16-Bit Lower Power PulSAR ADCs in MSOP/LFCSP (QFN) AD7988-1/AD7988-5 Data Sheet FEATURES GENERAL DESCRIPTION Low power dissipation AD7988-5: 3.5 mW @ 500 kSPS AD7988-1: 700 µW @ 100 kSPS 16-bit resolution with no missing codes Throughput: 100 kSPS/500 kSPS options INL: ±0.6 LSB typical, ±1.25 LSB maximum SINAD: 91.5 dB @ 10 kHz THD: −114 dB @ 10 kHz Pseudo differential analog input range 0 V to VREF with VREF from 2.5 V to 5.5 V Any input range and easy to drive with the ADA4841-1 No pipeline delay Single-supply 2.5 V operation with 1.8 V/2.5 V/3 V/5 V logic interface SPI-/QSPI-/MICROWIRE™-/DSP-compatible serial interface Daisy-chain multiple ADCs 10-lead MSOP and 10-lead, 3 mm × 3 mm LFCSP (QFN), same space as SOT-23 Wide operating temperature range: −40°C to +125°C The AD7988-1/AD7988-5 are 16-bit, successive approximation, analog-to-digital converters (ADC) that operate from a single power supply, VDD. The AD7988-1 offers a 100 kSPS throughput, and the AD7988-5 offers a 500 kSPS throughput. They are low power, 16-bit sampling ADCs with a versatile serial interface port. On the CNV rising edge, they sample an analog input, IN+, between 0 V to VREF with respect to a ground sense, IN−. The reference voltage, REF, is applied externally and can be set independent of the supply voltage, VDD. The SPI-compatible serial interface also features the ability to daisy-chain several ADCs on a single 3-wire bus using the SDI input. It is compatible with 1.8 V, 2.5 V, 3 V, or 5 V logic using the separate supply, VIO. The AD7988-1/AD7988-5 generics are housed in a 10-lead MSOP or a 10-lead LFCSP (QFN) with operation specified from −40°C to +125°C. Table 1. MSOP, LFCSP (QFN) 14-/16-/18-Bit PulSAR® ADCs APPLICATIONS Battery-powered equipment Low power data acquisition systems Portable medical instruments ATE equipment Data acquisitions Communications 400 kSPS to 500 kSPS AD76902 Bits 18 1 100 kSPS 250 kSPS AD7691 2 161 AD7684 AD76872 16 3 AD7680 AD7683 AD7988-12 AD7940 AD76852 AD7694 AD76882 AD76932 AD76862 AD7988-52 AD79422 AD79462 143 ≥1000 kSPS AD79822 AD79842 AD79802 ADC Driver ADA4941-1 ADA4841-1 ADA4941-1 ADA4841-1 ADA4841-1 ADA4841-1 ADA4841-1 ADA4841-1 1 True differential. Pin-for-pin compatible. 3 Pseudo differential. 2 TYPICAL APPLICATION DIAGRAM 2.5V TO 5V REF 2.5V VDD VIO 0V TO VREF IN– AD7988-1/ AD7988-5 SCK SDO GND CNV 3- OR 4-WIRE INTERFACE (SPI, DAISY CHAIN, CS) 10231-001 IN+ 1.8V TO 5.5V SDI Figure 1. Rev. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2012 Analog Devices, Inc. All rights reserved. AD7988-1/AD7988-5 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Analog Inputs.............................................................................. 16 Applications ....................................................................................... 1 Driver Amplifier Choice ........................................................... 16 General Description ......................................................................... 1 Voltage Reference Input ............................................................ 17 Typical Application Diagram .......................................................... 1 Power Supply............................................................................... 17 Revision History ............................................................................... 2 Digital Interface .......................................................................... 17 Specifications..................................................................................... 3 CS Mode, 3-Wire ........................................................................ 18 Timing Specifications .................................................................. 5 CS Mode 4-Wire ......................................................................... 19 Absolute Maximum Ratings ............................................................ 7 Chain Mode ................................................................................ 20 ESD Caution .................................................................................. 7 Applications Information .............................................................. 21 Pin Configurations and Function Descriptions ........................... 8 Interfacing to Blackfin® DSP ..................................................... 21 Terminology ...................................................................................... 9 Layout .......................................................................................... 21 Typical Performance Characteristics ........................................... 10 Evaluating the Performance of the AD7988-x ........................ 21 Theory of Operation ...................................................................... 14 Outline Dimensions ....................................................................... 22 Circuit Information .................................................................... 14 Ordering Guide .......................................................................... 23 Converter Operation .................................................................. 14 Typical Connection Diagram.................................................... 15 REVISION HISTORY 8/12—Rev. B to Rev. C Changes to Ordering Guide .......................................................... 