AD ADG1414BRUZ 9.5 î© ron â±15 v/12 v/â±5 v icmos serially-controlled octal spst switch Datasheet

9.5 Ω RON ±15 V/+12 V/±5 V iCMOS
Serially-Controlled Octal SPST Switches
ADG1414
FEATURES
FUNCTIONAL BLOCK DIAGRAM
SPI interface
Supports daisy-chain mode
9.5 Ω on resistance @ 25°C
1.6 Ω on-resistance flatness
Fully specified at ±15 V, +12 V, ±5 V
3 V logic-compatible inputs
Rail-to-rail operation
24-lead TSSOP and 24-lead 4 mm × 4 mm LFCSP
ADG1414
The ADG1414 is a monolithic complementary metal-oxide
semiconductor (CMOS) device containing eight independently
selectable switches designed on an industrial CMOS (iCMOS®)
process. iCMOS is a modular manufacturing process combining
high voltage CMOS and bipolar technologies. iCMOS components
can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduce the
package size.
The ADG1414 is a set of octal SPST (single-pole, single-throw)
switches controlled via a 3-wire serial interface. On resistance is
closely matched between switches and is very flat over the full
signal range. Each switch conducts equally well in both directions and the input signal range extends to the supplies.
D2
S3
D3
S4
D4
S5
D5
S6
D6
S7
D7
S8
D8
INPUT SHIFT
REGISTER
Automatic test equipment
Data acquisition systems
Battery-powered systems
Sample-and-hold systems
Audio signal routing
Video signal routing
Communication systems
GENERAL DESCRIPTION
D1
S2
SCLK DIN SYNC
SDO
RESET/VL
08497-001
APPLICATIONS
S1
Figure 1.
Data is written to these devices in the form of eight bits; each
bit corresponds to one channel.
The ADG1414 utilizes a versatile 3-wire serial interface that
operates at clock rates of up to 50 MHz and is compatible with
standard SPI, QSPI™, MICROWIRE™, and DSP interface
standards. The output of the shift register, SDO, enables a
number of these parts to be daisy chained.
On power-up, all switches are in the off condition, and the
internal registers contain all zeros.
PRODUCT HIGHLIGHTS
1.
2.
3.
4.
50 MHz serial interface.
9.5 Ω on resistance.
1.6 Ω on-resistance flatness.
24-lead TSSOP and 4 mm × 4 mm LFCSP packages.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
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One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2009 Analog Devices, Inc. All rights reserved.
ADG1414
TABLE OF CONTENTS
Features .............................................................................................. 1
ESD Caution................................................................................ 10
Applications ....................................................................................... 1
Pin Configurations and Function Descriptions ..........................11
Functional Block Diagram .............................................................. 1
Typical Performance Characteristics ........................................... 13
Product Highlights ........................................................................... 1
Test Circuits ..................................................................................... 16
Revision History ............................................................................... 2
Terminology .................................................................................... 18
Specifications..................................................................................... 3
Theory of Operation ...................................................................... 19
±15 V Dual Supply ....................................................................... 3
Serial Interface ............................................................................ 19
12 V Single Supply ........................................................................ 4
Input Shift Register .................................................................... 19
±5 V Dual Supply ......................................................................... 6
Power-On Reset .......................................................................... 19
Continuous Current per Channel .............................................. 7
Daisy Chaining ........................................................................... 19
Timing Characteristics ................................................................ 8
Outline Dimensions ....................................................................... 20
Absolute Maximum Ratings.......................................................... 10
Ordering Guide .......................................................................... 20
Thermal Resistance .................................................................... 10
REVISION HISTORY
10/09—Revision 0: Initial Version
Rev. 0 | Page 2 of 20
ADG1414
SPECIFICATIONS
±15 V DUAL SUPPLY
VDD = 15 V ± 10%, VSS = −15 V ± 10%, VL = 2.7 V to 5.5 V, GND = 0 V, unless otherwise noted.
