VAISH BZD27C3V6P Zener diodes with surge current specification Datasheet

BZD27C3V6P to BZD27C200P
Vishay Semiconductors
Zener Diodes with Surge Current Specification
Features
•
•
•
•
•
•
Sillicon Planar Zener Diodes
Low profile surface-mount package
e3
Zener and surge current specification
Low leakage current
Excellent stability
High temperature soldering:
260 °C/10 sec. at terminals
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
Mechanical Data
Case: JEDEC DO-219AB
Weight: approx. 15 mg
(SMF®)
Plastic case
17249
Packaging codes/options:
GS18 / 10 k per 13 " reel, (8 mm tape), 50 k/box
GS08 / 3 k per 7 " reel, (8 mm tape), 30 k/box
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
Parameter
Power dissipation
Symbol
Value
Unit
TL = 80 °C
Test condition
Ptot
2.3
W
TA = 25 °C
Ptot
1)
W
PZSM
300
W
PRSM
150
W
PRSM
100
W
Symbol
Value
Unit
RthJA
180
K/W
K/W
Non-repetitive peak pulse power 100 µs square pulse2)
dissipation
10/1000 µs waveform (BZD27-
0.8
C7V5P to BZD27-C100P)2)
10/1000 µs waveform (BZD27C110P to BZD27-C200P)2)
1)
Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads (≥ 40 µm thick)
2)
TJ = 25 °C prior to surge
Thermal Characteristics
Tamb = 25 °C, unless otherwise specified
Parameter
Test condition
Thermal resistance junction to ambient
air1)
RthJL
30
Maximum junction temperature
Thermal resistance junction to lead
Tj
150
°C
Storage temperature range
TS
- 55 to + 150
°C
1)
Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads (≥ 40 µm thick)
Electrical Characteristics
Tamb = 25 °C, unless otherwise specified
Parameter
Forward voltage
Document Number 85810
Rev. 1.8, 13-Apr-05
Test condition
IF = 0.2 A
Symbol
VF
Min
Typ.
Max
Unit
1.2
V
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BZD27C3V6P to BZD27C200P
Vishay Semiconductors
Electrical Characteristics
When used as voltage regulator diodes (TJ = 25 °C unless otherwise noted)
Partnumber
1)
Working Voltage1)
Differential
Resistance
Temperature
Coefficient
VZ @ IZT
rdif @ IZ
α Z @ IZ
IZT
IR
VR
V
Ω
%/°C
mA
µA
V
min
max
typ
max
min
max
Test
Current
Reverse Current at
Reverse Voltage
max
BZD27C3V6P
D0
3.4
3.8
4
8
-0.14
-0.04
100
100
BZD27C3V9P
D1
3.7
4.1
4
8
-0.14
-0.04
100
50
1
BZD27C4V3P
D2
4
4.6
4
7
-0.12
-0.02
100
25
1
BZD27C4V7P
D3
4.4
5
3
7
-0.1
0
100
10
1
BZD27C5V1P
D4
4.8
5.4
3
6
-0.08
0.02
100
5
1
BZD27C5V6P
D5
5.2
6
2
4
-0.04
0.04
100
10
2
BZD27C6V2P
D6
5.8
6.6
2
3
-0.01
0.06
100
5
2
BZD27C6V8P
D7
6.4
7.2
1
3
0
0.07
100
10
3
BZD27C7V5P
D8
7
7.9
1
2
0
0.07
100
50
3
BZD27C8V2P
D9
7.7
8.7
1
2
0.03
0.08
100
10
3
BZD27C9V1P
E0
8.5
9.6
2
4
0.03
0.08
50
10
5
BZD27C10P
E1
9.4
10.6
2
4
0.05
0.09
50
7
7.5
BZD27C11P
E2
10.4
11.6
4
7
0.05
0.1
50
4
8.2
BZD27C12P
E3
11.4
12.7