23 5/12—Rev. A to Rev. B Changes to Table 3 ............................................................................ 4 Updated Outline Dimensions ....................................................... 22 2/12—Rev. 0 to Rev. A Added LFCSP Thermal Impedance Values ................................... 7 Updated Outline Dimensions ....................................................... 23 Changes to Ordering Guide .......................................................... 23 2/12—Revision 0: Initial Version Rev. C | Page 2 of 24 Data Sheet AD7988-1/AD7988-5 SPECIFICATIONS VDD = 2.5 V, VIO = 2.3 V to 5.5 V, VREF = 5 V, TA = –40°C to +125°C, unless otherwise noted. Table 2. Parameter RESOLUTION ANALOG INPUT Voltage Range Absolute Input Voltage Analog Input CMRR Leakage Current at 25°C Input Impedance ACCURACY No Missing Codes Differential Linearity Error Integral Linearity Error Transition Noise Gain Error, TMIN to TMAX 2 Gain Error Temperature Drift Zero Error, TMIN to TMAX2 Zero Temperature Drift Power Supply Sensitivity THROUGHPUT AD7988-1 Conversion Rate Transient Response AD7988-5 Conversion Rate Transient Response AC ACCURACY Dynamic Range Oversampled Dynamic Range Signal-to-Noise Ratio, SNR Spurious-Free Dynamic Range, SFDR Total Harmonic Distortion, THD Signal-to-(Noise + Distortion), SINAD Test Conditions/Comments Min 16 IN+ − IN− IN+ IN− fIN = 1 kHz Acquisition phase 0 −0.1 −0.1 Typ Max Unit Bits VREF VREF + 0.1 +0.1 V V V dB nA 60 1 See the Analog Inputs section 16 −0.9 VREF = 5 V VREF = 2.5 V VREF = 5 V VREF = 2.5 V VREF = 5 V VREF = 2.5 V −1.25 −0.5 VDD = 2.5 V ± 5% VIO ≥ 2.3 V up to 85°C, VIO ≥ 3.3 V above 85°C up to 125°C Full-scale step 0 VIO ≥ 2.3 V up to 85°C, VIO ≥ 3.3 V above 85°C up to 125°C Full-scale step 0 VREF = 5 V VREF = 2.5 V fO = 10 kSPS fIN = 10 kHz, VREF = 5 V fIN = 10 kHz, VREF = 2.5 V fIN = 10 kHz fIN = 10 kHz fIN = 10 kHz, VREF = 5 V fIN = 10 kHz, VREF = 2.5 V 1 90 ±0.4 ±0.55 ±0.6 ±0.65 0.6 1.0 ±2 ±0.35 ±0.08 0.54 ±0.1 +0.9 +1.25 +0.5 100 kSPS 500 ns 500 kSPS 400 ns 92 87 111 91 86.5 −110 −114 91.5 87.0 LSB means least significant bit. With the 5 V input range, 1 LSB is 76.3 µV. See the Terminology section. These specifications include full temperature range variation, but not the error contribution from the external reference. 3 All specifications in dB are referred to a full-scale input FSR. Tested with an input signal at 0.5 dB below full scale, unless otherwise specified. 2 Rev. C | Page 3 of 24 Bits LSB 1 LSB1 LSB1 LSB1 LSB1 LSB1 LSB1 ppm/°C mV ppm/°C LSB1 dB 3 dB3 dB3 dB3 dB3 dB3 dB3 dB3 dB3 AD7988-1/AD7988-5 Data Sheet VDD = 2.5 V, VIO = 2.3 V to 5.5 V, VREF = 5 V, TA = –40°C to +125°C, unless otherwise noted. Table 3. Parameter REFERENCE Voltage Range Load Current SAMPLING DYNAMICS −3 dB Input Bandwidth Aperture Delay DIGITAL INPUTS Logic Levels VIL VIH VIL VIH IIL IIH DIGITAL OUTPUTS Data Format Pipeline Delay Test Conditions/Comments VOL VOH POWER SUPPLIES VDD VIO VIO Range Standby Current 1, 2 AD7988-1 Power Dissipation ISINK = 500 µA ISOURCE = −500 µA AD7988-5 Power Dissipation Energy per Conversion TEMPERATURE RANGE Specified Performance 1 2 Min Typ 2.4 Max Unit 5.1 VREF = 5 V 250 V µA VDD = 2.5 V 10 2.0 MHz ns VIO > 3 V VIO > 3 V VIO ≤ 3 V VIO ≤ 3 V Specified performance –0.3 0.7 × VIO –0.3 0.9 × VIO −1 −1 0.3 × VIO VIO + 0.3 0.1 × VIO VIO + 0.3 +1 +1 Serial 16 bits straight binary Conversion results available immediately after completed conversion 0.4 VIO − 0.3 2.375 2.3 1.8 2.5 VDD and VIO = 2.5 V, 25°C 10 kSPS throughput 100 kSPS throughput 0.35 70 700 500 kSPS throughput 3.5 7.0 TMIN to TMAX −40 With all digital inputs forced to VIO or GND as required. During the acquisition phase. Rev. C | Page 4 of 24 2.625 5.5 5.5 1 5 +125 V V V V µA µA V V V V V nA µW µW mW mW nJ/sample °C Data Sheet AD7988-1/AD7988-5 TIMING SPECIFICATIONS VDD = 2.37 V to 2.63 V, VIO = 3.3 V to 5.5 V, −40°C to +125°C unless otherwise stated. See Figure 2 and Figure 3 for load conditions. Table 4. Parameter AD7988-1 Throughput Rate Conversion Time: CNV Rising Edge to Data Available Acquisition Time Time Between Conversions AD7988-5 Throughput Rate Conversion Time: CNV Rising Edge to Data Available Acquisition Time Time Between Conversions CNV Pulse Width (CS Mode) SCK Period (CS Mode) VIO Above 4.5 V VIO Above 3 V VIO Above 2.7 V VIO Above 2.3 V SCK Period (Chain Mode) VIO Above 4.5 V VIO Above 3 V VIO Above 2.7 V VIO Above 2.3 V SCK Low Time SCK High Time SCK Falling Edge to Data Remains Valid SCK Falling Edge to Data Valid Delay VIO Above 4.5 V VIO Above 3 V VIO Above 2.7 V VIO Above 2.3 V CNV or SDI Low to SDO D15 MSB Valid (CS Mode) VIO Above 3 V VIO Above 2.3V CNV or SDI High or Last SCK Falling Edge to SDO High Impedance (CS Mode) SDI Valid Setup Time from CNV Rising Edge SDI Valid Hold Time from CNV Rising Edge (CS Mode) SDI Valid Hold Time from CNV Rising Edge (Chain Mode) SCK Valid Setup Time from CNV Rising Edge (Chain Mode) SCK Valid Hold Time from CNV Rising Edge (Chain Mode) SDI Valid Setup Time from SCK Falling Edge (Chain Mode) SDI Valid Hold Time from SCK Falling Edge (Chain Mode) Rev. C | Page 5 of 24 Symbol tCONV tACQ tCYC tCONV tACQ tCYC tCNVH tSCK Min Typ Max Unit 100 9.5 kHz μs ns μs 500 1.6 400 2 500 kHz μs ns μs ns 10.5 12 13 15 ns ns ns ns 11.5 13 14 16 4.5 4.5 3 ns ns ns ns ns ns ns 500 10 tSCK tSCKL tSCKH tHSDO tDSDO 9.5 11 12 14 ns ns ns ns 10 15 20 ns ns ns ns ns ns ns ns ns ns tEN tDIS tSSDICNV tHSDICNV tHSDICNV tSSCKCNV tHSCKCNV tSSDISCK tHSDISCK 5 2 0 5 5 2 3 AD7988-1/AD7988-5 Data Sheet 500µA IOL 1.4V TO SDO 500µA 10231-002 CL 20pF IOH Figure 2. Load Circuit for Digital Interface Timing Y% VIO1 X% VIO1 tDELAY VIH2 VIL2 VIH2 VIL2 1FOR VIO ≤ 3.0V, X = 90 AND Y = 10; FOR VIO > 3.0V X = 70, AND Y = 30. VIH AND MAXIMUM VIL USED. SEE DIGITAL INPUTS SPECIFICATIONS IN TABLE 3. 