Table 1.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On-Resistance Match Between
Channels (ΔRON)
On-Resistance Flatness (RFLAT(ON))
+25°C
−40°C to
+85°C
−40°C to
+125°C
VSS to VDD
9.5
11.5
0.55
14
1
1.6
1.9
1.5
2.15
16
1.7
2.3
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
±0.05
±1
Drain Off Leakage, ID (Off )
±0.15
±0.05
±0.15
±0.1
±0.3
±1
±2
±2
±4
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
±2
2.0
0.8
±0.001
±0.1
Digital Input Capacitance, CIN
LOGIC OUTPUTS (SDO)
Output Low Voltage, VOL 1
High Impedance Leakage Current
4
0.4
0.6
0.001
±1
High Impedance Output
Capacitance1
DYNAMIC CHARACTERISTICS1
tON
4
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Total Harmonic Distortion (THD + N)
75
93
25
35
10
−73
−75
0.05
−3 dB Bandwidth
Insertion Loss
CD, CS (Off )
CD, CS (On)
256
0.55
8
32
tOFF
110
120
35
35
Unit
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
VDD = +13.5 V, VSS = −13.5 V, VS = ±10 V, IS =
−10 mA; see Figure 23
VDD = +13.5 V, VSS = −13.5 V, VS = ±10 V, IS =
−10 mA
VDD = +13.5 V, VSS = −13.5 V, VS = ±10 V, IS =
−10 mA
VDD = +16.5 V, VSS = −16.5 V
nA typ
VS = ±10 V, VD = ∓10 V; see Figure 24
nA max
nA typ
VS = ±10 V, VD = ∓10 V; see Figure 24
nA max
nA typ
nA max
VS = VD = ±10 V; see Figure 25
V min
V max
μA typ
μA max
pF typ
VIN = VGND or VL
V max
V max
μA typ
μA max
pF typ
ISINK = 3 mA
ISINK = 6 mA
ns typ
ns max
ns typ
ns max
pC typ
dB typ
dB typ
% typ
RL = 100 Ω, CL = 35 pF
VS = 10 V; see Figure 30
RL = 100 Ω, CL = 35 pF
VS = 10 V; see Figure 30
VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 31
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 26
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 27
RL = 110 Ω, 15 V p-p, f = 20 Hz to 20 kHz; see
Figure 29
RL = 50 Ω, CL = 5 pF; see Figure 28
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 28
f = 1 MHz
f = 1 MHz
MHz typ
dB typ
pF typ
pF typ
Rev. 0 | Page 3 of 20
Test Conditions/Comments
ADG1414
Parameter
POWER REQUIREMENTS
IDD
−40°C to
+85°C
+25°C
−40°C to
+125°C
0.001
1
IL Inactive
0.3
1
IL Active @ 30 MHz
IL Active @ 50 MHz
0.26
0.3
0.35
0.5
0.55
0.42
ISS
0.001
1
±4.5/±16.5
VDD/VSS
1
Unit
μA typ
μA max
μA typ
μA max
mA typ
mA max
mA typ
mA max
μA typ
μA max
V min/max
Test Conditions/Comments
VDD = +16.5 V, VSS = −16.5 V
Digital inputs = 0 V or VL
Digital inputs = 0 V or VL
Digital inputs toggle between 0 V and VL
Digital inputs toggle between 0 V and VL
Digital inputs = 0 V or VL
Guaranteed by design, not subject to production test.
12 V SINGLE SUPPLY
VDD = 12 V ± 10%, VSS = 0 V, VL = 2.7 V to 5.5 V, GND = 0 V, unless otherwise noted.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On-Resistance Match Between
Channels (ΔRON)
On-Resistance Flatness (RFLAT(ON))
+25°C
−40°C to
+85°C
−40°C to
+125°C
0 to VDD
18
21.5
0.55
26
1.2
5
1.6
6
6.9
28.5
1.8
7.3
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
±0.02
±0.15
±0.02
±1
Drain Off Leakage, ID (Off )
±0.15
±0.05
±0.3
±1
±2
±2
±4
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
±2
2.0
0.8
±0.001
4
Rev. 0 | Page 4 of 20
Test Conditions/Comments
VDD = 10.8 V, VSS = 0 V; VS = 0 V to 10 V,
IS = −10 mA; see Figure 23
VDD = 10.8 V, VSS = 0 V; VS = 0 V to 10 V,
IS = −10 mA
VDD = 10.8 V, VSS = 0 V; VS = 0 V to 10 V,
IS = −10 mA
Ω max
nA typ
±0.1
Digital Input Capacitance, CIN
Unit
nA max
nA typ
VDD = 10.8 V
VS = 1 V/10 V, VD = 10 V/1 V; see
Figure 24
VS = 1 V/10 V, VD = 10 V/1 V; see
Figure 24
nA max
nA typ
nA max
VS = VD = 1 V or 10 V; see Figure 25
V min
V max
μA typ
μA max
pF typ
VIN = VGND or VL
ADG1414
Parameter
LOGIC OUTPUTS (SDO)
VOL, Output Low Voltage 1
High Impedance Leakage Current
High Impedance Output
Capacitance1
DYNAMIC CHARACTERISTICS1
tON
+25°C
−40°C to
+85°C
−40°C to
+125°C
0.4
0.6
±1
4
Test Conditions/Comments
V max
V max
μA max
pF typ
ISINK = 3 mA
ISINK = 6 mA
ns typ
ns max
ns typ
ns max
pC typ
RL = 100 Ω, CL = 35 pF
VS = 8 V; see Figure 30
RL = 100 Ω, CL = 35 pF
VS = 8 V; see Figure 30
VS = 6 V, RS = 0 Ω, CL = 1 nF; see
Figure 31
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 26
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 27
RL = 50 Ω, CL = 5 pF; see Figure 28
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see
Figure 28
f = 1 MHz
f = 1 MHz
VDD = +13.2 V
Digital inputs = 0 V or VL
Charge Injection
145
185
35
45
8
Off Isolation
−70
dB typ
Channel-to-Channel Crosstalk
−75
dB typ
−3 dB Bandwidth
Insertion Loss
240
1.15
MHz typ
dB typ
12
33
pF typ
pF typ
tOFF
CD, CS (Off )
CD, CS (On)
POWER REQUIREMENTS
IDD
220
240
46
46
0.001
1
IL Inactive
0.3
1
IL Active @ 30 MHz
0.26
IL Active @ 50 MHz
0.42
0.3
0.5
ISS
0.35
0.55
0.001
VDD/VSS
1
Unit
1
±4.5/±16.5
Guaranteed by design, not subject to production test.
