STMicroelectronics EMIF06-1005MX12Y Automotive 6-line ipadâ ¢ low capacitance emi filter andesd protection in micro qfn package Datasheet

EMIF06-1005MX12Y
Automotive 6-line IPAD™ low capacitance EMI filter and
ESD protection in micro QFN package
Datasheet - production data
Applications
Where EMI filtering in ESD sensitive equipment is
required:




LCD and camera for cars
DSP inputs
V2V, V2I communication systems
Digital tuner inputs
Description
This is a highly integrated 6-line device designed
to suppress EMI/RFI noise in all systems
exposed to electromagnetic interference.
Features









AEC-Q101 qualified
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering: -34 dB at
frequencies from 900 MHz to 1.8 GHz
Very low PCB space consumption: 3 mm x
1.35 mm
Very thin package: 0.8 mm max
High efficiency in ESD suppression on input
pins (IEC 61000-4-2 level 4)
High reliability offered by monolithic
integration
High reduction of parasitic elements through
integration and wafer level packaging
Lead-free package
This filter includes ESD protection circuitry, which
prevents the application from damages when
subjected to ESD surges up to 15 kV on the input
pins.
Figure 1: Pin configuration (top view)
Complies with the following standards



IEC 61000-4-2 level 4 input and output pins

15 kV (air discharge)

15 kV (contact discharge)
ISO10605 input and output pins:

11kV (air discharge)

11kV (contact discharge)
MIL STD 883G - method 3015-7 Class 3B
(all pins)
April 2017
DocID030405 Rev 2
This is information on a product in full production.
Figure 2: Basic cell configuration
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Characteristics
1
EMIF06-1005MX12Y
Characteristics
Table 1: Absolute ratings (limiting values at Tamb = 25 °C unless otherwise specified)
Symbol
Vpp
Tj
Parameter
Peak pulse voltage
Value
ESD IEC 61000-4-2
Contact discharge
Air discharge
ISO 10605 (330 pF - 330 Ω)
Contact discharge
Air discharge
15
15
Unit
kV
11
11
Operating junction temperature
150
°C
Tstg
Storage temperature range
-55 to +150
°C
Top
Operating temperature range
-55 to +150
°C
Figure 3: Electrical characteristics (definitions)
Table 2: Electrical characteristics (Tamb = 25 °C)
Symbol
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Test conditions
Min.
Typ.
Max.
Unit
V
VBR
IR = 1 mA
6
8
10
VF
IF = 10 mA
0.5
1.0
1.5
IRM
VRM = 3 V per line
RI/O
Tolerance ±10%
90
Cline
VLINE = 0 V dc, VOSC = 30 mV, f = 1 MHz
38
DocID030405 Rev 2
200
nA
100
110
Ω
45
52
pF
EMIF06-1005MX12Y
1.1
Characteristics
Characteristics (curves)
Figure 4: S21 attenuation measurement
Figure 5: Analog cross talk measurements
Figure 6: ESD response to IEC 61000-4-2
(+15 kV contact discharge)
Figure 7: ESD response to IEC 61000-4-2
(-15 kV contact discharge)
Pulse applied on input and measured on output. Behavior is symmetrical.
Figure 8: Line capacitance versus reverse voltage applied
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Package information
2
EMIF06-1005MX12Y
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1
QFN-12L package information
Figure 9: QFN-12L package outline
Table 3: QFN-12L package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
Max.
A
0.70
0.75
0.80
A1
0.00
0.02
0.05
b
0.18
0.25
0.30
D
2.95
3.00
3.05
E
1.30
1.35
1.40
D2
2.10
2.20
2.30
E2
0.20
0.25
0.30
e
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0.50
K
0.20
L
0.20
Cd
0.1
Cw
0.01
DocID030405 Rev 2
0.25
0.30
0.06
EMIF06-1005MX12Y
Package information
Figure 10: Footprint recommendations,
dimensions in mm
Figure 11: Marking layout
Figure 12: Stencil opening in mm
Figure 14: Tape and reel orientation
Figure 13: Package orientation in reel
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Package information
EMIF06-1005MX12Y
Figure 15: Reel dimensions in mm
Figure 16: Inner box dimension definition in mm
Figure 17: Tape dimension definitions
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EMIF06-1005MX12Y
Package information
Table 4: Tape mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
Max.
P1
3.9
4.0
4.1
P0
3.9
4.0
4.1
P2
1.95
2
2.05
Ø D0
1.5
Ø D1
1
F
5.45
5.50
5.55
K0
0.9
0.95
1.0
W
11.9
12
12.3
Figure 18: ST ECOPACK® recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component
movement. Maximum soldering profile corresponds to the latest IPC/JEDEC
J-STD-020.
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Ordering information
3
EMIF06-1005MX12Y
Ordering information
Figure 19: Ordering information scheme
EMIF 06 - 100 5 MX 12
Y
EMI Filter
06 : 6 lines
100 : R = 100 Ω; 5 : C = 50 pF
MX : QFN 500 µm pitch
12 : 12 leads
Y : AEC-Q101 compliant
Table 5: Ordering information
4
Order code
Marking
Package
Weight
Base qty.
Delivery mode
EMIF06-1005MX12Y
N7
QFN-12L wettable flank
8.41 mg
3000
Tape and reel
Revision history
Table 6: Document revision history
Date
Revision
03-Mar-2017
1
Initial release.
2
Updated Table 1: "Absolute ratings (limiting values at Tamb
= 25 °C unless otherwise specified)", Figure 4: "S21
attenuation measurement" and Figure 5: "Analog cross talk
measurements".
06-Apr-2017
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Changes
DocID030405 Rev 2
EMIF06-1005MX12Y
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