Bourns CM322522 MDS Cm322522 series wirewound chip inductor Datasheet

MATERIAL DECLARATION SHEET
Material
CM322522 Series
Product Line
Date
No.
19-July-2004
Construction
Element
Material Group
Material
Weight
(g)
1
Core
Ferrite
0.005
2
Solder
Internal Connection
0.001
3
4
Pad
Solder Plate
Terminal Electrode
Terminal Solder
0.010
0.001
5
Wire
Coated Wire
0.004
6
Adhesive
Epoxy
0.001
7
330K
Wirewound Chip Inductor
Coating
Headquarters Riverside CA
Resin
0.020
Total Weight
0.042
Material
CAS
If applicable
Average
Mass (%)
Copper (II) Oxide
Zinc Oxide
Nickel Oxide
Cobalt tetraoxide
Ferric Oxide
Tin
1317-38-0
1314-13-2
1313-99-1
1308-06-1
1333-86-4
7440-31-5
5.6
18.89
13.3
0.01
62.2
1
Lead
7439-92-1
97.3
Silver
Phosphor Bronze
Tin
Copper
Copper
Polyurethane Resin
7440-22-4
7440-50-8
7440-31-5
7440-58-8
7440-50-8
9009-54-5
1.7
100
99.3
0.7
95
5
Epoxy
25068-38-6
100
2.4
Epoxy Resin
Phenol Novolac
Antimony Trichloride
Brominated epoxy
Fused Silica
29690-82-2
9003-35-4
1309-64-4
40039-93-8
60676-86-0
18
10
3
2
67
47.6
www.bourns.com
Sum
(%)
Remark
11.9
2.4
RoHS exempted: High-melting
point solder
23.8
2.4
9.5
page 1 of 2
MATERIAL DECLARATION SHEET
Headquarters Riverside CA
www.bourns.com
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