AG102 The Communications Edge TM Product Information High Dynamic Range Gain Block Product Features Product Description Functional Diagram x 60 – 3000 MHz x 14 dB Gain x 2.4 dB Noise Figure x +36 dBm OIP3 x Single +3.3 or +4.5 Supply x Internally matched to 50 : x Lead-free/Green/RoHScompliant SOT-89 Package x MTTF > 1000 years The AG102 is a general-purpose gain block that offers good dynamic range and low noise figure in a low-cost surface-mount package. The combination of near-constant OIP3 and low noise figure performance over frequency makes it attractive for both narrowband and broadband applications. The device combines dependable performance with superb quality to maintain MTTF values exceeding 1000 years at mounting temperatures of +85 qC and is available in the environmentally-friendly lead-free/green /RoHS-compliant SOT-89 package. GND x Mobile Infrastructure x CATV / DBS x W-LAN / ISM x RFID x Defense / Homeland Security x Fixed Wireless 1 2 3 RF IN GND RF OUT Function Input Output/Bias Ground The AG102 uses a high reliability GaAs MMIC technology and only requires DC-blocking and bypass capacitors, and an inductive RF choke for operation. Internal matching provides a 50 ohm input / output impedance minimizing the number of required external components. Applications Pin No. 1 3 2, 4 The broadband MMIC amplifier is well suited for various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the AG102 will work for other applications within the 60 to 3000 MHz frequency range such as fixed wireless. Specifications (1) Parameter 4 Typical Performance (4) Units Min MHz MHz dB dB dB dBm dBm dB mA V 60 Operational Bandwidth Test Frequency Gain Input Return Loss(5) Output Return Loss Output P1dB Output IP3 (2) Noise Figure (3) Operating Current Range Supply Voltage 13 +33 55 Typ 800 14 8.5 20 +18 +36 2.4 70 4.5 Max Parameter Units 3000 Frequency S21 S11 (5) S22 Output P1dB Output IP3 Noise Figure Supply Voltage Device Current MHz dB dB dB dBm dBm dB V mA 16 90 1. Test conditions unless otherwise noted: T = 25º C, 50 system. 2. 3OIP measured with two tones at an output power of +2.5 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Noise figure can be optimized by matching the input for optimal return loss. Typical 900 14 -10 -27 +18 +36 2.4 1900 12.8 -9 -22 +18 +36 2.6 900 14 -10 -28 +16 +35 2.3 +4.5 70 1900 12.5 -9 -19 +16 +35 2.6 +3.3 68 4. Parameters reflect performance in an AG102-PCB application circuit, as shown on page 4. 5. Input return loss can be dramatically improved (<-20 dB) for narrowband applications as shown on page 5 of this datasheet. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature DC Voltage RF Input Power (continuous) Junction Temperature Rating Ordering Information -40 to +85 qC -55 to +150 qC +5.5 V +6 dBm +220 qC Part No. AG102-G AG102-PCB Description High Dynamic Range Gain Block (lead-free/green/RoHS-compliant SOT-89 Pkg) 0.8 – 2.6 GHz Fully Assembled Application Circuit Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com Page 1 of 6 June 2006 AG102 The Communications Edge TM Product Information High Dynamic Range Gain Block Typical Device Data S-Parameters (VDS = +4.5 V, IDS = 70 mA, T = 25 C, 50 ohm system) Input return loss can be improved with the appropriate input matching network shown later in this datasheet. S11 vs. Frequency 14 -5 10 8 -40c +25c -15 -20 6 -40c 500 1000 1500 2000 2500 0 Noise Figure vs. Frequency +85c 500 1000 1500 2000 2500 3000 0 500 1000 22 14 20 12 18 8 16 6 14 