EMB1428Q
www.ti.com
SNVS812A – MAY 2012 – REVISED MAY 2013
EMB1428Q Switch Matrix Gate Driver
Check for Samples: EMB1428Q
FEATURES
DESCRIPTION
•
•
•
The EMB1428 Switch Matrix Gate Driver IC is
designed to work in conjunction with EMB1499
DC/DC Controller IC to support TI’s switch matrix
based active cell balancing scheme in a battery
management system. The EMB1428 provides 12
floating MOSFET gate drivers necessary for
balancing up to 7 battery cells connected in a series
stack. Multiple EMB1428 ICs may be used together
to balance a stack of more than seven battery cells.
1
2
•
•
60V Maximum Stack Operating Voltage
Twelve (12) Floating Gate Drivers
SPI Bus Interface (for Charge/discharge
Commands and Fault Reporting)
Low Power Sleep Mode
EMB1428Q is an Automotive Grade Product
that is AEC-Q100 Grade 1 Qualified (-40°C to
+125°C Operating Junction Temperature)
APPLICATIONS
•
•
•
Li-Ion Battery Management Systems
Electrical/Hybrid Vehicles
Grid-Power Storage
The EMB1428 integrated circuit interfaces with the
EMB1499 DC/DC controller to control and enable
charging and discharging modes. The EMB1428 uses
an SPI bus to accept commands from the main
controller (CPU/MCU) on which battery cell should be
charged or discharged and to report back any faults
to the main controller (CPU/MCU).
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012–2013, Texas Instruments Incorporated
EMB1428Q
SNVS812A – MAY 2012 – REVISED MAY 2013
www.ti.com
Typical Application
Vstack
Vstack
°
7-Cell
HalfStack
EMB1499
®
GATE_LS
GATE_HS2
GATE_HS1 VSENSE_LS
VSENSE_HS
PWM_CLAMP
CELLPLUS
VINA
VINP
VINF
PVINF
MOSFET
DRIVER
+12V
Floating
12V Supply
PGNDF
GNDF
°
¯
VSET
EMB1428
SOURCE[11..0]
GATE[11..0]
VDDCP
EN
DIR
DIR_RT
DONE
FAULT2
FAULT1
FAULT0
CEXT2
DAC
EN
DIR
DIR_RT
DONE
FAULT2
FAULT1
FAULT0
GNDA GNDP
CEXT1
SPI BUS
VSTACK
VDD12V
VDDP
+12V
TO OTHER BALANCING CIRCUIT
+5V
+3.3V
CS
SD0
SDI
SCLK
CPU OR
MCU
VDD5V
FAULT_INT
VDDIO
RST
GNDP GND
Figure 1. Typical Application
2
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
EMB1428Q
www.ti.com
SNVS812A – MAY 2012 – REVISED MAY 2013
37
GATE11
SOURCE11
SOURCE10
38
GATE10
39
40
4GATE9
SOURCE9
41
SOURCE8
42
43
VDDCP
GATE8
44
CEXT2
45
46
CEXT1
28
27
* Exposed pad must be soldered to ground
11
26
VDD5V
VDDIO
FAULT_INT
CS
SDO
SDI
SCLK
EN
24
DIR
DIR_RT
DONE
23
25
FAULT0
22
21
FAULT1
FAULT2
GND
GATE0
12
20
Plane to ensure rated performance
13
GATE3
9
10
19
SOURCE3
29
18
GATE4
VDD12V
30
8
GND
RST
31
EMB1428
(Top View)
7
SOURCE0
SOURCE4
6
17
GATE5
32
GATE1
SOURCE5
5
16
GATE6
33
15
SOURCE6
34
4
GATE2
GATE7
3
SOURCE1
SOURCE7
36
35
SOURCE2
VDDP
1
2
14
GNDP
47
48
VSTACK
Connection Diagram
48-Pin WQFN
See RHS Package
Table 1. ORDERING INFORMATION
Order number
Package
Type
Package
Drawing
WQFN
RHS
EMB1428QSQ
EMB1428QSQE
Features
1000 Units in Tape and Reel
AECQ100 Grade qualified. Automotive
EMB1428QSQE 250 Units in Tape and
Reel Grade Production Flow (1)
250 Units in Tape and Reel
EMB1428QSQX
(1)
Supplied As
2500 Units in Tape and Reel
Automotive Grade (Q) product incorporates enhanced manufacturing and support processes for the automotive market, including defect
detection methodologies. Reliability qualification is compliant with the requirements and temperature grades defined in the AEC-Q100
standard. Automotive grade products are identified with the letter Q. For more information go to http://www.ti.com/automotive.
