100 130 Ω f = 85 MHz, CHECKER BOARD pattern MODE = H, VSEL = H, PRE = OFF 150 200 f = 85 MHz, CHECKER BOARD pattern MODE = H, VSEL = H, RPRE = 12 kΩ 150 200 f = 85 MHz, RANDOM pattern MODE = H, VSEL = H, PRE = OFF 140 195 f = 85 MHz, RANDOM pattern MODE = H, VSEL = H, RPRE = 12 kΩ 140 195 IOZ TRI-STATE Output Current RT Output Termination SERIALIZER SUPPLY CURRENT (DVDD, PVDD AND AVDD PINS) IDDTQ (1) (2) (3) 8 Serializer (Tx) Total Supply Current Quad Mode (includes load current) 350 (629) 1.00 mA (3) mA Typical values represent most likely parametric norms at VDD = 3.3V, TA = +25°C, and at the Recommended Operating Conditions at the time of product characterization and are not verified. Current into a the device is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground except VOD, ΔVOD, VTH, VTL which are differential voltages. DIGITAL, PLL, AND ANALOG VDDS Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 DS92LV3241, DS92LV3242 www.ti.com SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 Electrical Characteristics(1)(2) (continued) Over recommended operating supply and temperature ranges unless otherwise specified. Symbol IDDTD IDDTZ Parameter Conditions Serializer (Tx) Total Supply Current Dual Mode (includes load current) Serializer Supply Current Power-down Min Typ Max Units f= 50 MHz, CHECKER BOARD pattern MODE = L, VSEL = H, PRE = OFF 120 145 f= 50 MHz, CHECKER BOARD pattern MODE = H, VSEL = H, RPRE = 12 kΩ 120 145 f= 50 MHz, RANDOM pattern MODE = L, VSEL = H, PRE = OFF 115 135 f= 50 MHz, RANDOM pattern MODE = L, VSEL = H, RPRE = 12 kΩ 115 135 2 50 µA +50 mV mA TPWDNB = 0V (All other LVCMOS Inputs = 0V) DESERIALIZER LVDS DC SPECIFICATIONS VTH Differential Threshold High Voltage VTL Differential Threshold Low Voltage VCM = +1.8V RT Input Termination Internal differential output termination between differential pairs IIN Input Current −50 mV 100 130 Ω VIN = +2.4V, VDD = 3.6V ±100 ±250 µA VIN = 0V, VDD = 3.6V ±100 ±250 µA f = 85 MHz, CL = 8 pF, CHECKER BOARD pattern, Quad Mode 240 265 f = 85 MHz, CL = 8 pF, RANDOM pattern, Quad Mode 190 210 f = 50 MHz, CL = 8 pF, CHECKER BOARD pattern, Dual Mode 145 185 f = 50 MHz, CL = 8 pF, RANDOM pattern, Dual Mode 122 140 90 DESERIALIZER SUPPLY CURRENT (DVDD, PVDD AND AVDD PINS) (4) IDDR IDDRZ (4) Deserializer Total Supply Current (includes load current) mA mA Deserializer Supply Current Power-down PDB = 0V (All other LVCMOS Inputs = 0V, RxIN[3:0](P/N) = 0V) 100 µA Units DIGITAL, PLL, AND ANALOG VDDS Serializer Input Timing Requirements for TCLK Over recommended operating supply and temperature ranges unless otherwise specified. Symbol tCIP tCIH tTCIL tCIT tJIT Parameter Conditions TxCLKIN Period TxCLKIN High Time TxCLKIN Low Time TxCLKIN Transition Time Min Typ Max MODE = L (Dual Mode) 20 tCIP 50 MODE = H (Quad Mode) 11.76 tCIP 25 20 MHz – 50 MHz 0.45 x tCIP 0.5 x tCIP 0.55 x tCIP 40 MHz – 85 MHz 0.45 x tCIP 0.5 x tCIP 0.55 x tCIP 20 MHz – 50 MHz Figure 7 0.45 x tCIP 0.5 x tCIP 0.55 x tCIP 40 MHz – 85 MHz 0.45 x tCIP 0.5 x tCIP 0.55 x tCIP 20 MHz – 50 MHz Figure 6 0.5 1.2 40 MHz – 85 MHz 0.5 1.2 TxCLKIN Jitter ±100 Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 Submit Documentation Feedback ns ns ns ns psP-P 9 DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 www.ti.com Serializer Switching Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions tLLHT LVDS Low-to-High Transition Time tLHLT LVDS High-to-Low Transition Time tSTC TxIN[31:0] Setup to TxCLKIN tHTC TxIN[31:0] Hold from TxCLKIN tPLD Serializer PLL Lock Time Min No pre-emphasis Figure 5 IOVDD = 1.71V to 1.89V Figure 7 0 IOVDD = 3.135V to 3.465V 0 IOVDD = 1.71V to 1.89V 2.5 IOVDD = 3.135V to 3.465V 2.25 Figure 9 Typ Data Output LOW to TRI-STATE Delay See tHZD Data Output TRI-STATE to HIGH Delay See (1) tSD Serializer Propagation Delay - Latency f = 50 MHz, R_FB = H, PRE = OFF, MODE = L Figure 8 350 ps 350 ps ns ns 4400 x tCIP 5000 x tCIP ns 5 10 ns 5 10 ns 4.5 tCIP + 6.77 f = 50 MHz, R_FB = L, PRE = OFF, MODE = L 4.5 tCIP + 4.5 tCIP + 4.5 tCIP + 5.63 7.09 9.29 f = 20 MHz, R_FB = H, PRE = OFF, MODE = L 4.5 tCIP + 4.5 tCIP + 4.5 tCIP + 6.57 8.74 10.74 f = 85MHz, R_FB = H, PRE = OFF, MODE = H 9.0 tCIP + 6.99 f = 85MHz, R_FB = L, PRE = OFF, MODE = H 9.0 tCIP + 9.0 tCIP + 9.0 tCIP + 5.97 7.38 9.64 f = 40 MHz, R_FB = HL, PRE = OFF, MODE = H 9.0 tCIP + 9.0 tCIP + 9.0 tCIP + 6.30 8.26 10.49 ns tLVSKD LVDS Output Skew LVDS differential output channel-tochannel skew 30 ΛSTXBW Jitter Transfer Function -3 dB Bandwidth Dual Mode f = 50 MHz Figure 15 2.8 Quad Mode f = 85 MHz 2 Dual Mode f = 50 MHz 0.3 Quad Mode f = 85 MHz 0.9 (1) 10 Serializer Jitter Transfer Function Peaking Units (1) tLZD δSTX Max 500 ps MHz dB When the Serializer output is at TRI-STATE the Deserializer will lose PLL lock. Resynchronization MUST occur before data transfer. Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 DS92LV3241, DS92LV3242 www.ti.com SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 Deserializer Switching Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. Symbol tROCP Parameter Conditions Receiver Output Clock Period tRODC RxCLKOUT Duty Cycle tROTR LVCMOS Low-to-High Transition Time tROTF LVCMOS High-to-Low Transition Time tROTR LVCMOS Low-to-High Transition Time tROTF LVCMOS High-to-Low Transition Time tROSC RxOUT[31:0] Setup to RxCLKOUT tROHC RxOUT[31:0] Hold to RxCLKOUT tROSC RxOUT[31:0] Setup to RxCLKOUT tROHC RxOUT[31:0] Hold to RxCLKOUT tHZR Data Output High to TRI-STATE Delay tLZR Min Typ Max tROCP = tCIP (Dual Mode) Figure 11 20 tROCP 50 tROCP = tCIP (Quad Mode) 11.76 tROCP 25 45 50 55 ns CL = 8pF (lumped load) (Dual Mode) Figure 10 CL = 8pF (lumped load) (Quad Mode) f = 85 MHz (Quad Mode) Figure 13 % 3.2 ns 3.5 ns ns 2.4 ns 1.9 f = 50 MHz (Dual Mode) Units 5.6 0.5 x tROCP ns 7.4 0.5 x tROCP ns 3.4 0.5 x tROCP ns 3.4 0.5 x tROCP ns 5 10 ns Data Output Low to TRI-STATE Delay 5 10 ns tZHR Data Output TRI-STATE to High Delay 5 10 ns tZLR Data Output TRI-STATE to Low Delay 5 10 ns tRD Deserializer Propagation Delay – Latency tRPLLS (1) Deserializer PLL Lock Time TOLJIT Deserializer Input Jitter Tolerance tLVSKR LVDS Differential Input Skew Tolerance (1) f = 20 MHz (Dual Mode) Figure 12 5.5 x tROCP + 3.35 ns f = 50 MHz (Dual Mode) 5.5 x tROCP + 6.00 ns f = 40 MHz (Quad Mode) 12.0 x tROCP + 7.4 ns f = 85 MHz (Quad Mode) 12.0 x tROCP + 5.7 ns 20 MHz – 50 MHz (Dual Mode) Figure 13 128k x tROCP ns 40 MHz – 85 MHz (Quad Mode) Figure 13 256k x tROCP ns 0.25 20 MHz – 85 MHz Figure 17 UI 0.4 x tROCP ns tRPLLS is the time required by the Deserializer to obtain lock when exiting power-down mode. Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 Submit Documentation Feedback 11 DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 www.ti.com AC Timing Diagrams and Test Circuits Differential Signal 80% 80% 20% Vdiff = 0V 20% tLLHT tLHLT Figure 5. Serializer LVDS Transition Times VDDIO 80% 80% TxCLKIN 20% 20% 0V tCIT tCIT Figure 6. Serializer Input Clock Transition Time tCIP TxCLKIN tCIH + tCIL tSTC TxIN tHTC Setup Hold SYMBOL N +2 | | SYMBOL N+1 | | | | SYMBOL N SYMBOL N+3 | SYMBOL N - 1 | | TxIN | | Figure 7. Serializer Setup/Hold and High/Low Times TxCLKIN tSD SYMBOL N | | SYMBOL N +1 | | SYMBOL N-1 | | SYMBOL N - 2 | | TxOUT | | SYMBOL N - 3 Figure 8. Serializer Propagation Delay 12 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 DS92LV3241, DS92LV3242 www.ti.com SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 PDB 2.0V 0.8V tHZD or tLZD TxCLKIN tPLD TxOUT LVDS Output HIGH TRI-STATE LVDS Output Active TRI-STATE Figure 9. Serializer PLL Lock Time VOH 80% 80% 20% 20% VOL tROTF tROTR Figure 10. Deserializer LVCMOS Output Transition Time tROCP tRODC RxCLKOUT tRODC VDD/2 VDD/2 tROSC RxOUT [31:0] VDD/2 tROHC Data Valid Before RxCLKOUT Data Valid After RxCLKOUT VDD/2 Figure 11. Deserializer Setup and Hold times SYMBOL N + 3 | | SYMBOL N + 2 | | RxIN SYMBOL N +1 | | | | SYMBOL N | | SYMBOL N - 1 | t RD SYMBOL N | | SYMBOL N - 1 | | SYMBOL N - 2 | | SYMBOL N - 3 | | RxOUT | | RxCLKOUT SYMBOL N +1 Figure 12. Deserializer Propagation Delay Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 Submit Documentation Feedback 13 DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 www.ti.com 2.0V PDB 0.8V | | tRPLLS RxIN [1:0]+/- LOCK 'RQ¶W &DUH TRI-STATE TRI-STATE tHZR or tLZR RxOUT [31:0] TRI-STATE TRI-STATE RxCLKOUT TRI-STATE TRI-STATE REN Figure 13. Deserializer PLL Lock Time and PDB TRI-STATE Delay 500: VREF CL = 8 pF VREF = VDD/2 for tZLR or tLZR + - VREF = 0V for tZHR or tHZR REN VOH VDD/2 REN VDD/2 VOL tLZR tZLR VOL + 0.5V VOL + 0.5V VOL tHZR RxOUT [31:0] tZHR VOH VOH - 0.5V VOH + 0.5V Note: CL includes instrumentation and fixture capacitance within 6 cm of RxOUT [31:0]. Figure 14. Deserializer TRI_STATE Test Circuit and Timing 0 GAIN (dB) Dual Mode 50 MHz -3 Quad Mode 85 MHz -6 -9 1.0E+02 1.0E+03 1.0E+04 1.0E+05 1.0E+06 1.0E+07 FREQUENCY (Hz) Figure 15. Serializer Jitter Transfer 14 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 32 TxIN PARALLEL-TO-SERIAL www.ti.com TxOUT[3:0]+ RT RL TxOUT[3:0]- TxCLKIN Figure 16. Serializer VOD Test Circuit Diagram CLK1 