EIC1314-4 13.75-14.50GHz 4-Watt Internally-Matched Power FET UPDATED 08/21/2007 FEATURES • • • • • • • 13.75 –14.50GHz Bandwidth Input/Output Impedance Matched to 50 Ohms +36.0 dBm Output Power at 1dB Compression 6.0 dB Power Gain at 1dB Compression 25% Power Added Efficiency -45 dBc IM3 at Po = 25.0 dBm SCL 100% Tested for DC, RF, and RTH Caution! ESD sensitive device. ELECTRICAL CHARACTERISTICS (Ta = 25°C) IDSS PARAMETERS/TEST CONDITIONS1 Output Power at 1dB Compression f = 13.75-14.50GHz VDS = 10 V, IDSQ ≈ 1100mA Gain at 1dB Compression f = 13.75-14.50GHz VDS = 10 V, IDSQ ≈ 1100mA Gain Flatness f = 13.75-14.50GHz VDS = 10 V, IDSQ ≈ 1100mA Power Added Efficiency at 1dB Compression f = 13.75-14.50GHz VDS = 10 V, IDSQ ≈ 1100mA Drain Current at 1dB Compression f = 13.75-14.50GHz Output 3rd Order Intermodulation Distortion ∆f = 10 MHz 2-Tone Test; Pout = 25.0 dBm S.C.L2 VDS = 10 V, IDSQ ≈ 65% IDSS f = 14.50GHz Saturated Drain Current VDS = 3 V, VGS = 0 V VP Pinch-off Voltage SYMBOL P1dB G1dB ∆G PAE Id1dB IM3 RTH MIN TYP 35.5 36.0 dBm 5.0 6.0 dB UNITS ±0.6 dB 25 1100 -42 VDS = 3 V, IDS = 20 mA Thermal Resistance MAX 3 % 1300 mA -45 dBc 2080 2880 -2.5 -4.0 5.5 6.0 mA V o C/W Note: 1. Tested with 100 Ohm gate resistor. 2. S.C.L. = Single Carrier Level. 3. Overall Rth depends on case mounting. ABSOLUTE MAXIMUM RATING FOR EFE SYMBOLS Vds Vgs Igf Igr Pin Tch Tstg Pt PARAMETERS Drain-Source Voltage Gate-Source Voltage Forward Gate Current Reverse Gate Current Input Power Channel Temperature Storage Temperature Total Power Dissipation ABSOLUTE1 CONTINUOUS2 15V 10V -5V -4V 48mA 14.4mA -9.6mA -2.4mA 35.5dBm @ 3dB Compression 175C 175C -65C to +175C -65C to +175C 25W 25W Note: 1. Exceeding any of the above ratings may result in permanent damage. 2. Exceeding any of the above ratings may reduce MTTF below design goals. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com page 1 of 4 Revised October 2007 EIC1314-4 13.75-14.50GHz 4-Watt Internally-Matched Power FET UPDATED 08/21/2007 PERFORMANCE DATA Typical S-Parameters (T= 25°C, 50Ω system, de-embedded to edge of package) VDS = 10 V, IDSQ ≈ 1100mA S11 and S22 0 2. 3. 10 0 0. 4 4 -4 .0 0 4. -5. 0 5.0 2 -0. 0.2 -10.0 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0 0.2 10.0 0 0.2 0.4 0.6 0.8 1.0 2.0 3.0 4.0 5.0 10.0 0 DB(|S[2,1]|) * EIC1314-4 -10 DB(|S[1,2]|) * EIC1314-4 10.0 -10.0 2 -0. -20 0.2 -5. 0 5.0 -4 .0 0 4. .0 0. 1.0 0.8 -0.8 -0 .6 6 0. 0 0 -1.0 3. 