BM78 Bluetooth® 4.2 Dual-Mode Module Features • Bluetooth Classic (BR/EDR) and Low Energy (LE) • Certified to FCC, IC, MIC, KCC, and NCC radio regulations • European R&TTE Directive Assessed Radio module • Bluetooth SIG 4.2 qualified • Transparent UART mode for seamless serial data over UART interface • Easy to configure with User Interface (UI) tool, a Windows® configuration utility or directly by MCUs • Firmware can be upgraded in the field over UART (Flash version) • Integral chip antenna (BM78SPPS5MC2/NC2) or external antenna (BM78SPP05MC2/NC2) • Integrated crystal, internal voltage regulator, and matching circuitry • Configurable I/O pins for control and status • Supports Apple® iPod Accessory Protocol (iAP2), (only BM78SPPx5MC2) • Supports Bluetooth 4.2 LE secure connections • Bluetooth 4.2 LE data packet length extension • Small and compact surface mount module • Castellated SMT pads for easy and reliable PCB mounting • Ideal for portable battery operated devices • One LED driver with 16 steps brightness control RF/Analog • Frequency: 2.402 GHz to 2.480 GHz • Receive Sensitivity: -90 dBm (BR/EDR), -92 dBm (LE) • Class 2 output power (+1.5 dBm typical) MAC/Baseband/Higher Layer • Secure AES128 encryption • Bluetooth 3.0: GAP, SPP, SDP, RFCOMM, and L2CAP • Bluetooth 4.2: GAP, GATT, ATT, SMP, and L2CAP Operating Conditions • Operating voltage range: 3.3V to 4.2V • Operating temperature: -20ºC to +70ºC Applications • • • • • • Internet of Things (IoT) Secure Payment Home and Security Health and Fitness Industrial and Data Logger LED Lighting (16 configurations) Data Throughput Data Throughput at 1 Mbps UART baud rate: • BR/EDR: up to 32 Kbps • LE: up to 7 Kbps Data Throughput at 115200 bps UART baud rate • BR/EDR: upto 10 Kbps • LE: up to 6 Kbps 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 1 BM78 General Description The BM78 module is a fully-certified, Bluetooth version 4.2 module for customers to easily add dual-mode Bluetooth wireless capability to their products. The BM78 is built around Microchip's IS1678 Bluetooth dual-mode module, and it is available in ROM-based (BM78SPPx5NC2) and Flash-based (BM78SPPx5MC2) versions. Refer to Section 9.0 “Ordering Information” for additional information on the BM78 SKUs. The BM78 bridges the customer products to smart phones or tablets for convenient data transfer, control, and access to cloud applications delivering local connectivity for IoT. The BM78 supports GAP, SDP, SPP, and GATT profiles. Data transfer is achieved through the Bluetooth link by sending or receiving data through transparent UART mode, making it easy to integrate with any microprocessor or Microcontroller (MCU) with a UART interface. It also enables a easy configuration by using a UI tool, a Windows configuration utility, or directly through UART by MCUs. DS60001380A-Page 2 Advance Information 2016 Microchip Technology Inc. BM78 Table of Contents 1.0 System Overview ............................................................................................................................................................................ 5 2.0 Application Information ................................................................................................................................................................. 11 3.0 Operating Pattern .......................................................................................................................................................................... 23 4.0 Electrical Characteristics ............................................................................................................................................................... 31 5.0 Radio Characteristics .................................................................................................................................................................... 35 6.0 Physical Dimensions ..................................................................................................................................................................... 37 7.0 Reflow profile ................................................................................................................................................................................ 43 8.0 Module Placement ........................................................................................................................................................................ 45 9.0 Ordering Information ..................................................................................................................................................................... 49 Appendix A: Certification Notices ........................................................................................................................................................ 