Light Touch Switches/EVQQX 6 mm Square SMD Light Touch Switches Type: EVQQX ■ Features ■ Recommended Applications Height 2.0 mm, 2.5 mm, 3.1 mm ● Reflow soldering ● Wide product variety ● Operating signal input switches for communication ● External dimensions: 6.2 mm҂6.2 mm, ● Operation switches for portable electronic equipment (Camcorders, Portable audio players, etc.) equipment. ■ Explanation of Part Numbers 1 2 3 4 5 E V Q Q X Product Code 6 7 8 Height Type 9 Push Plate Color ■ Product Chart Reflow soldering Soldering Type with Push Plate Without sealing film Taping L=2.0, 2.5, 3.1 mm Packaging Ground terminal L Profile Operating Force Without With 1.3 N EVQQXP EVQQXM 1.6 N EVQQXS EVQQXN 2.6 N EVQQXT EVQQXK ■ Specifications Type Snap action / Push-on type SPST Rating 10 µA 2 Vdc to 20 mA 15 Vdc (Resistive load) Contact Resistance Electrical 50 m액 max. Insulation Resistance 50 M액 min. (at 100 Vdc) Dielectric Withstanding Voltage 250 Vac for 1 minute 3 ms max. (ON) 8 ms max. (OFF) Bouncing Mechanical Operating Force 1.3 N±0.4 N 1.6 N±0.5 N Travel Endurance Operating Life 2.6 N± 0.6 N 0.25 mm±0.10 mm 1000000 cycles min. Operating Temperature –20 °C to +70 °C –40 °C to +85 °C (Bulk) –20 °C to +60 °C (Taping) Storage Temperature Minimum Quantity/Packing Unit Quantity/Carton 100000 cycles min. H=2.0 mm 4000 pcs. Embossed Taping (Reel Pack) H=2.5 mm, 3.1 mm 2000 pcs. Embossed Taping (Reel Pack) H=2.0 mm 20000 pcs. H=2.5 mm, 3.1 mm 10000 pcs. Note: Non washable Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Apr. 2008 Light Touch Switches/EVQQX ■ Dimensions in mm (not to scale) EVQQX (Embossed Taping) 0 0.8 –0.1 A .6 φ3 B H 3.3 6.5±0.3 φ3 Knob A' B' 1.3 0.05±0.1 Notes: 1. Non-washable in solvents 2. Types with ground terminal available 6.2±0.3 4 6.8±0.3 With push plate Surface mount For reflow soldering With ground terminal Without ground terminal 2 1 R0.3 2 1 min. (3.6) A B A' B' 1 min. (3.2) (3.3) (3.2) 1 min. 1 min.✽ 4 PWB land pattern for reference Circuit Diagram Height Even though the ground terminal is not soldered the ground effect would be gained. However when soldering the ground terminal, do investigation sufficiently beforehand in the invasion of the flux. We recommend to connect the GND land shown in the switch spec with the GND of your P.W.B for withstanding electric static discharge. H 2.0±0.2 2.5±0.2 ✽ This land not necessary when a ground terminal is not used. Part Numbers Ground Terminal Operating Force +0.3 3.1−0.1 H=Height Push Plate Color Operating Life EVQQXP01W Without 1.3 N 2.0 mm White 1000000 cycles EVQQXP02W Without 1.3 N 2.5 mm White 1000000 cycles EVQQXP03W Without 1.3 N 3.1 mm White 1000000 cycles EVQQXS01W Without 1.6 N 2.0 mm White 1000000 cycles EVQQXS02W Without 1.6 N 2.5 mm White 1000000 cycles EVQQXS03W Without 1.6 N 3.1 mm White 1000000 cycles EVQQXT01W Without 2.6 N 2.0 mm White 100000 cycles EVQQXT02W Without 2.6 N 2.5 mm White 100000 cycles EVQQXT03W Without 2.6 N 3.1 mm White 100000 cycles EVQQXM01W With 1.3 N 2.0 mm White 1000000 cycles EVQQXM02W With 1.3 N 2.5 mm White 1000000 cycles EVQQXM03W With 1.3 N 3.1 mm White 1000000 cycles EVQQXN01W With 1.6 N 2.0 mm White 1000000 cycles EVQQXN02W With 1.6 N 2.5 mm White 1000000 cycles EVQQXN03W With 1.6 N 3.1 mm White 1000000 cycles EVQQXK01W With 2.6 N 2.0 mm White 100000 cycles EVQQXK02W With 2.6 N 2.5 mm White 100000 cycles EVQQXK03W With 2.6 N 3.1 mm White 100000 cycles Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Jun. 2008 Light Touch Switches/EVQQX ■ Recommended Reflow Soldering Conditions ● Embossed Carrier Taping Fan or Normal Temp. 230 180 Tape width=12.0 mm t1 Feeding hole Chip pocket P2 P0 φD0 E 150 F W A B Operation Top (°C) MAX. 260 t2 (Normal Temp.) 90±30 P1 Chip component Tape running direction 40±10 Soldering Time (s) Unit: mm Part No. A Height 2.0 2.5/3.1 EVQQX 7.0±0.2 B W 7.5±0.2 12.0±0.3 F 5.5±0.1 E P1 P2 1.75±0.10 8.0±0.1 Item A P0 2.0±0.1 D0 Dia. t1 +0.1 –0 4.0±0.1 t2 2.2±0.2 3.2±0.2 0.30±0.05 1.5 ● Standard Reel Dimensions in mm (not to scale) T E B Item W Rate (mm) 14.0±1.5 D r B C Rate (mm) φ370.0±2.0 φ50.0 min. φ13.0±0.5 C A W ■ Recommended Shape of Test Pole D E φ21.0±1.0 2.0±0.5 T t r — 1.0 to 3.0 1.0±0.5 t ■ Recommended Operating Conditions 0.3 mm max. φ2.0 to φ3.0 Test pole Leaning angle range 90 °±4 ° (vertical direction) Switch R0.2±0.05 Mounting surface Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Nov. 2007