Cypress CY7C64316-16LKXC Encoreâ ¢ v full-speed usb controller Datasheet

CY7C6435x
CY7C64345, CY7C6431x
PRELIMINARY
enCoRe™ V Full-Speed USB Controller
Features
❐
Configurable inputs on all GPIO
Low dropout voltage regulator for Port1 pins. Programmable
to output 3.0, 2.5, or 1.8V at the IO pins.
❐ Selectable, regulated digital IO on Port 1
• Configurable Input Threshold for Port 1
• 3.0V, 20 mA Total Port 1 Source Current
• Hot-Swappable
❐ 5 mA Strong drive mode on Ports 0 and 1
❐
■
Powerful Harvard Architecture Processor
❐ M8C Processor speeds running up to 24 MHz
❐ Low power at high processing speeds
❐ Interrupt controller
❐ 3.0V to 5.5V Operating voltage
❐ Temperature range: 0°C to 70°C
■ Flexible On-Chip Memory
❐ Up to 32K Flash program storage
50,000 Erase/write cycles
❐ Up to 2048 bytes SRAM data storage
❐ Flexible protection modes
❐ In-System Serial Programming (ISSP)
■ Complete Development Tools
❐ Free development tool (PSoC Designer™)
❐ Full-featured, in-circuit emulator and programmer
❐ Full-speed emulation
❐ Complex breakpoint structure
❐ 128K Trace memory
■ Precision, Programmable Clocking
❐ Crystal-less oscillator with support for an external crystal or
resonator
❐ Internal ±5.0% 6/12/24 MHz main oscillator
❐ Internal low-speed oscillator at 32 kHz for watchdog and
sleep. The frequency range is 19-50 kHz with a 32 kHz typical
value.
❐ 0.25% Accuracy for USB with no external components
■ Programmable Pin Configurations
❐ 25 mA Sink current on all GPIO
❐ Pull up, high Z, open drain, CMOS drive modes on all GPIO
enCoRe V
Block Diagram
Port 4
Port 3
■
Full-Speed USB (12 Mbps)
❐ Eight unidirectional endpoints
❐ One bidirectional control endpoint
❐ USB 2.0 compliant
❐ Dedicated 512 bytes buffer
❐ No external crystal required
■
Additional System Resources
❐ Configurable communication speeds
2
❐ I C™ slave
• Selectable to 50 kHz, 100 kHz, or 400 kHz
• Implementation requires no clock stretching
• Implementation during sleep modes with less than 100 μA
• Hardware address detection
❐ SPI master and SPI slave
• Configurable between 46.9 kHz - 3 MHz
❐ Three 16-bit timers
❐ 10-bit ADC to use for monitoring battery voltage or other signals
❐ Watchdog and sleep timers
❐ Integrated supervisory circuit
Port 2
Port 1
Port 0
Prog. LDO
enCoRe V
CORE
System Bus
SRAM
2048 Bytes
SROM
Flash 32K
CPU Core
(M8C)
Interrupt
Controller
Sleep and
Watchdog
6/12/24 MHz Internal Main Oscillator
3 16-Bit
Timers
I2C Slave/SPI
Master-Slave
POR and LVD
System Resets
Full
Speed
USB
SYSTEM RESOURCES
Cypress Semiconductor Corporation
Document Number: 001-12394 Rev. *D
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised October 17, 2007
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■
Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR (power
on reset) circuit eliminates the need for a system supervisor.
■
The 5V maximum input, 1.8/2.5/3V-selectable output,
low-dropout regulator (LDO) provides regulation for IOs. A
register controlled bypass mode allows the user to disable the
LDO.
The architecture for this device family, as illustrated (enCoRe V),
is comprised of three main areas: the CPU core, the system
resources, and the full-speed USB system. Depending on the
enCoRe V package, up to 36 general purpose IO (GPIO) are also
included.
■
Standard Cypress PSoC IDE tools are available for debugging
the enCoRe V family of parts.
This product is an enhanced version of Cypress’ successful
full-speed USB peripheral controllers. Enhancements include
faster CPU at lower voltage operation, lower current
consumption, twice the RAM and Flash, hot-swapable IOs, I2C
hardware address recognition, new very low current sleep mode,
and new package options.
The quickest path to understanding the enCoRe V silicon is by
reading this data sheet and using the PSoC Designer Integrated
Development Environment (IDE). This data sheet is an overview
of the enCoRe V integrated circuit and presents specific pin,
register, and electrical specifications.
Functional Overview
The enCoRe V family of devices are designed to replace multiple
traditional full-speed USB microcontroller system components
with one, low cost single-chip programmable component.
Communication peripherals (I2C/SPI), a fast CPU, Flash
program memory, SRAM data memory, and configurable IO are
included in a range of convenient pinouts.
The enCoRe V Core
The enCoRe V Core is a powerful engine that supports a rich
instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and IMO
(internal main oscillator) and ILO (internal low speed oscillator).
The CPU core, called the M8C, is a powerful processor with
speeds up to 24 MHz. The M8C is a four-MIPS, 8-bit Harvard
architecture microprocessor.
System resources provide additional capability, such as a configurable I2C slave/SPI master-slave communication interface and
various system resets supported by the M8C.
Additional System Resources
System resources, some of which have been previously listed,
provide additional capability useful to complete systems.
Additional resources include low voltage detection and power on
reset. Brief statements describing the merits of each system
resource are presented below.
■
Full-speed USB (12 Mbps) with nine configurable endpoints
and 512 bytes of dedicated USB RAM. No external components
are required except two series resistors. It is specified for
commercial temperature USB operation. For reliable USB
operation, ensure the supply voltage is between 4.35V and
5.25V, or around 3.3V.
■
10-bit on-chip ADC shared between system performance
manager (used to calculate parameters based on temperature
for flash write operations) and the user.
■
The I2C slave/SPI master-slave module provides 50/100/400
kHz communication over two wires. SPI communication over
3 or 4 wires runs at speeds of 46.9 kHz to 3 MHz (lower for a
slower system clock).
■
In the case of I2C slave mode, the hardware address recognition feature reduces the already low power consumption by
eliminating the need for CPU intervention until a packet
addressed to the target device has been received.
Document Number: 001-12394 Rev. *D
Getting Started
For up-to-date ordering, packaging, and electrical specification
information, reference the latest enCoRe V device data sheets
on the web at http://www.cypress.com.
Development Kits
Development Kits are available from the following distributors:
Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store
contains development kits, C compilers, and all accessories for
PSoC development. Go to the Cypress Online Store web site at
http://www.cypress.com, click the Online Store shopping cart
icon at the bottom of the web page, and click USB (Universal
Serial Bus) to view a current list of available items.