2MINIMUM Figure 3. Voltage Levels for Timing Rev. C | Page 6 of 24 10231-003 tDELAY Data Sheet AD7988-1/AD7988-5 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Analog Inputs IN+, 1 IN−1 to GND Supply Voltage REF, VIO to GND VDD to GND VDD to VIO Digital Inputs to GND Digital Outputs to GND Storage Temperature Range Junction Temperature θJA Thermal Impedance 10-Lead MSOP 10-Lead LFCSP θJC Thermal Impedance 10-Lead MSOP 10-Lead LFCSP Reflow Soldering 1 Rating −0.3 V to VREF + 0.3 V or ±130 mA −0.3 V to +6 V −0.3 V to +3 V +3 V to −6 V −0.3 V to VIO + 0.3 V −0.3 V to VIO + 0.3 V −65°C to +125°C 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION 200°C/W 80°C/W 44°C/W 15°C/W JEDEC Standard (J-STD-020) See the Analog Inputs section. Rev. C | Page 7 of 24 AD7988-1/AD7988-5 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS REF 1 10 VIO 9 SDI IN+ 3 AD7988-1/ AD7988-5 8 SCK IN– 4 TOP VIEW (Not to Scale) 7 SDO 6 CNV VDD 2 GND 5 IN– 4 GND 5 10231-004 REF 1 IN+ 3 10 VIO AD7988-1/ AD7988-5 9 SDI TOP VIEW (Not to Scale) 8 SCK 7 SDO 6 CNV NOTES 1. THE EXPOSED PAD CAN BE CONNECTED TO GND. Figure 4. 10-Lead MSOP Pin Configuration 10231-005 VDD 2 Figure 5. 10-Lead LFCSP (QFN) Pin Configuration Table 6. Pin Function Descriptions Pin No. 1 Mnemonic REF Type 1 AI 2 3 VDD IN+ P AI 4 5 6 IN− GND CNV AI P DI 7 8 9 SDO SCK SDI DO DI DI 10 VIO P EP Description Reference Input Voltage. The VREF range is from 2.4 V to 5.1 V. It is referred to the GND pin. The GND pin should be decoupled closely to the REF pin with a 10 µF capacitor. Power Supply. Analog Input. It is referred to IN−. The voltage range, for example, the difference between IN+ and IN−, is 0 V to VREF. Analog Input Ground Sense. Connect to the analog ground plane or to a remote sense ground. Power Supply Ground. Convert Input. This input has multiple functions. On its leading edge, it initiates the conversions and selects the interface mode of the part: chain mode or CS mode. In CS mode, the SDO pin is enabled when CNV is low. In chain mode, the data should be read when CNV is high. Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK. Serial Data Clock Input. When the part is selected, the conversion result is shifted out by this clock. Serial Data Input. This input provides multiple features. It selects the interface mode of the ADC as follows: Chain mode is selected if this pin is low during the CNV rising edge. In this mode, SDI is used as a data input to daisy-chain the conversion results of two or more ADCs onto a single SDO line. The digital data level on SDI is output on SDO with a delay of 16 SCK cycles. CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can enable the serial output signals when low. Input/Output Interface Digital Power. Nominally at the same supply as the host interface (1.8 V, 2.5 V, 3 V, or 5 V). Exposed Pad. The exposed pad can be connected to GND. 1 AI = analog input, DI = digital input, DO = digital output, and P = power. Rev. C | Page 8 of 24 Data Sheet AD7988-1/AD7988-5 TERMINOLOGY Integral Nonlinearity Error (INL) INL refers to the deviation of each individual code from a line drawn from negative full scale through positive full scale. The point used as negative full scale occurs ½ LSB before the first code transition. Positive full scale is defined as a level 1½ LSB beyond the last code transition. The deviation is measured from the middle of each code to the true straight line (see Figure 30). Differential Nonlinearity Error (DNL) In an ideal ADC, code transitions are 1 LSB apart. DNL is the maximum deviation from this ideal value. It is often specified in terms of resolution for which no missing codes are guaranteed. Offset Error The first transition should occur at a level ½ LSB above analog ground (38.1 µV for the 0 V to 5 V range). The offset error is the deviation of the actual transition from that point. Gain Error The last transition (from 111 … 10 to 111 … 11) should occur for an analog voltage 1½ LSB below the nominal full scale (4.999886 V for the 0 V to 5 V range). The gain error is the deviation of the actual level of the last transition from the ideal level after the offset is adjusted out. Spurious-Free Dynamic Range (SFDR) SFDR is the difference, in decibels (dB), between the rms amplitude of the input signal and the peak spurious signal. Effective Resolution Effective resolution is calculated as Effective Resolution = log2(2N/RMS Input Noise) and is expressed in bits. Total Harmonic Distortion (THD) THD is the ratio of the rms sum of the first five harmonic components to the rms value of a full-scale input signal and is expressed in dB. Dynamic Range Dynamic range is the ratio of the rms value of the full scale to the total rms noise measured with the inputs shorted together. The value for dynamic range is expressed in dB. It is measured with a signal at −60 dBFS to include all noise sources and DNL artifacts. Signal-to-Noise Ratio (SNR) SNR is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, excluding harmonics and dc. The value for SNR is expressed in dB. Signal-to-(Noise + Distortion) Ratio (SINAD) SINAD is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in dB. Aperture Delay Aperture delay is the measure of the acquisition performance. It is the time between the rising edge of the CNV input and when the input signal is held for a conversion. Effective Number of Bits (ENOB) ENOB is a measurement of the resolution with a sine wave input. It is related to SINAD by the following formula: ENOB = (SINADdB − 1.76)/6.02 and is expressed in bits. Noise-Free Code Resolution Noise-free code resolution is the number of bits beyond which it is impossible to distinctly resolve individual codes. It is calculated as Transient Response Transient response is the time required for the ADC to accurately acquire its input after a full-scale step function is applied. Noise-Free Code Resolution = log2(2N/Peak-to-Peak Noise) and is expressed in bits. Rev. C | Page 9 of 24 AD7988-1/AD7988-5 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS VDD = 2.5 V, VREF = 5.0 V, VIO = 3.3 V, unless otherwise noted. 0 0 fS = 500kSPS fIN = 10kHz SNR = 91.17dB THD = –113.63dB SFDR = 110.30dB SINAD = 91.15dB –40 –60 –80 –100 –120 –140 –160 –60 –80 –100 –120 –140 100 150 200 250 FREQUENCY (kHz) –180 0 10 20 30 Figure 6. AD7988-5 FFT Plot, VREF = 5 V 1.25 fS = 500kSPS fIN = 10kHz 0.75 0.50 INL (LSB) –60 POSITIVE INL: +0.40 LSB NEGATIVE INL: –0.35 LSB 1.00 SNR = 86.8dB THD = –111.4dB SFDR = 105.9dB SINAD = 86.8dB –40 50 Figure 9. AD7988-1 FFT Plot, VREF = 2.5 V 0 –20 40 FREQUENCY (kHz) 10231-049 50 10231-046 0 –80 –100 –120 0.25 0 –0.25 –0.75 –160 –1.00 –180 0 50 100 150 200 250 FREQUENCY (kHz) –1.25 0 16384 32768 1.25 0 fS = 100kSPS fIN = 10kHz 0.75 0.50 INL (LSB) –60 POSITIVE INL: +0.45 LSB NEGATIVE INL: –0.29 LSB 1.00 SNR = 91.09dB THD = –113.12dB SFDR = 110.30dB SINAD = 91.05dB –40 65536 Figure 10. Integral Nonlinearity vs. Code, VREF = 5 V Figure 7. AD7988-5 FFT Plot, VREF = 2.5 V –20 49152 CODE 10231-010 –0.50 –140 10231-047 –80 –100 –120 0.25 0 –0.25 –0.50 –140 –0.75 –160 –1.00 0 10 20 30 FREQUENCY (kHz) 40 50 10231-048 –1.25 –180 0 16384 32768 49152 CODE Figure 11. Integral Nonlinearity vs. Code, VREF = 2.5 V Figure 8. AD7988-1 FFT Plot, VREF = 5 V Rev. C | Page 10 of 24 65536 10231-011 AMPLITUDE (dB of FULL SCALE) SNR = 86.7dB THD = –110.4dB SFDR = 103.9dB SINAD = 86.6dB –40 –160 –180 AMPLITUDE (dB of FULL SCALE) fS = 100kSPS fIN = 10kHz –20 AMPLITUDE (dB of FULL SCALE) AMPLITUDE (dB of FULL SCALE) –20 Data Sheet AD7988-1/AD7988-5 1.00 60k POSITIVE INL: +0.18 LSB NEGATIVE INL: –0.21 LSB 0.75 50970 50k 45198 0.50 40k COUNTS DNL (LSB) 0.25 0 30k –0.25 18848 20k –0.50 12424 10k –0.75 32768 49152 65536 CODE 1217 2290 30 0 0 Figure 15. Histogram of a DC Input at the Code Transition, VREF = 2.5 V 16 100 SNR SINAD ENOB SNR, SINAD (dB) 0.50 0.25 DNL (LSB) 94 CODE IN HEX POSITIVE INL: +0.25 LSB NEGATIVE INL: –0.22 LSB 0.75 1 7FFA 7FFB 7FFC 7FFD 7FFE 7FFF 8000 8001 8002 8003 8004 8005 8006 Figure 12. Differential Nonlinearity vs. Code, VREF = 5 V 1.00 0 0 –0.25 –0.50 95 15 90 14 85 13 ENOB (Bits) 16384 10231-012 0 0 10231-015 0 –1.00 –0.75 16384 32768 49152 65536 80 2.25 CODE 2.75 3.25 3.75 4.25 12 5.25 4.75 10231-016 0 10231-013 –1.00 REFERENCE VOLTAGE (V) Figure 13. Differential Nonlinearity vs. Code, VREF = 2.5 V Figure 16. SNR, SINAD, and ENOB vs. Reference Voltage 180k 60k 162595 53412 160k 50k 140k 40k COUNTS 100k 80k 60k 37417 31540 30k 20k 52720 42731 40k 10k 7285 20k 5807 0 0 22 1291 852 29 2 0 0 0 8003 8004 8005 8006 8007 8008 8009 800A 800B 800C 800D 800E 800F CODE IN HEX Figure 14. Histogram of a DC Input at the Code Center, VREF = 5 V 0 0 0 19 590 512 11 0 0 7FFA 7FFB 7FFC 7FFD 7FFE 7FFF 8000 8001 8002 8003 8004 8005 8006 CODE IN HEX 10231-051 0 10231-050 COUNTS 120k Figure 17. Histogram of a DC Input at the Code Center, VREF = 2.5 V Rev. C | Page 11 of 24 AD7988-1/AD7988-5 Data Sheet 95 95 94 93 93 92 SNR (dB) SNR (dB) 91 90 89 91 89 88 87 87 –8 –7 –6 –5 –4 –3 –2 –1 0 INPUT LEVEL (dB OF FULL SCALE) 85 –55 –35 –15 5 25 45 65 85 105 125 10231-053 –9 10231-018 85 –10 2.625 10231-023 86 TEMPERATURE (°C) Figure 21. SNR vs. Temperature Figure 18. SNR vs. Input Level –95 115 0.7 IVDD –100 0.6 110 SFDR 100 THD –115 CURRENT (mA) –110 SFDR (dB) 105 95 0.4 0.3 IREF 0.2 IVIO 90 –125 2.25 2.75 3.25 3.75 4.25 4.75 0.1 85 5.25 0 2.375 10231-019 –120 REFERENCE VOLTAGE (V) 2.425 2.475 2.525 2.575 VDD VOLTAGE (V) Figure 22. Operating Currents vs. Supply (AD7988-5) Figure 19. THD, SFDR vs. Reference Voltage 100 0.14 IVDD 0.12 95 CURRENT (mA) 0.10 90 0.08 0.06 IREF 0.04 85 IVIO 80 10 100 FREQUENCY (kHz) 1k Figure 20. SINAD vs. Frequency 0 2.375 2.425 2.475 2.525 2.575 VDD VOLTAGE (V) Figure 23. Operating Currents vs. Supply (AD7988-1) Rev. C | Page 12 of 24 2.625 10231-024 0.02 10231-052 SINAD (dB) THD (dB) 0.5 –105 Data Sheet AD7988-1/AD7988-5 –85 0.14 –90 0.12 IVDD –95 CURRENT (mA) 0.10 THD (dB) –100 –105 –110 008 0.06 IREF 0.04 –115 IVIO 1k 100 FREQUENCY (kHz) 0 –55 10231-054 –125 10 –35 –15 5 25 45 65 85 105 10231-028 0.02 –120 125 TEMPERATURE (°C) Figure 24. THD vs. Frequency Figure 27. Operating Currents vs. Temperature (AD7988-1) 8 –110 7 –112 CURRENT (µA) THD (dB) 6 –114 –116 5 4 3 IVDD + IVIO 2 –118 –35 –15 5 25 45 65 85 105 125 TEMPERATURE (°C) Figure 25. THD vs. Temperature IVDD 0.6 0.4 0.3 IREF 0.2 IVIO 0.1 –15 5 25 45 65 85 105 125 TEMPERATURE (°C) 10231-027 CURRENT (mA) 0.5 –35 –35 –15 5 25 45 65 85 105 TEMPERATURE (°C) Figure 28. Power-Down Currents