PIN DESCRIPTIONS
Pin
Name
Description
Application Information
1
GNDP
Ground for charge pump circuitry
Connect to stack ground at board level.
2
VDDP
12V supply for charge pump circuitry
Connect to 12V supply at board level with
0.1µF bypass cap to GNDP.
3, 5, 7, 9, 11, 14,
16, 18, 37, 39, 41,
43
SOURCE0 to
SOURCE11
Floating driver references
Connect to FET switch sources.
4, 6, 8, 10, 12, 15,
17, 19, 38, 40, 42,
44
GATE0 to GATE11
Floating driver outputs
Connect to FET switch gates.
13, 36
GND
Ground
Internal reference for all analog and digital
circuitry except the charge pump.
20, 21, 22
FAULT[2, 1, 0]
Inputs, three-bit digital fault code from
EMB1499
Fault code is reported to CPU through the
SPI bus. 5V Schmitt-trigger inputs, 12V
signal tolerant.
23
DONE
Input from EMB1499, indicates end of charge
cycle
5V Schmitt-trigger input, 12V signal tolerant.
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
3
EMB1428Q
SNVS812A – MAY 2012 – REVISED MAY 2013
www.ti.com
PIN DESCRIPTIONS (continued)
Pin
Name
24
DIR_RT
Description
Application Information
Input from EMB1499, handshake signal,
inverted version of DIR
5V Schmitt-trigger input, 12V signal tolerant.
25
DIR
Output to EMB1499, indicates direction of
charging current
'High' indicates charge mode, 'Low' indicates
discharge mode. 5V CMOS output levels.
26
EN
Output to EMB1499, enable signal for
charge/discharge cycle
'High' signals EMB1499 to begin charge or
discharge cycle, 'Low' signals EMB1499 to
ramp down current and finish present cycle.
5V CMOS levels.
27
SCLK
SPI clock input
1MHz SPI interface, I/O levels are
referenced to the VDDIO supply.
28
SDI
SPI data input
29
SDO
SPI data output
30
CS
31
FAULT_INT
Fault interrupt output to CPU
Referenced to the VDDIO supply.
32
VDDIO
IO supply for SPI interface circuitry
Connect to CPU supply to match I/O levels.
33
VDD5V
5V supply for digital core and EMB1499
interface circuitry
34
VDD12V
12V supply for analog core circuitry
35
RST
45
VDDCP
46, 47
CEXT1, CEXT2
48
VSTACK
SPI chip select input
RESET pin
Floating supply input from external charge
pump circuit
Connected to external charge pump circuit
that provides a floating supply referenced to
the top of the battery module (VSTACK).
Charge pump driver outputs
Buffered, differential 1MHz clock signals for
driving external charge pump circuit.
Supply from the highest voltage in the battery
module
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
4
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
EMB1428Q
www.ti.com
SNVS812A – MAY 2012 – REVISED MAY 2013
ABSOLUTE MAXIMUM RATINGS (1)
Any SOURCE pin to GND
-0.5V to 70V
VSTACK to GND
-0.5V to 70V
VDDCP to VSTACK
-0.5V to 25V
VDDCP to GND
-0.5V to 90V
VDD12V to GND
-0.5V to 16V
VDDP to GNDP
-0.5V to 16V
GNDP to GND
-0.5V to 0.5V
FAULTx, DONE, DIR_RT to GND
-0.5V to 16V
VDD5V, VDDIO to GND
-0.5V to 7.5V
All other inputs to GND
-0.5V to 7.5V
ESD Rating
(2)
±2 kV
Soldering Information
Junction Temperature
150°C
Storage Temperature
-65°C to 150°C
(1)
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the recommended Operating Ratings is not implied. The recommended Operating Ratings
indicate conditions at which the device is functional and should not be operated beyond such conditions.