Technical Training
Free PSoC and USB technical training is available for beginners
and is taught by a marketing or application engineer over the
phone. PSoC training classes cover designing, debugging,
advanced analog, as well as application-specific classes
covering topics such as PSoC, USB and the LIN bus. Go to
http://www.cypress.com, click on Design Support located on the
left side of the web page, and select Technical Training for more
details.
Consultants
Certified Cypress USB Consultants offer everything from
technical assistance to completed USB designs. To contact or
become a Cypress PSoC/USB Consultant go to
http://www.cypress.com, click on Design Support located on
the left side of the web page, and select CYPros Consultants.
Technical Support
Cypress application engineers take pride in fast and accurate
response. You can reach them with a 4-hour guaranteed
response at http://www.cypress.com/support/login.cfm.
Application Notes
Many application notes are available to assist you in every
aspect of your design effort. To view the USB application notes,
go to the http://www.cypress.com web site and select Application Notes under the Design Resources list located in the
center of the web page. By default, application notes are sorted
by date .
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Development Tools
using the enCoRe V device blocks. Examples of user modules
are timers, 10-bit ADC, SPI/I2C etc.
PSoC Designer is a Microsoft Windows-based, integrated development environment for the Programmable System-on-Chip
(PSoC) devices. The PSoC Designer IDE and application runs
on Windows NT 4.0, Windows 2000, Windows Millennium (Me),
or Windows XP. (Reference the PSoC Designer Functional Flow
diagram below.)
The device editor also supports easy development of multiple
configurations and dynamic reconfiguration. Dynamic reconfiguration allows for changing configurations at run time.
PSoC Designer helps the customer to select an operating configuration for the USB, write application code that uses the USB,
and debug the application. This system provides design
database management by project, an integrated debugger with
In-Circuit Emulator, in-system programming support, and the
CYASM macro assembler for the CPUs.
PSoC Designer also supports a high-level C language compiler
developed specifically for the devices in the family.
Figure 1. PSoC Designer Subsystems
PSoC Designer sets up power-on initialization tables for selected
enCoRe V block configurations and creates source code for an
application framework. The framework contains software to
operate the selected components and, if the project uses more
than one operating configuration, contains routines to switch
between different sets of enCoRe V block configurations at run
time. PSoC Designer can print out a configuration sheet for a
given project configuration for use during application
programming in conjunction with the Device Data Sheet. Once
the framework is generated, the user can add application-specific code to flesh out the framework. It is also possible
to change the selected components and regenerate the
framework.
Application Editor
In the Application Editor you can edit your C language and
Assembly language source code. You can also assemble,
compile, link, and build.
Assembler. The macro assembler allows the merging of
assembly code seamlessly with C code. The link libraries
automatically use absolute addressing or are compiled in relative
mode, and linked with other software modules to get absolute
addressing.
C Language Compiler. A C language compiler is available that
supports the enCoRe V family of devices. Even if you have never
worked in the C language before, the product quickly allows you
to create complete C programs for the enCoRe V family devices.
The embedded, optimizing C compiler provides all the features
of C tailored to the enCoRe V architecture. It comes complete
with embedded libraries providing port and bus operations,
standard keypad and display support, and extended math
functionality.
Debugger
The PSoC Designer Debugger subsystem provides hardware
in-circuit emulation, allowing the designer to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow the designer to read the
program and read and write data memory, read and write IO
registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The
debugger also allows the designer to create a trace buffer of
registers and memory locations of interest.
Online Help System
PSoC Designer Software Subsystems
Device Editor
The device editor subsystem allows the user to select different
onboard analog and digital components called user modules
Document Number: 001-12394 Rev. *D
The online help system displays online, context-sensitive help
for the user. Designed for procedural and quick reference, each
functional subsystem has its own context-sensitive help. This
system also provides tutorials and links to FAQs and an Online
Support Forum to aid the designer in getting started.
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Hardware Tools
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Figure 2. User Module and Source Code Development Flows
In-Circuit Emulator
A low cost, high functionality ICE (In-Circuit Emulator) is
available for development support. This hardware has the
capability to program single devices.
The emulator consists of a base unit that connects to the PC by
way of a USB port. The base unit is universal and operates with
most Cypress USB and all PSoC devices. Emulation pods for
each device family are available separately. The emulation pod
takes the place of the enCoRe V device in the target board and
performs full-speed (24 MHz) operation.
Designing with User Modules
To speed the development process, the PSoC Designer
Integrated Development Environment (IDE) provides a feature
where the resources of the part are selected as user modules.
For example, the timers, I2C, SPI resources are available as
user modules. User modules make selecting and implementing
peripheral devices simple and easy.
Each user module establishes the basic register settings that
implement the selected function. It also provides parameters that
allow you to tailor its precise configuration to your particular
application. User modules also provide tested software to cut
your development time. The user module application
programming interface (API) provides high-level functions to
control and respond to hardware events at run time. The API also
provides optional interrupt service routines that you can adapt as
needed.
The API functions are documented in user module data sheets
that are viewed directly in the PSoC Designer IDE. These data
sheets explain the internal operation of the user module and
provide performance specifications. Each data sheet describes
the use of each user module parameter and documents the
setting of each register controlled by the user module.
The development process starts when you open a new project
and bring up the Device Editor, a graphical user interface (GUI)
for configuring the hardware. You pick and place the user
modules you need for your project. The tool automatically builds
signal chains by connecting user modules to the default IO pins
or as required. At this stage, you also configure the clock source
connections and enter parameter values directly or by selecting
values from drop-down menus. When you are ready to test the
hardware configuration or move on to developing code for the
project, you perform the “Generate Application” step. This
causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the
high-level user module API functions.
Device Editor
User
Module
Selection
Source
Code
Generator
Generate
Application
Application Editor
Project
Manager
Source
Code
Editor
Build
Manager
Build
All
Debugger
Interface
to ICE
Storage
Inspector
Event &
Breakpoint
Manager
The next step is to write your main program, and any
sub-routines using PSoC Designer’s Application Editor
subsystem. The Application Editor includes a Project Manager
that allows you to open the project source code files (including
all generated code files) from a hierarchal view. The source code
editor provides syntax coloring and advanced edit features for
both C and assembly language. File search capabilities include
simple string searches and recursive “grep-style” patterns. A
single mouse click invokes the Build Manager. It employs a
professional-strength “makefile” system to automatically analyze
all file dependencies and run the compiler and assembler as
necessary. Project-level options control optimization strategies
used by the compiler and linker. Syntax errors are displayed in a
console window. Double clicking the error message takes you
directly to the offending line of source code. When all is correct,
the linker builds a HEX file image suitable for programming.
The last step in the development process takes place inside the
PSoC Designer’s Debugger subsystem. The Debugger
downloads the HEX image to the In-Circuit Emulator (ICE) where
it runs at full-speed. Debugger capabilities rival those of systems
costing many times more. In addition to traditional single-step,
run-to-breakpoint and watch-variable features, the Debugger
provides a large trace buffer and allows you define complex
breakpoint events that include monitoring address and data bus
values, memory locations and external signals.