Rev. 0 | Page 5 of 20
μA typ
μA max
μA typ
μA max
mA typ
mA max
mA typ
mA max
μA typ
μA max
V min/max
Digital inputs = 0 V or VL
Digital inputs toggle between 0 V
and VL
Digital inputs toggle between 0V
and VL
Digital inputs = 0 V or VL
ADG1414
±5 V DUAL SUPPLY
VDD = +5 V ± 10%, VSS = −5 V ± 10%, VL = 2.7 V to VDD, GND = 0 V, unless otherwise noted.
Table 3.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On-Resistance Match Between
Channels (ΔRON)
On-Resistance Flatness (RFLAT(ON))
+25°C
−40°C to
+85°C
VSS to VDD
21
25
0.6
29
1.3
5.2
6.4
1.7
7.3
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
±0.02
±0.15
±0.02
±1
Drain Off Leakage, ID (Off )
±0.15
±0.05
±0.3
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
−40°C to
+125°C
32
1.9
7.6
High Impedance Leakage Current
High Impedance Output
Capacitance1
DYNAMIC CHARACTERISTICS1
tON
VS = ±4.5 V, VD = ∓4.5 V; see Figure 24
±1
±2
VS = VD = ±4.5 V; see Figure 25
±2
±4
nA max
nA typ
nA max
V min
V max
μA typ
μA max
pF typ
VIN = VGND or VL
0.4
0.6
±1
4
256
1
11
35
VDD = +4.5 V, VSS = −4.5 V, VS = ±4.5 V;
IS = −10 mA
VDD = +5.5 V, VSS = −5.5 V
nA max
nA typ
4
−3 dB Bandwidth
Insertion Loss
CD, CS (Off )
CD, CS (On)
Ω max
Ω typ
Ω max
VDD = +4.5 V, VSS = −4.5 V, VS = ±4.5V, IS =
−10 mA
±2
±0.001
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Total Harmonic Distortion, THD + N
tOFF
Ω max
Ω typ
VDD = +4.5 V, VSS = −4.5 V, VS = ±4.5 V, IS =
−10 mA; see Figure 23
VS = ±4.5 V, VD = ∓4.5 V; see Figure 24
2.0
0.8
190
250
45
60
7
–70
–75
0.14
V
Ω typ
Test Conditions/Comments
nA typ
±0.1
Digital Input Capacitance, CIN
LOGIC OUTPUTS (SDO)
VOL, Output Low Voltage 1
Unit
290
320
65
70
V max
V max
μA max
pF typ
ISINK = 3 mA
ISINK = 6 mA
ns typ
ns max
ns typ
ns max
pC typ
dB typ
dB typ
% typ
RL = 100 Ω, CL = 35 pF
VS = 3 V; see Figure 30
RL = 100 Ω, CL = 35 pF
VS = 3 V; see Figure 30
VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 31
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 26
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 27
RL = 110 Ω, 5 V p-p, f = 20 Hz to 20 kHz; see
Figure 29
RL = 50 Ω, CL = 5 pF; see Figure 28
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 28
f = 1 MHz
f = 1 MHz
MHz typ
dB typ
pF typ
pF typ
Rev. 0 | Page 6 of 20
ADG1414
Parameter
POWER REQUIREMENTS
IDD
+25°C
−40°C to
+85°C
−40°C to
+125°C
0.001
1
IL Inactive
0.3
1
IL Active @ 30 MHz
IL Active @ 50 MHz
ISS
0.26
0.3
0.35
0.5
0.55
0.42
0.001
1
±4.5/±16.5
VDD/VSS
1
Unit
μA typ
μA max
μA typ
μA max
mA typ
mA max
mA typ
mA max
μA typ
μA max
V min/max
Test Conditions/Comments
VDD = +5.5 V, VSS = −5.5 V
Digital inputs = 0 V or VL
Digital inputs = 0 V or VL
Digital inputs toggle between 0 V and VL
Digital inputs toggle between 0 V and VL
Digital inputs = 0 V or VL
Guaranteed by design, not subject to production test.
