MATERIAL DECLARATION SHEET Material CM322522 Series Product Line Date No. 19-July-2004 Construction Element Material Group Material Weight (g) 1 Core Ferrite 0.005 2 Solder Internal Connection 0.001 3 4 Pad Solder Plate Terminal Electrode Terminal Solder 0.010 0.001 5 Wire Coated Wire 0.004 6 Adhesive Epoxy 0.001 7 330K Wirewound Chip Inductor Coating Headquarters Riverside CA Resin 0.020 Total Weight 0.042 Material CAS If applicable Average Mass (%) Copper (II) Oxide Zinc Oxide Nickel Oxide Cobalt tetraoxide Ferric Oxide Tin 1317-38-0 1314-13-2 1313-99-1 1308-06-1 1333-86-4 7440-31-5 5.6 18.89 13.3 0.01 62.2 1 Lead 7439-92-1 97.3 Silver Phosphor Bronze Tin Copper Copper Polyurethane Resin 7440-22-4 7440-50-8 7440-31-5 7440-58-8 7440-50-8 9009-54-5 1.7 100 99.3 0.7 95 5 Epoxy 25068-38-6 100 2.4 Epoxy Resin Phenol Novolac Antimony Trichloride Brominated epoxy Fused Silica 29690-82-2 9003-35-4 1309-64-4 40039-93-8 60676-86-0 18 10 3 2 67 47.6 www.bourns.com Sum (%) Remark 11.9 2.4 RoHS exempted: High-melting point solder 23.8 2.4 9.5 page 1 of 2 MATERIAL DECLARATION SHEET Headquarters Riverside CA www.bourns.com page 2 of 2