The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD22–A114.
OPERATING RATINGS
VSTACK to GND
15V to 60V
VDD12V to GND
10.8V to 13.2V
VDDP to GNDP
10.8V to 13.2V
VDD5V, to GND
4.5V to 5.5V
VDDIO to GND
2.5V to 5.5V
VDDCP to VSTACK
18V to 24V
Junction Temperature (TJ)
-40°C to 125°C
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
5
EMB1428Q
SNVS812A – MAY 2012 – REVISED MAY 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of −40°C
to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent
the most likely parametric norm at TJ = 25°, and are provided for reference purposes only. VSTACK = 60V, SOURCEX = 0V,
VDD12V = VDDP = 12V, VDD5V = 5V, VDDIO = 3.3V unless otherwise indicated in the conditions column.
Symbol
Typ (1)
Max
Units
1.57
2.4
mA
4
6
mA
VSTACK = 60V
100
125
µA
SOURCEx = 60V
135
180
µA
0.2
1.8
µA
1.4
2.3
µA
0.4
µA
0.2
µA
11
µA
0.1
µA
2.3
µA
0.8
µA
1.2
µA
Parameter
Conditions
ISTACK
Stack supply current
System connected to Cell 1,
IVDDP
Charge pump driver supply
current
EN high
IVDD12V
12V supply current
IVDD5V
5V supply current
IVDDIO
IO supply current
ISTACK_SD
Stack supply current, shutdown
Shutdown (FETs disconnected)
IVDDP_SD
Charge pump driver supply
current, shutdown
VSTACK = 60V
IVDD12V_SD
12V supply current, shutdown
SOURCEx = 60V
IVDD5V_SD
5V supply current, shutdown
IVDDIO_SD
IO supply current, shutdown
ISTACK_RST
Stack supply current, reset
RESET
IVDDP_RST
Charge pump driver supply
current, reset
VSTACK = 60V
IVDD12V_RST
12V supply current, reset
SOURCEx = 60V
IVDD5V_RST
5V supply current, reset
IVDDIO_RST
IO supply current, reset
Min
System Parameters
8.7
0.28
20
28
µA
0.5
µA
2.4
ms
FET Driver Parameters
tEN
Driver setup time, Cell-to-Cell
Rising edge of DONE to rising edge
of EN
Driver set up time from shutdown
Rising edge of CS to rising edge of
EN
1.23
2.4
ms
tPD
Shutdown time
Rising edge of DONE to last clock
pulse on CEXT2
330
500
µs
VGSON
Driver output 'on' voltage, VGATEVSOURCE
12.1
14
V
ΔVGSON
VSTACK Line Regulation
SOURCEx = 0V, VSTACK = 15V to
60V
3.5
9
mV/V
VSOURCE Line Regulation
SOURCEx = 0V to 60V, VSTACK =
60V
5.5
20
mV/V
IGON
GATE pin output drive current
during FET turn-on transient
(GATE-SOURCE) = VGSON/2
RGSTRANS
Driver output pull-down
resistance during FET turn-off
transient, GATE to SOURCE pin
(GATE-SOURCE) = VGSON/2
RGSON
Driver output pull-down
resistance active
RGSOFF
Driver output pull-down
resistance after FET turn-off
transient has finished, GATE to
SOURCE pin
ISRC
SOURCE pin bias current, powerup, driver output on
210
µA
SOURCE pin bias current, powerup, driver output off
80
µA
SOURCE pin bias current, power- Shutdown
down
100
nA
ISRC_SD
(1)
6
10.8
(GATE-SOURCE) ≤ 0.2V
100
225
µA
16.2
17.5
Ω
100
150
220
Ω
100
150
220
Ω
Typical specifications represent the most likely parametric norm at 25°C operation.
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
EMB1428Q
www.ti.com
SNVS812A – MAY 2012 – REVISED MAY 2013
ELECTRICAL CHARACTERISTICS (continued)
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of −40°C
to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent
the most likely parametric norm at TJ = 25°, and are provided for reference purposes only. VSTACK = 60V, SOURCEX = 0V,
VDD12V = VDDP = 12V, VDD5V = 5V, VDDIO = 3.3V unless otherwise indicated in the conditions column.