4
7
0.05
0.1
50
3
9.1
BZD27C13P
E4
12.4
14.1
5
10
0.05
0.1
50
2
10
BZD27C15P
E5
13.8
15.6
5
10
0.05
0.1
50
1
11
BZD27C16P
E6
15.3
17.1
6
15
0.06
0.11
25
1
12
BZD27C18P
E7
16.8
19.1
6
15
0.06
0.11
25
1
13
BZD27C20P
E8
18.8
21.2
6
15
0.06
0.11
25
1
15
BZD27C22P
E9
20.8
23.3
6
15
0.06
0.11
25
1
16
BZD27C24P
F0
22.8
25.6
7
15
0.06
0.11
25
1
18
BZD27C27P
F1
25.1
28.9
7
15
0.06
0.11
25
1
20
BZD27C30P
F2
28
32
8
15
0.06
0.11
25
1
22
BZD27C33P
F3
31
35
8
15
0.06
0.11
25
1
24
BZD27C36P
F4
34
38
21
40
0.06
0.11
10
1
27
BZD27C39P
F5
37
41
21
40
0.06
0.11
10
1
30
BZD27C43P
F6
40
46
24
45
0.07
0.12
10
1
33
BZD27C47P
F7
44
50
24
45
0.07
0.12
10
1
36
BZD27C51P
F8
48
54
25
60
0.07
0.12
10
1
39
BZD27C56P
F9
52
60
25
60
0.07
0.12
10
1
43
BZD27C62P
G0
58
66
25
80
0.08
0.13
10
1
47
BZD27C68P
G1
64
72
25
80
0.08
0.13
10
1
51
BZD27C75P
G2
70
79
30
100
0.08
0.13
10
1
56
BZD27C82P
G3
77
87
30
100
0.08
0.13
10
1
62
BZD27C91P
G4
85
96
60
200
0.08
0.13
5
1
68
BZD27C100P
G5
94
106
60
200
0.09
0.13
5
1
75
BZD27C110P
G6
104
116
80
250
0.09
0.13
5
1
82
BZD27C120P
G7
114
127
80
250
0.09
0.13
5
1
91
BZD27C130P
G8
124
141
110
300
0.09
0.13
5
1
100
BZD27C150P
G9
138
156
130
300
0.09
0.13
5
1
110
BZD27C160P
H0
153
171
150
350
0.09
0.13
5
1
120
BZD27C180P
H1
168
191
180
400
0.09
0.13
5
1
130
BZD27C200P
H2
188
212
200
500
0.09
0.13
5
1
150
1
Pulse test: tp ≤ 5 ms.
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Marking
Code
Document Number 85810
Rev. 1.8, 13-Apr-05
BZD27C3V6P to BZD27C200P
Vishay Semiconductors
Electrical Characteristics
When used as protection diodes (TJ = 25 °C unless otherwise noted)
Partnumber
Rev.
Breakdown
Voltage
Test
Current
Temperature Coefficient
V(BR)R at
Itest
Itest
αZ @ Itest
V
mA
min
1)
%/°C
Clamping Voltage
VC
at IRSM1)
V
A
min
max
max
Reverse Current at
Stand-Off Voltage
IR
at VWM
µA
V
max
BZD27C7V5P
7
100
0
0.07
11.3
13.3
1500
BZD27C8V2P
7.7
100
0.03
0.08
12.3
12.2
1200
6.2
6.8
BZD27C9V1P
8.5
50
0.03
0.08
13.3
11.3
100
7.5
BZD27C10P
9.4
50
0.05
0.09
14.8
10.1
20
8.2
BZD27C11P
10.4
50
0.05
0.1
15.7
9.6
5
9.1
BZD27C12P
11.4
50
0.05
0.1
17
8.8
5
10
BZD27C13P
12.4
50
0.05
0.1
18.9
7.9
5
11
BZD27C15P
13.8
50
0.05
0.1
20.9
7.2
5
12
BZD27C16P
15.3
25
0.06
0.11
22.9
6.6
5
13
BZD27C18P
16.8
25
0.06
0.11
25.6
5.9
5
15
BZD27C20P
18.8
25
0.06
0.11
28.4
5.3
5
16
BZD27C22P
20.8
25
0.06
0.11
31
4.8
5
18
BZD27C24P
22.8
25
0.06
0.11
33.8
4.4
5
20
BZD27C27P
25.1
25
0.06
0.11
38.1
3.9
5
22
BZD27C30P
28
25
0.06
0.11
42.2
3.6
5
24
BZD27C33P
31
25
0.06
0.11
46.2
3.2
5
27
BZD27C36P
34
10
0.06
0.11
50.1
3
5
30
BZD27C39P
37
10
0.06
0.11
54.1
2.8
5
33
BZD27C43P
40
10
0.07
0.12
60.7
2.5
5
36
BZD27C47P
44
10
0.07
0.12
65.5
2.3
5
39
BZD27C51P
48
10
0.07
0.12
70.8
2.1
5
43
