Ironwood CG-BGA-4009 Directly mounts to target pcb with hardware Datasheet

Top View
Features
A
Directly mounts to target PCB (needs tooling
30.23mm
[1.190"]
holes) with hardware
Minimum real estate required
Compression plate distributes forces evenly
A
Clamshell lid
8
25.48mm [1.003"]
Materials:
Side View
(Section AA)
5.85mm
4
34.5mm
1
+ IC thickness
3
1
Clam Shell Lid: Black anodized Aluminum.
Height = 16.5 mm.
2
Socket Base: Black anodized Aluminum.
Height = 6 mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 8.5 mm.
4
Compression Screw: Clear anodized Aluminum.
Height = 25 mm, Fluted Knob
5
Ball Guide: Kapton polyimide.
6
Customer's BGA IC
7
2
Socket Base Screw: Socket Head Cap Screw,
alloy steel with black oxide finish, 0-80 Thread,
1/4" long.
5
8
Latch: Black anodised Aluminum.
9
Elastomer Guide: Non-clad FR4.
Thickness = 0.725mm.
10
Elastomer: 40 micron dia gold plated brass filaments
arranged symmetrically in a silicone rubber (63.5
degree angle). Thickness = 0.75mm.
6
Customer's PCB
9
10
7
CG-BGA-4009 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev:A
Drawing: Vinayak R
Date: 9/1/09
File: CG-BGA-4009 Dwg.mcd
Modified:
All Tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4
Recommended PCB Layout
Top View
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
Orientation Mark
0.80mm typ.
2.3375mm*
1.9625mm
2.54mm
Ø 0.850mm±0.025mm (x2)
Nonplated Alignment Hole
15.225mm±0.125mm sqr.
Socket size
Ø 0.3600mm PAD
5.08mm
Ø 1.61mm±0.05mm (x4)
Nonplated Mounting Hole
1.25mm±0.13mm (x4)
1.25mm±0.13mm (x4)
8.80mm(x4)
Ø 4.78mm washer keep out
12.725mm
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
CG-BGA-4009 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
All dimensions are in mm unless stated otherwise
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
Status: Released
Scale: 4:1
Rev:A
Drawing: Vinayak R
Date: 9/1/09
File: CG-BGA-4009 Dwg.mcd
Modified:
Recommended PCB Layout Tolerances:
±0.025mm [±0.001”] unless stated otherwise.
PAGE 2 of 4
Compatible BGA Spec
D
X
Y
e
E
3
Øb
Ø0.15 X Y
Ø0.08
Bottom View
Top View
1.
5
2.
3
Dimension b is measured at the
maximum solder ball diameter, parallel
to datum plane Z.
4
Datum Z (seating plane) is defined
by the spherical crowns of the solder balls.
5
Parallelism measurement shall exclude
any effect of mark on top surface of package.
A
0.08 Z
A1
4
Side View
DIM
Interpret dimensions and tolerances per
ASME Y14.5M-1994.
0.20 Z
Z
Dimensions are in millimeters.
MIN
MAX
2.5
A
A1
0.35
0.25
b
0.6
D
10.0 BSC
E
10.0 BSC
e
0.8 BSC
Array: 12x12
CG-BGA-4009 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev:A
Drawing: Vinayak R
Date: 9/1/09
File: CG-BGA-4009 Dwg.mcd
Modified:
PAGE 3 of 4
9.71mm
8.59mm
25.48mm
12.86mm
8.09mm
30.23mm
37.55mm
13.33mm
1.81mm
10.08mm
7.33mm
3.33mm
7.61mm
11.12mm
16.11mm
20.07mm
41.30mm
14.11mm
CG-BGA-4009 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev:A
Drawing: Vinayak R
Date: 9/1/09
File: CG-BGA-4009 Dwg.mcd
Modified:
All Tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 4 of 4
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