Symbol
Parameter
Conditions
Min
Typ (1)
Max
Units
Charge Pump Parameters
VCPO
Charge pump output measured
with respect to VSTACK
ROUT_CP
VCP_UVH
VDDP = 12V, System connected to
Cell 1, EN high
23.5
V
Charge pump output resistance
1.7
Ω
Charge pump UVLO upper trip
voltage, VDDCP - VSTACK
16
V
VCP_UVL
Charge pump UVLO lower trip
voltage, VDDCP - VSTACK
14
V
fCLK
CEXT1,2 pin clock frequency
0.9
1.0
1.15
MHz
2.25
2.35
V
SPI/Microcontroller Interface Input Parameters (CS, SDI, SCLK, RST)
VIH
CS, SDI, SCLK Logic high
threshold
VIL
CS, SDI, SCLK Logic low
threshold
VIH-5V
CS, SDI, SCLK Logic high
threshold
VIL-5V
CS, SDI, SCLK Logic low
threshold
IIN
SDI, SCLK Input bias current
RPUCS
Internal Pull-up resistance from
CS to VDDIO
VIH_RST
Reset Logic high threshold
VIL_RST
Reset Logic low threshold
RPDRST
Internal Pull-down resistance
from RST to GND
0.95
VDDIO = 5.0V
1.0
3.47
1.45
V
3.6
1.55
VSDI, VSCLK = VDDIO = 5.0V
V
0.01
0.1
98
1.0
0.55
V
µA
kΩ
1.35
V
0.95
V
98
kΩ
3.19
V
SPI/Microcontroller Interface Output Parameters (FAULT_INT, SDO)
VOH
Output High Voltage
VOL
Output Low Voltage
ISOURCE = 200µA
3.15
ISOURCE = 1mA
2.7
ISINK = 200µA
0.12
ISINK = 1mA
0.6
V
0.155
V
V
IOZH
SDO TRI-STATE Leakage
current (high)
VSDO = 0V or VDDIO
3
µA
IOZL
SDO TRI-STATE Leakage
current (low)
VSDO = 0V or VDDIO
0.2
µA
1.0
1.1
MHz
50
75
%
SPI/Microcontroller Interface Timing Specifications (Need SPI mode)
fSCLK
Serial clock from CPU
DC
SCLK Duty Cycle
10
tCSU
CS falling edge to SCLK rising
edge
100
ns
tCDSU
CS rising edge to SCLK rising
edge
50
ns
tTRANS
CS high pulse width
1.5
µs
tSU
SDI setup to SCLK rising edge
50
ns
SDO setup from SCLK rising
edge
200
ns
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
7
EMB1428Q
SNVS812A – MAY 2012 – REVISED MAY 2013
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of −40°C
to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent
the most likely parametric norm at TJ = 25°, and are provided for reference purposes only. VSTACK = 60V, SOURCEX = 0V,
VDD12V = VDDP = 12V, VDD5V = 5V, VDDIO = 3.3V unless otherwise indicated in the conditions column.