CONTINUOUS CURRENT PER CHANNEL
Table 4. Eight Channels On
Parameter
CONTINUOUS CURRENT PER CHANNEL 1
15 V Dual Supply
24-Lead TSSOP (θJA = 112.6°C/W)
24-Lead LFCSP (θJA = 30.4°C/W)
12 V Single Supply
24-Lead TSSOP (θJA = 112.6°C/W)
24-Lead LFCSP (θJA = 30.4°C/W)
5 V Dual Supply
24-Lead TSSOP (θJA = 112.6°C/W)
24-Lead LFCSP (θJA = 30.4°C/W)
1
25°C
85°C
125°C
Unit
67
121
46
75
31
42
mA max
mA max
Test Conditions/Comments
VDD = +13.5 V, VSS = −13.5 V
VDD = 10.8 V, VSS = 0 V
64
115
44
72
30
41
mA max
mA max
48
86
35
57
22
36
mA max
mA max
25°C
85°C
125°C
Unit
169
295
97
139
48
55
mA max
mA max
161
281
93
135
47
54
mA max
mA max
122
214
76
114
43
51
mA max
mA max
VDD = +4.5 V, VSS = −4.5 V
Guaranteed by design, not subject to production test.
Table 5. One Channel On
Parameter
CONTINUOUS CURRENT PER CHANNEL 1
15 V Dual Supply
24-Lead TSSOP (θJA = 112.6°C/W)
24-Lead LFCSP (θJA = 30.4°C/W)
12 V Single Supply
24-Lead TSSOP (θJA = 112.6°C/W)
24-Lead LFCSP (θJA = 30.4°C/W)
5 V Dual Supply
24-Lead TSSOP (θJA = 112.6°C/W)
24-Lead LFCSP (θJA = 30.4°C/W)
1
Test Conditions/Comments
VDD = +13.5 V, VSS = −13.5 V
VDD = 10.8 V, VSS = 0 V
VDD = +4.5 V, VSS = −4.5 V
Guaranteed by design, not subject to production test.
Rev. 0 | Page 7 of 20
ADG1414
TIMING CHARACTERISTICS
All input signals are specified with tR = tF = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2 (see Figure 2).
VDD = 4.5 V to 16.5 V; VSS = −16.5 V to 0 V; VL = 2.7 V to 5.5 V or VDD (whichever is less); GND = 0 V; all specifications TMIN to TMAX,
unless otherwise noted. 1
Table 6.
Parameter
t1 2
t2
t3
t4
Limit at TMIN, TMAX
20
9
9
5
Unit
ns min
ns min
ns min
ns min
Conditions/Comments
SCLK cycle time
SCLK high time
SCLK low time
SYNC to SCLK active edge setup time
t5
t6
t7
5
5
5
ns min
ns min
ns min
Data setup time
Data hold time
SCLK active edge to SYNC rising edge
t8
15
ns min
Minimum SYNC high time
t9
5
ns min
SYNC rising edge to next SCLK active edge ignored
t10
5
ns min
SCLK active edge to SYNC falling edge ignored
t11 3
t12
40
15
ns max
ns min
SCLK rising edge to SDO valid
Minimum RESET pulse width
1
Guaranteed by design and characterization, not production tested.
Maximum SCLK frequency is 50 MHz at VDD = 4.5 V to 16.5 V; VSS = −16.5 V to 0 V, VL = 2.7 V to 5.5 V or VDD (whichever is less); GND = 0 V.
3
Measured with the 1 kΩ pull-up resistor to VL and 20 pF load. t11 determines the maximum SCLK frequency in daisy-chain mode.
2
Timing Diagrams
t10
t1
t9
SCLK
t8
t2
t3
t7
t4
SYNC
t6
t5
DIN
DB0
DB7
08497-002
RESET
t12
Figure 2. Serial Write Operation
Rev. 0 | Page 8 of 20
ADG1414
t1
SCLK
8
t8
t3
t4
16
t9
t2
t7
SYNC
t5
t6
DIN
DB7
DB0
DB0
DB7
INPUT WORD FOR DEVICE N + 1
INPUT WORD FOR DEVICE N
t11
DB0
DB31
UNDEFINED
INPUT WORD FOR DEVICE N
Figure 3. Daisy-Chain Timing Diagram
Rev. 0 | Page 9 of 20
08497-003
SDO
ADG1414
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 7.
Parameter
VDD to VSS
VDD to GND
VSS to GND
VL to GND
Analog Inputs1
Digital Inputs1
Continuous Current, Sx or Dx
Pins
Peak Current, Sx or Dx (Pulsed
at 1 ms, 10% Duty Cycle Max)
TSSOP Package
LFCSP Package
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
Reflow Soldering Peak
Temperature, Pb free
Time at Peak Temperature
1
Rating
35 V
−0.3 V to +25 V
+0.3 V to −25 V
−0.3 V to +7 V
VSS − 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
GND − 0.3 V to VL + 0.3 V or
30 mA, whichever occurs first
Table 4 specifications + 15%
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
THERMAL RESISTANCE
Table 8. Thermal Resistance
Package Type
24-Lead TSSOP1
24-Lead LFCSP2
300 mA
400 mA
–40°C to +125°C
−65°C to +150°C
150°C
260°C
1
2
θJA
112.6
30.4
4-layer board.
4-layer board and exposed paddle soldered to VSS.
ESD CAUTION
10 sec to 40 sec
Overvoltages at the analog and digital inputs are clamped by internal
diodes. Limit the current to the maximum ratings given.