vs. Temperature 0.7 0 –55 0 –55 Figure 26. Operating Currents vs. Temperature (AD7988-5) Rev. C | Page 13 of 24 125 10231-029 –120 –55 10231-026 1 AD7988-1/AD7988-5 Data Sheet THEORY OF OPERATION IN+ MSB LSB 32,768C 16,384C 4C 2C C SWITCHES CONTROL SW+ C BUSY REF COMP GND 32,768C 16,384C 4C 2C C CONTROL LOGIC OUTPUT CODE C LSB MSB SW– 10231-030 CNV IN– Figure 29. ADC Simplified Schematic CIRCUIT INFORMATION The AD7988-1/AD7988-5 devices are fast, low power, singlesupply, precise 16-bit ADCs that use a successive approximation architecture. The AD7988-1 is capable of converting 100,000 samples per second (100 kSPS), whereas the AD7988-5 is capable of a throughput of 500 kSPS, and they power down between conversions. When operating at 10 kSPS, for example, the ADC consumes 70 µW typically, ideal for battery-powered applications. The AD7988-x provides the user with on-chip track-and-hold and does not exhibit any pipeline delay or latency, making it ideal for multiple multiplexed channel applications. The AD7988-x can be interfaced to any 1.8 V to 5 V digital logic family. It is housed in a 10-lead MSOP or a tiny 10-lead LFCSP (QFN) that combines space savings and allows flexible configurations. CONVERTER OPERATION The AD7988-x is a successive approximation ADC based on a charge redistribution DAC. Figure 29 shows the simplified schematic of the ADC. The capacitive DAC consists of two identical arrays of 16 binary weighted capacitors, which are connected to the two comparator inputs. During the acquisition phase, terminals of the array tied to the comparator’s input are connected to GND via SW+ and SW−. All independent switches are connected to the analog inputs. Therefore, the capacitor arrays are used as sampling capacitors and acquire the analog signal on the IN+ and IN− inputs. When the acquisition phase is completed and the CNV input goes high, a conversion phase is initiated. When the conversion phase begins, SW+ and SW− are opened first. The two capacitor arrays are then disconnected from the inputs and connected to the GND input. Therefore, the differential voltage between the IN+ and IN− inputs captured at the end of the acquisition phase are applied to the comparator inputs, causing the comparator to become unbalanced. By switching each element of the capacitor array between GND and REF, the comparator input varies by binary weighted voltage steps (VREF/2, VREF/4 … VREF/65,536). The control logic toggles these switches, starting with the MSB, to bring the comparator back into a balanced condition. After the completion of this process, the part returns to the acquisition phase and the control logic generates the ADC output code. Because the AD7988-x has an on-board conversion clock, the serial clock, SCK, is not required for the conversion process. Rev. C | Page 14 of 24 Data Sheet AD7988-1/AD7988-5 Transfer Functions Table 7. Output Codes and Ideal Input Voltages The ideal transfer characteristic for the AD7988-x is shown in Figure 30 and Table 7. Description FSR – 1 LSB Midscale + 1 LSB Midscale Midscale – 1 LSB –FSR + 1 LSB –FSR 111 ... 101 1 2 Analog Input Digital Output Code (Hex) FFFF1 8001 8000 7FFF 0001 00002 This is also the code for an overranged analog input (VIN+ − VIN− above VREF − VGND). This is also the code for an underranged analog input (VIN+ − VIN− below VGND). TYPICAL CONNECTION DIAGRAM Figure 31 shows an example of the recommended connection diagram for the AD7988-x when multiple supplies are available. 000 ... 010 000 ... 001 000 ... 000 –FSR –FSR + 1LSB –FSR + 0.5LSB +FSR – 1 LSB +FSR – 1.5 LSB ANALOG INPUT 10231-031 Figure 30. ADC Ideal Transfer Function REF1 V+ 2.5V 10µF2 100nF V+ 1.8V TO 5.5V 100nF 20Ω REF 0V TO VREF 3 2.7nF VDD VIO IN+ SDI AD7988-1/ AD7988-5 V– 4 SCK 3- OR 4-WIRE INTERFACE5 SDO CNV IN– GND 1 SEE THE VOLTAGE REFERENCE INPUT SECTION FOR REFERENCE SELECTION. 2C REF IS USUALLY A 10µF CERAMIC CAPACITOR (X5R). 3 SEE THE DRIVER AMPLIFIER CHOICE SECTION. 4 OPTIONAL FILTER. SEE THE ANALOG INPUTS SECTION. 5 SEE THE DIGITAL INTERFACE SECTION FOR THE MOST CONVENIENT INTERFACE MODE. Figure 31. Typical Application Diagram with Multiple Supplies Rev. C | Page 15 of 24 10231-032 ADC CODE (STRAIGHT BINARY) 111 ... 111 111 ... 110 VREF = 5 V 4.999924 V 2.500076 V 2.5 V 2.499924 V 76.3 µV 0V AD7988-1/AD7988-5 Data Sheet ANALOG INPUTS DRIVER AMPLIFIER CHOICE Figure 32 shows an equivalent circuit of the input structure of the AD7988-x. Although the AD7988-x is easy to drive, the driver amplifier needs to meet the following requirements: The two diodes, D1 and D2, provide ESD protection for the analog inputs, IN+ and IN−. Care must be taken to ensure that the analog input signal never exceeds the supply rails by more than 0.3 V, because this causes these diodes to become forwardbiased and start conducting current. These diodes can handle a forward-biased current of 130 mA maximum. For instance, these conditions may eventually occur when the input buffer’s supplies are different from VDD. In such a case (for example, an input buffer with a short circuit), the current limitation can be used to protect the part. • SNRLOSS REF RIN CIN D2 GND 10231-033 D1 IN+ OR IN– CPIN The noise generated by the driver amplifier must be kept as low as possible to preserve the SNR and transition noise performance of the AD7988-x. The noise coming from the driver is filtered by the AD7988-x analog input circuit’s one-pole, low-pass filter made by RIN and CIN or by the external filter, if one is used. Because the typical noise of the AD7988-x is 47.3 µV rms, the SNR degradation due to the amplifier is Figure 32. Equivalent Analog Input Circuit The analog input structure allows the sampling of the true differential signal between IN+ and IN−. By using these differential inputs, signals common to both inputs are rejected. 