Conditions
Min
Typ (1)
Symbol
Parameter
Max
Units
tHD
CSand SDI hold time from SCLK
rising edge
200
ns
SDO hold time from SCLK rising
edge
250
ns
tCS
CS falling edge to SDO enabled
50
ns
tDIS
CS rising edge to SDO disabled
(tri-state)
60
ns
3.6
V
EMB1499 Interface Input Parameters (FAULT0, FAULT1, FAULT2, DIR_RT, DONE)
VIH-EMB1499
Logic high threshold
VIL-EMB1499
Logic low threshold
IIN-EMB1499
Input bias current
3.4
1.4
1.6
V(FAULTX, DIR_RT, DONE) = 12V
V
0.6
1
µA
EMB1499 Interface Output Parameters (EN, DIR)
VOH-EMB1499
Output High Voltage
VOL-EMB1499
Output Low Voltage
ISOURCE = 200µA
4.86
4.9
ISOURCE = 1mA
4.4
ISINK = 200µA
0.11
ISINK = 1mA
0.56
V
V
0.3
V
V
EMB1499 Interface Timing Specifications
tDIR
DIR transition to corresponding
DIR_RT
tDIRSU
DIR setup to EN rising edge
tINT
Any fault condition to FAULT_INT
rising edge
tDNL
DONE low pulse width
Prior to EMB1499 fault condition
3
µs
tFSU
FAULT[2, 1, 0] setup to DONE
rising edge
EMB1499 reporting a fault condition
1
µs
tFHD
FAULT[2, 1, 0] hold time from
DONE rising edge
8
µs
8
700
3.4
µs
2
Submit Documentation Feedback
ns
µs
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
EMB1428Q
www.ti.com
SNVS812A – MAY 2012 – REVISED MAY 2013
BLOCK DIAGRAM
EXTERNAL CIRCUITRY
FROM TOP OF BATTERY
STACK (60V MAX)
0.01P
0.01P
0.01P
CHARGE PUMP
CEXT1
CEXT2
VDDCP
VSTACK
Approx. VSTACK + (2 X VDDP)
SOFT
START
VDDP
CHARGE
PUMP
UVLO
CLK
LEVEL SHIFT
HV CURRENT MIRROR
GNDP
FLOATING DRIVER 12X
DRIVER BIAS CURRENT
GENERATOR
VDD5V
RST
POR
VDDIO
CS
CLK
SDI
SDO
FAULT_INT
1 MHz
CLOCK
5V CORE LOGIC
3.3V
I/O
SHUTDOWN BIAS
100 nA
VDD12V
DRVR
UVLO
LEVEL
SHIFT
DRIVER
GATE
SOURCE
BANDGAP
SPI
INTERFACE
bg_good
VDD5V
DIR_RT
DONE
FAULT[2..0]
DIR
EN
STATE
MACHINE
5V
I/O
EMB1499
INTERFACE
bg_good
SWITCH _EN
SLEW
Figure 2. EMB1428 High -Level Block Diagram
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
9
EMB1428Q
SNVS812A – MAY 2012 – REVISED MAY 2013
www.ti.com
APPLICATION INFORMATION
The EMB1428 and the EMB1499 work in conjunction to control an active balancing circuit for up to 7 battery cells
connected in series. See Typical Application for the typical system architecture. The EMB1428 provides 12
floating gate drivers that are needed for the control of the FET switch matrix in the circuit. The EMB1499 is a
DC/DC controller that regulates the inductor current in the bi-directional forward converter. In a typical
application, the forward converter has the inductor side connected to the switch matrix and the other side to the
battery stack. With such an arrangement, every cell balancing action is an energy exchange between a cell and
the whole stack. The maximum number of cells in such a stack is constrained by the maximum stack voltage the
EMB1428 can handle (60V). Theoretically the 7 cells associated with an EMB1428 can be anywhere along the
stack. So in the case of a 14-cell stack, one EMB1428 can be used to handle the lower 7 cells (lower half-stack),
and another EMB1428 can be used to handle the upper 7 cells (upper half-stack).
When the EMB1428 receives a cell balance command from the micro controller to charge or discharge a
particular cell, it will first turn off all switches irrelevant to the balancing of that cell and then turn on the switches
that will properly connect the cell to the forward converter. Once the proper switches in the switch matrix have
been turned on, the EMB1428 will signal the EMB1499 to start charging or discharging the cell. The EMB1499
will then ramp the forward converter’s inductor current (positive or negative) to a user-defined magnitude and
keep a current constant. The inductor current is the balancing current the cell receives. Upon receiving a
command from the microcontroller to stop balancing or to switch balancing action to a different cell, the
EMB1428 will inform the EMB1499 to bring the balancing current towards zero. Once the inductor current has
ramped down to zero, the EMB1428 will turn off all the switches that are not needed by the new command and
turn on the switches that are needed (if any). If the new command is to balance a different cell, the EMB1428 will
then signal the EMB1499 to ramp the inductor current again. If the new command is to stop balancing, the
EMB1428 will enter a low power sleep mode, also known as shutdown mode.
The Switch Matrix
The FET switches in a switch matrix fall into two categories. See Figure 3 for a detailed illustration. The switches
directly connected to the battery cells are called the “cell switches”. Each cell switch is comprised of two N-FETs
that are connected in a common source and common gate manner and is capable of blocking current flow in
both directions. The switches directly connected to the DC/DC converter are called the "polarity switches". Each
polarity switch is simply an N-FET and is capable of blocking current flow in one direction only.