Rev. 0 | Page 10 of 20
θJC
50
Unit
°C/W
°C/W
ADG1414
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
SCLK 1
23 RESET/VL
DIN 3
22 SDO
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
20 S8
GND
S1
D1
S2
D2
S3
19 D8
18 S7
D2 8
17 D7
S3 9
16 S6
D3 10
15 D6
S4 11
14 S5
D4 12
13 D5
1
2
3
4
5
6
PIN 1
INDICATOR
ADG1414
TOP VIEW
(Not to Scale)
18
17
16
15
14
13
VSS
S8
D8
S7
D7
S6
7
8
9
10
11
12
S2 7
ADG1414
D3
S4
D4
D5
S5
D6
D1 6
21 VSS
08497-004
S1 5
NOTES
1. EXPOSED PAD TIED TO SUBSTRATE, VSS.
Figure 4. TSSOP Pin Configuration
08497-005
GND 4
DIN
VDD
SCLK
SYNC
RESET/VL
SDO
24 SYNC
VDD 2
Figure 5. LFCSP Pin Configuration
Table 9. Pin Function Descriptions
Pin No.
TSSOP
1
LFCSP
22
Mnemonic
SCLK
2
3
23
24
VDD
DIN
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
GND
S1
D1
S2
D2
S3
D3
S4
D4
D5
S5
D6
S6
D7
S7
D8
S8
VSS
22
19
SDO
23
20
RESET/VL
Description
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial
clock input. Data can be transferred at rates of up to 50 MHz.
Most Positive Power Supply Potential.
Serial Data Input. This device has an 8-bit shift register. Data is clocked into the register on the
falling edge of the serial clock input.
Ground (0 V) Reference.
Source Terminal 1. This pin can be an input or an output.
Drain Terminal 1. This pin can be an input or an output.
Source Terminal 2. This pin can be an input or an output.
Drain Terminal 2. This pin can be an input or an output.
Source Terminal 3. This pin can be an input or an output.
Drain Terminal 3. This pin can be an input or an output.
Source Terminal 4. This pin can be an input or an output.
Drain Terminal 4. This pin can be an input or an output.
Drain Terminal 5. This pin can be an input or an output.
Source Terminal 5. This pin can be an input or an output.
Drain Terminal 6. This pin can be an input or an output.
Source Terminal 6. This pin can be an input or an output.
Drain Terminal 7. This pin can be an input or an output.
Source Terminal 7. This pin can be an input or an output.
Drain Terminal 8. This pin can be an input or an output.
Source Terminal 8. This pin can be an input or an output.
Most Negative Power Supply Potential. In single-supply applications, it can be connected to
ground.
Serial Data Output. This pin can be used for daisy-chaining a number of these devices together or
for reading back the data in the shift register for diagnostic purposes. The serial data is transferred
on the rising edge of SCLK and is valid on the falling edge of the clock. Pull this open-drain output
to the supply with an external resistor.
RESET/Logic Power Supply Input (VL). When this pin is low (<0.8 V), this pin acts as RESET, all
switches are open, and appropriate registers are cleared to 0. Otherwise, it is the logic power
supply input that operates from 2.7 V to 5.5 V.
Rev. 0 | Page 11 of 20
ADG1414
Pin No.
TSSOP
24
LFCSP
21
Mnemonic
SYNC
N/A 1
EP
Exposed Pad
1
Description
Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC
goes low, it powers on the SCLK and DIN buffers and enables the input shift register. Data is
transferred in on the falling edges of the following clocks. Taking SYNC high updates the switch
condition.
Exposed Pad. Exposed pad tied to the substrate, VSS.
N/A means not applicable.