51 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 3 BM78 NOTES: DS60001380A-Page 4 Advance Information 2016 Microchip Technology Inc. BM78 1.0 SYSTEM OVERVIEW The BM78 module is a fully certified, embedded 2.4 GHz Bluetooth version 4.2 (BR/EDR/LE) wireless module. It includes an on board Bluetooth stack, a power management subsystem, a 2.4 GHz transceiver, and an RF power amplifier. Customers can embed Bluetooth functionality into any applications using the BM78. The BM78 enables rapid product development and faster time to market, and it is designed to provide integrators with the following features: • • • • • Simple integration and programming Reduced development time Superior wireless module with low-cost system Interoperability with Bluetooth host Wide range of applications FIGURE 1-1: The BM78 has four Stock Keeping Units (SKUs). For additional information on SKUs, refer to Section 9.0 “Ordering Information”. The BM78SPPS5MC2/NC2 is a complete and fully regulatory certified module with an integral ceramic chip antenna and RF shield. The BM78SPP05MC2/NC2 is a low-cost alternative with RF out PAD (for external antenna) and no RF shield. The integrator is responsible for the antenna, antenna matching, and regulatory certifications. The BM78 is a small, compact, and surface mounted module with castellated pads for easy and reliable host PCB mounting. It is compatible with standard pick-and-place equipment and can independently maintain a low-power wireless connection. Low power usage and flexible power management maximize the lifetime of the BM78 in battery-operated devices. A wide operating temperature range enables its applications in indoor and outdoor environments. Figure 1-1 illustrates the internal block diagram of the BM78. INTERNAL BLOCK DIAGRAM OF BM78 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 5 BM78 Table 1-1 provides various BM78SPPx5MC2/NC2 module. TABLE 1-1: pins of the PIN DESCRIPTION Description S5 Pin 05 Pin Symbol Type 1 — GND Power Ground reference 2 — GND Power Ground reference 3 1 GND Power Ground reference 4 2 BAT_IN Power Battery Input (3.3V to 4.2V) Main positive supply input Connect to 10 uF (X5R/X7R) capacitor 5 3 SW_BTN DI 6 4 LDO33_O Power Internal 3.3V LDO output, can source no more than 50 mA 7 5 VDD_IO Power I/O positive supply input. Internal use only, do not connect to other devices 8 6 LDO18_O Power Internal 1.8V LDO output. Internal use only, do not connect to other devices 9 7 WAKEUP DI 10 8 PMULDO_O Power Software Button H: Power On L: Power Off Wakeup from Sleep mode (active- low) (internal pull-up) Power management unit output. Internal use only, do not connect to other devices 11 9 P0_4 DO Status Indication pin along with P1_5, refer to Table 2-3 12 10 P1_5 DO Status Indication pin along with P0_4, refer to Table 2-3 13 11 P1_2/SCL DO I2C SCL 14 12 P1_3/SDA DIO I2C SDA 15 13 P1_7/CTS DIO Configurable Control or Indication pin or UART CTS (input) 16 14 P0_5 DIO Configurable Control or Indication pin 17 15 P0_0/RTS DIO Configurable Control or Indication pin or UART RTS (output) 18 16 P2_0 DI System configuration pin along with P2_4 and EAN pins, used to set the BM78 in any one of the following three modes: Application mode (for normal operation), Test mode (to change EEPROM values), and Write Flash mode (to enter the new firmware into the module), refer to Table 2-1 19 17 P2_4 DI System configuration pin along with P2_0 and EAN pins, used to set the module in any one of the following three modes: Application mode (for normal operation), Test mode (to change EEPROM values), and Write Flash mode (to enter new firmware into the module), refer to Table 2-1 A = Analog D = Digital I = Input Legend: DS60001380A-Page 6 O = Output Advance Information 2016 Microchip Technology Inc. BM78 TABLE 1-1: PIN DESCRIPTION (CONTINUED) Description S5 Pin 05 Pin Symbol Type 20 18 EAN DI External address-bus negative System configuration pin along with P2_0 and P2_4 pins, used to set the module in any of the three modes: Application mode (for normal operation), Test mode (to change EEPROM values), and Write Flash mode (to enter new firmware into the module), refer to Table 2-1 ROM: Must be pulled high to VDD_IO FLASH: Must be pulled down with 4.7Kohm to GND 21 19 RST_N DI Module Reset (active-low) (internal pull up) Apply a pulse of at least 63 ns 22 20 RXD DI UART data input 23 21 TXD DO UART data output 24 22 P3_1 DIO Configurable Control or Indication pin (Internally pulled-up, if configured as an input) 25 23 P3_2 DIO Configurable Control or Indication pin (Internally pulled-up, if configured as an input) 26 24 P3_3 DIO Configurable Control or Indication pin (Internally pulled-up, if configured as an input) 27 25 P3_4 DIO Configurable Control or Indication pin (Internally pulled-up, if configured as an input) 28 26 P3_6 DIO Do not connect 29 27 P3_7 DIO Configurable Control or Indication pin (Internally pulled-up, if configured as an input) 30 28 LED1 DO Status LED, connect to LDO33_0 31 29 GND Power — 30 BT_RF AIO 32 Legend: — GND Power A = Analog D = Digital I = Input 2016 Microchip Technology Inc. Ground reference External antenna connection(50 ohms) Ground reference O = Output Advance Information DS60001380A-Page 7 BM78 Figure 1-2 and Figure 1-3 illustrate the pin diagrams of the BM78SPPS5MC2/NC2 and BM78SPP05MC2/NC2 modules. FIGURE 1-2: DS60001380A-Page 8 BM78SPPS5MC2/NC2 PIN DIAGRAM Advance Information 2016 Microchip Technology Inc. BM78 FIGURE 1-3: BM78SPP05MC2/NC2 PIN DIAGRAM 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 9 BM78 NOTES: DS60001380A-Page 10 Advance Information 2016 Microchip Technology Inc. BM78 2.0 APPLICATION INFORMATION 2.1 System Configuration The I/O pins, P2_0, P2_4 and EAN, place the BM78 into operating mode and each of these pins have internal pull up and allow configuration settings and firmware to be updated from UART. Table 2-1 provides system configuration details. TABLE 2-1: SYSTEM CONFIGURATION SETTINGS Module P2_0 P2_4 EAN BM78SPPx5NC2 (ROM Variant) Low High High Write EEPROM and test mode High High High Normal operation/application mode Low Low High Write FLASH Low High Low Write EEPROM and test mode High High Low Normal operational/application mode BM78SPPx5MC2 (Flash Variant) 2.2 Operational Mode Control and Indication I/O Pins The I/O pins, P0_0, P0_5, P1_7, P3_1, P3_2, P3_3, P3_4, and P3_7, are configurable control and indication pins. The control signals are inputs to the BM78 and the indication signals are outputs from the BM78. Table 2-2 provides default I/O pin configuration details. PROFILE_IND INQUIRY CONTROL PAIRING_KEY UART_RX_IND LINK_DROP_CONTROL (DISCONNECT) GET WIFI INFO KEY RSSI_IND LOW_BATTERY_IND UART_CTS(1,2) ■ P0_0 P0_5 CONTROL AND INDICATION I/O PIN ASSIGNMENTS UART_RTS(1,2) N/C PINS TABLE 2-2: ■ ■ P1_7 ■ P3_1 ■ P3_2 ■ P3_3 ■ P3_4 ■ P3_7 Note 1: The RTS pin can only be assigned to P0_0 and the CTS pin can only be assigned to P1_7. 