CLK1 CLK0 CLK1 CLK0 RxIN1 RxIN3 CLK0 CLK1 RxIN0 (Master) RxIN2 CLK0 tLVSKR 1 RxCLKOUT Cycle RxCLKOUT Figure 17. LVDS Deserializer Input Skew Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 Submit Documentation Feedback 15 DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 www.ti.com FUNCTIONAL DESCRIPTION The DS92LV3241 Serializer (SER) and DS92LV3242 Deserializer (DES) chipset is a flexible SER/DES chipset that translates a 32-bit parallel LVCMOS data bus into a quad (4 pairs) or dual (2 pairs) LVDS serial links with embedded clock. The DS92LV3241 serializes the 32-bit wide parallel LVCMOS word into four or two high-speed LVDS serial data streams with embedded clock, scrambles and DC Balances the data to support AC coupling and enhance signal quality. The DS92LV3242 receives the dual/quad LVDS serial data streams and converts it back into a 32-bit wide parallel data with a recovered clock. The dual/quad LVDS serial data stream reduces cable size, the number of connectors, and eases skew concerns. Parallel clocks between 20 MHz to 85 MHz are supported by the dual or quad operating modes. The modes are user selectable through a control pin on Serializer. In dual mode, the transmit clock frequency supports 20 MHz to 50 MHz and in quad mode the transmit clock frequency supports 40 MHz to 85 MHz. In the dual mode configuration, the embedded clock LVDS serial streams have an effective data payload of 640 Mbps (20MHz x 32-bit) to 1.6 Gbps (50MHz x 32- bit). In the quad mode configuration, the embedded clock LVDS serial streams have an effective data payload of 1.28 Gbps (40MHz x 32-bit) to 2.72 Gbps (85MHz x 32-bit). The SER/DES chipset is designed to transmit data over long distances through standard twisted pair (TWP) cables. The differential inputs and outputs are internally terminated with 100 ohm resistors to provide source and load termination, minimize stub length, to reduce component count and further minimize board space. The DES can attain lock to a data stream without the use of a separate reference clock source; greatly simplifying system complexity and reducing overall cost. The DES synchronizes to the SER regardless of data pattern, delivering true automatic “plug-and-lock” performance. It will lock to the incoming serial stream without the need of special training patterns or special sync characters. The DES recovers the clock and data by extracting the embedded clock information, deskews the serial data channels and then deserializes the data. The DES also monitors the incoming clock information, determines lock status, and asserts the LOCK output high when lock occurs. In addition the DES also supports an optional AT-SPEED BIST (Built In Self Test) mode, BIST error flag, and LOCK status reporting pin. The SER and the DES have a power down control signal to enable efficient operation in various applications. DESKEW AND CHANNEL ALIGNMENT The DES automatically detects dual or quad serial channel mode and provides a clock alignment and deskew function without the need for any special training patterns. During the locking phase, the embedded clock information is recovered on all channels and the serial links are internally synchronized, de-skewed, and auto aligned. The internal CDR circuitry will dynamically compensate for up to 0.4 times the parallel clock period of per channel phase skew (channel-to-channel) between the recovered clocks of the serial links. This provides skew phase tolerance from mismatches in interconnect wires such as PCB trace routing, cable pair-to-pair length differences, and connector imbalances. DATA TRANSFER After SER lock is established (SER PLL to TxCLKIN), the inputs TxIN0–TxIN31 are latched into the encoder block. Data is clocked into the SER by the TxCLKIN input. The edge of TxCLKIN used to strobe the data is selectable via the R_FB (SER) pin. R_FB (SER) high selects the rising edge for clocking data and low selects the falling edge. The SER outputs (TxOUT[3:0]+/-) are intended to drive a AC Coupled point-to-point connections. The SER latches 32-bit parallel data bus and performs several operations to it. The 32-bit parallel data is internally encoded and sequentially transmitted over the two high-speed serial LVDS channels. For each serial channel, the SER transmits 20 bits of information per payload to the DES. In the dual mode, the 32-bit parallel data is scaled and bit-mapped across two 20-bit data payloads per channel, resulting in a per channel throughput of 400 Mbps to 1.0 Gbps (20 bits x clock rate). Under quad mode, the internal PLL operates