CX1SM CRYSTAL 530 kHz to 2.1 MHz Low Profile, Miniature Surface Mount Quartz Crystal ™ DESCRIPTION The CX1SM quartz crystals are leadless devices designed for surface mounting on printed circuit boards or hybrid substrates. They are hermetically sealed in a rugged, miniature ceramic package. The CX1SM crystal is manufactured using the STATEK-developed photolithographic process, and was designed utilizing the experience acquired by producing millions of crystals for industrial, commercial, military and medical applications. Maximum process temperature should not exceed 260OC. actual size side view Glass Lid Shown PACKAGE DIMENSIONS FEATURES Extensional mode D Ideal for use with microprocessors Designed for low power applications A Compatible with hybrid or PC board packaging TOP BOTTOM Low aging E D Full military testing available Ideal for battery operated applications EQUIVALENT CIRCUIT L1 C1 C TYP. C0 1 E B Designed and manufactured in the USA R1 R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance 2 DIM inches mm inches mm A 0.315 8.00 0.330 8.38 B 0.140 3.56 0.155 3.94 C - - D 0.045 1.14 0.055 1.40 E 0.060 1.52 0.070 1.78 DIM “C” SUGGESTED LAND PATTERN 0.070 (1.78) MAX. GLASS LID see below CERAMIC LID MAX inches mm inches mm SM1 0.065 1.65 0.070 1.78 SM2 0.067 1.70 0.072 1.83 SM3 0.070 1.78 0.075 1.90 0.160 (4.06) inches (mm) 0.270 (6.86) IS O RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de YS 90 01 ERT T E M C IFIC T A N IO S 10129 - Rev B TYPICAL APPLICATION FOR A PIERCE OSCILLATOR SPECIFICATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Parameters Fundamental Overtone Frequency Range, (Hz) 555 k 614 k 1.0 M 1.4 M1.8432 M 2.1M Motional Resistance,R1(Ω) 600 275 500 Motional Capacitance,C1 (fF) 2.5 3.6 2.0 Quality Factor, Q (k) Shunt Capacitance,C0 (pF) 170 260 1.2 1.3 Motional Resistance,R1 MAX Calibration Tolerance* 775 300 475 1.5 2.8 2.6 190 100 110 70 1.1 1.0 1.3 1.3 3 kΩ + _ 500 ppm (0.05%) + _ 1000 ppm (0.1%) + _ 10000 ppm (1.0%) 3 µW MAX Drive Level Load Capacitance** 7 pF Turning Point (T0)** 35OC Temperature Coefficient (k) -0.035 ppm/OC2 Note: Frequency f at temperature T is related to frequency f0 2 at turning point temperature T0 by: f-f0 = k(T-T0) f0 Function Mode Aging, first year Shock, survival Vibration, survival Operating Temp. Range Storage Temp. Range Max Process Temperature Extensional 5 ppm MAX 750 g peak, 0.3 ms, 1/2 sine 10 g RMS, 20-1,000 Hz random -10OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) -55OC to +125OC 260OC for 20 sec. The low profile CX miniature surface mount crystal is ideal for small, high density, battery operated portable products. The CX crystal designed in a Pierce oscillator (single inverter) circuit provides very low current consumption and high stability. A conventional CMOS Pierce oscillator circuit is shown below. The crystal is effectively inductive and in a PI-network circuit with CD and CG provides the additional phase shift necessary to sustain oscillation. The oscillation frequency (f0) is 15 to 250 ppm above the crystal’s series resonant frequency (fS). Drive Level RA is used to limit the crystal’s drive level by forming a voltage divider between RA and CD. RA also stabilizes the oscillator against changes in the amplifiers output resistance (R0). RA should be increased for higher voltage operation. Load Capacitance The CX crystal calibration tolerance is influenced by the effective circuit capacitances, specified as the load capacitance (CL). CL is approximately equal to: CL = CD x CG CD + CG NOTE: CD and CG include stray layout to ground and CS is the stray shunt capacitance between the crystal terminal. In practice, the effective value of CL will be less than that calculated from CD, CG and CS values because of the effect of the amplifier output resistance. CS should be minimized. The oscillation frequency (f0) is approximately equal to: [ f0 = fS 1 + *Tighter tolerances available. ** Other values available. Where f S C1 C0 TERMINATIONS Designation SM1 SM2 SM3 Termination Gold Plated Solder Plated Solder Dipped (1) + CS C1 2(C0 + CL) ] (2) = Series resonant frequency of the crystal = Motional Capacitance = Shunt Capacitance CONVENTIONAL CMOS PIERCE OSCILLATOR CIRCUIT Rf PACKAGING OPTIONS CX1SM BUFFER - Tray Pack - Tape and Reel (Reference tape and reel data sheet 10109) AMPLIFIER HOW TO ORDER CX1SM CRYSTALS CX1 S C SM1 Blank = Glass Lid C = Ceramic Lid Frequency K = kHz M = MHz 500 OSC Freq (fO ) / M Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC Calibration S = Customer Specified Tolerance @ 25OC (in ppm) CG CX1 XTAL CD 10129 - Rev B IS O RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de YS 90 01 ERT T E M C IFIC T A N IO S “S” if special or custom design. Blank if Std. SM1 = Gold Plated SM2 = Solder Plated SM3 = Solder Dipped 1.0M, RA