Of the 7 cells handled by the EMB1428, assume the bottom cell is Cell 1, the one above it is Cell 2, and so on.
Cell 1 is connected to two cell switches, i.e. Cell Switch 0 and Cell Switch 1 (CSW0 and CSW1). Cell 2 is
connected to CSW1 and CSW2. This pattern repeats through all cell connections. Each cell switch has one drain
node connected to either the EVEN rail (if the switch is even numbered) or the ODD rail (if the switch is odd
numbered). Each of the four polarity switches (PSW0 through PSW3) either has a drain connected to the positive
end of the DC/DC converter and a source connected to the EVEN or ODD rail, or has a source connected to the
negative end of the DC/DC converter and a drain to the EVEN or ODD rail. The function of the cell switches is to
select the chosen cell on the EVEN and ODD rails and the function of the polarity switches is to connect the cell
to the DC/DC converter in a positive-to-positive and negative-to-negative manner.
Each time the EMB1428 tries to charge or discharge a certain cell, it will first turn off all irrelevant switches, and
turn on or keep on relevant cell switches. It will then connect the cell to the EVEN and ODD rails and turn on the
appropriate polarity switches.
10
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
EMB1428Q
www.ti.com
SNVS812A – MAY 2012 – REVISED MAY 2013
TOP OF STACK
VSTACK
GATE7
GATE11
PSW3
CSW7
ODD
SOURCE11
EVEN
SOURCE10
SOURCE 7
CELL 7
GATE6
GATE10
PSW2
CSW6
CELL 6
DC/DC
CONVERTER
SOURCE6
GATE5
CSW5
GATE9
PSW1
SOURCE9
CELL 5
SOURCE5
GATE4
CSW4
GATE8
PSW0
SOURCE8
CELL 4
SOURCE4
GATE3
CSW3
CELL 3
SOURCE3
GATE6
CSW6
POLARITY SWITCHES
CELL 2
SOURCE2
GATE1
CSW1
CELL 1
SOURCE1
GATE0
CELL SWITCHES
CSW0
SOURCE0
BOTTOM OF STACK
Figure 3. Switch Matrix
Reference Current Generator
A block diagram of the reference current generator is shown in Figure 4. This block generates bias currents that
are used in the 12 floating drivers to create temperature-stable driver output voltages. The main blocks in the
reference current generator are bandgap, opamp, resistor/diode stack, and shutdown bias generator.
The 5V bandgap voltage is forced across a stack of resistors and diodes in the operational amplifier feedback
loop to generate a reference current. The reference current is mirrored from the VDDCP rail to each of the 12
floating drivers.
During sleep mode the bandgap output is held at 0V such that the reference current output is zero. A SOURCE
shutdown bias current, ISRC, is already created by a parallel bias generator that is active any time VSTACK is
greater than 2V typical. The SOURCE shutdown bias current ensures that the driver outputs will be clamped off
during shutdown if there is any significant voltage applied to VSTACK.
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
11
EMB1428Q
SNVS812A – MAY 2012 – REVISED MAY 2013
www.ti.com
VDDCP
Approx. VSTACK + (2 X VDDP)
HV CURRENT MIRROR
BIAS CURRENTS
TO DRIVERS
Cpgood (From Charge Pump)
SHUTDOWN BIAS
100 nA
VDD12V
BANDGAP
bg_good
Figure 4. Reference Current Generator
The reference generator also monitors the cpgood signal which comes from the charge pump UVLO. If cpgood is
low then the reference generator is held in a standby mode with zero output current until the charge pump has
started. This delay prevents supply headroom issues that can occur if the drivers are turned on before the charge
pump has created a large enough voltage at the VDDCP pin.
The bg_good signal is generated by a Schmitt trigger inverter that is driven by the operational amplifier feedback
loop. This signal indicates that the bandgap has started up, the charge pump is operational, and the reference
current is flowing to the drivers. The digital block monitors the bg_good signal and generates a fault if it is low
when an SPI command is received.