2: The RTS and CTS pins can be configured as GPIOs if flow control is disabled. 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 11 BM78 2.3 Status Indication I/O Pins The I/O pins, P1_5 and P0_4, are status indicator pins: Status_IND_1 and status_IND_2. Together these pins provide status indication to MCUs. Table 2-3 provides status indication of the P1_5 and P0_4 pins. TABLE 2-3: P1_5/STATUS_IND_1 P0_4/STATUS_IND_2 H H Power-on (default setting) and deep-sleep state. HH status should be stable for at least 500 ms. H L Access state L H Link state (UART data transmitting) L L Link state (no UART data transmitted) L = Low H = High Legend: 2.4 STATUS INDICATION Indication Power Tree Figure 2-1 illustrates the power tree diagram of the BM78. FIGURE 2-1: DS60001380A-Page 12 POWER TREE DIAGRAM Advance Information 2016 Microchip Technology Inc. BM78 2.5 Software Button (SW_BTN) The Software Button (SW_BTN) input pin powers the BM78 ON (high) or OFF (low) into the S4 mode. The S4 mode is the Deep-sleep mode and the S2 mode is the FIGURE 2-2: Sleep mode. The S4 mode can only be triggered by the SW_BTN pin, and the power consumption is lower in the S4 mode. Figure 2-2 through Figure 2-4 display the waveforms for the BM78 in the high and low status, that is access and link status. SW_BTN TIME (HIGH) AT APP MODE(1,2,3,4,5) Note 1: MCU can send UART command, refer to Table 2-3. 2: Time duration (475 ms) is for reference purpose only, check the status pin. 3: Reset is ‘no connect’. 4: Time is configured as default setting. 5: Data corresponds to the BM78SPPx5NC2 (ROM variant) module. 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 13 BM78 FIGURE 2-3: SW_BTN TIME (LOW) AT ACCESS STATES(1,2,3) Note 1: Reset is ‘no connect’. 2: Time is configured as default setting. 3: Data corresponds to the BM78SPPx5NC2 (ROM variant) module. FIGURE 2-4: SW_BTN TIME (LOW) AT LINK STATES(1,2,3) Note 1: 830 ms time duration is a typical value measured on iPhone 6 and this time duration can vary from one smart phone to another. 2: Reset is ‘no connect’. 3: Time is configured as default setting. DS60001380A-Page 14 Advance Information 2016 Microchip Technology Inc. BM78 2.6 WAKE UP The WAKE UP input pin wakes the BM78 from Sleep mode (active-low) and wake up is always from Sleep mode (S2) to Standby mode. Figure 2-5 illustrates the timing diagram of the BM78 in the Wake Up mode. FIGURE 2-5: WAKEUP TIME(1,2) Note 1: 85 ms is for reference time and the user should check the status pin. 2: Refer to Table 2-3 for the status of the P0_4/P1_5 pin. 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 15 BM78 2.7 External Reset The watchdog timer (WDT) can Reset the BM78 which has an integrated Power-on Reset (POR) circuit that reset all circuits to a known Power-on state. This action can also be driven by an external Reset signal that can be used to externally control the device, forcing it into a FIGURE 2-6: Power-on Reset state. The Reset signal input is active-low and connection is not required in most of the applications. Figure 2-6 illustrates the timing diagram of the BM78 when it is in the Reset (RST_N is set to active low) state. TIMING WAVEFORMS ON RESET (WHEN RST_N IS SET TO ACTIVE LOW)(1,2,3,4) Note 1: Auto Pattern can use external Reset, refer to Section 3.0 “Operating Pattern”. 2: The RST_N state trigger must be greater than 63 ns. 3: Manual pattern can use external Reset and Reset command, refer to Section 3.0 “Operating Pattern”. 4: Time duration (350 ms) is for reference purpose only, check the status pin. DS60001380A-Page 16 Advance Information 2016 Microchip Technology Inc. BM78 2.8 LED Driver The BM78 has a dedicated LED driver and the LED (LED1) can be connected directly with the BM78 using this driver, see Figure 2-7. The maximum current sourcing for the LED is 5 mA and it provides 16 options (steps) to trim the brightness. The LED brightness can be configured using the User Interface (UI) tool, a Windows® configuration utility. FIGURE 2-7: The following are status indication of the LED and each indication is a configurable flashing sequence: • • • • • Standby Link Back Low Battery Inquiry Link LED DRIVER 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 17 BM78 2.9 Host MCU Interface over UART Figure 2-8 illustrates an example of UART interface with host MCU and power scheme using 3.3V to the VDD. Battery power is applied to the BAT_IN pin. From the LDO33_O pin, voltage can be routed to the FIGURE 2-8: VDD_IO pin and external circuitry including the MCU. This power scheme ensures that the BM78 and MCU I/O voltages are compatible. Note: The internal 3.3V LDO current source should not exceed 50 mA (i.e maximum). POWER AND MCU INTERFACE EXAMPLE FOR BM78 Note 1: Ensure that VDD_IO and MCU VDD voltages are compatible. 