47.3 = 20 log π 2 2 47.3 + f −3dB (Ne N ) 2 where: f–3dB is the input bandwidth in MHz of the AD7988-x (10 MHz) or the cutoff frequency of the input filter, if one is used. N is the noise gain of the amplifier (for example, 1 in buffer configuration). eN is the equivalent input noise voltage of the op amp, in nV/√Hz. For ac applications, the driver should have a THD performance commensurate with the AD7988-x. For multichannel multiplexed applications, the driver amplifier and the AD7988-x analog input circuit must settle for a full-scale step onto the capacitor array at a 16-bit level (0.0015%, 15 ppm). In the amplifier data sheet, settling at 0.1% to 0.01% is more commonly specified. This may differ significantly from the settling time at a 16-bit level and should be verified prior to driver selection. During the acquisition phase, the impedance of the analog inputs (IN+ and IN−) can be modeled as a parallel combination of Capacitor CPIN and the network formed by the series connection of RIN and CIN. CPIN is primarily the pin capacitance. RIN is typically 400 Ω and is a lumped component made up of serial resistors and the on resistance of the switches. CIN is typically 30 pF and is mainly the ADC sampling capacitor. During the conversion phase, when the switches are opened, the input impedance is limited to CPIN. RIN and CIN make a one-pole, low-pass filter that reduces undesirable aliasing effects and limits the noise. • When the source impedance of the driving circuit is low, the AD7988-x can be driven directly. Large source impedances significantly affect the ac performance, especially THD. The dc performances are less sensitive to the input impedance. The maximum source impedance depends on the amount of THD that can be tolerated. The THD degrades as a function of the source impedance and the maximum input frequency. Table 8. Recommended Driver Amplifiers • Amplifier ADA4841-1 AD8021 AD8022 OP184 AD8655 AD8605, AD8615 Rev. C | Page 16 of 24 Typical Application Very low noise, small size, and low power Very low noise and high frequency Low noise and high frequency Low power, low noise, and low frequency 5 V single-supply, low noise 5 V single-supply, low power Data Sheet AD7988-1/AD7988-5 VOLTAGE REFERENCE INPUT The AD7988-x voltage reference input, REF, has a dynamic input impedance and should therefore be driven by a low impedance source with efficient decoupling between the REF and GND pins, as explained in the Layout section. When REF is driven by a very low impedance source, for example, a reference buffer using the AD8031 or the AD8605, a ceramic chip capacitor is appropriate for optimum performance. If an unbuffered reference voltage is used, the decoupling value depends on the reference used. For example, a 22 µF (X5R, 1206 size) ceramic chip capacitor is appropriate for optimum performance using a low temperature drift ADR43x reference. If desired, a reference-decoupling capacitor value as small as 2.2 µF can be used with a minimal impact on performance, especially DNL. Regardless, there is no need for an additional lower value ceramic decoupling capacitor (for example, 100 nF) between the REF and GND pins. POWER SUPPLY The AD7988-x uses two power supply pins: a core supply, VDD, and a digital input/output interface supply, VIO. VIO allows direct interface with any logic between 1.8 V and 5.0 V. To reduce the number of supplies needed, VIO and VDD can be tied together. The AD7988-x is independent of power supply sequencing between VIO and VDD. Additionally, it is very insensitive to power supply variations over a wide frequency range, as shown in Figure 33. 80 To ensure optimum performance, VDD should be roughly half of REF, the voltage reference input. For example, if REF is 5.0 V, VDD should be set to 2.5 V (±5%). If REF = 2.5V, and VDD = 2.5 V, performance is degraded as can be seen in Table 2. The AD7988-x powers down automatically at the end of each conversion phase. DIGITAL INTERFACE Although the AD7988-x has a reduced number of pins, it offers flexibility in its serial interface modes. The AD7988-x, when in CS mode, is compatible with SPI, QSPI™, and digital hosts. This interface can use either a 3-wire or 4-wire interface. A 3-wire interface using the CNV, SCK, and SDO signals minimizes wiring connections and is useful, for instance, in isolated applications. A 4-wire interface using the SDI, CNV, SCK, and SDO signals allows CNV, which initiates the conversions, to be independent of the readback timing (SDI). This is useful in low jitter sampling or simultaneous sampling applications. The AD7988-x, when in chain mode, provides a daisy-chain feature using the SDI input for cascading multiple ADCs on a single data line, similar to a shift register. The mode in which the part operates depends on the SDI level when the CNV rising edge occurs. CS mode is selected if SDI is high, and chain mode is selected if SDI is low. The SDI hold time is such that when SDI and CNV are connected together, the chain mode is selected. The user must time out the maximum conversion time prior to readback. 