BZD27C56P
52
10
0.07
0.12
78.6
1.9
5
47
BZD27C62P
58
10
0.08
0.13
86.5
1.7
5
51
BZD27C68P
64
10
0.08
0.13
94.4
1.6
5
56
BZD27C75P
70
10
0.08
0.13
103.5
1.5
5
62
BZD27C82P
77
10
0.08
0.13
114
1.3
5
68
BZD27C91P
85
5
0.09
0.13
126
1.2
5
75
BZD27C100P
94
5
0.09
0.13
139
1.1
5
82
BZD27C110P
104
5
0.09
0.13
139
0.72
5
91
BZD27C120P
114
5
0.09
0.13
152
0.65
5
100
BZD27C130P
124
5
0.09
0.13
169
0.59
5
110
BZD27C150P
138
5
0.09
0.13
187
0.53
5
120
BZD27C160P
153
5
0.09
0.13
205
0.48
5
130
BZD27C180P
168
5
0.09
0.13
229
0.43
5
150
BZD27C200P
188
5
0.09
0.13
254
0.39
5
160
Non-repetitive peak reverse current in accordance with "IEC 60-1, Section 8" (10/1000 µs pulse); see Fig. 5.
Document Number 85810
Rev. 1.8, 13-Apr-05
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BZD27C3V6P to BZD27C200P
Vishay Semiconductors
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
Typ. VF
Max. VF
1.00
0.10
0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6
17411
140
120
100
80
60
40
20
0
0
25
17414
VF – Forward Voltage ( V )
Figure 1. Forward Current vs. Forward Voltage
C D – Typ. Junction Capacitance ( pF )
160
PRSM–Max. Pulse Power Dissipation ( W )
I F – Forward Current ( A )
10.00
50
75 100 125 150 175 200
VZnom – Zener Voltage ( V )
Figure 4. Maximum Pulse Power Dissipation vs. Zener Voltage
10000
C5V1P
C6V8P
C12P
IRSM
(%)
100
90
C18P
1000
t1 = 10 µs
t2 = 1000 µ s
50
100
C27P
C51P
10
C200P
10
0.0
17412
0.5
1.0
1.5
2.0
2.5
VR – Reverse Voltage (V)
17415
Figure 2. Typ. Diode Capacitance vs. Reverse Voltage
t
t1
3.0
t2
Figure 5. Non-Repetitive Peak Reverse Current Pulse Definition
Ptot –Power Dissipation ( W )
3.0
tie point temperature
2.5
2.0
1.5
ambient temperature
1.0
0.5
0.0
0
17413
25
50
75
100
125
150
Tamb – Ambient Temperature ( qC )
Figure 3. Power Dissipation vs. Ambient Temperature
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Document Number 85810
Rev. 1.8, 13-Apr-05
BZD27C3V6P to BZD27C200P
Vishay Semiconductors
Package Dimensions in mm (Inches)
0.85 (0.033)
0.35 (0.014)
3.9 (0.152)
3.5 (0.137)
5
0.16 (0.006)
0.99 (0.039)
0.97 (0.038)
Z
5
Cathode Band
Top View
Detail Z
enlarged
1.9 (0.074)
1.7 (0.066)
1.2 (0.047)
0.8 (0.031)
0.10 max
2.9 (0.113)
2.7 (0.105)
ISO Method E
Mounting Pad Layout
1.6 (0.062)
1.3 (0.051)
1.4 (0.055)
17247
Document Number 85810
Rev. 1.8, 13-Apr-05
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BZD27C3V6P to BZD27C200P
Vishay Semiconductors
Blistertape for SMF
PS
18513
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Document Number 85810
Rev. 1.8, 13-Apr-05
BZD27C3V6P to BZD27C200P
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 85810
Rev. 1.8, 13-Apr-05
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