CM1240 Dual-Voltage ESD Protection Array for USB Port Features • • • • • • • • channel of the CM1240 is a high voltage (HV) diode which has a capacitance of 25pF enabling it to protect power supply inputs or OLED power rails, etc. 4 channels of ESD Protection 8kV ESD protection (IEC 61000-4-2, contact discharge) 16kV ESD protection (HBM) SOT-563 TDFN-8, 1.70mm x 1.35mm, 0.4mm pitch TDFN-8, 2mm x 2mm, 0.5mm pitch Lead free 16V clamp on Vcc The parts integrate avalanche-type ESD diodes, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes are designed and characterized to safely dissipate ESD strikes of 8kV, the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges of greater than 16kV. Applications • • • USB and Mini-USB applications I/O port protection for mobile handsets Wireless handsets Product Description California Micro Devices’ CM1240 is a four channel ESD protection array. Three channels of the CM1240 are low voltage (LV) diodes, which have a capacitance of 7pF enabling them to protect high speed I/O ports while providing robust ESD protection. The other This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CM1240 is ideal for protecting USB or mini USB ports operating at full speed (12Mbps). The CM1240 is available in a space saving, low profile, lead-free TDFN-8 or SOT-563 package. PACKAGE / PINOUT DIAGRAMS TDFN-8 SOT-563 D1 1 D1 1 6 GND D2 2 5 D3 VCC 3 4 2 NC DAP 6 D3 3 7 NC VCC 4 8 NC D2 GND 5 NC Ordering Information PART NUMBERING INFORMATION Lead-free Finish Leads Package Ordering Part Number Part Marking 6 SOT-563 CM1240-F4SE L40 8 TDFN-0.5mm CM1240-04DE L40 4E 8 TDFN-0.4mm CM1240-04D4 L4 PIN DESCRIPTIONS © 2007 California Micro Devices Corp. All rights reserved. 5/16/07 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 1 CM1240 Specifications SOT-563 PIN# TDFN PIN# NAME 1 1 D1 Cathode connection for Low Voltage ESD diode 2 2 D2 Cathode connection for Low Voltage ESD diode 5 3 D3 Cathode connection for Low Voltage ESD diode 3 4 Vcc Cathode connection for High Voltage ESD diode – 5 NC No connect – 6 NC No connect – 7 NC No connect No connect DESCRIPTION – 8 NC 4 DAP GND Anode-side connection for all ESD diodes 6 – GND Anode-side connection for all ESD diodes ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS ±16 kV [GND - 0.3] to +13 [GND - 0.3] to +5.5 V V –65 to +150 °C 300 °C RATING UNITS –40 to +85 °C ESD Protection (HBM) Pin Voltages Vcc to GND All other pins to GND Storage Temperature Range Lead Temperature (soldering, 10sec) STANDARD OPERATING CONDITIONS PARAMETER Operating temperature range © 2007 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 5/16/07 CM1240 Specifications ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) Symbol Parameter Conditions Min Typ Max Units CLV LV diode Capacitance at 3Vdc; 1MHz, 30mVac 6 pF CHV HV diode Capacitance at 3Vdc; 1MHz, 30mVac 25 pF ILV LV Diode Leakage at +3.3V reverse bias voltage 0.01 0.4 μA IHV HV Diode Leakage at +11V reverse bias voltage 0.01 0.4 μA VCL(LV) LV Diode Signal Clamp Voltage: Positive Clamp, 10mA Negative Clamp, –10mA 5.6 –1.5 6.8 –0.8 9 –0.4 V V VCL(HV) HV Diode Signal Clamp Voltage: Positive Clamp, 10mA Negative Clamp, –10mA 13 –1.5 16 –0.8 19 –0.4 V V VESD In-system ESD withstand voltage: Human Body Model (MIL-STD-883, method 3015) IEC 61000-4-2, contact discharge method Note 2 ±25 ±12 kV kV RDYN(LV) LV Diode Dynamic Resistance: Positive Negative 2.8 1.2 Ω Ω RDYN(HV) HV Diode Dynamic Resistance: Positive Negative 1 0.7 Ω Ω Note 1: Guaranteed at 25°C only Note 2: ESD applied to input/output pins with respect to GND, one at a time. These parameters are guaranteed by design. © 2007 California Micro Devices Corp. All rights reserved. 