Floating Gate Driver
Figure 5 shows the main blocks in the floating gate driver cell along with a dual-FET load and the built-in bleeder
resistor. Each of the 12 drivers has a floating supply generator, shutdown circuit, UVLO, level-shift, and output
buffer. The SOURCE pin can be up to 60V above ground for a 14 cell pack (14X4.3V) and the GATE pin must be
able to swing 12V above the SOURCE pin (in some cases above the top of the battery stack) to turn on the
external FETs.
The internal 100k bleeder resistors ensure that the FET switches will automatically turn off in the event of a
catastrophic driver failure and that the FET switches are in an off state upon system power-up. The driver is
designed to drive the FET switch directly with no gate-source resistor.
12
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
EMB1428Q
www.ti.com
SNVS812A – MAY 2012 – REVISED MAY 2013
VDDCP
Reference Current
From IrefGen
Floating
Supply
Generator
External
to
EMB1428
Shutdown
bg_good
SWITCH_EN
UVLO
Level
Shift
OUTPUT
DRIVER
100 k:
Bleeder
Resistor
SOURCE
Pin
slew
SWITCH_EN
Dual-FET
Switch
Level
Shift
Figure 5. Floating Gate Driver
Each driver receives a reference current from the VDDCP rail that must flow out of the SOURCE pin and into the
FET network along with the rest of the driver's bias current. The total SOURCE pin current for each driver with an
off output is ISRC. For drivers with outputs that are 'on', IGON flows through the bleeder resistor and out of the
source connection. For drivers 0 through 7 this current can flow into the battery stack or into the EVEN or ODD
rail depending on which of the two FET body diodes is forward biased. This current helps ensure that the source
connection of the dual-FET switches does not get pulled down such that a drain-source breakdown occurs. For
drivers 8 through 11 this current usually flows into the EVEN or ODD rails, through an 'ON' dual-FET switch, and
back into the battery stack.
Driver Shutdown Circuit
The driver shutdown block is essentially a simple level-shift circuit that monitors the system level shutdown signal
(SWITCH_EN) and the bg_good signal. If shutdown is high and/or bg_good is low then the driver output is forced
low and the driver enters a low power shutdown state. The bg_good signal indicates that the charge pump and
bandgap are powered up and functional. This circuit also indirectly ensures that the drivers will automatically shut
down if either the 5V or 12V supplies are not operational.
Floating Driver UVLO
A UVLO circuit is included in each driver to prevent the driver output from turning on unless its floating supply is
active.
Floating Driver Output Buffer
Figure 6 shows the architecture for the floating driver output buffer along with a dual-FET load. The output buffer
uses a two-stage parallel architecture to help control output currents that must be supplied by the charge pump.
A low-output-drive slewing stage begins every output transition and a parallel high-output-drive latching stage is
activated once the output has slewed to within 300mV(typical) of whichever rail it is approaching. The latching
stage also provides a low output impedance to hold the output on or off in the presence of external noise
transients. This architecture is used because all current provided by the output buffer to charge the external FET
switch gate-source capacitance (i.e. turn a switch 'ON') must be supplied to the VDDCP pin by the charge pump.
Turning a switch off is much simpler: all charge drained from the external FET gate-source capacitance flows into
the GATE pin, through the driver pull-down circuitry, and back out through the SOURCE pin.
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
13
EMB1428Q
SNVS812A – MAY 2012 – REVISED MAY 2013
www.ti.com
High-Current
Latch Stage
Low-Current
Slew Stage
MP0
MP2
+
-
+300 mV
Fixed 250 PA
Pullup
MP1
+
Comp1
External to EMB1428
Comparator
Enable
Signals
Comp2
SWITCH_EN
UVLO
Enable
+
+
-
100 k:
Bleeder
Resistor
MN1
Dual-FET
Switch
+300 mV
MN0
MN2
Slew Current
Level-Shift
SOURCE
Pin
Slew Signal
to
Digital Core
Figure 6. Floating Driver Output Buffer
The slewing output stage consists of a pull-up current source (MN0, MP0, and MP2) and a resistive pull-down
circuit (MN2, and 20K resistor). The pull-up slewing current is IGON. The approximate pull-up time can be
estimated using the model shown in Figure 7 where the input is a current step waveform. RBLD is the 100k
bleeder resistance, typical. Vo is the voltage to which the slewing stage pulls the gate voltage up to (12V-0.3V =
11.7V). The equation for the slewing time is:
IGON x RBLD
)
tSLEW = Cgs x RBLD x ln(
IGON x RBLD - Vo
(1)
Using the above equation along with a conservative estimate for the Cgs of the dual-FETs of 5nF gives pull-up
times of 316 µs (RBLD = 100k; Vo = 11.7V ).
