CES521
Schottky Barrier Diode
Silicon Epitaxial
CES521
1. Applications
•
High-Speed Switching
2. Features
(1)
Low forward voltage: VF(3) = 0.5 V (max).
(2)
Small and compact ESC package, equivalent to SOD-523 and SC-79
packages.
3. Packaging and Internal Circuit
1: Cathode
2: Anode
ESC
)
4. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25
25
Characteristics
Symbol
Note
Rating
Unit
Reverse voltage
VR
30
V
Peak forward current
IFM
300
mA
Average rectified current
IO
200
IFSM
(Note 1)
1
A
Power dissipation
PD
(Note 2)
150
mW
Junction temperature
Tj
125
Storage temperature
Tstg
-55 to 125
Operating temperature
Topr
-40 to 100
Non-repetitive peak forward surge current
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Measured with a 10ms pulse.
Note 2: Mounted on a glass-epoxy circuit board of 20 mm × 20 mm, Pad dimension of 4 mm × 4 mm.
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CES521
)
5. Electrical Characteristics (Unless otherwise specified, Ta = 25
25
Characteristics
Symbol
Forward voltage
Reverse current
Total capacitance
Note
Test Condition
Min
Typ.
Max
Unit
V
VF(1)
IF = 1 mA
0.20
VF(2)
IF = 5 mA
0.24
VF(3)
IF = 200 mA
0.45
0.5
IR(1)
VR = 10 V
20
IR(2)
VR = 30 V
30
Ct
VR = 0 V, f = 1 MHz
26
µA
pF
6. Marking
Fig. 6.1 Marking
Marking Code
Part Number
RB
CES521
7. Usage Considerations
•
Schottky barrier diodes (SBDs) have reverse leakage greater than other types of diodes. This makes SBDs
more susceptible to thermal runaway under high-temperature and high-voltage conditions. Thus, both
forward and reverse power losses of SBDs should be considered for thermal and safety design.
8. Land pattern dimensions for reference only
Fig. 8.1 Land pattern dimensions for reference only (Unit: mm)
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CES521
9. Characteristics Curves (Note)
Fig. 9.1 IF - VF
Fig. 9.2 IR - VR
Fig. 9.3 Ct - VR
Note:
The above characteristics curves are presented for reference only and not guaranteed by production test.
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CES521
Package Dimensions
Unit: mm
Weight: 1.4 mg (typ.)
Package Name(s)
Nickname: ESC
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CES521
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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