APL5601/5602 Low Dropout 600mA Fixed Voltage Linear Regulator Features General Description • Low Dropout Voltage: 220mV (Typical) @600mA • Wide Input Voltage from 2.9V~6.5V The APL5601/5602 family of low-power and low dropout linear regulators which operate from 2.9V to 6.5V input • Low Quiescent Current: 140µA • Output Voltage Range : 1~5V • Fixed Output Voltage with 2% Accuracy • Stable with a Low ESR, 2.2µF Output Capacitance • Short Circuit Current-Limit • Over-Temperature Protection • Current-Limit Protection • Internal Soft-Start voltage and deliver up to 600mA output current. Typical dropout voltage is only 220mV (typical) at 600mA output. The APL5601/5602 regulators with low 140µA quiescent current are ideal for battery-powered system appliances. The APL5601/5602 regulators are stable with a 2.2µF ceramic capacitor. The features of current-limit, short circuit current-limit, and over-temperature protection protect the device against currnet over loads and overtemperature. • SOT-23-3, SOT-89, and SOT-223 Packages • Lead Free and Green Devices Available The APL5601/5602 regulators come in SOT-23-3, SOT89, and SOT-223 packages. Simplified Application Circuit (RoHS Compliant) Applications APL5601/5602 VIN • • CD/DVD-ROM, CD-R/W VIN COUT 1µF • Set-Top Box • PC Peripherals • Battery-Powered System VOUT CIN Networking System, LAN Card, ADSL/Cable Modem VOUT GND 2.2µF Pin Configuration APL5601 GND 1 GND 1 VIN (Tab) VIN 2 VOUT 3 APL5602 APL5601 VIN 2 VOUT 3 VOUT 1 VOUT 1 VIN GND 2 (Tab) VIN 3 GND (Tab) GND 2 SOT-223 (Top View) SOT-89 (Top View) APL5601 APL5602 GND (Tab) VIN 3 SOT-89 (Top View) SOT-223 (Top View) GND 1 3 VIN VOUT 2 SOT-23-3 (Top View) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 1 www.anpec.com.tw APL5601/5602 Ordering and Marking Information Voltage Code (Note 1) 10 : 1.0V 12 : 1.2V 15 : 1.5V 18 : 1.8V 25 : 2.5V 28 : 2.8V 30 : 3.0V 31 : 3.1V 33 : 3.3V 48 : 4.8V 50 : 5.0V Package Code A : SOT-23-3 D : SOT-89 V : SOT-223 Operating Ambient Temperature Range I : -40 to 85 oC H : -40 to 125oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APL5601/2 Assembly Material Handling Code Temperature Range Package Code Voltage Code APL5601 XXXXX VV APL5601/2 D/V: APL5602 XXXXX VV XXXXX - Date Code VV - Voltage Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Note 1: For other voltage versions please contact ANPEC for details. Marking for SOT-23-3 Product Name Marking APL5601-10A 61aX APL5601-12A 615X APL5601-15A 619X APL5601-18A 61CX APL5601-25A 61JX APL5601-28A 61MX APL5601-30A 61OX APL5601-31A 61PX APL5601-33A 61RX APL5601-48A 61XX APL5601-50A 61ZX Note: The last character in the Marking, “X”, refers to date code. Absolute Maximum Ratings Symbol VIN VOUT (Note 2) Parameter VIN Supply Voltage (VIN to GND) Output Voltage (VOUT to GND) PD Power Dissipation TJ Maximum Junction Temperature Rating Unit -0.3 to 7 V -0.3 to VIN+0.3 V Internally Limited TSTG Storage Temperature Range TSDR Maximum Lead Soldering Temperature, 10 Seconds 150 o -65 to 150 o 260 o C C C Note 2: Stresses beyond the absolute maximum rating may damage the device and exposure to absolute maximum rating conditions for extended periods may affect device reliability. Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 2 www.anpec.com.tw APL5601/5602 Thermal Characteristics (Note 3, 4) Symbol Parameter Typical Value Unit Junction to Air Thermal Resistance θJA SOT-23-3 SOT-89 SOT-223 260 180 135 SOT-23-3 SOT-89 SOT-223 130 40 15 °C/W Junction to Case Thermal Resistance θJC Note 3: At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values. The junction-to-ambient thermal resistance is measured on a PC board mounting with the device soldered down to minimum copper area. If power dissipation causes the junction temperature to exceed specified limits, the device will go into thermal shutdown. Note 4: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD (max) = (TJ – TA) / θJA; TJ = 125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature. Recommended Operating Conditions Symbol Parameter Range Unit 2.9 to 6.5V V Output Cur rent 0 to 0.6 A Input Capacitor 0.82 to 470 µF 1 to 33 0 µF Ju nction Tempera ture -40 to 125 °C Ambien t Tempe rature (Temperature Code:I) -40 to 85 °C Ambien t Tempe rature (Temperature Code:H) -40 to 125 °C VIN VIN Supply Voltage I OUT C IN C OUT TJ TA Output Cap acitor Electrical Characteristics Refer to the typical application circuit. V IN = VOUT+1V or (Minimum VIN=2.9V ), IOUT = 1mA, T A = -40 to 85°C , unle ss o therwise specified. Typical va lues are at TA = 25 °C. AP L5601/APL5602 Symbol Pa ram eter Test Conditions Unit Min. Typ. Max. - 140 220 µA 2.1 2.5 2.9 V - 0.15 - V T A = 25°C -1 - +1 T A = -40 to 8 5°C -2 - +2 SUPP LY CURRENT IQ Quie scent Cu rrent V IN =5V, IOUT =0mA UNDER-VOLTAGE-LOCKOUT VIN UVLO Threshol d V IN rising VIN UVLO Hysteresis OUTPUT VOLTAGE VOUT VDROP Output Vol tag e %VOUT Line Regul ati on V IN = V OUT + 1V to 6V - 0.03 0.19 %/V Load Regu lation I OUT = 1mA to 600mA - 0.6 1.5 %/A V OUT=2 .8V, I OUT=600mA - 240 500 V OUT=3 .3V, I OUT=600mA - 220 450 V OUT=5 V, I OU T=600mA - 200 420 Dropout Vo lta ge Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 3 mV www.anpec.com.tw APL5601/5602 Electrical Characteristics(Cont.) Refer to the typical app lication circu it. VIN = VOUT +1V or (Minimum VIN=2.9V) , I OUT = 1mA, T A = -40 to 85 °C , unless otherwise specified. Typical values are at TA = 25 °C. APL56 01/AP L5 602 S ymbol Parameter Test Conditions Unit Min. Typ. Max. - 55 - dB 700 - - mA Thermal Shutdown Temperature - 150 - °C Thermal Shutdown Hysteresis - 40 - °C - 250 - mA - 130 300 µs OUTPUT VOLTAGE (Cont.) PSRR Power Supply Ripple Reje ction V IN = VOUT + 2V, f = 1kHz SOFT-S TART AND PROTECTIO N I LIM Output Cu rrent Limit Shor t Circu it Curren t Limit T SS V OUT < 0 .6V Soft-Start Time Refer to the typical app lication circuit. VIN = VOUT +1V or (Minimum VIN=2.9V ), I OUT = 1mA, T A = -40 to 125°C , unless othe rwise specified. Typical values are at TA = 25 °C. AP L5601/APL5602 S ymbol Parameter Te st Conditions Unit Min. Typ. Max. - 140 300 2.1 2.5 2.9 V - 0.1 5 - V SUPP LY CURRENT IQ Q uiescent Current VIN=5V , I OUT =0mA µA UNDER-VOLTAGE-LOCKOUT V IN UVLO Th reshold VIN r isin g V IN UVLO Hysteresis OUTPUT VOLTAGE VOUT V DROP TA = 25°C -1 - +1 TA = -40 to 125°C -3 - +3 L ine Regulation VIN = V OU T + 1V to 6V - 0.0 3 0.3 % /V Load Regulation IOUT = 1mA to 600mA - 0.6 2 % /A VOUT=2.8V, I OUT=600mA - 240 550 VOUT=3.3V, I OUT=600mA - 220 500 VOUT=5V, I OUT =600mA - 200 470 700 - - mA - 250 - mA - 130 400 µs O utput Voltage Dropout Voltage % VOUT mV SOFT-S TART AND PROTECTIO N I LIM O utput Current Limit S hort Circuit Current L imi t T SS VOUT < 0.6V S oft-Sta rt Time Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 4 www.anpec.com.tw APL5601/5602 Typical Operating Characteristics VIN=5V, VOUT=3.3V, CIN=1µF, COUT=2.2µF, TA=25OC, unless otherwise specified. VIN to VOUT Dropout vs. Junction Temperature Quiescent Current vs. Input Voltage 350 200 VIN to VOUT Dropout, VDROP (V) Quiescent Current (µA) IOUT=0mA 160 120 80 40 1 2 3 4 5 250 200 IOUT=600mA 150 IOUT=400mA 100 50 IOUT=200mA 0 -50 0 0 VOUT=3.3V 300 6 -25 25 50 75 100 125 150 o Junction Temperature, TJ ( C) Input Voltage, VIN (V) VIN to VOUT Dropout vs. Junction Temperature Current-Limit vs. Junction Temperature 300 1.8 VOUT=5V VIN=5V 1.6 250 1.4 Current-Limit, ILIM (A) VIN to VOUT Dropout, VDROP (V) 0 200 IOUT=600mA 150 100 IOUT=400mA 50 -25 0 25 1 0.8 0.6 VIN=3.3V 0.4 0.2 IOUT=200mA 0 -50 1.2 50 75 100 125 0 150 -50 o -25 0 25 50 75 100 125 150 o Junction Temperature, TJ ( C) Junction Temperature, TJ ( C) Power Supply Ripple Rejection 0 -10 VIN=3.3V, VOUT=1.8V, CIN=1µF, COUT=2.2µF, IOUT=500mA PSRR (dB) -20 -30 -40 -50 -60 -70 -80 1000 10000 100000 Frequency (Hz) Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 5 www.anpec.com.tw APL5601/5602 Operating Waveforms VIN=5V, VOUT=3.3V, CIN=1µF, COUT=2.2µF, TA=25OC, unless otherwise specified. Power Off Power On VVININ VIN 1 1 VSET VOUT 2 VOUT 2 VOUT IOUT IOUT IOUT 3 3 CH1 : VIN , 2V/div CH2 : VOUT , 2V/div CH3 : IOUT , 500mA/div Time : 1ms/div CH1 : VIN , 2V/div CH2 : VOUT , 2V/div CH3 : IOUT , 500mA/div Time : 200ms/div Line Transient Load Transient VIN=5V, VOUT=3.3V CIN=1µF, COUT=2.2µF, IOUT rising/falling time=1µs 1 VIN=4.5~6V, VIN rising/falling=10µs, IOUT=300mA VOUT VIN IOUT 1 2 VOUT 2 CH1 : VOUT , 100mV/div (offset=3.3V) CH2 : IOUT , 200mV/div Time : 200µs/div Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 CH1 : VIN , 2V/div CH2 : VOUT , 20mV/div (offset=3.3V) Time : 200µs/div 6 www.anpec.com.tw APL5601/5602 Operating Waveforms (Cont.) VIN=5V, VOUT=3.3V, CIN=1µF, COUT=2.2µF, TA=25OC, unless otherwise specified. Thermal Shutdown Current-Limit and Short Circuit Current-Limit VIN 1 VIN VOUT 1 VOUT 2 2 IOUT IOUT 3 3 CH1 : VIN , 5V/div CH2 : VOUT , 2V/div CH3 : IOUT , 1A/div Time : 2ms/div CH1 : VIN , 5V/div CH2 : VOUT , 2V/div CH3 : IOUT , 500mA/div Time : 500ms/div Pin Description PIN NO. FUNCTION NAME 1 VIN 2 VOUT Input Supply Pin. Supply voltage can range from 2.9V to 6.5V. Bypass with a 1µF capacitor to the GND Regulator Output. Sources up to 600mA. A small capacitor is needed from this pin to ground to assure stability. 3 GND Ground. Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 7 www.anpec.com.tw APL5601/5602 Block Diagram VIN Current-Limit UVLO and Soft-Start VREF 0.8V VOUT Thermal Shutdown Short Circuit Current-Limit GND Typical Application Circuit APL5601/5602 VOUT VIN VOUT VIN CIN 1µF Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 COUT 2.2µF GND 8 www.anpec.com.tw APL5601/5602 Function Description Under Voltage Lockout (UVLO) Thermal Shutdown The APL5601/5602 regulators have built-in under-volt- A thermal shutdown circuit limits the junction tempera- age lock-out circuits to keep the output shuting off until internal circuitry is operating properly. The UVLO function ture of APL5601/5602. When the junction temperature exceeds +150oC, the thermal shutdown circuitry disables initiates a soft-start process after input voltage exceeds its rising UVLO threshold during power on. Typical UVLO the output, allowing the device to cool down. The output circuitry is enabled again after the junction temperature threshold is 2.5V with 0.15V hysteresis. cools down by 40oC, resulting in a pulsed output during continuous thermal overload conditions. Thermal pro- Soft-Start tection is designed to protect the IC in the event of over temperature conditions. For reliable operation, the junc- The APL5601/5602 provide an internal soft-start circuitry tion temperature cannot exceed TJ=+125 oC. to control rise rate of the output voltage and limit the current surge during start-up. Approximate 20µs delay time after the VIN is over the UVLO threshold, the output voltage starts the soft-start. The typical soft-start interval is about 130µs. Current-Limit The APL5601/5602 provides a current-limit circuitry, which monitors and controls P-MOS’s gate voltage, limiting the output current to 700mA. For reliable operation, the device should not be operated in current-limit for extended