at ½ the input clock frequency rate. The 32 bits are bit-mapped and sequenced per every 2 cycles at ½ the TxCLKIN frequency across four channels, resutling in a per channel throughput of 400 Mbps to 850 Mbps (20 bits x clock rate/2). The chipset supports frequency ranges of 20 MHz to 85 MHz. 16 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 DS92LV3241, DS92LV3242 www.ti.com SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 When all of the DES channels obtain lock , the LOCK pin is driven high and synchronously delivers valid data and recovered clock on the output. The DES locks to the clock, uses it to generate multiple internal data strobes, and then drives the recovered clock to the RxCLKOUT pin. The recovered clock (RxCLKOUT) is synchronous to the data on the RxOUT[31:0] pins. While LOCK is high, data on RxOUT[31:0] is valid. Otherwise, RxOUT[31:0] is invalid. The polarity of the RxCLKOUT edge is controlled by its R_FB (DES) input. RxOUT[31:0], LOCK and RxCLKOUT outputs will each drive a maximum of 8 pF load. REN controls TRI-STATE for RxOUT0–RxOUT31 and the RxCLKOUT pin on the DES. RESYNCHRONIZATION In the absence of data transitions on one of the channels into the DES (e.g. a loss of the link), it will automatically try to resynchronize and re-establish lock using the standard lock sequence on the master channel (Channel 0). For example, if the embedded clock is not detected one time in succession on any of the serial links, the LOCK pin is driven low. The DES then monitors the master channel for lock, once that is obtained, the second channel is locked and aligned. The logic state of the LOCK signal indicates whether the data on RxOUT is valid; when it is high, the data is valid. The system may monitor the LOCK pin to determine whether data on the RxOUT is valid. POWERDOWN The Powerdown state is a low power sleep mode that the SER and DES may use to reduce power when no data is being transferred. The respective PDB pins are used to set each device into power down mode, which reduces supply current into the µA range. The SER enters Powerdown when the SER PDB pin is driven low. In Powerdown, the PLL stops and the outputs go into TRI-STATE, disabling load current and reducing current supply. To exit Powerdown, SER PDB must be driven high. When the SER exits Powerdown, its PLL must lock to TxCLKIN before it is ready for sending data to the DES. The system must then allow time for the DES to lock before data can be recovered. The DES enters Powerdown mode when DES PDB is driven low. In Powerdown mode, the PLL’s stop and the outputs enter TRI-STATE. To bring the DES block out of the Powerdown state, the system drives DES PDB high. Both the SER and DES must relock before data can be transferred from Host and received by the Target. The DES will startup and assert LOCK high when it is locked to the embedded clocks. See also Figure 13. TRI-STATE For the SER, TRI-STATE is entered when the SER PDB pin is driven low. This will TRI-STATE the driver output pins on TxOUT[3:0]+/-. In addition, when MODE=0 (dual mode), the TxOUT[3:2]+/- outputs pins are in TRISTATE. When you drive the REN or DES PDB pin low, the DES output pins (RxOUT[31:0]) and RxCLKOUT will enter TRI-STATE. The LOCK output remains active, reflecting the state of the PLL. The DES input pins are high impedance during receiver Powerdown (DES PDB low) and power-off (VDD = 0V). See also Figure 13. TRANSMIT PARALLEL DATA AND CONTROL INPUTS The DS92LV3241 operates on a core supply voltage of 3.3V with an optional digital supply voltage for 1.8V, lowswing, input support. The SER single-ended (32-bit parallel data and control inputs) pins are 1.8V and 3.3V LVCMOS logic level compatible and is configured through the IOVDD input supply rail. If 1.8V is required, the IOVDD pin must be connected to a 1.8V supply rail. Also when power is applied to the transmitter, IOVDD pin must be applied before or simultaneously with other power supply pins (3.3V). If 1.8V input swing is not required, this pin should be tied to the common 3.3V rail. During normal operation, the voltage level on the IOVDD pins must not change. PRE-EMPHASIS The SER LVDS Line Driver features a Pre-Emphasis function used to compensate for extra long or lossy transmission media. The same amount of Pre-Emphasis is applied on all of the enabled differential output channels. Cable drive is enhanced with a user selectable Pre-Emphasis feature that provides additional output current during transitions to counteract cable loading effects. The transmission distance will be limited by the loss characteristics and quality of the media. Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 Submit Documentation Feedback 17 DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 www.ti.com To enable the Pre-Emphasis function, the “PRE” pin requires one external resistor (Rpre) to VSS (GND) in order to set the pre-emphasized current level. Options include: 1. Normal Output (no Pre-emphasis) – Leave the PRE pin open, include an R pad, do not populate. 2. Enhanced Output (Pre-emphasis enabled) – connect a resistor on the PRE pin to Vss. Values of the Rpre Resistor should be between 12K Ohm and 100K Ohm. Values less than 6K Ohm should not be used. The amount of Pre-Emphasis for a given media will depend on the transmission distance and Fmax of the application. In general, too much Pre-Emphasis can cause over or undershoot at the receiver input pins. This can result in excessive noise, crosstalk, reduced Fmax, and increased power dissipation. For shorter cables or distances, Pre-Emphasis is typically not be required. Signal quality measurements should be made at the end of the application cable to confirm the proper amount of Pre-Emphasis for the specific application. The Pre-Emphasis circuit increases the drive current to I = 48 / (RPRE). For example if RPRE = 15 kOhms, then the current is increased by an additional 3.2 mA. To calculate the expected increase in VOD, multiply the increase in current by 50 ohms. So for the case of RPRE = 15 kOhms, the boost to VOD would be 3.2 mA x 50 Ohms = 160 mV. The duration of the current is controlled to one bit by time. If more than one bit value is repeated in the next cycle(s), the Pre-Emphasis current is turned off (back to the normal output current level) for the next bit(s). To boost high frequency data and pre-equalize teh data patternreduce ISI (Inter-Symbol Interference) improving the resulting eye pattern. VOD SELECT The SER Line Driver Differential Output Voltage (VOD) magnitude is selectable. Two levels are provided and are selected by the VSEL pin. When this pin is LOW, normal output levels are obtained. For most application set the VSEL pin LOW. When this pin is HIGH, the output current is increased to double the VOD level. Use this setting only for extra long cables or high-loss interconnects. Table 1. VOD Control VSEL Pin Setting Effect LOW Small VOD, typ 440 mVP-P HIGH Large VOD, typ 850 mVP-P SERIAL INTERFACE The serial links between the DS92LV3241 and the DS92LV3242 are intended for a balanced 100 Ohm interconnects. The links must be configured as an AC coupled interface. The SER and DES support AC-coupled interconnects through an integrated DC balanced encoding/decoding scheme. An external AC coupling capacitors must be placed, in series, in the LVDS signal path. The DES input stage is designed for AC-coupling by providing a built-in AC bias network which sets the internal common mode voltage (VCM) to +1.8V. For the high-speed LVDS transmission, small footprint packages should be used for the AC coupling capacitors. This will help minimize degradation of signal quality due to package parasitics. NPO class 1 or X7R class 2 type capacitors are recommended. 50 WVDC should be the minimum used for best system-level ESD performance. The most common used capacitor value for the interface is 100 nF (0.1 uF) capacitor. One set of capacitors may be used for isolation. Two sets (both ends) may also be used for maximum isolation of both the SER and DES from cable faults. The DS92LV3241 and the DS92LV3242 differential I/O’s are internally terminated with 100 Ohm resistance between the inverting and non-inverting pins and do not require external termination. The internal resistance value will be between 90 ohm and 130 ohm. The integrated terminations improve signal integrity, reduce stub lengths, and decrease the external component count resulting in space savings. 