Document Number: 001-12394 Rev. *D
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Document Conventions
Acronyms Used
The following table lists the acronyms that are used in this
document.
Acronym
Description
Acronym
Description
POR
power on reset
PPOR
precision power on reset
PSoC®
Programmable System-on-Chip™
SLIMO
slow IMO
SRAM
static random access memory
API
application programming interface
CPU
central processing unit
Units of Measure
GPIO
general purpose IO
GUI
graphical user interface
ICE
in-circuit emulator
A units of measure table is located in the Electrical Specifications
section. Table 5 on page 15 lists all the abbreviations used to
measure the enCoRe V devices.
ILO
internal low speed oscillator
Numeric Naming
IMO
internal main oscillator
IO
input/output
LSb
least-significant bit
LVD
low voltage detect
MSb
most-significant bit
Hexidecimal numbers are represented with all letters in
uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexidecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’).
Numbers not indicated by an ‘h’, ‘b’, or 0x are decimal.
Document Number: 001-12394 Rev. *D
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Pin Configuration
The enCoRe V USB device is available in a variety of packages which are listed and illustrated in the subsequent tables.
16-Pin Part Pinout
P2[5]
P0[1]
P0[3]
P0[7]
15
14
13
7
8
D–
P0[4]
XRES
P1[4]
P1[0]
Vdd
6
D+
12
QFN
11
(Top View) 10
9
5
P1[5]
P1[1]
1
2
3
4
Vss
P2[3]
P1[7]
16
Figure 3. CY7C64315/CY7C64316 16-Pin enCoRe V Device
Table 1. 16-Pin Part Pinout (QFN)
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Type
Digital
IO
IOHR
IOHR
IOHR
Power
USB line
USB line
Power
IOHR
IOHR
Input
IOH
IOH
IOH
IOH
IO
Name
P2[3]
P1[7]
P1[5]
P1[1](1)
Vss
D+
D–
Vdd
P1[0](1)
P1[4]
XRES
P0[4]
P0[7]
P0[3]
P0[1]
P2[5]
Description
Digital IO, Crystal Input (Xin)
Digital IO, SPI SS, I2C SCL
Digital IO, SPI MISO, I2C SDA
Digital IO, ISSP CLK, 12C SCL, SPI MOSI
Ground connection
USB PHY
USB PHY
Supply
Digital IO, ISSP DATA, I2C SDA, SPI CLK
Digital IO, optional external clock input (EXTCLK)
Active high external reset with internal pull down
Digital IO
Digital IO
Digital IO
Digital IO
Digital IO, Crystal Output (Xout)
LEDGEND I = Input, O = Outpit, OH = 5 mA High Output Drive, R = Regulated Output.
Note
1. These are the in-system serial programming (ISSP) pins, that are not High Z at power on reset (POR).
Document Number: 001-12394 Rev. *D
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32-Pin Part Pinout
P0[5]
P0[7]
Vdd
P0[6]
P0[4]
P0[2]
30
29
28
27
26
25
P0[3]
Vss
32
31
Figure 4. CY7C64345 32-Pin enCoRe V USB Device
P0[1]
1
24
P0[0]
P2[5]
P2[3]
2
23
P2[6]
18
P3[0]
17
XRES
D+
16
P3[2]
15
19
7
8
P1[6]
6
P1[4]
P1[5]
P1[3]
P1[1]
P1[2]
P2[0]
13
14
20
P1[0]
( Top View)
12
5
Vdd
P2[4]
P2[2]
11
22
21
D–
QFN
9
10
3
4
Vss
P2[1]
P1[7]
Table 2. 32-Pin Part Pinout (QFN)
Pin No.
Type
Name
Description
1
IOH
P0[1]
Digital IO
2
IO
P2[5]
Digital IO, Crystal Output (Xout)
3
IO
P2[3]
Digital IO, Crystal Input (Xin)
4
IO
P2[1]
Digital IO
5
IOHR
P1[7]
Digital IO, I2C SCL, SPI SS
6
IOHR
P1[5]
Digital IO, I2C SDA, SPI MISO
7
IOHR
P1[3]
Digital IO, SPI CLK
8
IOHR
P1[1](2)
Digital IO, ISSP CLK, I2C SCL, SPI MOSI
9
Power
Vss
Ground
10
IO
D+
USB PHY
11
IO
D–
USB PHY
12
Power
Vdd
Supply voltage
13
IOHR
P1[0](2)
Digital IO, ISSP DATA, I2C SDA, SPI CLK
14
IOHR
P1[2]
Digital IO
15
IOHR
P1[4]
Digital IO, optional external clock input (EXTCLK)
16
IOHR
P1[6]
Digital IO
17
Reset
XRES
Active high external reset with internal pull down
18
IO
P3[0]
Digital IO
19
IO
P3[2]
Digital IO
20
IO
P2[0]
Digital IO
21
IO
P2[2]
Digital IO
Note
2. These are the in-system serial programming (ISSP) pins, that are not High Z at power on reset (POR).
Document Number: 001-12394 Rev. *D
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Table 2. 32-Pin Part Pinout (QFN) (continued)
Pin No.
Type
Name
Description
22
IO
P2[4]
Digital IO
23
IO
P2[6]
Digital IO
24
IOH
P0[0]
Digital IO
25
IOH
P0[2]
Digital IO
26
IOH
P0[4]
Digital IO
27
IOH
P0[6]
Digital IO
28
Power
Vdd
Supply voltage
29
IOH
P0[7]
Digital IO
30
IOH
P0[5]
Digital IO
31
IOH
P0[3]
Digital IO
32
Power
Vss
Ground
CP
Power
Vss
Ensure the center pad is connected to ground
LEDGEND I = Input, O = Outpit, OH = 5 mA High Output Drive, R = Regulated Output.
Document Number: 001-12394 Rev. *D
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48-Pin Part Pinout
P0[0]
38
37
39
Vdd
P0[6]
P0[4]
P0[2]
P0[7]
NC
NC
42
41
40
43
P0[5]
45
44
46
47
1
2
7
8
9
10
P3[1]
P1[7]
11
12
5
6
QFN
30
29
28
27
18
19
20
21
22
23
24
Vss
D+
DVdd
P1[0]
26
25
P2[6]
P2[4]
P2[2]
P2[0]
P4[2]
P4[0]
P3[6]
P3[4]
P3[2]
P3[0]
XRES
P1[6]
P1[4]
17
P1[1]
P1[2]
16
15
P1[3]
(Top View)
13
14
P1[5]
36
35
34
33
32
31
3
4
P2[3]
P2[1]
P4[3]
P4[1]
P3[7]
P3[5]
P3[3]
NC
NC
NC
P2[7]
P2[5]
48
P0[1]
Vss
P0[3]
Figure 5. CY7C64355/CY7C64356 48-Pin enCoRe V USB Device
Table 3. 48-Pin Part Pinout (QFN)
Pin No.