5/16/07 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 3 CM1240 Mechanical Details SOT-563 Mechanical Specifications MechanicalPackage PackageDiagrams Diagrams Mechanical The CM1240 is supplied in a 6-pin SOT-563 package. Dimensions are presented below. TOP VIEW PACKAGE DIMENSIONS Package SOT-563 D Leads 6 e1 Dim. A Millimeters Max Min Nom Max 0.50 0.55 0.60 0.020 0.022 0.024 0.17 c 0.08 D 0.22 0.27 0.007 0.18 0.003 1.60 BSC 1.50 1.60 0.009 0.011 0.059 E 0.20 CD 1 Pin 1 Marking 2 3 e 0.20 b c 2X 0.067 E1 1.20 BSC 0.047 BSC e 0.50 BSC 0.020 BSC e1 1.00 BSC 0.040 BSC L 0.20 BSC 0.008 BSC # per tape and reel E1 0.007 0.063 4 2X 0.063 BSC 1.70 C A-B 2X D 5 6 Nom b E Inches Min 0.20 SIDE VIEW 5000 pieces A 0.10 C SEATING PLANE C Controlling dimension: millimeters END VIEW c L * For best results, both grounds should be connected Package Dimensions for SOT-563. © 2007 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 5/16/07 CM1240 Mechanical Details (cont’d) TDFN-08 Mechanical Specifications The CM1240 is supplied in an 8-lead 0.5mm TDFN package. Dimensions are presented below. Mechanical Package Diagrams For complete information on the TDFN-08, see the California Micro Devices TDFN Package Information document. D 8 7 6 5 Package TDFN JEDEC No. MO-229 (Var. VCCD-3)* Leads 8 Dim. A E PACKAGE DIMENSIONS Pin 1 Marking Millimeters Inches Min Nom Max Min Nom Max 0.70 0.75 0.80 0.028 0.030 0.031 A3 0.20 REF b 0.20 0.25 0.30 0.008 0.010 0.012 D 1.90 2.00 2.10 0.075 0.079 0.083 D2 1.50 1.60 1.70 0.059 0.063 0.067 E 1.90 2.00 2.10 0.075 0.079 0.083 E2 0.80 0.90 1.00 0.031 0.035 0.039 e 0.50 BSC K 0.20 L 0.20 # per tape and reel 1 2 3 4 0.008 REF TOP VIEW 0.10 C 0.020 BSC 0.008 0.30 0.40 0.008 0.012 A SIDE VIEW A3 0.016 3000 pieces 1 2 3 4 Controlling dimension: millimeters D2 GND PAD E2 *This package is compliant with JEDEC standard MO-229, variation VCCD-3 with exception of the D2 and E2 dimensions as called out in the table above and the r1 dimension which is not specified in the MO-229 standard. C0.25 L R 8 7 6 5 K b e 8X BOTTOM VIEW 0.10 M CAB Package Dimensions for 8-Lead, 0.5mm pitch TDFN package © 2007 California Micro Devices Corp. All rights reserved. 5/16/07 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 5 CM1240 Mechanical Details (cont’d) TDFN-08 Mechanical Specifications Mechanical Package Diagrams Dimensions for the CM1240 supplied in a 8-lead, 0.4mm pitch TDFN package are presented below. PACKAGE DIMENSIONS 8 7 6 5 TDFN JEDEC No. MO-229C* Leads 8 Pin 1 Marking E Package Dim. D Millimeters Inches Min Nom Max Min Nom Max 1 2 3 4 A 0.70 0.75 0.80 0.028 0.030 0.031 TOP VIEW A1 0.00 0.02 0.05 0.000 0.001 0.002 A3 0.200 REF 0.008 REF b 0.15 0.20 0.25 0.006 0.008 0.010 D 1.60 1.70 1.80 0.063 0.067 0.071 D2 1.10 1.20 1.30 0.043 0.047 0.051 E 1.25 1.35 1.45 0.049 0.053 0.057 E2 0.30 e 0.40 0.50 0.012 0.40 BSC K 0.20 L 0.15 0.016 0.10 C 0.08 C A1 A 0.020 0.016 BSC 8X 0.008 0.25 0.35 # per tape and reel 0.006 0.10 0.010 A3 SIDE VIEW 0.014 M CAB b e 3000 pieces Pin 1 Locator Controlling dimension: millimeters K *This package is compliant with JEDEC standard MO-229C with the exception of the D, D2, E, E2, K and L dimensions as called out in the table above. 1 2 3 C0.2 GND PAD 7 6 8 E2 4 5 D2 L BOTTOM VIEW Recommend PCB Land Pattern Dimensions for 8-Lead, 0.4mm pitch TDFN package 0.30 0.70 0.25 0.55 1.66 0.40 Note: Dimensions in millimeters. Drawing not to scale. © 2007 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 5/16/07