BD23B Dual Band 2-Way SMT Power Divider 1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro Device Features Typical Isolation = 25 dB Typical Insertion Loss = 0.4 dB MSL 3 moisture rating Lead-free/RoHS-compliant SOIC-8 Plastic Package With exposed back side ground pad Product Description Typical Performance1 BeRex’s Divider BD23B is designed for PCS, WCDMA & TD-SCDMA and WiBro band with low Insertion Loss and Isolation. This chip is fully passivated for enhanced performance and reliability and packaged in RoHScompliant with SOIC-8 surface mount package. It can be used without back side ground soldering. (This may degrade the performance at the high frequency edge.) Parameter Min Frequency Range Insertion Loss Typical 1900 0.4 Isolation 15 Max Unit 2500 0.8 MHz dB 25 dB IRL(S11) -23 -15 dBm ORL(S22/S33) Amplitude Balance Phase Balance -25 0.05 0.5 -15 0.2 1.0 dBm dB deg *All specifications apply to the following test conditions, 1. Device performance _ measured on BeRex E/B at 25°C, 50ohm system. 2. Insertion Loss: Above 3.0dB. 3. Back side ground _ soldered. Applications Absolute Maximum Ratings Base station Infrastructure Commercial/Industrial/Military wireless system Parameter Input Power Storage Temperature Operating Temperature Rating 1W CW dBm -55 to +155°C -40 to +85°C Operation of this device above any of these parameters may result in permanent damage. Evaluation Board Drawing Function Block Diagram Pins 1,3,4,6 and 7 must be DC and RF grounded. BeRex ●website: www.berex.com ●email: [email protected] 1 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. D BD23B Dual Band 2-Way SMT Power Divider 1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro Typical Test Data With Back Side Ground Soldering Parameters Unit WCDMA & TD-SCDMA WiBro Frequency Range MHz 1900 2075 2250 2200 2350 2500 Insertion Loss dB 0.38 0.39 0.44 0.42 0.46 0.54 Isolation dB 18.7 21.6 25.8 24.2 28.5 23.8 IRL(S11) dB -21.4 -26.7 -25.2 -27.0 -21.6 -17.4 ORL(S22,S33) dB -20.9 -24.5 -23.0 -23.7 -21.6 -20.8 Phase Diff. deg 0.0 0.2 0.3 0.3 0.5 0.7 Amplitude Balance dB 0.03 0.04 0.06 0.05 0.06 0.09 Without Back Side Ground Soldering BeRex Parameters Unit WCDMA & TD-SCDMA Frequency Range MHz 1900 2075 2250 2200 2350 2500 Insertion Loss dB 0.36 0.38 0.45 0.42 0.49 0.6 Isolation dB 19.2 22.2 25.7 24.7 25.8 20.5 IRL(S11) dB -24.2 -26.0 -20.4 -22.1 -17.6 -14.2 ORL(S22,S33) dB -22.3 -25.0 -21.9 -22.8 -20.4 -19.3 Phase Diff. deg 1.7 1.6 1.7 1.7 1.7 1.8 Amplitude Balance dB 0.07 0.06 0.07 0.07 0.06 0.06 ●website: www.berex.com WiBro ●email: [email protected] 2 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. D BD23B Dual Band 2-Way SMT Power Divider 1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro Insertion Loss vs. Frequency Isolation vs. Frequency IRL vs. Frequency ORL vs. Frequency Notes) - BG: Data taken with backside ground soldering - NBG: Data taken without backside ground soldering BeRex ●website: www.berex.com ●email: [email protected] 3 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. D BD23B Dual Band 2-Way SMT Power Divider 1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro Package Outline Drawing BeRex ●website: www.berex.com ●email: [email protected] 4 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. D BD23B Dual Band 2-Way SMT Power Divider 1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro Suggested PCB Land Pattern and PAD Layout PCB Land Pattern RF In 0.047"(1.20) PCB Mounting 0.018"(0.45) 0.076"(1.92) 0.157"(3.98) 0.040"(1.01) RF Out1 RF Out2 0.030"(0.76) 0.198"(5.02) Note : All dimension _ millimeters PCB lay out _ on BeRex website Package Marking Tape & Reel Packaging information: SOIC8 SOIC8-Part orientation Tape Width (mm): 12 YY = Year, WW = Working Week, XX = Wafer No. Reel Size (inches): 7 Device Cavity Pitch (mm): 8 Direction of feed Devices Per Reel: 1000 Lead plating finish 100% Tin Matte finish (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns.) MSL / ESD Rating MSL Rating: Level 3 at +265°C convection reflow Standard: JEDEC Standard J-STD-020 NATO CAGE code: 2 BeRex N 9 6 F ●website: www.berex.com ●email: [email protected] 5 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. D