Type
1
NC
NC
No connection
2
IO
P2[7]
Digital IO
3
IO
P2[5]
Digital IO, Crystal Out (Xout)
4
IO
P2[3]
Digital IO, Crystal In (Xin)
5
IO
P2[1]
Digital IO
6
IO
P4[3]
Digital IO
7
IO
P4[1]
Digital IO
8
IO
P3[7]
Digital IO
9
IO
P3[5]
Digital IO
10
IO
P3[3]
Digital IO
11
IO
P3[1]
Digital IO
12
IOHR
P1[7]
Digital IO, I2C SCL, SPI SS
13
IOHR
P1[5]
Digital IO, I2C SDA, SPI MISO
14
NC
NC
No connection
15
NC
NC
No connection
16
IOHR
P1[3]
Digital IO, SPI CLK
17
IOHR
P1[1](3)
Digital IO, ISSP CLK, I2C SCL, SPI MOSI
18
Power
Vss
Supply ground
19
IO
D+
USB
20
IO
D–
USB
21
Power
Vdd
Supply voltage
IOHR
P1[0](3)
Digital IO, ISSP DATA, I2C SDA, SPI CLK
22
Pin Name
Description
Note
3. These are the in-system serial programming (ISSP) pins, that are not High Z at power on reset (POR).
Document Number: 001-12394 Rev. *D
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Table 3. 48-Pin Part Pinout (QFN) (continued)
Pin No.
Type
Pin Name
Description
23
IOHR
P1[2]
Digital IO,
24
IOHR
P1[4]
Digital IO, optional external clock input (EXTCLK)
25
IOHR
P1[6]
Digital IO
26
XRES
Ext Reset
Active high external reset with internal pull down
27
IO
P3[0]
Digital IO
28
IO
P3[2]
Digital IO
29
IO
P3[4]
Digital IO
30
IO
P3[6]
Digital IO
31
IO
P4[0]
Digital IO
32
IO
P4[2]
Digital IO
33
IO
P2[0]
Digital IO
34
IO
P2[2]
Digital IO
35
IO
P2[4]
Digital IO
36
IO
P2[6]
Digital IO
37
IOH
P0[0]
Digital IO
38
IOH
P0[2]
Digital IO
39
IOH
P0[4]
Digital IO
40
IOH
P0[6]
Digital IO
41
Power
Vdd
Supply voltage
42
NC
NC
No connection
43
NC
NC
No connection
44
IOH
P0[7]
Digital IO
45
IOH
P0[5]
Digital IO
46
IOH
P0[3]
Digital IO
47
Power
Vss
Supply ground
48
IOH
P0[1]
Digital IO
LEDGEND I = Input, O = Outpit, OH = 5 mA High Output Drive, R = Regulated Output.
Document Number: 001-12394 Rev. *D
Page 10 of 26
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CY7C6435x
CY7C64345, CY7C6431x
PRELIMINARY
Register Reference
The section discusses the registers of the enCoRe V device. It
lists all the registers in mapping tables, in address order.
Register Conventions
The register conventions specific to this section and the
Register Reference chapter are listed in the following table.
Table 4. Register Conventions
Convention
Description
R
Read register or bits
W
Write register or bits
O
Only a read/write register or bits
L
Logical register or bits
C
Clearable register or bits
#
Access is bit specific
Register Mapping Tables
The enCoRe V device has a total register address space of 512
bytes. The register space is also referred to as IO space and is
broken into two parts: Bank 0 (user space) and Bank 1 (configuration space). The XIO bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XIO bit is
set, the user is said to be in the “extended” address space or the
“configuration” registers.
Register Map Bank 0 Table: User Space
Name
PRT0DR
PRT0IE
PRT1DR
PRT1IE
PRT2DR
PRT2IE
PRT3DR
PRT3IE
PRT4DR
PRT4IE
Addr
(0,Hex)
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
21
Access
RW
RW
RW
RW
RW
RW
RW
RW
Name
EP1_CNT0
EP1_CNT1
EP2_CNT0
EP2_CNT1
EP3_CNT0
EP3_CNT1
EP4_CNT0
EP4_CNT1
EP5_CNT0
EP5_CNT1
EP6_CNT0
EP6_CNT1
EP7_CNT0
EP7_CNT1
EP8_CNT0
EP8_CNT1
RW
RW
PMA0_DR
PMA1_DR
PMA2_DR
PMA3_DR
PMA4_DR
PMA5_DR
PMA6_DR
PMA7_DR
22
Gray fields are reserved; do not access these fields.
Document Number: 001-12394 Rev. *D
Addr
(0,Hex)
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
Access
#
RW
#
RW
#
RW
#
RW
#
RW
#
RW
#
RW
#
RW
RW
RW
RW
RW
RW
RW
RW
RW
62
# Access is bit specific.
Name
Addr
(0,Hex)
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
Access
Name
I2C_XCFG
I2C_XSTAT
I2C_ADDR
I2C_BP
I2C_CP
CPU_BP
CPU_CP
I2C_BUF
CUR_PP
STK_PP
IDX_PP
MVR_PP
MVW_PP
I2C_CFG
I2C_SCR
I2C_DR
INT_CLR0
INT_CLR1
INT_CLR2
INT_CLR3
INT_MSK2
INT_MSK1
INT_MSK0
INT_SW_E
N
INT_VC
Addr
(0,Hex)
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
Access
RW
R
RW
R
R
RW
R
RW
RW
RW
RW
RW
RW
RW
#
RW
RW
RW
RW
RW
RW
RW
RW
RW
RC
Page 11 of 26
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CY7C6435x
CY7C64345, CY7C6431x
PRELIMINARY
Addr
Name
(0,Hex) Access
23
24
PMA8_DR
25
PMA9_DR
26
PMA10_DR
27
PMA11_DR
28
PMA12_DR
SPI_TXR
29
W
PMA13_DR
SPI_RXR
2A
R
PMA14_DR
SPI_CR
2B
#
PMA15_DR
2C
TMP_DR0
2D
TMP_DR1
2E
TMP_DR2
2F
TMP_DR3
30
USB_SOF0
31
R
USB_SOF1
32
R
USB_CR0
33
RW
USBIO_CR0
34
#
USBIO_CR1
35
#
EP0_CR
36
#
EP0_CNT0
37
#
EP0_DR0
38
RW
EP0_DR1
39
RW
EP0_DR2
3A
RW
EP0_DR3
3B
RW
EP0_DR4
3C
RW
EP0_DR5
3D
RW
EP0_DR6
3E
RW
EP0_DR7
3F
RW
Gray fields are reserved; do not access these fields.
