WJ AG102 High dynamic range gain block Datasheet

AG102
The Communications Edge TM
Product Information
High Dynamic Range Gain Block
Product Features
Product Description
Functional Diagram
x 60 – 3000 MHz
x 14 dB Gain
x 2.4 dB Noise Figure
x +36 dBm OIP3
x Single +3.3 or +4.5 Supply
x Internally matched to 50 :
x Lead-free/Green/RoHScompliant SOT-89 Package
x MTTF > 1000 years
The AG102 is a general-purpose gain block that offers
good dynamic range and low noise figure in a low-cost
surface-mount package. The combination of near-constant
OIP3 and low noise figure performance over frequency
makes it attractive for both narrowband and broadband
applications. The device combines dependable performance
with superb quality to maintain MTTF values exceeding
1000 years at mounting temperatures of +85 qC and is
available in the environmentally-friendly lead-free/green
/RoHS-compliant SOT-89 package.
GND
x Mobile Infrastructure
x CATV / DBS
x W-LAN / ISM
x RFID
x Defense / Homeland Security
x Fixed Wireless
1
2
3
RF IN
GND
RF OUT
Function
Input
Output/Bias
Ground
The AG102 uses a high reliability GaAs MMIC technology
and only requires DC-blocking and bypass capacitors, and
an inductive RF choke for operation. Internal matching
provides a 50 ohm input / output impedance minimizing the
number of required external components.
Applications
Pin No.
1
3
2, 4
The broadband MMIC amplifier is well suited for various
current and next generation wireless technologies such as
GPRS, GSM, CDMA, and W-CDMA. In addition, the
AG102 will work for other applications within the 60 to
3000 MHz frequency range such as fixed wireless.
Specifications (1)
Parameter
4
Typical Performance (4)
Units
Min
MHz
MHz
dB
dB
dB
dBm
dBm
dB
mA
V
60
Operational Bandwidth
Test Frequency
Gain
Input Return Loss(5)
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure (3)
Operating Current Range
Supply Voltage
13
+33
55
Typ
800
14
8.5
20
+18
+36
2.4
70
4.5
Max
Parameter
Units
3000
Frequency
S21
S11 (5)
S22
Output P1dB
Output IP3
Noise Figure
Supply Voltage
Device Current
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
16
90
1. Test conditions unless otherwise noted: T = 25º C, 50 system.
2. 3OIP measured with two tones at an output power of +2.5 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Noise figure can be optimized by matching the input for optimal return loss.
Typical
900
14
-10
-27
+18
+36
2.4
1900
12.8
-9
-22
+18
+36
2.6
900
14
-10
-28
+16
+35
2.3
+4.5
70
1900
12.5
-9
-19
+16
+35
2.6
+3.3
68
4. Parameters reflect performance in an AG102-PCB application circuit, as shown on page 4.
5. Input return loss can be dramatically improved (<-20 dB) for narrowband applications as shown on
page 5 of this datasheet.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
Rating
Ordering Information
-40 to +85 qC
-55 to +150 qC
+5.5 V
+6 dBm
+220 qC
Part No.
AG102-G
AG102-PCB
Description
High Dynamic Range Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
0.8 – 2.6 GHz Fully Assembled Application Circuit
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 1 of 6
June 2006
AG102
The Communications Edge TM
Product Information
High Dynamic Range Gain Block
Typical Device Data
S-Parameters (VDS = +4.5 V, IDS = 70 mA, T = 25 C, 50 ohm system)
Input return loss can be improved with the appropriate input matching network shown later in this datasheet.