70 65 60 55 1 10 100 FREQUENCY (kHz) 1k 10231-034 PSRR (dB) 75 Figure 33. PSRR vs. Frequency Rev. C | Page 17 of 24 AD7988-1/AD7988-5 Data Sheet CS MODE, 3-WIRE When CNV goes low, the MSB is output onto SDO. The remaining data bits are then clocked by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can be used to capture the data, a digital host using the SCK falling edge allows a faster reading rate, provided that it has an acceptable hold time. After the 16th SCK falling edge or when CNV goes high, whichever is earlier, SDO returns to high impedance. This mode is typically used when a single AD7988-x is connected to an SPI-compatible digital host. The connection diagram is shown in Figure 34, and the corresponding timing is given in Figure 35. With SDI tied to VIO, a rising edge on CNV initiates a conversion, selects the CS mode, and forces SDO to high impedance. When the conversion is complete, the AD7988-x enters the acquisition phase and powers down. CONVERT DIGITAL HOST CNV VIO SDI AD7988-1/ AD7988-5 DATA IN SDO 10231-035 SCK CLK Figure 34. 3-Wire CS Mode Connection Diagram SDI = 1 tCYC tCNVH CNV ACQUISITION tCONV tACQ CONVERSION ACQUISITION tSCK tSCKL 2 3 14 tHSDO 16 tSCKH tEN SDO 15 tDIS tDSDO D15 D14 D13 D1 Figure 35. 3-Wire CS Mode Serial Interface Timing (SDI High) Rev. C | Page 18 of 24 D0 10231-036 1 SCK Data Sheet AD7988-1/AD7988-5 CS MODE 4-WIRE When the conversion is complete, the AD7988-x enters the acquisition phase and powers down. Each ADC result can be read by bringing its SDI input low, which consequently outputs the MSB onto SDO. The remaining data bits are then clocked by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can be used to capture the data, a digital host using the SCK falling edge allows a faster reading rate, provided that it has an acceptable hold time. After the 16th SCK falling edge or when SDI goes high, whichever is earlier, SDO returns to high impedance and another AD7988-x can be read. This mode is typically used when multiple AD7988-x devices are connected to an SPI-compatible digital host. A connection diagram example using two AD7988-x devices is shown in Figure 36, and the corresponding timing is given in Figure 37. With SDI high, a rising edge on CNV initiates a conversion, selects the CS mode, and forces SDO to high impedance. In this mode, CNV must be held high during the conversion phase and the subsequent data readback (if SDI and CNV are low, SDO is driven low). Prior to the minimum conversion time, SDI can be used to select other SPI devices, such as analog multiplexers, but SDI must be returned high before the minimum conversion time elapses and then held high for the maximum conversion time. CS2 CS1 CONVERT CNV AD7988-1/ AD7988-5 SDO SDI DIGITAL HOST SDO SCK SCK 10231-037 SDI CNV AD7988-1/ AD7988-5 DATA IN CLK Figure 36. 4-Wire CS Mode Connection Diagram tCYC CNV ACQUISITION tCONV tACQ CONVERSION ACQUISITION tSSDICNV SDI (CS1) tHSDICNV SDI (CS2) tSCK tSCKL 1 2 3 14 tHSDO 16 17 18 30 31 32 tSCKH tEN SDO 15 tDIS tDSDO D15 D14 D13 D1 D0 D15 Figure 37. 4-Wire CS Mode Serial Interface Timing Rev. C | Page 19 of 24 D14 D1 D0 10231-038 SCK AD7988-1/AD7988-5 Data Sheet CHAIN MODE phase and the subsequent data readback. When the conversion is complete, the MSB is output onto SDO and the AD7988-x enters the acquisition phase and powers down. The remaining data bits stored in the internal shift register are clocked by subsequent SCK falling edges. For each ADC, SDI feeds the input of the internal shift register and is clocked by the SCK falling edge. Each ADC in the chain outputs its data MSB first, and 16 × N clocks are required to read back the N ADCs. The data is valid on both SCK edges. Although the rising edge can be used to capture the data, a digital host using the SCK falling edge allows a faster reading rate and, consequently, more AD7988-x devices in the chain, provided that the digital host has an acceptable hold time. The maximum conversion rate may be reduced due to the total readback time. This mode can be used to daisy-chain multiple AD7988-x devices on a 3-wire serial interface. This feature is useful for reducing component count and wiring connections, for example, in isolated multiconverter applications or for systems with a limited interfacing capacity. Data readback is analogous to clocking a shift register. A connection diagram example using two AD7988-x devices is shown in Figure 38, and the corresponding timing is given in Figure 39. When SDI and CNV are low, SDO is driven low. With SCK low, a rising edge on CNV initiates a conversion and selects the chain mode. In this mode, CNV is held high during the conversion CONVERT CNV CNV AD7988-1/ AD7988-5 SDO SDI AD7988-1/ AD7988-5 SDO DATA IN B SCK A SCK 10231-039 SDI DIGITAL HOST CLK Figure 38. Chain Mode Connection Diagram SDIA = 0 tCYC CNV ACQUISITION tCONV tACQ CONVERSION ACQUISITION tSCK tSCKL tSSCKCNV SCK 1 2 3 15 16 17 18 30 31 32 D A1 DA0 tSCKH tHSDISCK tEN SDOA = SDIB 14 tSSDISCK tHSCKCNV DA15 DA14 DA13 D A1 DA0 DB 1 DB0 tHSDO SDOB DB15 DB14 DB13 DA15 Figure 39. Chain Mode Serial Interface Timing Rev. C | Page 20 of 24 DA14 10231-040 tDSDO Data Sheet AD7988-1/AD7988-5 APPLICATIONS INFORMATION INTERFACING TO BLACKFIN® DSP The AD7988-x can easily connect to a DSP SPI or SPORT. The SPI configuration is straightforward, using the standard SPI interface as shown in Figure 40. SPI_CLK