2: The control and indication ports are configurable DS60001380A-Page 18 Advance Information 2016 Microchip Technology Inc. 2016 Microchip Technology Inc. 2.10 Reference Circuit Figure 2-9 through Figure 2-12 illustrate the reference schematic of the power supply design implemented for the BM78. FIGURE 2-9: BM78SPP05MC2/NC2 REFERENCE CIRCUIT Advance Information BM78 DS60001380A-Page 19 BM78 BM78SPP05MC2/NC2 REFERENCE CIRCUIT DS60001380A-Page 20 FIGURE 2-10: Advance Information 2016 Microchip Technology Inc. BM78SPPS5MC2/NC2 REFERENCE CIRCUIT 2016 Microchip Technology Inc. FIGURE 2-11: Advance Information BM78 DS60001380A-Page 21 BM78 BM78SPPS5MC2/NC2 REFERENCE CIRCUIT DS60001380A-Page 22 FIGURE 2-12: Advance Information 2016 Microchip Technology Inc. BM78 3.0 OPERATING PATTERN The BM78 provides two operating patterns, Auto Pattern and Manual Pattern, and the operating modes can be configured through the UI tool or the host MCU. See Figure 3-1. FIGURE 3-1: If the Auto_Pattern_Setting parameter is enabled, the BM78 triggers the Auto Pattern state machine otherwise Manual Pattern is used. Configure mode is available only in Auto Pattern and it can be enabled or disabled by the UI settings or host MCU. OPERATING PATTERN CONFIGURATION 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 23 BM78 3.1 Auto Pattern In Auto Pattern, the BM78 automatically operates after power on without any interference from the MCU. Auto Pattern is the basic application of the BM78. Figure 3-2 illustrates the characteristics of Auto Pattern. FIGURE 3-2: AUTO PATTERN CHARACTERISTIC Although the BM78 is set to operate in Auto Pattern mode, it provides the flexibility for the MCU to perform some specific settings in Configure mode by command set. If the BM78 has enabled authenticated pairing, the command set is required to accomplish the Bluetooth link. The MCU doesn’t have to deal with the BM78 state, and the BM78 changes its state after power on. However, the MCU can terminate the connection by using GPIOs. The transparent pipe is used for application data transmission and data is transmitted between the remote host and MCU. The MCU knows the state of the BM78 by GPIOs. The configure mode is available only in Auto Pattern and it can be enabled or disabled by UI tool settings. Basically, the MCU is communicating with the BM78 by GPIOs, except for data transmission. DS60001380A-Page 24 Advance Information 2016 Microchip Technology Inc. BM78 Figure 3-3 illustrates how the BM78 changes its own state. After power on, there are two options, one is to enter Stand-by mode and the other is to enter Link-Back mode, and it depends on if any device is recorded in the BM78. Irrespective of the mode, the BM78 waits for the remote side to establish a connection or tries to establish a connection with the remote side. Once the connection is established, the state of FIGURE 3-3: the BM78 changes to connected mode. If the connection is terminated, the BM78 goes into Deep-Sleep mode. Note: Link-Back mode is available only for SPP profile or mode. BM78 INTERNAL STATE MACHINE The BM78 stays in Access state and it is ready for a remote host to access. It either waits for the remote side to create a connection or tries to create a connection on its own. TABLE 3-1: STATE INDICATION State Access State Mode Configure Mode Stand-by Mode Link-Back mode Pairing Procedure Link State Connected Mode Deep-sleep State Deep-Sleep Mode Configure mode and pairing procedure are also defined as Access state. If the BM78 enters link state, it means not only the Bluetooth link has been established successfully, but also the data session is triggered. MCUs can transmit data to a remote host or receive data from a remote host in this state. 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 25 BM78 Figure 3-4 illustrates Auto Pattern transparent pipe. If MCU wants to send data (12345) to the remote side, the data should be in the.hex format to the BM78 and the BM78 transmits the received data to the remote side. Similarly, if the BM78 receives data from the remote host, it sends the data in the.hex format to the MCU. FIGURE 3-4: 3.2 AUTO PATTERN TRANSPARENT PIPE Manual Pattern In Manual Pattern, the MCU communicates with the BM78 using command sets. The MCU must send correct commands to handle the state of the BM78. The change in the BM78 state is based on the MCU commands. FIGURE 3-5: DS60001380A-Page 26 The data pipe for Manual Pattern is different from Auto Pattern. Since the MCU is communicating with the MCU by command sets, the data transmission will follow the command set rule. This is defined as protocol pipe. In Manual Pattern, the MCU can get the detail status by the BM78_Status_Report event. Figure 3-5 illustrates the characteristics of Manual Pattern. MANUAL PATTERN CHARACTERISTICS Advance Information 2016 Microchip Technology Inc. BM78 Figure 3-6 illustrates the MCU state change in Manual Pattern. For Manual Pattern, all MCU state change requires a corresponding command. For example, the MCU sends the Invisible_Setting command with the parameter Enter_Standby_Mode, then the BM78 goes into stand-by mode. The MCU sends the SPP_Create_Link command, then BM78 goes into Link-Back mode. nection is terminated. The MCU should decide on the mode of the BM78 once the connection is terminated, that is based on the overall system behavior. In Auto Pattern, the BM78 goes into Deep-Sleep mode once the connection is terminated, and in Manual Pattern the BM78 stays in Idle mode even after the con- FIGURE 3-6: STATE CHANGES BY MCU IN MANUAL PATTERN 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 27 BM78 Figure 3-7 illustrates the Manual Pattern protocol pipe. If the MCU wants to send data (12345) to remote side, the data format should follow the UART command protocol. FIGURE 3-7: DS60001380A-Page 28 MANUAL