1 0 0 500 1000 1500 2000 2500 4 3000 2 4 6 8 10 Input Power (dBm) Output IP3 vs. Output Power 25 4 6 6 14 4 12 0 2 4 6 8 10 Input Power (dBm) 25 +25c 8 10 14 ACPR vs. Channel Power 30 -40c 12 25 °C, IS-95, 9 Ch. Forward, ±885 kHz offset, 30 kHz Meas BW -35 freq = 1900 MHz -45 -55 -65 +85c -75 20 2 16 14 35 +85c 20 0 8 ACPR (dBc) OIP3 (dBm) 30 +25c 20 Gain 18 frequency = 1900 / 1910 MHz 40 35 -40c 12 22 Output Power Output IP3 vs. Output Power frequency = 900 / 910 MHz 3000 10 12 0 Frequency (MHz) 40 Gain (dB) Gain (dB) 2 10 Output Power (dBm) 12 Gain 3 2500 frequency = 1900 MHz, Temp = +25°C Output Power 4 2000 Output Power / Gain vs. Input Power frequency = 900 MHz, Temp = +25°C 14 1500 Frequency (MHz) Output Power / Gain vs. Input Power 5 NF (dB) -20 Frequency (MHz) 6 +85c -40 3000 Frequency (MHz) OIP3 (dBm) +25c -30 0 +25c -30 -25 +85c -40c -10 -10 S22 (dB) 12 S22 vs. Frequency 0 Output Power (dBm) 0 S11 (dB) Gain (dB) Gain vs. Frequency 16 0 2 Output Power (dBm) 4 6 8 6 10 7 8 9 10 11 12 13 Output Channel Power (dBm) Output Power (dBm) S-Parameters (VD = +4.5 V, ID = 78 mA, T = 25 C, calibrated to device leads) Freq (MHz) 50 250 500 750 1000 1250 1500 1750 2000 2250 2500 2750 3000 S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -4.72 -8.67 -8.96 -9.06 -9.04 -9.00 -8.89 -8.74 -8.65 -8.40 -7.99 -7.93 -7.47 -30.88 -27.48 -37.68 -51.15 -66.87 -82.11 -97.31 -112.48 -128.51 -142.86 -157.26 -171.48 175.92 15.44 13.93 13.75 13.60 13.47 13.39 13.13 12.91 12.68 12.48 12.22 11.88 11.53 164.91 165.39 157.18 148.11 137.91 128.62 118.57 109.09 99.48 89.94 80.41 71.42 62.05 -21.66 -20.26 -20.14 -20.02 -19.92 -19.85 -19.73 -19.56 -19.71 -19.53 -19.40 -19.33 -19.58 30.26 3.92 -2.25 -7.65 -10.63 -15.19 -18.74 -23.00 -28.33 -33.37 -37.91 -42.30 -47.37 -9.38 -16.70 -17.56 -18.25 -19.05 -20.28 -21.30 -22.57 -25.15 -27.03 -28.58 -28.56 -28.48 -40.39 -32.88 -31.25 -35.67 -43.62 -51.49 -61.37 -73.75 -85.19 -103.19 -135.19 -177.83 153.84 Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com Page 2 of 6 June 2006 AG102 The Communications Edge TM Product Information High Dynamic Range Gain Block Typical Device Data S-Parameters (VDS = +3.3 V, IDS = 68 mA, T = 25 C, 50 ohm system) Input return loss can be improved with the appropriate input matching network shown later in this datasheet. S11 vs. Frequency 0 14 -5 12 10 8 -40c +25c 6 -15 -20 500 1000 1500 2000 2500 3000 +25c +85c -20 -30 -40c +25c +85c -30 0 -40c -10 -10 -25 +85c S22 vs. Frequency 0 S22 (dB) S11 (dB) Gain (dB) Gain vs. Frequency 16 -40 0 500 1000 Frequency (MHz) 1500 2000 2500 3000 0 500 1000 Frequency (MHz) 1500 2000 2500 3000 Frequency (MHz) Noise Figure vs. Frequency Output IP3 vs. Output Power 6 frequency = 900 / 910 MHz 40 4 OIP3 (dBm) NF (dB) 5 3 2 1 35 30 25 -40c 0 +25c +85c 20 0 500 1000 1500 2000 2500 3000 0 2 Frequency (MHz) Output Power / Gain vs. Input Power 6 8 10 Output Power / Gain vs. Input Power frequency = 900 MHz, Temp = +25°C 14 4 Output Power (dBm) 20 14 18 12 frequency = 1900 MHz, Temp = +25°C 20 16 8 14 6 12 4 10 0 2 4 6 8 10 Input Power (dBm) 12 14 18 Gain 10 Output Power 16 8 14 6 12 4 Output Power (dBm) 10 Gain (dB) Gain (dB) 12 Gain Output Power (dBm) Output Power 10 0 2 4 6 8 10 Input Power (dBm) 12 14 Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com Page 3 of 6 June 2006 AG102 The Communications Edge TM Product Information High Dynamic Range Gain Block Application Circuit: 800 – 2600 MHz (AG102-PCB) +4.5 V ID=C6 C=1.8e4 pF 14 DB(|S[1,1]|) * (R) 