Name
Document Number: 001-12394 Rev. *D
Addr
Access
Name
(0,Hex)
63
64
RW
65
RW
66
RW
67
RW
68
RW
69
RW
6A
RW
6B
RW
6C
RW
6D
RW
6E
RW
6F
RW
70
PT0_CFG
71
PT0_DATA1
72
PT0_DATA0
73
PT1_CFG
74
PT1_DATA1
75
PT1_DATA0
76
PT2_CFG
77
PT2_DATA1
78
PT2_DATA0
79
7A
7B
7C
7D
7E
7F
# Access is bit specific.
Addr
(0,Hex)
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
Access
Name
RES_WDT
INT_MSK3
RW
RW
RW
RW
RW
RW
RW
RW
RW
CPU_F
CPU_SCR1
CPU_SCR0
Addr
(0,Hex)
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
Access
W
RW
RL
#
#
Page 12 of 26
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CY7C6435x
CY7C64345, CY7C6431x
PRELIMINARY
Register Map Bank 1 Table: Configuration Space
Addr
Access
Name
(1,Hex)
PRT0DM0
00
RW
PMA4_RA
PRT0DM1
01
RW
PMA5_RA
02
PMA6_RA
03
PMA7_RA
PRT1DM0
04
RW
PMA8_WA
PRT1DM1
05
RW
PMA9_WA
06
PMA10_WA
07
PMA11_WA
PRT2DM0
08
RW
PMA12_WA
PRT2DM1
09
RW
PMA13_WA
0A
PMA14_WA
0B
PMA15_WA
PRT3DM0
0C
RW
PMA8_RA
PRT3DM1
0D
RW
PMA9_RA
0E
PMA10_RA
0F
PMA11_RA
PRT4DM0
10
RW
PMA12_RA
PRT4DM1
11
RW
PMA13_RA
12
PMA14_RA
13
PMA15_RA
14
EP1_CR0
15
EP2_CR0
16
EP3_CR0
17
EP4_CR0
18
EP5_CR0
19
EP6_CRO
1A
EP7_CR0
1B
EP8_CR0
1C
1D
1E
1F
20
21
22
23
24
25
26
27
28
SPI_CFG
29
RW
2A
2B
2C
TMP_DR0
2D
TMP_DR1
2E
TMP_DR2
2F
TMP_DR3
USB_CR1
30
#
31
32
USBIO_CR2
33
RW
PMA0_WA
34
RW
PMA1_WA
35
RW
PMA2_WA
36
RW
PMA3_WA
37
RW
PMA4_WA
38
RW
PMA5_WA
39
RW
Gray fields are reserved; do not access these fields.
Name
Document Number: 001-12394 Rev. *D
Addr
Access
Name
(1,Hex)
40
RW
41
RW
42
RW
43
RW
44
RW
45
RW
46
RW
47
RW
48
RW
49
RW
4A
RW
4B
RW
4C
RW
4D
RW
4E
RW
4F
RW
50
RW
51
RW
52
RW
53
RW
54
#
55
#
56
#
57
#
58
#
59
#
5A
#
5B
#
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
RW
6D
RW
6E
RW
6F
RW
70
71
72
73
74
75
76
77
78
79
# Access is bit specific.
Addr
(1,Hex)
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
Access
Addr
(1,Hex)
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
IO_CFG
DC
OUT_P1
DD
DE
DF
OSC_CR0 E0
ECO_CFG E1
OSC_CR2 E2
VLT_CR
E3
VLT_CMP E4
E5
E6
E7
IMO_TR
E8
ILO_TR
E9
EA
SLP_CFG EB
SLP_CFG2 EC
SLP_CFG3 ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
CPU_F
F7
F8
F9
Name
Access
RW
RW
RW
#
RW
RW
R
W
W
RW
RW
RW
RL
Page 13 of 26
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CY7C6435x
CY7C64345, CY7C6431x
PRELIMINARY
Addr
Name
(1,Hex) Access
PMA6_WA
3A
RW
PMA7_WA
3B
RW
PMA0_RA
3C
RW
PMA1_RA
3D
RW
PMA2_RA
3E
RW
PMA3_RA
3F
RW
Gray fields are reserved; do not access these fields.
Name
Document Number: 001-12394 Rev. *D
Addr
Access
Name
(1,Hex)
7A
7B
7C
7D
7E
7F
# Access is bit specific.
Addr
(1,Hex)
BA
BB
BC
BD
BE
BF
Access
Name
Addr
(1,Hex)
FA
FB
FC
FD
FE
FF
Access
Page 14 of 26
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PRELIMINARY
CY7C6435x
CY7C64345, CY7C6431x
Electrical Specifications
This chapter presents the DC and AC electrical specifications of
the enCoRe V USB devices. For the most up to date electrical
specifications, verify that you have the most recent data sheet
available by visiting the company web site at
http://www.cypress.com
Figure 6. Voltage versus CPU Frequency
5.5V
lid ng
Va rati n
pe gio
Re
Vdd Voltage
O
3.0V
750 kHz
3 MHz
24 MHz
CPU Frequency
Figure 7. IMO Frequency Trim Options
5.5V
Vdd Voltage
SLIMO
Mode
= 01
SLIMO
Mode
= 00
SLIMO
Mode
= 10
3.0V
750 kHz
3 MHz
6 MHz 12 MHz 24 MHz
The following table lists the units of measure that are used in this
chapter.
Table 5. Units of Measure
Symbol
o
C
dB
fF
Hz
KB
Kbit
kHz
kΩ
MHz
MΩ
μA
μF
μH
μs
μV
μVrms
μW
mA
ms
mV
nA
ns
nV
W
pA
pF
pp
ppm
ps
sps
s
V
Unit of Measure
degree Celsius
decibels
femto farad
hertz
1024 bytes
1024 bits
kilohertz
kilohm
megahertz
megaohm
microampere
microfarad
microhenry
microsecond
microvolts
microvolts root-mean-square
microwatts
milli-ampere
milli-second
milli-volts
nanoampere
nanosecond
nanovolts
ohm
picoampere
picofarad
peak-to-peak
parts per million
picosecond
samples per second
sigma: one standard deviation
volts
IMO Frequency
Document Number: 001-12394 Rev. *D
Page 15 of 26
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PRELIMINARY
CY7C6435x
CY7C64345, CY7C6431x
Electrical Characteristics
Absolute Maximum Ratings
Storage Temperature (TSTG) (4) ............................................. ..............................................................-55oC to 125oC (Typical +25oC)
Supply Voltage Relative to Vss (Vdd) .................................... ......................................................................................... -0.5V to +6.0V
DC Input Voltage (VIO)........................................................... .........................................................................Vss - 0.5V to Vdd + 0.5V
DC Voltage Applied to Tri-state (VIOZ) ................................... .........................................................................Vss - 0.5V to Vdd + 0.5V
Maximum Current into any Port Pin (IMIO)............................. ..................................................................................... -25mA to +50mA
Electro Static Discharge Voltage (ESD) (5) ............................ ......................................................................................................2000V
Latch-up Current (LU) (6) ....................................................... .................................................................................................... 200mA
Operating Conditions
Ambient Temperature (TA) ..................................................... .............................................................................................0oC to 70oC
Operational Die Temperature (TJ)(7) ...................................... .............................................................................................0oC to 85oC
DC Electrical Characteristics
DC Chip-Level Specifications
Table 6 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 6. DC Chip-Level Specifications
Parameter
Description
Conditions
Min
Typ
Max
Units
3.0
–
5.5
V
Vdd
Supply Voltage
See table titled DC POR and LVD
Specifications on page 18.