S11 vs. Frequency
14
-5
10
8
-40c
+25c
-15
-20
6
-40c
500
1000
1500
2000
2500
0
Noise Figure vs. Frequency
+85c
500
1000
1500
2000
2500
3000
0
500
1000
22
14
20
12
18
8
16
6
14
1
0
0
500
1000
1500
2000
2500
4
3000
2
4
6
8
10
Input Power (dBm)
Output IP3 vs. Output Power
25
4
6
6
14
4
12
0
2
4
6
8
10
Input Power (dBm)
25
+25c
8
10
14
ACPR vs. Channel Power
30
-40c
12
25 °C, IS-95, 9 Ch. Forward, ±885 kHz offset, 30 kHz Meas BW
-35
freq = 1900 MHz
-45
-55
-65
+85c
-75
20
2
16
14
35
+85c
20
0
8
ACPR (dBc)
OIP3 (dBm)
30
+25c
20
Gain
18
frequency = 1900 / 1910 MHz
40
35
-40c
12
22
Output Power
Output IP3 vs. Output Power
frequency = 900 / 910 MHz
3000
10
12
0
Frequency (MHz)
40
Gain (dB)
Gain (dB)
2
10
Output Power (dBm)
12 Gain
3
2500
frequency = 1900 MHz, Temp = +25°C
Output Power
4
2000
Output Power / Gain vs. Input Power
frequency = 900 MHz, Temp = +25°C
14
1500
Frequency (MHz)
Output Power / Gain vs. Input Power
5
NF (dB)
-20
Frequency (MHz)
6
+85c
-40
3000
Frequency (MHz)
OIP3 (dBm)
+25c
-30
0
+25c
-30
-25
+85c
-40c
-10
-10
S22 (dB)
12
S22 vs. Frequency
0
Output Power (dBm)
0
S11 (dB)
Gain (dB)
Gain vs. Frequency
16
0
2
Output Power (dBm)
4
6
8
6
10
7
8
9
10
11
12
13
Output Channel Power (dBm)
Output Power (dBm)
S-Parameters (VD = +4.5 V, ID = 78 mA, T = 25 C, calibrated to device leads)
Freq (MHz)
50
250
500
750
1000
1250
1500
1750
2000
2250
2500
2750
3000
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
-4.72
-8.67
-8.96
-9.06
-9.04
-9.00
-8.89
-8.74
-8.65
-8.40
-7.99
-7.93
-7.47
-30.88
-27.48
-37.68
-51.15
-66.87
-82.11
-97.31
-112.48
-128.51
-142.86
-157.26
-171.48
175.92
15.44
13.93
13.75
13.60
13.47
13.39
13.13
12.91
12.68
12.48
12.22
11.88
11.53
164.91
165.39
157.18
148.11
137.91
128.62
118.57
109.09
99.48
89.94
80.41
71.42
62.05
-21.66
-20.26
-20.14
-20.02
-19.92
-19.85
-19.73
-19.56
-19.71
-19.53
-19.40
-19.33
-19.58
30.26
3.92
-2.25
-7.65
-10.63
-15.19
-18.74
-23.00
-28.33
-33.37
-37.91
-42.30
-47.37
-9.38
-16.70
-17.56
-18.25
-19.05
-20.28
-21.30
-22.57
-25.15
-27.03
-28.58
-28.56
-28.48
-40.39
-32.88
-31.25
-35.67
-43.62
-51.49
-61.37
-73.75
-85.19
-103.19
-135.19
-177.83
153.84
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 2 of 6
June 2006
AG102
The Communications Edge TM
Product Information
High Dynamic Range Gain Block
Typical Device Data
S-Parameters (VDS = +3.3 V, IDS = 68 mA, T = 25 C, 50 ohm system)
Input return loss can be improved with the appropriate input matching network shown later in this datasheet.
S11 vs. Frequency
0
14
-5
12
10
8
-40c
+25c
6
-15
-20
500
1000
1500
2000
2500
3000
+25c
+85c
-20
-30
-40c
+25c
+85c
-30
0
-40c
-10
-10
-25
+85c
S22 vs. Frequency
0
S22 (dB)
S11 (dB)
Gain (dB)
Gain vs. Frequency
16
-40
0
500
1000
Frequency (MHz)
1500
2000
2500
3000
0
500
1000
Frequency (MHz)
1500
2000
2500
3000
Frequency (MHz)
Noise Figure vs. Frequency
Output IP3 vs. Output Power
6
frequency = 900 / 910 MHz
40
4
OIP3 (dBm)
NF (dB)
5
3
2
1
35
30
25
-40c
0
+25c
+85c
20
0
500
1000
1500
2000
2500
3000
0
2
Frequency (MHz)
Output Power / Gain vs. Input Power
6
8
10
Output Power / Gain vs. Input Power
frequency = 900 MHz, Temp = +25°C
14
4
Output Power (dBm)
20
14
18
12
frequency = 1900 MHz, Temp = +25°C
20
16
8
14
6
12
4
10
0
2
4
6
8
10
Input Power (dBm)
12
14
18
Gain
10
Output Power
16
8
14
6
12
4
Output Power (dBm)
10
Gain (dB)
Gain (dB)
12 Gain
Output Power (dBm)
Output Power
10
0
2
4
6
8
10
Input Power (dBm)
12
14
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 3 of 6
June 2006
AG102
The Communications Edge TM
Product Information