Rev. 0 | Page 12 of 20
ADG1414
TYPICAL PERFORMANCE CHARACTERISTICS
16
18
VDD = +10V
VSS = –10V
VDD = +13.5V
VSS = –13.5V
14
15
VDD = +12V
VSS = –12V
ON RESISTANCE (Ω)
ON RESISTANCE (Ω)
12
10
8
6
VDD = +16.5V
VSS = –16.5V
VDD = +15V
VSS = –15V
4
12
TA = +125°C
TA = +85°C
9
TA = +25°C
6
TA = –40°C
3
2
–1.5
4.5
1.5
7.5
10.5 13.5 16.5
VS, VD (V)
0
–15
08497-006
0
–16.5 –13.5 –10.5 –7.5 –4.5
Figure 6. On Resistance as a Function of VD (VS), Dual Supply
5
10
15
Figure 9. On Resistance as a Function of VD (VS), for Different Temperatures,
15 V Dual Supply
30
25
ON RESISTANCE (Ω)
VDD = +4.5V
VSS = –4.5V
VDD = +5.0V
VSS = –5.0V
20
15
VDD = +5.5V
VSS = –5.5V
10
VDD = +7V
VSS = –7V
5
TA = +85°C
15
TA = +25°C
10
TA = –40°C
VDD = +5V
VSS = –5V
–3
1
–1
3
5
7
VS, VD (V)
0
–5
–4
–3
–2
–1
0
1
2
3
4
5
VS, VD (V)
08497-010
–5
TA = +125°C
20
5
TA = 25°C
IS = –10mA
08497-007
ON RESISTANCE (Ω)
0
VDD = +3.0V
VSS = –3.0V
30
0
–7
–5
VS, VD (V)
35
25
–10
08497-009
VDD = +15V
VSS = –15V
TA = 25°C
IS = –10mA
Figure 10. On Resistance as a Function of VD (VS), for Different Temperatures,
5 V Dual Supply
Figure 7. On Resistance as a Function of VD (Vs), Dual Supply
25
40
VDD = +5V
VSS = 0V
35
20
20
VDD = +10.8V
VSS = 0V
15
ON RESISTANCE (Ω)
VDD = +8V
VSS = 0V
25
VDD = +12V
VSS = 0V
TA = +125°C
15
TA = +85°C
TA = +25°C
10
TA = –40°C
10
0
TA = 25°C
IS = –10mA
0
1.5
3.0
4.5
6.0
7.5
9.0
5
VDD = +13.2V
VSS = 0V
10.5
12.0 13.5
VDD = +12V
VSS = 0V
15.0
VS, VD (V)
Figure 8. On Resistance as a Function of VD (VS), Single Supply
0
0
2
4
6
VS, VD (V)
8
10
12
08497-011
VDD = +15V
VSS = 0V
5
08497-008
ON RESISTANCE (Ω)
30
Figure 11. On Resistance as a Function of VD (VS), for Different Temperatures,
12 V Single Supply
Rev. 0 | Page 13 of 20
ADG1414
2.5
500
IDD PER LOGIC INPUT
TA = 25°C
VL = 5.5V
ID, IS (ON) – –
1.5
400
ID (OFF) –+
IS (OFF) +–
1.0
ID, IS (ON) ++
0.5
IDD (µA)
LEAKAGE CURRENT (nA)
VDD = +15V
VSS = –15V
2.0
VBIAS = +10/–10V
0
300
200
–0.5
IS (OFF) –+
–1.0
100
ID (OFF) +–
–1.5
40
60
80
100
120
TEMPERATURE (°C)
0
0.5
1.0
80
CHARGE INJECTION (pC)
2.0
1.5
ID, IS (ON) – –
1.0
ID (OFF) –+
IS (OFF) +–
0
–1.0
20
40
60
80
100
120
TEMPERATURE (°C)
4.0
4.5
5.0
TA = 25°C
40
20
VDD = +5V
VSS = –5V
VDD = +12V
VSS = 0V
0
–20
–60
–15
VDD = +15V
VSS = –15V
–10
–5
0
5
10
15
VS (V)
Figure 16. Charge Injection vs. Source Voltage
Figure 13. Leakage Current as a Function of Temperature,
5 V Dual Supply
300
3.0
VDD = 12V
VSS = 0V
2.5 VBIAS = 1V/10V
ID, IS (ON) ++
250
2.0
tON (±5V)
200
1.5
TIME (ns)
LEAKAGE CURRENT (nA)
3.5
–40
IS (OFF) –+
ID (OFF) +–
0
3.0
60
08497-014
LEAKAGE CURRENT (nA)
ID, IS (ON) ++
–0.5
2.5
Figure 15. IDD vs. Logic Level
3.0
0.5
2.0
LOGIC LEVEL (V)
Figure 12. Leakage Current as a Function of Temperature, 15 V Dual Supply
VDD = +5V
VSS = –5V
2.5 VBIAS = +4.5/–4.5V
1.5
08497-017
20
08497-013
0
0
08497-016
VL = 2.7V
–2.0
ID, IS (ON) – –
1.0
ID (OFF) –+
0.5
IS (OFF) +–
tON (+12V)
150
100
tON (±15V)
0
tOFF (±5V)
50
ID (OFF) +–
–1.0
0
20
40
60
80
TEMPERATURE (°C)
100
120
Figure 14. Leakage Current as a Function of Temperature, 12 V Single Supply
Rev. 0 | Page 14 of 20
0
–40
tOFF (+12V)
tOFF (±15V)
–20
0
20
40
60
80
100
TEMPERATURE (°C)
Figure 17. Transition Time vs. Temperature
120
08497-018
IS (OFF) –+
08497-015
–0.5
ADG1414
0
LOAD = 110Ω
0.18 TA = 25°C
0.16
VDD = +5V, VSS = –5V, VS = +5V p-p
0.14
–40
THD + N (%)
OFF ISOLATION (dB)
–20
0.20
TA = 25°C
VDD = +15V
VSS = –15V
–60
0.12
0.10
0.08
VDD = +15V, VSS = –15V, VS = +10V p-p
–80
0.06
0.04
–100
100k
1M
10M
100M
1G
FREQUENCY (Hz)
0
08497-019
10k
0
5000
Figure 18. Off Isolation vs. Frequency
15,000
20,000
Figure 21. THD + N vs. Frequency, 15 V Dual Supply
0
0
TA = 25°C
VDD = +15V
VSS = –15V
–0.5
–20
TA = 25°C
VDD = +15V
VSS = –15V
–1.0
–40