IDD24
Supply Current, IMO = 24 MHz
Conditions are Vdd = 3.0V, TA = 25oC,
CPU = 24 MHz,
No USB/I2C/SPI.
–
–
2.15
mA
IDD12
Supply Current, IMO = 12 MHz
Conditions are Vdd = 3.0V, TA = 25oC,
CPU = 12 MHz,
No USB/I2C/SPI.
–
–
1.45
mA
IDD6
Supply Current, IMO = 6 MHz
Conditions are Vdd = 3.0V, TA = 25oC,
CPU = 6 MHz,
No USB/I2C/SPI.
–
–
1.1
mA
ISB0
Deep Sleep Current
Vdd = 3.0V, TA = 25oC, IO regulator
turned off.
–
0.1
–
μA
ISB1
Standby Current with POR, LVD and
Sleep Timer
Vdd = 3.0V, TA = 25oC, IO regulator
turned off.
–
–
1.5
μA
Notes
4. Higher storage temperatures reduce data retention time. Recommended Storage Temperature is +25°C ± 25°C. Extended duration storage temperatures above 85oC
degrade reliability.
5. Human Body Model ESD.
6. Per JESD78 standard.
7. The temperature rise from ambient to junction is package specific. See “Package Diagram” on page 22 for Thermal Impedances. The user must limit the power
consumption to comply with this requirement.
Document Number: 001-12394 Rev. *D
Page 16 of 26
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PRELIMINARY
CY7C6435x
CY7C64345, CY7C6431x
Table 7. DC Characteristics – USB Interface
Symbol
Min
Typ
Max
Units
USB D+ pull up resistance
With idle bus
0.900
TBD
1.575
kΩ
Rusba
USB D+ pull up resistance
While receiving traffic
1.425
TBD
3.090
kΩ
Vohusb
Static Output High
2.8
TBD
3.6
V
TBD
0.3
V
0.2
TBD
Rusbi
Description
Volusb
Static Output Low
Vdi
Differential Input Sensitivity
Vcm
Differential Input Common Mode Range
Vse
Single Ended Receiver Threshold
Cin
Transceiver Capacitance
Iio
Hi-Z State Data Line Leakage
Rps2
PS/2 Pull-up resistance
Rext
External USB Series Resistor
Conditions
On D+ or D- line
In series with each USB pin
V
TBD
TBD
TBD
V
0.8
TBD
2.0
V
TBD
50
pF
TBD
TBD
TBD
uA
3
TBD
7
kΩ
23
TBD
25
Ω
DC General Purpose IO Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 3.0V to 5.5V and
0°C ≤ TA ≤ 70°C. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only.
Table 8. 3.0V and 5.5V DC GPIO Specifications
Symbol
RPU
VOH1
VOL
Description
Pull up resistor
High Output Voltage
Port 0, 2, or 3 Pins
High Output Voltage
Port 0, 2, or 3 Pins
High Output Voltage
Port 1 Pins with LDO Regulator Disabled
High Output Voltage
Port 1 Pins with LDO Regulator Disabled
High Output Voltage
Port 1 Pins with LDO Regulator Enabled
High Output Voltage
Port 1 Pins with LDO Regulator Enabled
Low Output Voltage
VIL
VIH
VH
IIL
CIN
Input Low Voltage
Input High Voltage
Input Hysteresis Voltage
Input Leakage (Absolute Value)
Capacitive Load on Pins as Input
COUT
Capacitive Load on Pins as Output
VOH2
VOH3
VOH4
VOH5
VOH6
Document Number: 001-12394 Rev. *D
Conditions
Min
4
OH < 10 µA, Vdd > 3.0V, maximum of Vdd - 0.2
10 mA source current in all IOs.
OH = 1mA Vdd > 3.0, maximum of 20 Vdd - 0.9
mA source current in all IOs.
OH < 10 µA, Vdd > 3.0V, maximum of Vdd - 0.2
10 mA source current in all IOs.
OH = 5mA, Vdd > 3.0V, maximum of 20 Vdd - 0.9
mA source current in all IOs.
OH < 10µA, Vdd > 3.1V, maximum of 4
2.85
IOs all sourcing 5 mA.
OH = 5 mA, Vdd > 3.1V, maximum of
2.2
20 mA source current in all IOs.
–
OL = 20mA, Vdd > 3.3V, maximum of
60 mA sink current on even port pins
(for example, P0[2] and P1[4]) and 60
mA sink current on odd port pins (for
example, P0[3] and P1[5]).
Vdd = 3.3 to 5.5.
–
Vdd = 3.3 to 5.5.
2.0
50
–
Package and pin dependent.
0.5
Temp = 25oC.
Package and pin dependent.
0.5
Temp = 25oC.
Typ
5.6
–
Max
8
–
Units
kΩ
V
–
–
V
–
–
V
–
–
V
3.0
3.15
V
–
–
V
–
0.75
V
–
–
60
1
1.7
0.8
200
25
5
V
V
mV
nA
pF
1.7
5
pF
Page 17 of 26
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CY7C6435x
CY7C64345, CY7C6431x
PRELIMINARY
DC POR and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 9. DC POR and LVD Specifications
Symbol
Description
VPPOR
Vdd Value for PPOR Trip
PORLEV[1:0] = 10b, HPOR = 1
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
Vdd Value for LVD Trip
VM[2:0] = 000b
VM[2:0] = 001b
M[2:0] = 010b(8)
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
Min
Typ
Max
Units
–
2.82
2.95
V
–
–
2.85
2.95
3.06
–
–
4.62
–
–
2.92
3.02
3.13
–
–
4.73
–
–
2.99
3.09
3.20
–
–
4.83
–
–
V
V
V
–
–
V
DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 10.DC Programming Specifications
Symbol
VddIWRITE
IDDP
VILP
VIHP
IILP
Description
Supply Voltage for Flash Write Operations
Supply Current During Programming or Verify
Input Low Voltage During Programming or Verify
Input High Voltage During Programming or Verify
Input Current when Applying Vilp to P1[0] or P1[1] During
Programming or Verify(9)
IIHP
Input Current when Applying Vihp to P1[0] or P1[1] During
Programming or Verify(10)
VOLV
Output Low Voltage During Programming or Verify
VOHV
Output High Voltage During Programming or Verify
FlashENPB Flash Write Endurance(11)
FlashDR
Flash Data Retention(12)
