Spec. No. : C476HB Issued Date : 2009.08.21 Revised Date : 2011.07.15 Page No. : 1/3 CYStech Electronics Corp. Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers Reverse Voltage 50V to 1000V Forward Current 1.0 Ampere DBS DB101SG thru DB107SG Features • Ideal for printed circuit boards • Applicable for automotive insertion • High surge current capability • High temperature soldering guaranteed: 260°C, 10 seconds, 0.375”(9.5mm) lead length at 5 lbs( 2.3kg) tension. • Pb-free lead plating and halogen-free package Equivalent Circuit Mechanical Data • Case: Molded plastic body, epoxy meets UL 94V-0 flammability rating • Terminals: Pure tin plated, solderable per J-STD-002B and JESD22-B102D • Polarity : as marked on body Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.) Parameter Symbol Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage drop per leg, IF=1A Maximum average forward output rectified current at TA=40 °C Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Rating for fusing (t<8.3ms) Maximum DC reverse current at rated DC blocking voltage per leg VRRM VRMS VDC Type DB101SG DB102SG DB103SG DB104SG DB105SG DB106SG DB107SG 50 35 50 100 70 100 200 140 200 400 280 400 VF 1.1 IF(AV) 1 IFSM 50 600 420 600 (Note 1) A A 10 μA 500 TA=125°C Typical diode junction capacitance per leg @f=1MHz and applied 4V reverse voltage Storage temperature range Operating temperature range V V V V IR (Note 1) 1000 700 1000 10 TA=25°C Typical thermal resistance per leg 800 560 800 Units RθJA RθJL 40 15 °C /W CJ 25 pF Tstg TJ -55 ~ +150 -55 ~ +150 °C °C Note : 1.Units mounted on PCB with 0.47”×0.47”(12 mm×12mm) copper pads. DB101SG thru DB107SG CYStek Product Specification CYStech Electronics Corp. Spec. No. : C476HB Issued Date : 2009.08.21 Revised Date : 2011.07.15 Page No. : 2/3 RATING AND CHARACTERISTIC CURVES DB101SG THRU DB107SG DB101SG thru DB107SG CYStek Product Specification CYStech Electronics Corp. Spec. No. : C476HB Issued Date : 2009.08.21 Revised Date : 2011.07.15 Page No. : 3/3 DBS Dimension DIM Inches Min. Max. 0.195 0.205 0.040 0.047 0.320 0.335 45° (typ) 0.120 0.130 A B C D E Millimeters Min. Max. 5.000 5.200 1.020 1.200 8.130 8.510 45° (typ) 3.050 3.300 DIM F G H J K Inches Min. Max. 0.386 0.404 0.245 0.255 0.009 0.013 0.040 0.060 0.003 0.013 Millimeters Min. Max. 9.800 10.300 6.200 6.500 0.220 0.330 1.020 1.530 0.076 0.330 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead :Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. DB101SG thru DB107SG CYStek Product Specification