–1.5
ACPSRR (dB)
INSERTION LOSS (dB)
10,000
FREQUENCY (Hz)
08497-023
0.02
–120
1k
–2.0
–2.5
NO DECOUPLING
CAPACITORS
–60
DECOUPLING
CAPACITORS
–80
–3.0
–100
10k
100k
1M
10M
100M
1G
FREQUENCY (Hz)
Figure 19. On Response vs. Frequency
0
TA = 25°C
VDD = +15V
VSS = –15V
–40
–60
–80
–100
–120
10k
100k
1M
10M
100M
FREQUENCY (Hz)
10k
100k
1M
FREQUENCY (Hz)
Figure 22. ACPSRR vs. Frequency
1G
08497-021
CROSSTALK (dB)
–20
–120
1k
Figure 20. Crosstalk vs. Frequency
Rev. 0 | Page 15 of 20
10M
08497-025
–4.0
1k
08497-012
–3.5
ADG1414
TEST CIRCUITS
IDS
V1
ID (ON)
A
NC
VD
VS
VDD
0.1µF
NETWORK
ANALYZER
S
0.1µF
VDD
50Ω
IN
VS
VS
D
D
RL
50Ω
GND
VOUT
VIN
OFF ISOLATION = 20 log
VOUT
VS
INSERTION LOSS = 20 log
Figure 26. Off Isolation
VDD
VOUT WITH SWITCH
VOUT WITHOUT SWITCH
VSS
0.1µF
VDD
RL
50Ω
VOUT
Figure 28. Insertion Loss
0.1µF
VSS
0.1µF
0.1µF
VDD
VSS
AUDIO PRECISION
S1
VDD
D
S2
VSS
RS
R
50Ω
S
IN
VS
VS
V p-p
D
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
VIN
VOUT
VS
RL
10kΩ
GND
Figure 29. THD + Noise
Figure 27. Channel-to-Channel Crosstalk
Rev. 0 | Page 16 of 20
VOUT
08497-035
GND
08497-033
VOUT
RL
50Ω
GND
08497-032
VIN
NETWORK
ANALYZER
NETWORK
ANALYZER
VSS
S
50Ω
50Ω
IN
VD
VSS
0.1µF
VSS
A
08497-034
VDD
D
Figure 25. On Leakage
VSS
0.1µF
S
NC = NO CONNECT
Figure 24. Off Leakage
Figure 23. On Resistance
VDD
D
08497-027
RON = V1/IDS
ID (OFF)
S
A
08497-026
VS
D
08497-028
IS (OFF)
S
ADG1414
VDD
VSS
0.1µF
0.1µF
VSS
S
VOUT
D
RL
300Ω
VS
CL
35pF
INPUT LOGIC
SYNC
50%
50%
90%
90%
VOUT
GND
tON
tOFF
08497-029
VDD
Figure 30. Switching Times
3V
SYNC
RS
VDD
VSS
VDD
VSS
S
D
QINJ = CL × ΔVOUT
INPUT LOGIC
ΔVOUT
SWITCH OFF
SWITCH ON
Figure 31. Charge Injection
Rev. 0 | Page 17 of 20
GND
08497-031
VOUT
VOUT
CL
1nF
VS
ADG1414
TERMINOLOGY
IDD
The positive supply current.
CD, CS (On)
The on switch capacitance, measured with reference to ground.
ISS
The negative supply current.
CIN
The digital input capacitance.
VD (VS)
The analog voltage on Terminal Dx or Terminal Sx.
tON
The delay between applying the digital control input and the
output switching on. See Figure 30.
RON
The ohmic resistance between Terminal Dx and Terminal Sx.
Δ RON
The difference between the RON of any two channels.
RFLAT(ON)
Flatness is defined as the difference between the maximum and
minimum value of on resistance, as measured over the specified
analog signal range.
IS (Off)
The source leakage current with the switch off.
tOFF
The delay between applying the digital control input and the
output switching off. See Figure 30.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
Off Isolation
A measure of unwanted signal coupling through an off switch.
ID (Off)
The drain leakage current with the switch off.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
ID, IS (On)
The channel leakage current with the switch on.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
VINL
The maximum input voltage for Logic 0.
On Response
The frequency response of the on switch.
VINH
The minimum input voltage for Logic 1.
Insertion Loss
The loss due to the on resistance of the switch.
IINL (IINH)
The input current of the digital input.
THD + N
The ratio of the harmonic amplitude plus noise of the signal to
the fundamental.
CS (Off)
The off switch source capacitance, measured with reference
to ground.
CD (Off)
The off switch drain capacitance, measured with reference to
ground.
AC Power Supply Rejection Ratio (ACPSRR)
A measure of the ability of a part to avoid coupling noise and
spurious signals that appear on the supply voltage pin to the
output of the switch. The dc voltage on the device is modulated
by a sine wave of 0.62 V p-p. The ratio of the amplitude of signal
on the output to the amplitude of the modulation is the
ACPSRR.