Min
3.0
–
–
VIH
–
Typ
–
5
–
–
–
Max
–
25
VIL
–
0.2
Units
V
mA
V
V
mA
–
–
1.5
mA
–
Vdd - 1.0
50,000
10
–
–
–
20
Vss + 0.75
Vdd
–
–
V
V
Cycles
Years
Notes
8. Always greater than 50 mV above VPPOR (PORLEV = 10) for falling supply.
9. Driving internal pull down resistor.
10. Driving internal pull down resistor.
11. Erase/write cycles per block.
12. Following maximum Flash write cycles.
Document Number: 001-12394 Rev. *D
Page 18 of 26
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PRELIMINARY
CY7C6435x
CY7C64345, CY7C6431x
AC Electrical Characteristics
AC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 11.AC Chip-Level Specifications
Symbol
FMAX
FCPU
F32K1
FIMO24
FIMO12
FIMO6
DCIMO
TRAMP
Description
Maximum Operating Frequency(13)
Maximum Processing Frequency(14)
Internal Low Speed Oscillator Frequency
Internal Main Oscillator Stability for 24 MHz ± 5%(15)
Internal Main Oscillator Stability for 12 MHz(16)
Internal Main Oscillator Stability for 6 MHz(17)
Duty Cycle of IMO
Supply Ramp Time
Min
24
24
30.4
22.8
11.4
5.7
40
0
Typ
–
–
32
24
12
6.0
50
–
Max
–
–
33.6
25.2
12.6
6.3
60
–
Units
MHz
MHz
kHz
MHz
MHz
MHz
%
μs
Min
Typ
Max
Units
Table 12.AC Characteristics – USB Data Timings
Symbol
Description
Conditions
Tdrate
Full-speed data rate
Average bit rate
12–0.25%
12
12 + 0.25
MHz
Tdjr1
Receiver data jitter tolerance
To next transition
-8
TBD
8
ns
Tdjr2
Receiver data jitter tolerance
To pair transition
-5
TBD
5
ns
Tudj1
Driver differential jitter
To next transition
-3.5
TBD
3.5
ns
Tudj2
Driver differential jitter
To pair transition
-4.0
TBD
4.0
ns
Tfdeop
Source jitter for differntial transition
To SE0 transition
-2
TBD
5
ns
175
Tfeopt
Source SE0 interval of EOP
160
TBD
Tfeopr
Receiver SE0 interval of EOP
82
TBD
Tfst
Width of SE0 interval during differential
transition
ns
ns
TBD
14
ns
Min
Typ
Max
Units
Table 13.AC Characteristics – USB Driver
Symbol
Description
Conditions
Tr
Transition rise time
50 pF
4
TBD
20
ns
Tf
Transition fall time
50 pF
4
TBD
20
ns
TR
Rise/fall time matching
90.00
TBD
111.11
%
Vcrs
Output signal crossover voltage
1.3
TBD
2.0
V
Notes
13. Vdd = 3.0V and TJ = 85oC, digital clocking functions.
14. Vdd = 3.0V and TJ = 85oC, CPU speed.
15. Trimmed for 3.3V operation using factory trim values.
16. Trimmed for 3.3V operation using factory trim values.
17. Trimmed for 3.3V operation using factory trim values.
Document Number: 001-12394 Rev. *D
Page 19 of 26
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PRELIMINARY
CY7C6435x
CY7C64345, CY7C6431x
AC General Purpose IO Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 14.AC GPIO Specifications
Symbol
Description
FGPIO
GPIO Operating Frequency
TRise023 Rise Time, Strong Mode
Ports 0, 2, 3
TRise1
Rise Time, Strong Mode
Port 1
TFall
Fall Time, Strong Mode
All Ports
Conditions
Normal Strong Mode, Port 1
Vdd = 3.3 to 5.5V, 10% - 90%
Min
0
15
Typ
–
–
Max
12
80
Units
MHz
ns
Vdd = 3.3 to 5.5V, 10% - 90%
7
–
50
ns
Vdd = 3.3 to 5.5V, 10% - 90%
7
–
50
ns
Figure 8. GPIO Timing Diagram
90%
GPIO
Pin
Output
Voltage
10%
TFall
TRise023
TRise1
AC External Clock Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 15.AC External Clock Specifications
Symbol
Description
Min
Typ
Max
Units
FOSCEXT
Frequency
0.750
–
25.2
MHz
–
High Period
20.6
–
5300
ns
–
Low Period
20.6
–
–
ns
–
Power Up IMO to Switch
150
–
–
μs
Document Number: 001-12394 Rev. *D
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CY7C64345, CY7C6431x
PRELIMINARY
AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 16.AC Programming Specifications
Symbol
TRSCLK
TFSCLK
TSSCLK
THSCLK
FSCLK
TERASEB
TWRITE
TDSCLK
TDSCLK3
TDSCLK2
Description
Rise Time of SCLK
Fall Time of SCLK
Data Set up Time to Falling Edge of SCLK
Data Hold Time from Falling Edge of SCLK
Frequency of SCLK
Flash Erase Time (Block)
Flash Block Write Time
Data Out Delay from Falling Edge of SCLK
Data Out Delay from Falling Edge of SCLK
Data Out Delay from Falling Edge of SCLK
Min
1
1
40
40
0
–
–
–
–
–
Typ
–
–
–
–
–
–
–
–
–
–
Max
20
20
–
–
8
18
25
45
50
70
Units
ns
ns
ns
ns
MHz
ms
ms
ns
ns
ns
AC SPI Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 17.AC SPI Specifications
Symbol
Description
Min
Typ
Max
Units
–
–
8.2
MHz
Maximum Input Clock Frequency Selection, Slave
–
–
4.1
MHz
Width of SS_ Negated Between Transmissions
50
–
–
ns
FSPIM
Maximum Input Clock Frequency Selection, Master(18)
FSPIS
TSS
AC I2C Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 18.AC Characteristics of the I2C SDA and SCL Pins
Symbol
Description
SCL Clock Frequency
FSCLI2C
THDSTAI2C Hold Time (repeated) START Condition. After this period, the first
clock pulse is generated.
TLOWI2C
LOW Period of the SCL Clock
THIGHI2C HIGH Period of the SCL Clock
TSUSTAI2C Set-up Time for a Repeated START Condition
THDDATI2C Data Hold Time
TSUDATI2C Data Set-up Time
TSUSTOI2C Set-up Time for STOP Condition
Bus Free Time Between a STOP and START Condition
TBUFI2C
Pulse Width of spikes are suppressed by the input filter.