PATTERN PROTOCOL PIPE Advance Information 2016 Microchip Technology Inc. BM78 3.3 3.3.1 Mode Definition CONFIGURE MODE The Configure mode configures the relative settings before the BM78 enters into Auto Pattern state. If Configure mode is enabled, the BM78 will send Configure mode status event to notify the MCU that the BM78 is ready to receive commands. If the BM78 doesn’t FIGURE 3-8: receive any valid command within the specified Configure mode time, it will exit from Configure mode automatically. Once the MCU sends any valid command within the Configure mode time, the BM78 will not exit Configure mode until the MCU gives the leave Configure mode command. Once the BM78 exits from Configure mode, it goes to process Auto Pattern state machine. CONFIGURE MODE 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 29 BM78 3.3.2 STANDBY MODE • SPP (BR/EDR) - Enable the inquiry scan and page scan in this mode - Configurable to be discoverable - Ready to be paired • Bluetooth Low Energy (BLE) - Enable the undirected advertising in this mode - Ready to be paired 3.3.3 LINK-BACK MODE • SPP (BR/EDR) - Enable page procedure to establish dedicated or last connected Bluetooth SPP link - Configurable to be invisible situation • BLE - No BLE link-back behavior because of iOS limitation - Configurable to be invisible situation - Ready to be paired 3.3.4 CONNECTED MODE • SPP (BR/EDR) - Use SPP or iAP protocol to exchange the application data - Connection Establish status: SPP Connected mode • BLE - Use GATT protocol to exchange the application data - Connection establish status: BLE Connected mode 3.3.5 DEEP-SLEEP MODE • Auto Pattern - Enter into Deep-Sleep mode automatically - Wake-up trigger: Wakeup pin • Manual Pattern - Enter into Deep-Sleep mode by MCU command assign - Wake-up trigger: Wakeup pin or UART_RX_Ind pin DS60001380A-Page 30 Advance Information 2016 Microchip Technology Inc. BM78 4.0 ELECTRICAL CHARACTERISTICS This section provides an overview of the electrical characteristics of the BM78 module. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the BM78 devices are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. Absolute Maximum Ratings Ambient temperature under bias.............................................................................................................. .-20°C to +70°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V Maximum output current sunk by any I/O pin..........................................................................................................12 mA Maximum output current sourced by any I/O pin.....................................................................................................12 mA Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 31 BM78 Table 4-1 through Table 4-7 provide the recommended operating conditions and the electrical specifications of the BM78. TABLE 4-1: RECOMMENDED OPERATING CONDITIONS Rating Min. Typical Max. Ambient Operating temperature range -20ºC +25ºC +70ºC Relative Humidity (Operating) 10% — 90% Relative Humidity (Storage) ESD 10% — 90% HBM — ±2KV — MM — ±200V — — 1000 hrs — HTOL (Note 1) Supply voltage: BAT_IN 3.3V — 4.2V Supply voltage: 1V8, VCC_RF, VDD_XO, AVDD_SAR 1.8V 1.9V 2.1V SW_BTN 3.3V — 4.2V — — 3.6V LED1 Reset VTH,res threshold voltage — 1.6V — VIL input logic levels low -0.3V — 0.8V VIH input logic levels high 2.0V — 3.6V — — 0.4V VOL output logic levels low (IOl = 12mA) VOH output logic levels high (IOh = 12mA) 2.4V — — RF continuous Tx mode — — 43 mA RF continuous Rx mode — — 37 mA Note 1: HTOL life test condition: +125ºC, BAT_IN = 4.2V, LDO33_O = 3.3V, LDO18_O = 1.9V. TABLE 4-2: 3.3V LDO ELECTRICAL PARAMETERS(1,2) Parameter Min. Typical Max. Unit Operating Temperature -20 — +70 ºC Output Current (VIN = 3.6V /load regulation with 100mV drop) — 100 — mA Quiescent Current (VIN = 3.6V) — 150 — uA Min. Typical Max. Unit Operating Temperature -20 — +70 ºC Output Current (VIN = 3.6V/load regulation with 0.3mV drop) — 100 — uA Quiescent Current (VIN = 3.6V) — 120 — uA Note 1: With 10 uF capacitor at LDO33_O as the condition for IP verification. 2: Output voltage can be calibrated using the MP tool TABLE 4-3: PMU LDO(1,2) Parameter Note 1: With 1uF capacitor at PMULDO_O as the condition for IP verification. 2: Output voltage can be calibrated by using the MP tool. TABLE 4-4: SAR-ADC AND BATTERY VOLTAGE DETECTOR Parameter Operating Temperature DS60001380A-Page 32 Min. Typical Max. Unit -20 — +70 ºC Advance Information 2016 Microchip Technology Inc. BM78 TABLE 4-4: SAR-ADC AND BATTERY VOLTAGE DETECTOR Parameter Min. Typical Max. Unit AVDD_SAR power supply — SAR_BAT detection (Note 1) 3.3 1.8 — V — 4.2 Resolution V — 10 — bit Operating Current (including bandgap) — — 1 mA Deep-sleep Current — — 1 uA Note 1: SAR_BAT is connected with BAT_IN internally for battery voltage detection. TABLE 4-5: INTENSITY CONTROLLABLE LED DRIVER Parameter Operating Temperature Min. Typical Max. Unit -20 — +70 ºC Open-drain Voltage — — 3.6 V Current Step — 0.3 — mA Programmable Current Range 0 — 5 mA Intensity control — 16 — step Power down open-drain current — — 1 uA Deep-sleep Current — — 1 uA TABLE 4-6: POWER CONSUMPTION-CLASSIC(1,2) Test Condition Current Consumption (avg.) (mA) Remarks Standby mode 2.543 — Deep-sleep mode 0.187 Connected+Sniff, Master (no data) 0.541 No data was transmitted Sniff interval = 500 ms — Connected+Sniff, Slave (no data) 0.551 No data was transmitted Sniff interval = 500 ms Data, Master 10.67 Data transmitted at 115200 bps; block size = 500 Data, Slave 14.87 Data transmitted at 115200 bps; block size = 500 Note 1: Classic BR/EDR and RX_IND functions are enabled. 