period. Short Circuit Current-Limit When the output voltage drops below 0.6V, which is caused by the over load or short circuit, the internal short circuit current-limit circuitry limits the output current down to 250mA. The short circuit current-limit is used to reduce the power dissipation during short circuit condition. In some high VIN-VOUT conditions, if the junction temperature is over the thermal shutdown temperature, the device will enter the thermal shutdown. Please refer to the section on thermal considerations for power dissipation calculations. The short circuit current-limit has a blanking time feature after the UVLO threshold is reached, so that it will avoid the output causing short circuit currentlimit protection during start-up; the blanking time is about 600µs. Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 9 www.anpec.com.tw APL5601/5602 Application Information For normal operation, do not exceed the maximum operating junction temperature of TJ=125 oC. The calculated Input Capacitor The APL5601/5602 require proper input capacitors to power dissipation should be less than: supply surge current during stepping load transients to prevent the input rail from dropping. Because the para- PD =(125-25)/260 = 0.38(W) sitic inductor from the voltage sources or other bulk capacitors to the VIN limits the slew rate of the surge current, The pin 3 of the SOT-23 and the tabs (and pin 2) of the SOT-89 and SOT-223 provide an electrical connections it is necessary to place the input capacitors near VIN as close as possible. Input capacitors should be larger than and channel heat away. Connect the pins and tabs to a large area copper plane on PCBs for better heat 0.82µF. dissipation. Output Capacitor Layout Consideration The APL5601/5602 need a proper output capacitor to maintain circuit stability and to improve transient response Figure 1 illustrates the layout. Below is a checklist for your layout: over temperature and current. In order to insure the circuit stability, the proper output capacitor value should be 1. Please place the input capacitors close to the VIN. 2. Ceramic capacitors for load must be placed near the larger than 1µF. With X5R and X7R dielectrics, 2.2µF is sufficient at all operating temperatures. Maximum output load as close as possible. 3. To place APL5601/5602 and output capacitors near the capacitor should be less than 330µF to insure the system can be powered on successfully. load is good for performance. 4. Large current paths, the bold lines in figure 1, must 100 Instable region ESR (Ω) 10 have wide tracks. 1 APL5601/5602 0.1 Stable region VIN 0.01 VIN 0.001 0.0001 CIN Untested 1 10 100 Output Capacitor(µF) VOUT VOUT COUT GND 1000 Operation Region and Power Dissipation Figure 1. The APL5601/5602 maximum power dissipation de- Recommended Minimum Footprint pends on the thermal resistance and temperature difference between the die junction and ambient air. The power 0.076 0.126 0.067 junction and ambient air. θJA is the thermal resistance between junction and ambient air. Assuming the TA=25oC, maximum TJ=150oC (typical thermal limit threshold) and θJA=260oC/W (SOT-23-3), so the maximum power dissi- 0.091 pation is calculated as: 0.038 Unit : Inch PD(max)=(150-25)/260 = 0.48(W) Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 0.067 0.164 where (TJ-TA) is the temperature difference between the 0.104 0.277 PD = (TJ - TA) / θJA 0.140 dissipation PD across the device is: SOT-223 10 0.059 0.022 Unit : Inch SOT-89 www.anpec.com.tw APL5601/5602 Application Information (Cont.) Recommended Minimum Footprint (Cont.) 0.057 0.037 0.102 0.024 0.074 Unit : Inch SOT-23-3 Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 11 