Tel: 0044 (0)118 979 1238 Fax: 0044 (0)118 979 1283 E-mail: [email protected] ACT200 The ACT200 is an ultra miniature surface mount Watch Crystal with a low power consumption making it ideal for portable applications. Its small footprint renders it suitable for high density circuit boards or applications where space is limited. The tape and reel packaging means that it is ideal for automatic placement machines (loose product is also available). The heart of the device is a heat resistant cylinder type crystal which provides for high stability characteristics sufficient to allow reflow soldering. Specification Parameter Nominal Frequency Frequency Tolerance Frequency v Temp Characteristics Turnover Temperature Freq. Temp. coefficient Temp Operating Range Temp Storage Range Equivalent Series Resistance Shunt Capacitance Load Capacitance Motional Capacitance Capacitance Ratio Drive Level Insulation Resistance Aging (first year) Symbol fo Δf/fo Δf/fo Tm β Topr Tstg ESR Co CL C1 γ DL IR Fa Specification 32.768KHz ±5, ±10, ±20, ±30ppm See drawing 25°C ±5°C -0.034 ±0.006ppm/°C² -40 ~ +85°C -55 ~ +125°C 50KΩ max 1.35pF Typical 6 &12.5pF( Other options available ) 0.003pF Typical 450 Typical 1μW max 500MΩ min ±3ppm max Condition @25°C -10 ~ +60°C @25°C Please specify @ DC 100V ±15V 25°C ±3°C Pad surface material Sn Cu Please note that all parameters can not necessarily be specified in the same device Customer to specify: Frequency Tolerance, Load Capacitance, Operating Temperature Range & Storage Temperature Range In line with our ongoing policy of product evolvement and improvement, the above specification may be subject to change without notice ISO9001:2000 Registered For quotations or further information please contact us at: 3 The Business Centre, Molly Millars Lane, Wokingham, Berkshire, RG41 2EY, UK http://www.actcrystals.com 1 of 2 Issue 6 M4E Date 30-06-06 Tel : Fax : email : 0044 (0)118 979 1238 0044 (0)118 979 1283 [email protected] ACT200 TAPE AND REEL SOLDERING of SMD WATCH CRYSTALS Reflow oven should be set up to emulate or better the maximum reflow profile shown in the diagram below. Note it is just as important to conform to the times given as well as the temperatures. Pre-heat should not exceed 180°C ±5°C Maximum time 120s Peak soldering temperature should not exceed 260°C. Time at peak temperature should not exceed 10 seconds. Total reflow time above 120°C should not exceed 6 minutes. WASH PROCESSES and SMD WATCH CRYSTALS In order to achieve the optimum performance of plastic packaged watch crystals the plastic normally used is a polymer plastic which is porous. With some wash processes (Involving total immersion of the unit) the moisture ingress causes an impedance across the internal crystal unit connections to stop it oscillating. In time (shortened by a drying process) the crystal will recover to its original characteristics. The performance with regard to damp heat (humidity) is not effected by the use of this plastic. Devices using an epoxy plastic are an option to overcome this problem should it cause any inconvenience. But this type of package is increasingly becoming more difficult to obtain due to environmental problems with the use of epoxy plastics. In line with our ongoing policy of product evolvement and improvement, the above specification may be subject to change without notice ISO9001:2000 Registered For quotations or further information please contact us at: 3 The Business Centre, Molly Millars Lane, Wokingham, Berkshire, RG41 2EY, UK http://www.actcrystals.com 2 of 2 Issue 6 M4E Date 30-06-06