2: The data corresponds to BM78SPPx5NC2 (ROM variant). TABLE 4-7: POWER CONSUMPTION-LOW ENERGY(1,2,3) Test Condition Current Consumption (avg.) (mA) Deep-sleep mode 0.13 — LE fast advertising 1.21 LE fast advertising interval = 100 ms 0.88 LE fast advertising interval = 160 ms 0.48 LE fast advertising interval = 500 ms 1.72 LE fast advertising interval = 100 ms+ Beacon 100 ms 0.62 LE fast advertising interval = 500 ms+ Beacon 500 ms 2016 Microchip Technology Inc. Advance Information Remarks DS60001380A-Page 33 BM78 TABLE 4-7: POWER CONSUMPTION-LOW ENERGY(1,2,3) (CONTINUED) Test Condition Current Consumption (avg.) (mA) Reduced power advertising 0.39 LE Reduced Power advertising interval = 961 ms 1.00 LE Reduced Power advertising interval = 961 ms+Beacon 100 ms 0.51 LE Reduced Power advertising interval = 961 ms+Beacon 500 ms Connected (No data) 0.39 Connection interval = 1500 ms 0.43 Connection interval = 600 ms Connected (iPhone® 6 to module) 0.45 Connection interval = 500 ms Connected (module to iPhone 6) Remarks 0.60 Connection interval = 200 ms 6.6 Connection interval = 500 ms 7.0 Connection interval = 200 ms Note 1: Low energy, RX_IND function is enabled. 2: Data corresponds to the BM78SPPx5NC2 (ROM variant). 3: Only low energy DS60001380A-Page 34 Advance Information 2016 Microchip Technology Inc. BM78 5.0 RADIO CHARACTERISTICS Table 5-1 provides the transmitter characteristics of the BM78 module. TABLE 5-1: performance TRANSMITTER PERFORMANCE(1,2) BDR power EDR (2M/3M) power LE power Min. Typical Max. Bluetooth Specification Unit dBm — 1.5 — -6 ~ +4 — -1 — -6 ~ +4 — 0.5 — -20 ~ +10 Note 1: The RF Transmit power can be calibrated during production by using the MP Tool software and the MT8852 Bluetooth Test equipment. 2: Test condition: VCC RF = 1.80V, temperature = 25ºC. Table 5-2 provides the receiver performance characteristics of the BM78 module. TABLE 5-2: RECEIVER PERFORMANCE(1) Min. Typical Max. BDR Sensitivity — -90 — EDR 2M Sensitivity — -90 — EDR 3M Sensitivity — -82 — LE Sensitivity — -92 — Bluetooth Specification ≤-70 Unit dBm Note 1: Test condition: VCC RF = 1.80V, temperature = 25ºC. 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 35 BM78 NOTES: DS60001380A-Page 36 Advance Information 2016 Microchip Technology Inc. BM78 6.0 PHYSICAL DIMENSIONS Figure 6-1 illustrates the physical dimensions of the BM78SPPS5MC2/NC2 module. FIGURE 6-1: BM78SPPS5MC2/NC2 MODULE DIMENSIONS 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 37 BM78 Figure 6-2 illustrates the recommended host PCB foot print. FIGURE 6-2: DS60001380APage 38 BM78SPPS5MC2/NC2 RECOMMENDED PCB FOOTPRINT Advance Information 2016 Microchip Technology Inc. BM78 Figure 6-3 illustrates the recommendations for mounting the BM78SPPS5MC2/NC2 on the host PCB, and it also shows the minimum ground plane area to the left and right of the module for the best antenna performance. recommended as needed for host PCB EMC noise reduction. For best range performance, keep all external metal at least 31 mm away from the ceramic chip antenna. Avoid top copper layer near the test pin area. When designing the host PCB, the areas under the antenna should not contain any top, inner, or bottom copper layer. A low-impedance ground plane will ensure best radio performance (best range and lowest noise). The ground plane can be extended beyond the minimum FIGURE 6-3: BM78SPPS5MC2/NC2 HOST PCB MOUNTING SUGGESTION 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 39 BM78 Figure 6-4 illustrates the physical dimensions of the BM78SPP05MC2/NC2 module. FIGURE 6-4: DS60001380APage 40 BM78SPP05MC2/NC2 MODULE DIMENSIONS Advance Information 2016 Microchip Technology Inc. BM78 Figure 6-5 illustrates the recommended host PCB foot print. FIGURE 6-5: BM78SPP05MC2/NC2 RECOMMENDED PCB FOOTPRINT 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 41 BM78 Figure 6-6 illustrates the recommended mounting details for the BM78SPP05MC2/NC2 module and recommended layout of the host PCB. possible for minimum loss and better impedance matching. If the micro-strip trace is longer, it should be a 50 ohm impedance. A low-impedance ground plane will ensure best radio Pin30 performance (best range, lowest noise). (BT_RF) is a 50 ohm connection to an external antenna connector, PCB trace antenna, or component (ceramic chip) antenna through a host PCB with 50 ohm impedance and micro-strip trace. This trace can be extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test posts. It is recommended that the micro-strip trace be as short as FIGURE 6-6: DS60001380APage 42 BM78SPP05MC2/NC2 HOST PCB MOUNTING SUGGESTION Advance Information 2016 Microchip Technology Inc. BM78 7.0 REFLOW PROFILE The BM78 should be assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. The BM78 can be soldered to the host PCB by using the standard leaded and lead-free solder reflow profile. To avoid damage to the module, follow these recommendations: • Follow solder reflow recommendations provided in Microchip Technology Application Note “AN233 Solder Reflow Recommendation (DS00233)”. • Refer to the solder paste data sheet for specific reflow profile recommendations. • Do not exceed the peak temperature (TP) of 250ºC. • Use no-clean flux solder paste. • Do not wash as moisture can be trapped under the shield. • Use only one flow. If the PCB requires multiple FIGURE 7-1: flows, apply the module on the final flow. • Standard: IPC/JEDEC J-STD-020. - Condition: Preheat:150~200 ℃ for 60~120 seconds. - Average ramp-up rate (217 ℃ to peak): 3 ℃ sec max. - Temperature