18 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 DS92LV3241, DS92LV3242 www.ti.com SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 AT-SPEED BIST FEATURE The DS92LV3241/ DS92LV3242 serial link is equipped with built-in self-test (BIST) capability to support both system manufacturing and field diagnostics. BIST mode is intended to check the entire high-speed serial interface at full link-speed without the use of specialized and expensive test equipment. This feature provides a simple method for a system host to perform diagnostic testing of both SER and DES. The BIST function is easily configured through the SER BISTEN pin. When the BIST mode is activated, the SER generates a PRBS (pseudo-random bit sequence) pattern (2^7-1). This pattern traverses each lane to the DES input. The DS92LV3242 includes an on-chip PRBS pattern verification circuit that checks the data pattern for bit errors and reports any errors on the data output pins of the DES. The AT-Speed BIST feature is enabled by setting the BISTEN to High on SER. The BISTEN input must be High or Low for 4 or more TxCLKIN clock cycles in order to activate or deactivate the BIST mode. An input clock signal for the Serializer TxCLKIN must also be applied during the entire BIST operation. Once BIST is enabled, all the Serializer data inputs (TxIN[31:0]) are ignored and the DES outputs (RxOUT[31:0]) are not available. Next, the internal test pattern generator for each channel starts transmission of the BIST pattern from SER to DES. The DES BIST mode will be automatically activated by this sequence. A maximum of 128 consecutives clock symbols on DS92LV3242 DES is needed to detect BIST enable function. The BIST is implemented with independent transmit and receive paths for the four serial links. Each channel on the DES will be individually compared against the expected bit sequence of the BIST pattern. TxCLKIN PDB (High) BISTEN 2.0V 0.8V BIST disabled BIST enabled 4 x tCIP BIST disabled 4 x tCIP Figure 18. BIST Test Enabled/Disabled Under the BIST mode, the DES parallel outputs on RxOUT[31:0] are multiplexed to represent BIST status indicators. The pass/fail status of the BIST is represented by a Pass flag along with an Error counter. The Pass flag output is designated on DES RxOUT0 for Channel 0, and RxOUT8 for Channel 1. The DES's PLL must first be locked to ensure the Pass status is valid. The output Pass status pin will stay LOW and then transition to High once 44*10^6 symbols are achieved across each of the respective transmission links. The total time duration of the test is defined by the following: 44*10^6 x tCIP . After the Pass output flags reach a HIGH state, it will not drop to LOW even if subsequent bit errors occurred after the BIST duration period. Errors will be reported if the input test pattern comparison does not match. If an error (miss-compare) occurs, the status bit is latched on RxOUT[7:1] for Channel 0, and RxOUT[15:9] for Channel 1; reflecting the number of errors detected. Whenever a data bit contains an error, the Error counter bit output for that corresponding channel goes HIGH. Each counter for the serial link utilizes a 7-bit counter to store the number of errors detected (0 to 127 max). Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 Submit Documentation Feedback 19 DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 www.ti.com Recovered Pixel Clock Start Pixel BISTEN Case 1: No bit errors Recovered Pixel Data Channel 0 - RxOUT0 Channel 1 - RxOUT8 Channel 2 ± RxOUT16 Channel 3 ± RxOUT24 Error counter Channel 0 - RxOUT[7:1] Channel 1 - RxOUT[15:9] Channel 2 - RxOUT[23:17] Channel 3 - RxOUT[31:25] BIST PASS 0 0 0 Case 2: Bit error(s) B Recovered Pixel Data B B B Channel 0 - RxOUT0 Channel 1 - RxOUT8 Channel 2 ± RxOUT16 Channel 3 ± RxOUT24 Error counter Channel 0 - RxOUT[7:1] Channel 1 - RxOUT[15:9] Channel 2 - RxOUT[23:17] Channel 3 - RxOUT[31:25] BIST FAIL 0 1 2 3 4 4 Case 3: Bit error(s) Recovered Pixel Data Channel 0 - RxOUT0 Channel 1 - RxOUT8 Channel 2 ± RxOUT16 Channel 3 ± RxOUT24 Error counter Channel 0 - RxOUT[7:1] Channel 1 - RxOUT[15:9] Channel 2 - RxOUT[23:17] Channel 3 - RxOUT[31:25] B BIST PASS 0 B = Bad Bit 0 0 BIST Duration 44 x 106 x tCIP Status Region Figure 19. BIST Diagram for Different Bit Error Cases TYPICAL APPLICATION CONNECTION Figure 20 shows a typical application of the DS92LV3241 Serializer (SER). The differential outputs utilize 100nF coupling capacitors to the serial lines. Bypass capacitors are placed near the power supply pins. A system GPO (General Purpose Output) controls the PDB and BISTEN pins. In this application the R_FB (SER) pin is tied Low to latch data on the falling edge of the TxCLKIN. In this application the link is short, therefore the VSEL pin is tied LOW for the standard output swing level. The Pre-emphasis input utilizes a resistor to ground to set the amount of pre-emphasis desired by the application. Configuration pins for the typical application are shown for SER: • PDB – Power Down Control Input – Connect to host or tie HIGH (always ON) • BISTEN – Mode Input - tie LOW if BIST mode is not used, or connect to host • VSEL – tie LOW for normal VOD magnitude (application dependant) • MODE – For clock rates between 20 MHz and 50 MHz tie LOW, for 40 MHz to 85 MHz tie HIGH • PRE – Leave open if not required (have a R pad option on PCB) • RSVD1 & RSVD2 – tie LOW 20 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 DS92LV3241, DS92LV3242 www.ti.com SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 There are eight power pins for the device. These may be bussed together on a common 3.3V plane (3.3V LVCMOS I/O interface). If 1.8V input swing level for parallel data and control pins are required, connect the IOVDD pin to 1.8V. At a minimum, eight 0.1uF capacitors should be used for local bypassing. 