0 DB(|S[2,2]|) * (R) 13 -5 12 -10 11 -15 10 -20 ID=L3 L=12 nH ID=C5 C=56 pF NET="AG102" S21 (dB) ID=C2 C=56 pF Z0=50 Ohm L=170 mil Eeff=3.52 Loss=0 F0=1 GHz ID=L2 L=10 nH 9 S11, S22 (dB) DB(|S[2,1]|) * (L) -25 0.6 0.8 1 1.2 1.4 1.6 1.8 Frequency (GHz) 2 2.2 2.4 2.6 Circuit Board Material: .014” FR-4, 4 layers, .062” total thickness +4.5 V C=1e4 pF L=180 nH C=1e4 pF NET="AG102" S21 (dB) L=180 nH C=1e4 pF 17 0 16 -5 15 -10 14 -15 13 S11, S22 (dB) Reference Design: 70 MHz -20 C=5.6 pF DB(|S[1,1]|) (R) DB(|S[2,1]|) (L) DB(|S[2,2]|) (R) 12 -25 0.04 0.05 0.06 0.07 0.08 Frequency (GHz) 0.09 0.1 0.11 Reference Design: 170 MHz 17 C=1e4 pF L=39 nH NET="AG102" C=1000 pF S21 (dB) L=220 nH C=1000 pF 0 DB(|S[1,1]|) (R) DB(|S[2,1]|) (L) DB(|S[2,2]|) (R) 16 -5 15 -10 14 -15 13 -20 S11, S22 (dB) +4.5 V C=3.9 pF 12 -25 0.1 0.13 0.16 0.19 Frequency (GHz) 0.22 0.25 Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com Page 4 of 6 June 2006 AG102 The Communications Edge TM Product Information High Dynamic Range Gain Block Reference Design: 450 MHz 16 C=1e4 pF C=1000 pF NET="AG102" L=15 nH S21 (dB) L=82 nH C=1000 pF 0 DB(|S[1,1]|) (R) DB(|S[2,1]|) (L) DB(|S[2,2]|) (R) 15 -5 14 -10 13 -15 12 -20 S11, S22 (dB) +4.5 V C=1.2 pF 11 -25 0.3 0.35 0.4 0.45 0.5 0.55 Frequency (GHz) 0.6 0.65 0.7 Reference Design: 800 MHz 15 0 14 -5 S21 (dB) C=1e4 pF C=100 pF DB(|S(1,1)|) (R) 13 DB(|S(2,1)|) (L) DB(|S(2,2)|) (R) -10 12 -15 11 -20 L=33 nH C=100 pF C=100 pF NET="AG102" L=6.8 nH 10 S11, S22 (dB) +4.5 V -25 0.6 0.7 0.8 0.9 1 Frequency (GHz) 1.1 1.2 Reference Design: 1900 / 2140 MHz +4.5 V 14 0 13 -5 12 -10 11 -15 10 -20 CAP ID=C1 C=3.9 pF SUBCKT NET="AG102" S21 (dB) CAP C=56 pF TLINP ID=TL1 Z0=50 Ohm L=150 mil Eeff=3.4 Loss=0 F0=2 GHz IND ID=L2 L=33 nH CAP ID=C3 C=56 pF IND ID=L1 L=3.3 nH DB(|S(1,1)|) (R) DB(|S(2,1)|) (L) S11, S22 (dB) CAP C=1e4 pF DB(|S(2,2)|) (R) 9 -25 1.5 1.6 1.7 1.8 1.9 2 Frequency (GHz) 2.1 2.2 2.3 Reference Design: CATV Single-ended Operation +4.5 V 16 0 15 -5 14 -10 13 -15 L=100 nH Z=75 Ohm L=4.7 nH NET="AG102" R=5 Ohm C=1000 pF S11, S22 (dB) S21 (dB) C=1.8e4 pF Z=75 Ohm 12 -20 DB(|S[1,1]|) (R) DB(|S[2,1]|) (L) DB(|S[2,2]|) (R) 11 -25 0 0.2 0.4 0.6 Frequency (GHz) 0.8 1 Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com Page 5 of 6 June 2006 AG102 The Communications Edge TM Product Information High Dynamic Range Gain Block AG102-G (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded (maximum 245 qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Product Marking Outline Drawing The AG102-G will be marked with an “A1G” designator. An alphanumeric lot code (“XXXX-X” ) is also marked below the part designator on the top surface of the package. A “3” will be lasermarked in the upper righthand corner. The obsolete tin-lead package is marked with an “A1” designator followed by an alphanumeric lot code. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: Class 1B Passes 500V to <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV Passes 1000V to <2000V Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes Thermal Specifications Rating -40 to +85 qC 88 qC/W 113 qC Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tj (2) 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5V, 70 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 160 C. MTTF (million hrs) Parameter MTTF vs. GND Tab Temperature 10000 1000 100 10 60 70 80 90 100 Tab Temperature (°C) 110 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com Page 6 of 6 June 2006