maintained above 217: 60~150 seconds. - Time within 5℃ of peak temperature: 30 ~ 40 seconds. - Peak temperature: 260 +5/-0 ℃ . - Ramp-down rate (peak to 217): 6 ℃ /sec. max. - Time 25 ℃ to peak temperature: 8 minutes max. - Cycle interval 5 minutes. REFLOW PROFILE 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 43 BM78 NOTES: DS60001380A-Page 44 Advance Information 2016 Microchip Technology Inc. BM78 8.0 MODULE PLACEMENT For a Bluetooth wireless product, the antenna placement affects the performance of the whole system. The antenna requires free space to radiate the RF signal and it cannot be surrounded by the ground plane. Microchip recommends that the areas underneath the antenna on the host PCB should not contain copper on top, inner, or bottom layer. The ground plane can be extended beyond the minimum recommended as required for the main PCB EMC noise reduction. For the best range performance, keep all external metal away from the ceramic chip antenna, that is minimum 15 mm away. Figure 8-1 illustrates an example of good and poor antenna placement on a host PCB with ground plane. FIGURE 8-1: TABLE 8-1: MODULE PLACEMENT EXAMPLES RECOMMENDED ANTENNA Description ANT ANT3216A063R2400A PIFA 2.4GHZ L3.2W1.6 2016 Microchip Technology Inc. Manufacturer Part Number Manufacturer ANT3216A063R2400A YAGEO Advance Information DS60001380A-Page 45 BM78 Figure 8-2 illustrates the BM78 module is mounted on the BM78 Evaluation Board (EVB). It also shows the recommended keep out area for the antenna. FIGURE 8-2: Note: KEEP OUT AREA RECOMMENDED FOR ANTENNA For additional information on free space for antenna placement design, refer to the design rule document of the antenna manufacturer. DS60001380A-Page 46 Advance Information 2016 Microchip Technology Inc. BM78 8.1 BM78SPPS5MC2/NC2 Ceramic Chip Antenna The BM78SPPS5MC2/NC2 contains an integral ceramic chip antenna. Figure 8-3 illustrates the antenna radiation pattern of the ceramic chip antenna on the BM78SPPS5MC2/NC2. FIGURE 8-3: TABLE 8-2: BM78SPPS5MC2/NC2 ANTENNA RADIATION PATTERN ANTENNA RADIATION PATTERN DETAILS Parameter Values Frequency 2450 MHz Peak Gain 1.63 dBi Efficiency 71.55% 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 47 BM78 NOTES: DS60001380A-Page 48 Advance Information 2016 Microchip Technology Inc. ORDERING INFORMATION BM78 DS60001380APage 49 9.0 Table 9-1 provides the various SKUs of the BM78 module. TABLE 9-1: BM78 MODULE SKUS Device Microchip IC Antenna Description Shield BM78SPPS5MC2 IS1678SM-151 On-board BT4.2 Dual Mode, Class 2, Flash Variant Yes BM78SPP05MC2 IS1678SM-151 External BT4.2 Dual Mode, Class 2, Flash Variant No No BM78SPP05MC2-0002AA BM78SPPS5NC2 IS1678S-152 On-board BT4.2 Dual Mode, Class 2, ROM Variant Yes Planned BM78SPPS5NC2-0002AA BM78SPP05NC2 IS1678S-152 External BT4.2 Dual Mode, Class 2, ROM Variant No No BM78SPP05NC2-0002AA Note: Contact Microchip Sales office for information on Bluetooth 4.2 ROM variants of the BM78. Regulatory Certification Ordering Number FCC, IC, CE, MIC, KCC, NCC, BM78SPPS5MC2-0002AA JRF Advance Information 2016 Microchip Technology Inc. BM78 NOTES: DS60001380A-Page 50 Advance Information 2016 Microchip Technology Inc. BM78 APPENDIX A: CERTIFICATION NOTICES The BM78 has received regulatory approval for the following countries: • BT SIG/QDID: 75929 • United States/FCC ID: A8TBM78ABCDEFGH • Canada: - IC ID: 12246A-BM78SPPS5M2 - HVIN: BM78SPPS5M2 • Europe/CE • Japan/MIC: 202-SMD070 • Korea/KCC: MSIP-CRM-mcp-BM78SPPS5MC2 • Taiwan/NCC No: CCAN15LP0510T4 A.1 REGULATORY APPROVAL This section outlines the regulatory information for the BM78 for the following countries: • • • • • • • UNITED STATES The BM78 module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C "Intentional Radiators" modular approval in accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the BM78 module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user's authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The finished product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. For example, compliance must be demonstrated to regulations for other transmitter components within the host product. The requirements for unintentional radiators (Part 15 Subpart B "Unintentional Radiators"), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Verification, or Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate. 2016 Microchip Technology Inc. LABELING AND USER INFORMATION REQUIREMENTS The BM78 has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows: Contains Transmitter Module FCC ID: A8TBM78ABCDEFGH or Contains FCC ID:A8TBM78ABCDEFGH This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation A user's manual for the finished product should include the following statement: United States Canada Europe Japan Korea Taiwan Other Regulatory Jurisdictions A.1.1 A.1.2 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm. Advance Information DS60001380A-Page 51 BM78 A.1.3 RF EXPOSURE All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. A.1.4 HELPFUL WEB SITES Federal Communications http://www.fcc.gov. Commission (FCC): FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): http://apps.fcc.gov/oetcf/kdb/index.cfm. A.2 Canada The BM78 module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-247 and RSS-Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device. A.2.