www.anpec.com.tw APL5601/5602 Package Information SOT-23-3 D e E E1 SEE VIEW A c b 0.25 A L GAUGE PLANE SEATING PLANE 0 A1 A2 e1 VIEW A S Y M B O L SOT-23-3 INCHES MILLIMETERS MIN. MIN. MAX. A MAX. 0.057 1.45 A1 0.00 0.15 0.000 0.006 A2 0.90 1.30 0.035 0.051 b 0.30 0.50 0.012 0.020 c 0.08 0.22 0.003 0.009 D 2.70 3.10 0.106 0.122 E 2.60 3.00 0.102 0.118 E1 1.40 1.80 0.055 e 0.95 BSC e1 0.071 0.037 BSC 1.90 BSC 0.075 BSC L 0.30 0.60 0 0° 8° 0.012 0° 0.024 8° Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 12 www.anpec.com.tw APL5601/5602 Package Information SOT-89 A C L H E E1 D D1 e e1 B B1 SOT-89 S Y M B O L A MIN. MAX. MIN. MAX. 1.40 1.60 0.055 0.063 MILLIMETERS INCHES B 0.44 0.56 0.017 0.022 B1 0.36 0.48 0.014 0.019 C 0.35 0.44 0.014 0.017 D 4.40 4.60 0.173 0.181 D1 1.62 1.83 0.064 0.072 0.102 0.090 E 2.29 2.60 0.090 E1 2.13 2.29 0.084 e 1.50 BSC 0.059 BSC e1 3.00 BSC 0.118 BSC H 3.94 4.25 0.155 0.167 L 0.89 1.20 0.035 0.047 Note : Follow JEDEC TO-243 AA. Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 13 www.anpec.com.tw APL5601/5602 Package Information SOT-223 D b2 E E1 SEE VIEW A e c 0.25° L b 0 A A1 A2 e1 GAUGE PLANE SEATING PLANE VIEW A S Y M B O L SOT-223 MILLIMETERS MIN. INCHES MAX. A MIN. MAX. 1.80 0.071 A1 0.02 0.10 0.001 0.004 A2 1.50 1.70 0.059 0.067 b 0.66 0.84 0.026 0.033 b2 2.90 3.10 0.114 0.122 c 0.23 0.33 0.009 0.013 D 6.30 6.70 0.248 0.264 E 6.70 7.30 0.264 0.287 E1 3.30 3.70 0.130 0.146 e 2.30 BSC e1 4.60 BSC L 0 0.091 BSC 0.181 BSC 0.030 0.75 0° 0° 10 ° 10 ° Note : 1. Follow from JEDEC TO-261 AA. 2. Dimension D and E1 are determined at the outermost extremes of the plastic exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 14 www.anpec.com.tw APL5601/5602 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 OD1 B A B T SECTION A-A SECTION B-B H A d T1 Application SOT-23-3 Application SOT-89 Application SOT-223 A H T1 C d D W E1 F 178.0±2.00 50 MIN. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00 -0.40 3.20±0.20 3.10±0.20 1.50± 0.20 A H T1 C d D W E1 F 178.0±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. P0 P1 P2 D0 D1 T A0 B0 K0 4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 4.80±0.20 4.50±0.20 1.80± 0.20 A H T1 C d D W E1 F 320.0±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. P0 P1 P2 D0 D1 T A0 B0 K0 2.00±0.50 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 6.90±0.20 7.50±0.20 2.10± 0.20 4.00±0.10 8.00±0.10 12.0±0.30 1.75±0.10 12.00±0.30 1.75±0.10 5.50± 0.05 5.50± 0.05 (mm) Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 15 www.anpec.com.tw APL5601/5602 Devices Per Unit Package type Unit Quantity SOT-23-3 Tape & Reel 3000 SOT-89 Tape & Reel 1000 SOT-223 Tape & Reel 2500 Taping Direction Information SOT-23-3 USER DIRECTION OF FEED SOT-89 USER DIRECTION OF FEED SOT-223 USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 16 www.anpec.com.tw APL5601/5602 Classification Profile Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3°C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time 25°C to peak temperature * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 17 www.anpec.com.tw APL5601/5602 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness <2.5 mm ≥2.5 mm Volume mm <350 235 °C 220 °C 3 Volume mm ≥350 220 °C 220 °C 3 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm ≥2.5 mm Volume mm <350 260 °C 260 °C 250 °C 3 Volume mm 350-2000 260 °C 250 °C 245 °C 3 Volume mm >2000 260 °C 245 °C 245 °C 3 Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Description 5 Sec, 245°C 1000 Hrs, Bias @ Tj=125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM≧2KV VMM≧200V 10ms, 1tr≧100mA Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.7 - Jun., 2012 18 www.anpec.com.tw