2. S[2,2] * EIC1314-4 4 -30 13 .0 S[1,1] * EIC1314-4 -2 .4 -3 -0 FREQ S21 and S12 (dB) 1.0 0.8 6 .0 .0 . -0 .6 0. -0 -0.8 -1.0 -2 -3 S21 and S12 20 Swp Max 15GHz --- S11 --- 13.5 14 Frequency (GHz) Swp Min 13GHz --- S21 --- --- S12 --- 14.5 15 --- S22 --- (GHz) MAG ANG MAG ANG MAG ANG MAG ANG 13.0 0.5078 -2.28 2.0327 -117.68 0.0863 -144.55 0.5488 -133.93 13.2 0.4776 -17.96 2.1494 -132.66 0.095 -160.68 0.4743 -146.87 13.4 0.4118 -33.24 2.2575 -148.8 0.1036 -176.01 0.4121 -161.98 13.6 0.3207 -49.12 2.3651 -165.3 0.1096 167.92 0.3481 179.95 13.8 0.2203 -70.57 2.431 176.6 0.1188 150.43 0.2602 155.82 14.0 0.1094 -102.37 2.4478 158.24 0.1217 132.03 0.1895 123.3 14.2 0.0627 152.39 2.4123 139.92 0.1227 115.1 0.1576 76.56 14.4 0.1622 96.78 2.3192 121.93 0.1196 96.75 0.1927 30.27 14.6 0.2642 73.83 2.1858 104.48 0.1158 80.23 0.2491 1.19 14.8 0.353 56.65 2.0523 88.18 0.1109 63.47 0.3031 -18.21 15.0 0.421 42.58 1.9018 72.39 0.1037 48.43 0.3615 -34.26 Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com page 2 of 4 Revised October 2007 EIC1314-4 13.75-14.50GHz 4-Watt Internally-Matched Power FET UPDATED 08/21/2007 Power De-rating Curve and IM3 Definition Power Dissipation vs. Temperature THIRD-ORDER INTERCEPT POINT IP3 30 IP3 = Pout + IM3/2 Potentially Unsafe Operating Region 20 15 Safe Operating Region 10 f1 or f2 Pout [S.C.L.] (dBm) Total Power Dissipation (W) 25 Pout IM3 Pin IM3 (2f1-f2) f1 f2 (2f2-f1) f1 f2 5 (2f2 - f1) or (2f1 - f2) 0 25 50 75 100 125 Case Temperature (°C) 150 175 Pin [S.C.L.] (dBm) Typical Power Data (VDS = 10 V, IDSQ = 1100 mA) P-1dB & G-1dB vs Frequency 36 8 35 7 34 6 33 5 P-1dB (dBm) 32 13.4 13.6 13.8 14.0 14.2 Frequency (GHz) 14.4 IM3 vs Output Power 9 G-1dB (dB) 14.6 4 14.8 f1 = 14.5 GHz, f2 = 14.51 GHz -15 -20 G-1dB (dB) P-1dB (dBm) 37 Typical IM3 Data (VDS = 10 V, IDSQ ≈ 65% IDSS) -25 IM3 (dBc) 0 -30 -35 -40 -45 -50 IM3 (dBc) -55 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Pout [S.C.L.] (dBm) Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com page 3 of 4 Revised October 2007 EIC1314-4 13.75-14.50GHz 4-Watt Internally-Matched Power FET UPDATED 08/21/2007 PACKAGES OUTLINE Dimensions in inches, Tolerance + .005 unless otherwise specified EIC1314-4 (Hermetic) EIC1314-4NH (Non-Hermetic) Excelics Excelics EIC1314-4 EIC1314-4NH YYWW YYWW SN SN ALL DIMENSIONS IN INCHES ALL DIMENSIONS IN INCHES Caution! ESD sensitive device. Caution! ESD sensitive device. ORDERING INFORMATION Part Number Packages Grade1 fTest (GHz) P1dB (min) IM3 (min)2 EIC1314-4 Hermetic Industrial 13.75-14.50GHz 35.5 -42 EIC1314-4NH Non-Hermetic Industrial 13.75-14.50GHz 35.5 -42 Notes: 1. Contact factory for military and hi-rel grades. 2. Exact test conditions are specified in “Electrical Characteristics” table. DISCLAIMER EXCELICS SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. EXCELICS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN. LIFE SUPPORT POLICY EXCELICS SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF EXCELICS SEMICONDUCTOR, INC. AS HERE IN: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com page 4 of 4 Revised October 2007