3.3V VDDA VDD 3.3V VDDPLL VDD VDDPLL VDD IOVDD VDD TxCLKIN VSS 1.8V or 3.3V 3.3V VSS TxIN31 VSS TxIN30 VSS TxIN29 TxIN28 VSSPLL TxIN27 VSSPLL TxIN26 TxIN25 VSSA TxIN24 32-bit LVCMOS Data Bus + Clock TxIN23 IOVSS TxIN22 TxIN21 TxIN20 TxIN19 TxIN18 TxIN16 TxIN15 TxIN14 TxIN13 TxIN12 TxIN11 TxOUT0+ TxOUT0Serial LVDS TxIN17 TxOUT1+ TxOUT1TxOUT2+ TxOUT2- TxIN10 TxIN9 TxOUT3+ TxIN8 TxOUT3- TxIN7 TxIN6 TxIN5 PRE opt. TxIN4 TxIN3 Control TxIN2 TxIN1 R_FB TxIN0 VSEL PDB BISTEN MODE RSVD Notes: Caps are 0.1 PF except Bulk Supply (4.7 PF) Figure 20. DS92LV3241 Typical Connection Diagram Figure 21 shows a typical application of the DS92LV3242 Deserializer (DES). The differential inputs utilize 100nF coupling capacitors in the serial lines. Bypass capacitors are placed near the power supply pins. A system GPO (General Purpose Output) controls the PDB pin. In this application the R_FB (DES) pin is tied Low to strobe the data on the falling edge of the RxCLKOUT. The REN signal is not used and is tied High also. Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 Submit Documentation Feedback 21 DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 www.ti.com Configuration pins for the typical application are shown for DES: • PDB – Power Down Control Input – Connect to host or tie HIGH • REN – tie HIGH if not used (used to MUX two DES to one target device) • RSVD – tie LOW 3.3V VDDA VDD 3.3V VDDPLL VDD VDDPLL VDD VDDPLL VDD 3.3V VDD VSSPLL VSSPLL VSSPLL VSSA Serial LVDS RxIN0+ RxIN0RxIN1+ RxIN1RxIN2+ RxIN2RxIN3+ RxIN3- Tied ON REN R_FB RSVD Notes: Caps are 0.1 PF except Bulk Supply (4.7 PF) RxOUT31 RxOUT30 RxOUT29 RxOUT28 RxOUT27 RxOUT26 RxOUT25 RxOUT24 RxOUT23 RxOUT22 RxOUT21 RxOUT20 RxOUT19 RxOUT18 RxOUT17 RxOUT16 RxOUT15 RxOUT14 RxOUT13 RxOUT12 RxOUT11 RxOUT10 RxOUT9 RxOUT8 RxOUT7 RxOUT6 RxOUT5 RxOUT4 RxOUT3 RxOUT2 RxOUT1 RxOUT0 32-bit LVCMOS Data Bus + Clock VSS RxCLKOUT Control VSS VSS VSS VSS PDB LOCK Figure 21. DS92LV3242 Typical Connection Diagram 22 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 DS92LV3241, DS92LV3242 www.ti.com SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 Applications Information TRANSMISSION MEDIA The SER and DES are used in AC-coupled point-to-point configurations, through a PCB trace, or through twisted pair cables. Interconnect for LVDS typically has a differential impedance of 100 Ohms. Use cables and connectors that have matched differential impedance to minimize impedance discontinuities. In most applications that involve cables, the transmission distance will be determined on data rates involved, acceptable bit error rate and transmission medium. PCB LAYOUT AND POWER SYSTEM CONSIDERATIONS Circuit board layout and stack-up for the LVDS SER/DES devices should be designed to provide low-noise power feed to the device. Good layout practice will also separate high frequency or high-level inputs and outputs to minimize unwanted stray noise pickup, feedback and interference. Power system performance may be greatly improved by using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane capacitance for the PCB power system with low-inductance parasitics, which has proven especially effective at high frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the range of 0.01 uF to 0.1 uF. Tantalum capacitors may be in the 2.2 uF to 10 uF range. Voltage rating of the tantalum capacitors should be at least 5X the power supply voltage being used. Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommended at the point of power entry. This is typically in the 50uF to 100uF range and will smooth low frequency switching noise. It is recommended to connect power and ground pins directly to the power and ground planes with bypass capacitors connected to the plane with vias on both ends of the capacitor. Connecting power or ground pins to an external bypass capacitor will increase the inductance of the path. A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of these external bypass capacitors, usually in the range of 20-30 MHz range. To provide effective bypassing, multiple capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing the impedance at high frequency. Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not required. Pin Description tables typically provide guidance on which circuit blocks are connected to which power pin pairs. In some cases, an external filter many be used to provide clean power to sensitive circuits such as PLLs. Use at least a four layer board with a power and ground plane. Locate LVCMOS signals away from the LVDS lines to prevent coupling from the LVCMOS lines to the LVDS lines. Closely-coupled differential lines of 100 Ohms are typically recommended for LVDS interconnect. The closely coupled lines help to ensure that coupled noise will appear as common mode and thus is rejected by the receivers. The tightly coupled lines will also radiate less. PLUG AND GO The Serializer and Deserializer devices support hot plugging of the serial interconnect. The automatic receiver lock to random data “plug & go” capability allows the DS92LV3242 to obtain lock to the active data stream during a live insertion event. LVDS INTERCONNECT GUIDELINES For full details, see the Channel-Link PCB and Interconnect Design-In Guidelines (literature number SNLA008) and the Transmission Line RAPIDESIGNER Operation and Applications Guide (literature number SNLA035). • Use 100 Ohm coupled differential pairs • Use the S/2S/3S rule in spacings – S = space between the pair – 2S = space between pairs Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 Submit Documentation Feedback 23 DS92LV3241, DS92LV3242 SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 www.ti.com – 3S = space to LVCMOS signal Minimize the number of vias Use differential connectors when operating above 500 Mbps line speed Maintain balance of the traces Minimize skew within the pair Terminate as close to the TX outputs and RX inputs as possible • • • • • Additional general guidance can be found in the LVDS Owner’s Manual (literature number SNLA187), which is available in PDF format from the TI LVDS & CML Solutions web site. Typical Performance Characteristics The waveforms below illustrate the typical performance of the DS92LV3241. The SER was given a PCLK and configured as described below each picture. In all of the pictures the SER was configured with BISTEN pin set to logic HIGH. Each waveform was taken by using a high impedance low capacitance differential probe to probe across a 100 ohm differential termination resistor within one inch of TxOUT0+/-. 24 Figure 22. Serial Output Quad Mode, 85 MHz, VSEL = H, No Pre-Emphasis Figure 23. Serial Output Quad Mode, 85 MHz, VSEL = L, No Pre-Emphasis Figure 24. Serial Output Dual Mode, 50 MHz, VSEL = H, No Pre-Emphasis Figure 25. Serial Output Dual Mode, 50 MHz, VSEL = L, No Pre-Emphasis Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 DS92LV3241, DS92LV3242 www.ti.com SNLS314D – SEPTEMBER 2009 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision C (April 2013) to Revision D • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 24 Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: DS92LV3241 DS92LV3242 Submit Documentation Feedback 25 PACKAGE OPTION ADDENDUM www.ti.com 24-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS92LV3241TVS/NOPB ACTIVE TQFP PAG 64 160 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 DS92LV3241 TVS DS92LV3241TVSX/NOPB ACTIVE TQFP PAG 64 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 DS92LV3241 TVS DS92LV3242TVS/NOPB ACTIVE TQFP PAG 64 160 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 DS92LV3242 TVS DS92LV3242TVSX/NOPB ACTIVE TQFP PAG 64 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 DS92LV3242 TVS (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Nov-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS92LV3241TVSX/NOPB TQFP PAG 64 1000 330.0 24.4 13.0 13.0 1.45 16.0 24.0 Q2 DS92LV3242TVSX/NOPB TQFP PAG 64 1000 330.0 24.4 13.0 13.0 1.45 16.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS92LV3241TVSX/NOPB TQFP PAG 64 1000 367.0 367.0 45.0 DS92LV3242TVSX/NOPB TQFP PAG 64 1000 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MTQF006A – JANUARY 1995 – REVISED DECEMBER 1996 PAG (S-PQFP-G64) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 48 0,08 M 33 49 32 64 17 0,13 NOM 1 16 7,50 TYP Gage Plane 10,20 SQ 9,80 12,20 SQ 11,80 0,25 0,05 MIN 1,05 0,95 0°– 7° 0,75 0,45 Seating Plane 0,08 1,20 MAX 4040282 / C 11/96 NOTES: A. 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