High Dynamic Range Gain Block
Application Circuit: 800 – 2600 MHz (AG102-PCB)
+4.5 V
ID=C6
C=1.8e4 pF
14
DB(|S[1,1]|) * (R)
0
DB(|S[2,2]|) * (R)
13
-5
12
-10
11
-15
10
-20
ID=L3
L=12 nH
ID=C5
C=56 pF
NET="AG102"
S21 (dB)
ID=C2
C=56 pF
Z0=50 Ohm
L=170 mil
Eeff=3.52
Loss=0
F0=1 GHz
ID=L2
L=10 nH
9
S11, S22 (dB)
DB(|S[2,1]|) * (L)
-25
0.6
0.8
1
1.2
1.4
1.6
1.8
Frequency (GHz)
2
2.2
2.4
2.6
Circuit Board Material: .014” FR-4, 4 layers, .062” total thickness
+4.5 V
C=1e4 pF
L=180 nH
C=1e4 pF
NET="AG102"
S21 (dB)
L=180 nH
C=1e4 pF
17
0
16
-5
15
-10
14
-15
13
S11, S22 (dB)
Reference Design: 70 MHz
-20
C=5.6 pF
DB(|S[1,1]|) (R)
DB(|S[2,1]|) (L)
DB(|S[2,2]|) (R)
12
-25
0.04
0.05
0.06
0.07
0.08
Frequency (GHz)
0.09
0.1
0.11
Reference Design: 170 MHz
17
C=1e4 pF
L=39 nH
NET="AG102"
C=1000 pF
S21 (dB)
L=220 nH
C=1000 pF
0
DB(|S[1,1]|) (R)
DB(|S[2,1]|) (L)
DB(|S[2,2]|) (R)
16
-5
15
-10
14
-15
13
-20
S11, S22 (dB)
+4.5 V
C=3.9 pF
12
-25
0.1
0.13
0.16
0.19
Frequency (GHz)
0.22
0.25
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 4 of 6
June 2006
AG102
The Communications Edge TM
Product Information
High Dynamic Range Gain Block
Reference Design: 450 MHz
16
C=1e4 pF
C=1000 pF
NET="AG102"
L=15 nH
S21 (dB)
L=82 nH
C=1000 pF
0
DB(|S[1,1]|) (R)
DB(|S[2,1]|) (L)
DB(|S[2,2]|) (R)
15
-5
14
-10
13
-15
12
-20
S11, S22 (dB)
+4.5 V
C=1.2 pF
11
-25
0.3
0.35
0.4
0.45
0.5
0.55
Frequency (GHz)
0.6
0.65
0.7
Reference Design: 800 MHz
15
0
14
-5
S21 (dB)
C=1e4 pF
C=100 pF
DB(|S(1,1)|) (R)
13
DB(|S(2,1)|) (L)
DB(|S(2,2)|) (R)
-10
12
-15
11
-20
L=33 nH
C=100 pF
C=100 pF
NET="AG102"
L=6.8 nH
10
S11, S22 (dB)
+4.5 V
-25
0.6
0.7
0.8
0.9
1
Frequency (GHz)
1.1
1.2
Reference Design: 1900 / 2140 MHz
+4.5 V
14
0
13
-5
12
-10
11
-15
10
-20
CAP
ID=C1
C=3.9 pF
SUBCKT
NET="AG102"
S21 (dB)
CAP
C=56 pF
TLINP
ID=TL1
Z0=50 Ohm
L=150 mil
Eeff=3.4
Loss=0
F0=2 GHz
IND
ID=L2
L=33 nH
CAP
ID=C3
C=56 pF
IND
ID=L1
L=3.3 nH
DB(|S(1,1)|) (R)
DB(|S(2,1)|) (L)
S11, S22 (dB)
CAP
C=1e4 pF
DB(|S(2,2)|) (R)
9
-25
1.5
1.6
1.7
1.8
1.9
2
Frequency (GHz)
2.1
2.2
2.3
Reference Design: CATV Single-ended Operation
+4.5 V
16
0
15
-5
14
-10
13
-15
L=100 nH
Z=75 Ohm
L=4.7 nH
NET="AG102"
R=5 Ohm
C=1000 pF
S11, S22 (dB)
S21 (dB)
C=1.8e4 pF
Z=75 Ohm
12
-20
DB(|S[1,1]|) (R)
DB(|S[2,1]|) (L)
DB(|S[2,2]|) (R)
11
-25
0
0.2
0.4
0.6
Frequency (GHz)
0.8
1
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 5 of 6
June 2006
AG102
The Communications Edge TM
Product Information
High Dynamic Range Gain Block
AG102-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded
(maximum 245 qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Product Marking
Outline Drawing
The AG102-G will be marked with an “A1G”
designator.
An alphanumeric lot code
(“XXXX-X” ) is also marked below the part
designator on the top surface of the package.
A “3” will be lasermarked in the upper righthand corner. The obsolete tin-lead package is
marked with an “A1” designator followed by
an alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes 1000V to <2000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Thermal Specifications
Rating
-40 to +85 qC
88 qC/W
113 qC
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tj (2)
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 70 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 C.
MTTF (million hrs)
Parameter
MTTF vs. GND Tab Temperature
10000
1000
100
10
60
70
80
90
100
Tab Temperature (°C)
110
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 6 of 6
June 2006
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