TSPI2C
Standard Mode
Min
Max
0
100
4.0
–
4.7
4.0
4.7
0
250
4.0
4.7
–
–
–
–
–
–
–
–
–
Fast Mode
Min
Max
0
400
0.6
–
1.3
0.6
0.6
0
100(19)
0.6
1.3
0
–
–
–
–
–
–
–
50
Units
kHz
μs
μs
μs
μs
μs
ns
μs
μs
ns
Notes
18. Output clock frequency is half of input clock rate.
19. A Fast mode I2C-bus device can be used in a standard mode I2C-bus system, but the requirement tSU;DAT ≥ 250 ns must then be met. This is automatically the case if the device does not stretch the
LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the
Standard-Mode I2C-bus specification) before the SCL line is released.
Document Number: 001-12394 Rev. *D
Page 21 of 26
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CY7C6435x
CY7C64345, CY7C6431x
PRELIMINARY
Figure 9. Definition for Timing for Fast/Standard Mode on the I2C Bus
SDA
TLOWI2C
TSUDATI2C
THDSTAI2C
TSPI2C
TBUFI2C
SCL
S THDSTAI2C THDDATI2C THIGHI2C
TSUSTAI2C
Sr
TSUSTOI2C
P
S
Package Diagram
This chapter illustrates the packaging specifications for the enCoRe V USB device, along with the thermal impedances for each
package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the enCoRe V emulation tools and their dimensions, refer to the development kit.
Packaging Dimensions
Figure 10. 16-Lead (3x3 x 0.6 mm) QFN
Document Number: 001-12394 Rev. *D
Page 22 of 26
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PRELIMINARY
CY7C6435x
CY7C64345, CY7C6431x
Figure 11. 32-Lead (5x5 x 0.6 mm) QFN
001-06335 **
Document Number: 001-12394 Rev. *D
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CY7C6435x
CY7C64345, CY7C6431x
PRELIMINARY
Figure 12. 48-Lead (7x7 mm) QFN
SOLDERABLE
EXPOSED
PAD
NOTES:
1.
HATCH AREA IS SOLDERABLE EXPOSED METAL.
2. REFERENCE JEDEC#: MO-220
3. PACKAGE WEIGHT: 0.13g
4. ALL DIMENSIONS ARE IN MM [MIN/MAX]
5. PACKAGE CODE
PART #
DESCRIPTION
LF48A
LY48A
STANDARD
LEAD FREE
UNLESS OTHERWISE SPECIFIED
ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]
STANDARD TOLERANCES ON:
ANGLES
DECIMALS
.XX
-+
-+
.XXX
-+
.XXXX +
-
DESIGNED BY
DRAWN
CHK BY
DATE
JSO
DATE
02/02/07
CYPRESS 51-85152 *B
DATE
001-12919
*A COMPANY CONFIDENTIAL
TITLE
APPROVED BY
DATE
APPROVED BY
DATE
MATERIAL
SIZE
48LD QFN 7 X 7mm PACKAGE OUTLINE
(SUBCON PUNCH TYPE PKG with 5.1 X 5.1 EPAD)
PART NO.
SEE NOTES
DWG NO
R
001-12919
.
Document Number: 001-12394 Rev. *D
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CY7C6435x
CY7C64345, CY7C6431x
PRELIMINARY
Thermal Impedances
Table 19.Thermal Impedances per Package
Package
16 QFN
32 QFN**
48 QFN**
Typical θJA *
46 oC/W
14.5 oC/W
28 oC/W
* TJ = TA + Power x θJA
** To achieve the thermal impedance specified for the ** package,
solder the center thermal pad to the PCB ground plane.
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 20.Solder Reflow Peak Temperature
Package
Minimum Peak
Temperature*
Maximum Peak
Temperature
16 QFN
240oC
260oC
32 QFN
240oC
260oC
48 QFN
240oC
260oC
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5oC with Sn-Pb or 245 ± 5oC with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications.
Ordering Information
Ordering Code
Package
Information
Flash
SRAM
No. of GPIOs
CY7C64315-16LKXC
16-lead QFN
(3x3x0.6mm)
16K
1K
11
Mid-tier FS USB dongle, RC-host
module
CY7C64316-16LKXC
16-lead QFN
(3x3x0.6mm)
32K
2K
11
Hi-end FS USB dongle, RC-host
module
CY7C64345-32LKXC
32-lead QFN
(5x5x0.6mm)
16K
1K
25
Full-speed USB mouse
CY7C64355-48LFXC
48-lead QFN
(7x7x1.0mm)
16K
1K
36
Full-speed USB keyboard
CY7C64356-48LFXC
48-lead QFN
(7x7x1.0mm)
32K
2K
36
Hi-End FS USB keyboard
Document Number: 001-12394 Rev. *D
Target Applications
Page 25 of 26
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PRELIMINARY
CY7C6435x
CY7C64345, CY7C6431x
Document History Page
Document Title: CY7C6431X, CY7C64345, CY7C6435X ENCORE TM V FULL-SPEED USB CONTROLLER
Document Number: 001-12394
REV.
ECN.
Orig. of
Change
**
626256
TYJ
*A
735718
TYJ/ARI
Filled in TBDs, added new block diagram, and corrected some values. Part numbers updated as
per new specifications.
*B
1120404
ARI
Corrected the block diagram and Figure 3, which is the 16-pin enCoRe V device. Corrected the
description to pin 29 on Table 2, the Typ/Max values for ISB0 on the DC chip-level specifications,
the current value for the latch-up current in the Electrical Characteristics section, and corrected
the 16 QFN package information in the Thermal Impedance table.
Corrected some of the bulleted items on the first page.
Added DC Characteristics–USB Interface table.
Added AC Characteristics–USB Data Timings table.
Added AC Characteristics–USB Driver table.
Corrected Flash Write Endurance minimum value in the DC Programming Specifications table.
Corrected the Flash Erase Time max value and the Flash Block Write Time max value in the AC
Programming Specifications table.
Implemented new latest template.
Include paramters: Vcrs, Rpu (USB, active), Rpu (USB suspend), Tfdeop, Tfeopr2, Tfeopt, Tfst.
Added register map tables.
Corrected a value in the DC Chip-Level Specifications table.
*C
1241024
TYJ/ARI
*D
1639963
AESA
Description of Change
New data sheet.
Corrected Idd values in Table 6 - DC Chip-Level Specifications.
Post to www.cypress.com
© Cypress Semiconductor Corporation, 2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any
circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical,
life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical
components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-12394 Rev. *D
Revised October 17, 2007
Page 26 of 26
PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered
trademarks referenced herein are property of the respective corporations. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the
Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. All products and company names
mentioned in this document may be the trademarks of their respective holders.
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