Rev. 0 | Page 18 of 20
ADG1414
THEORY OF OPERATION
The ADG1414 is a set of serially controlled, octal SPST switches.
Each of the eight bits of the 8-bit write corresponds to one
switch of the device. A Logic 1 in the particular bit position
turns the switch on, whereas a Logic 0 turns the switch off.
Because each switch is independently controlled by an individual
bit, this provides the option of having any, all, or none of the
switches turned on.
SERIAL INTERFACE
The write sequence begins by bringing the SYNC line low. This
enables the input shift register. Data from the DIN line is
clocked into the 8-bit input shift register on the falling edge of
SCLK. The serial clock frequency can be as high as 50 MHz,
making the ADG1414 compatible with high speed DSPs.
Data can be written to the shift register in more or less than
eight bits. In each case, the shift register retains the last eight
bits that were written. When all eight bits have been written
into the shift register, the SYNC line is brought high again. The
switches are updated with the new configuration, and the input
shift register is disabled. With SYNC held high, the input shift
register is disabled; therefore, further data or noise on the DIN
line has no effect on the shift register.
Data appears on the SDO pin on the rising edge of SCLK
suitable for daisy chaining or readback, delayed by eight bits.
INPUT SHIFT REGISTER
The input shift register is eight bits wide (see Table 10). Each bit
controls one switch. These data bits are transferred to the switch
register on the rising edge of SYNC.
Table 10. ADG1414 Input Shift Register Bit Map1
MSB
1
LSB
DB6
S7
DB5
S6
DB4
S5
The ADG1414 contains a power-on reset circuit. On power-up
of the device, all switches are in the off condition and the
internal shift register is filled with zeros and remains so until a
valid write takes place.
The part also has a RESET/VL pin. When the RESET/VL pin is low,
all switches are off and the appropriate registers are cleared to 0.
DAISY CHAINING
The ADG1414 has a 3-wire serial interface (SYNC, SCLK, and
DIN pins) that is compatible with SPI, QSPI, and MICROWIRE
interface standards, as well as most DSPs. See Figure 2 for a
timing diagram of a typical write sequence.
DB7
S8
POWER-ON RESET
DB3
S4
DB2
S3
DB1
S2
For systems that contain several switches, the SDO pin can be
used to daisy-chain several devices together. The SDO pin can
also be used for diagnostic purposes and provide serial readback,
wherein the user can read back the switch contents.
SDO is an open-drain output that should be pulled to the VL
supply with an external resistor.
The SCLK is continuously applied to the input shift register
when SYNC is low. If more than eight clock pulses are applied,
the data ripples out of the shift register and appears on the SDO
line. This data is clocked out on the rising edge of SCLK and is
valid on the falling edge. By connecting this line to the DIN
input on the next device in the chain, a multiswitch interface is
constructed. Each device in the system requires eight clock
pulses; therefore, the total number of clock cycles must equal
8N, where N is the total number of devices in the chain.
When the serial transfer to all devices is complete, SYNC is
taken high. This prevents any further data from being clocked
into the input shift register.
The serial clock can be a continuous or a gated clock. A continuous SCLK source can be used only if SYNC can be held low
for the correct number of clock cycles. In gated clock mode, a
burst clock containing the exact number of clock cycles must be
used, and SYNC must be taken high after the final clock to latch
the data. Gated clock mode reduces power consumption by
reducing the active clock time.
DB0
S1
Logic 0 = switch off and Logic 1 = switch on.
Rev. 0 | Page 19 of 20
ADG1414
OUTLINE DIMENSIONS
7.90
7.80
7.70
24
13
4.50
4.40
4.30
6.40 BSC
1
12
PIN 1
0.65
BSC
1.20
MAX
0.15
0.05
0.30
0.19
SEATING
PLANE
0.75
0.60
0.45
8°
0°
0.20
0.09
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AD
Figure 32. 24-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-24)
Dimensions shown in millimeters
0.60 MAX
4.00
BSC SQ
TOP
VIEW
0.50
BSC
3.75
BSC SQ
0.50
0.40
0.30
1.00
0.85
0.80
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
24 1
19
18
2.65
2.50 SQ
2.35
EXPOSED
PAD
(BOTTOMVIEW)
13
12
7
6
0.23 MIN
2.50 REF
0.05 MAX
0.02 NOM
0.30
0.23
0.18
PIN 1
INDICATOR
0.20 REF
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8
082908-A
PIN 1
INDICATOR
0.60 MAX
Figure 33. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-24-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADG1414BRUZ 1
ADG1414BRUZ-REEL71
ADG1414BCPZ-REEL71
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
24-Lead Thin Shrink Small Outline Package [TSSOP]
24-Lead Thin Shrink Small Outline Package [TSSOP]
24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Z = RoHS Compliant Part.
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08497-0-10/09(0)
Rev. 0 | Page 20 of 20
Package Option
RU-24
RU-24
CP-24-3
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