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements for the host device (from Section 3.1, RSS-Gen, Issue 4, November 2014): The host device shall be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows: Contains transmitter module IC: 12246A-BM78SPPS5M2 User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 4, November 2014): User manuals for license-exempt radio appara- DS60001380A-Page 52 tus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Transmitter Antenna (from Section 8.3 RSS-Gen, Issue 4, November 2014): User manuals for transmitters shall display the following notice in a conspicuous location: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. The above notice may be affixed to the device instead of displayed in the user manual. A.2.2 RF EXPOSURE All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). A.2.3 HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/ Advance Information 2016 Microchip Technology Inc. BM78 A.3 A.3.2 Europe From R&TTE Compliance Association document Technical Guidance Note 01: The BM78 module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. Provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio module manufacturer's installation instructions requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4] The BM78 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in Section TABLE A-1: “EUROPEAN COMPLIANCE TESTING”. A notified body opinion has also been issued. The European Compliance Testing listed in Section TABLE A-1: “EUROPEAN COMPLIANCE TESTING” was performed using the integral ceramic chip antenna. The R&TTE Compliance Association provides guidance on modular devices in document Technical Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm. Note: A.3.1 ANTENNA REQUIREMENTS To maintain conformance to the testing listed in Section TABLE A-1: “EUROPEAN COMPLIANCE TESTING”, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the R&TTE Directive. LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM78 module must follow CE marking requirements. The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE marking. TABLE A-1: EUROPEAN COMPLIANCE TESTING Certification Standards Article Safety EN 60950-1:2006+A11:2009 +A1:2010 +A12:2011+A2:2013 [3.1(a)] Health ETSI EN 300 328 V1.9.1 EN 62479:2010 EMC EN 300 489-1 V1.9.2 [3.1(b)] Laboratory Report Number 10052799 001 TUV Rheinland 10052796 001 10052797 001 10052437 001 EN 301 489-17 V2.2.1 Radio ETSI EN 300 328 V1.9.1 Notified Body Opinion DS60001380A-Page 53 0197 (3.2) — 10052796 001 10052797 001 TUV Rheinland Advance Information 10048937 001 2016 Microchip Technology Inc. BM78 A.3.3 HELPFUL WEBSITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/. The BM78 module is labeled with its own technical conformity mark and certification number. The final product in which this module is being used must have a label referring to the type certified module inside: Additional helpful web sites are: • Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.htm • European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org • European Telecommunications Standards Institute (ETSI): http://www.etsi.org • European Radio Communications Office (ERO): http://www.ero.dk • The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA): http://www.rtteca.com/ A.4 Japan HELPFUL WEB SITES Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/ A.5 Korea The BM78 module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. A.5.1 The BM78 module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: • If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required. • There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html A.4.1 A.4.2 LABELING AND USER INFORMATION REQUIREMENTS LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM78 module must follow KC marking requirements. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The BM78 module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module: A.5.2 HELPFUL WEB SITES Korea Communications Commission (KCC): http://www.kcc.go.kr National Radio Research Agency (RRA): http://rra.go.kr The label on the final product which contains the BM78 module must follow Japan marking requirements. The integrator of the module should refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. DS60001380A-Page 54 Advance Information 2016 Microchip Technology Inc. BM78 A.6 Taiwan The BM78 module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product should contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. A.6.1 LABELING AND USER INFORMATION REQUIREMENTS The BM78 module is labeled with its own NCC mark and certificate number as below: The user's manual should contain below warning (for RF device) in traditional Chinese: 注意 ! 依據 低功率電波輻射性電機管理辦法 第十二條 經型式認證合格之低功率射頻電機，非經許 可， 公司、商號或使用者均不得擅自變更頻率、加大功率或 變更原設計 之特性及功能。 第十四條 低功率射頻電機之使用不得影響飛航安全及 干擾合法通信； 經發現有干擾現象時，應立即停用，並改善至無干擾時 方得繼續使用。 前項合法通信，指依電信規定作業之無線電信。 低功率射頻電機須忍受合法通信或工業、科學及醫療用 電波輻射性 電機設備之干擾。 A.6.2 HELPFUL WEB SITES National Communications http://www.ncc.gov.tw A.7 Commission (NCC): Other Regulatory Jurisdictions Should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, please contact Microchip for the required utilities and documentation. 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 55 BM78 APPENDIX B: REVISION HISTORY Revision A (January 2016) This is the initial released version of this document. DS60001380A-Page 56 Advance Information 2016 Microchip Technology Inc. BM78 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2016 Microchip Technology Inc. Advance Information DS60001380A-Page 57 BM78 NOTES: DS60001380A-Page 58 Advance Information 2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0133-9 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2016 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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