SCK SPI_MISO SDO SPI_MOSI CNV AD7988-1/ AD7988-5 10231-041 BLACKFIN DSP Figure 40. Typical Connection to Blackfin SPI Interface Similarly, the SPORT interface can be used to interface to this ADC. The SPORT interface has some benefits in that it can use direct memory access (DMA) and provides a lower jitter CNV signal generated from a hardware counter. Some glue logic may be required between SPORT and the AD7988-x interface. The evaluation board for the AD7988-x interfaces directly to the SPORT of the Blackfin-based (ADSPBF-527) SDP board. The configuration used for the SPORT interface requires the addition of some glue logic as shown in Figure 41. The SCK input to the ADC was gated off when CNV was high to keep the SCK line static while converting the data, thereby ensuring the best integrity of the result. This approach uses an AND gate and a NOT gate for the SCK path. The other logic gates used on the RSCLK and RFS paths are for delay matching purposes and may not be necessary where path lengths are short. Using at least one ground plane is recommended. It can be common or split between the digital and analog section. In the latter case, join the planes underneath the AD7988-x devices. The AD7988-x voltage reference input, REF, has a dynamic input impedance. Decouple REF with minimal parasitic inductances by placing the reference decoupling ceramic capacitor close to, but ideally right up against, the REF and GND pins and connecting them with wide, low impedance traces. Finally, decouple the power supplies of the AD7988-x, VDD and VIO, with ceramic capacitors, typically 100 nF, placed close to the AD7988-x and connected using short and wide traces to provide low impedance paths and to reduce the effect of glitches on the power supply lines. An example of a layout following these rules is shown in Figure 42 and Figure 43. EVALUATING THE PERFORMANCE OF THE AD7988-x The evaluation board package for the AD7988-x (EVAL-AD79885SDZ) includes a fully assembled and tested evaluation board, documentation, and software for controlling the board from a PC via the EVAL-SDP-CB1Z. AD7988-1/ AD7988-5 This is one approach to using the SPORT interface for this ADC; there may be other solutions equal to this approach. VDRIVE DR SDO RSCLK SCK RFS AD7988-1/ AD7988-5 TFS CNV 10231-043 TSCLK 10231-045 BLACKFIN DSP Figure 42. Example Layout of the AD7988-x (Top Layer) Figure 41. Evaluation Board Connection to Blackfin Sport Interface LAYOUT Design the printed circuit board (PCB) that houses the AD7988-x so that the analog and digital sections are separated and confined to certain areas of the board. The pinout of the AD7988-x, with all the analog signals on the left side and all the digital signals on the right side, eases this task. 10231-044 Avoid running digital lines under the device because these couple noise onto the die, unless a ground plane under the AD7988-x is used as a shield. Fast switching signals, such as CNV or clocks, should never run near analog signal paths. Avoid crossover of digital and analog signals. Figure 43. Example Layout of the AD7988-x (Bottom Layer) Rev. C | Page 21 of 24 AD7988-1/AD7988-5 Data Sheet OUTLINE DIMENSIONS 3.10 3.00 2.90 10 3.10 3.00 2.90 1 5.15 4.90 4.65 6 5 PIN 1 IDENTIFIER 0.50 BSC 0.95 0.85 0.75 15° MAX 1.10 MAX 0.30 0.15 0.70 0.55 0.40 0.23 0.13 6° 0° 091709-A 0.15 0.05 COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-187-BA Figure 44.10-Lead Mini Small Outline Package [MSOP] (RM-10) Dimensions shown in millimeters 2.48 2.38 2.23 3.10 3.00 SQ 2.90 0.50 BSC 6 10 0.50 0.40 0.30 5 TOP VIEW 0.80 0.75 0.70 SEATING PLANE 1.74 1.64 1.49 EXPOSED PAD 0.30 0.25 0.20 1 BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 PIN 1 INDICATOR (R 0.15) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.20 REF Figure 45. 10-Lead Lead Frame Chip Scale Package [QFN (LFCSP_WD)] 3 mm × 3 mm Body, Very Very Thin, Dual Lead (CP-10-9) Dimensions shown in millimeters Rev. C | Page 22 of 24 02-27-2012-B PIN 1 INDEX AREA Data Sheet AD7988-1/AD7988-5 ORDERING GUIDE Model 1 AD7988-1BRMZ AD7988-1BRMZ-RL7 AD7988-1BCPZ-RL AD7988-1BCPZ-RL7 AD7988-5BRMZ AD7988-5BRMZ-RL7 AD7988-5BCPZ-RL AD7988-5BCPZ-RL7 EVAL-AD7988-5SDZ Notes EVAL-SDP-CB1Z 3 2 Integral Nonlinearity ±1.25 LSB max ±1.25 LSB max ±1.25 LSB max ±1.25 LSB max ±1.25 LSB max ±1.25 LSB max ±1.25 LSB max ±1.25 LSB max Temperature Range −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C Ordering Quantity Tube, 50 Reel, 1,000 Reel, 5,000 Reel, 1,500 Tube, 50 Reel, 1,000 Reel, 5,000 Reel, 1,500 Package Description 10-Lead MSOP 10-Lead MSOP 10-Lead QFN (LFCSP_WD) 10-Lead QFN (LFCSP_WD) 10-Lead MSOP 10-Lead MSOP 10-Lead QFN (LFCSP_WD) 10-Lead QFN (LFCSP_WD) Evaluation Board with AD7988-5 Populated; Use for Evaluation of Both AD7988-1 and AD7988-5. System Demonstration Board, Used as a Controller Board for Data Transfer via USB Interface to PC. 1 Package Option RM-10 RM-10 CP-10-9 CP-10-9 RM-10 RM-10 CP-10-9 CP-10-9 Z = RoHS Compliant Part. This board can be used as a standalone evaluation board or in conjunction with the EVAL-SDZ-CB1Z for evaluation/demonstration purposes. 3 This board allows a PC to control and communicate with all Analog Devices evaluation boards ending in the SD designator. 2 Rev. C | Page 23 of 24 Branding C7E C7E C7X C7X C7Q C7Q C7Z C7Z AD7988-1/AD7988-5 Data Sheet NOTES ©2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10231-0-8/12(C) Rev. C | Page 24 of 24