The pull-down behavior of the slewing output stage is determined by the RC circuit formed by the 20K resistor,
the 100k bleeder resistor, and the Cgs of the external FETs. Using an analysis very similar to the above
equation, the pull-down time can be estimated at approximately 307 µs.
+
IGON
RBLD
CGS
-
Figure 7. Driver Output Slewing Model
14
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
EMB1428Q
www.ti.com
SNVS812A – MAY 2012 – REVISED MAY 2013
The latching output stage shown in Figure 6 consists of comparators Comp1 and Comp2 along with output
devices MP1 and MN1. Half of this stage is de-activated each time the output begins a transition so that it does
not conflict with the slewing stage. Comp1 and Comp2 receive an enable signal that switches them between
normal comparator operation and a low-power mode where their outputs are forced high (Comp1) or low
(Comp2) to unlatch. These comparators have a current output that is activated whenever the comparator is in
comparator mode but un-latched (i.e. the output is still slewing). These currents are wire-ORed and processed by
a level-shift circuit to produce a 5V logic slew signal. This slew signal is used by the digital core to control the
timing of the switch enable signals.
Charge Pump
The EMB1428 uses a two-stage charge pump architecture that is shown in Figure 8. The main components of
the charge pump are a soft start generator, clock level shift, output drivers, and a UVLO. This type of charge
pump produces a floating supply voltage, VCPP that is typically (2 x VDDP) - (3 x Vdiode) with no load. The
typical values for C1-C3 are expected to be 0.01 µF.
External to EMB1428
D1
D2
N1
N2
C1
CEXT1
VDDP
C3
D3
FROM TOP OF BATTERY
STACK (60V)
C2
CEXT2
VDDCP
VSTACK
SOFT
START
1 MHz
Internal
Clock
CLK
LVL SHIFT
CHARGE
PUMP
UVLO
GNDP
To Digital Block
Figure 8. Charge Pump
In steady-state, the signals at the CEXT1 and CEXT2 pins are square wave voltages that are 180° out of phase,
with an amplitude equal to the supply voltage VDDP. When CEXT1 is pulled low, C1 is charged through D1 to
VSTACK minus the diode drop. With no loading at the output of the charge pump, the capacitor C1 acts like a
simple electro-static level shift such that the CEXT1 square wave is reproduced at node N1 but switching
between VSTACK and VSTACK+VDDP. During the opposite clock phase, the phase difference between the
CEXT1 and CEXT2 pins allows charge to flow from C1 to C2 through D2 such that C2 is charged to
VSTACK+VDDP when N1 is high and N2 is low. The next phase of the clock causes N2 to be pushed up to
VSTACK + (2 x VDDP) through C2 which reverse biases D2 and forward biases D3. The D3/C3 circuit simply
rectifies this square wave and creates a DC voltage of approximately 2 x VDDP across C3. The voltage
developed across C3 is used as a floating supply for the VDDCP pin that is referenced to VSTACK. The VDDP
supply current is always 2 times the load current pulled from the output of the charge pump.
Charge Pump UVLO
A floating UVLO circuit is connected between the VDDCP and VSTACK pins to monitor the charge pump output.
The output of the UVLO has also been modified to produce the ground-referenced 5V cpgood signal through a
level-shift circuit. The UVLO trip points are listed in the ELECTRICAL CHARACTERISTICS table as VCP_UVH and
VCP_UVL.
Serial Interface
The serial interface operates on 8-bit transactions. See Figure 9 for proper operation of the serial interface. The
microcontroller must send a 4-bit command on SDI followed by 4 zeros. The EMB1428 will provide fault[3:0] on
SDO (related to the previous command), followed by the 4-bit command that it just received. The EMB1428 will
drive SDO on the falling edge of SCLK and sample SDI on the rising edge of SCLK. The assertion of CS will
cause an internal signal sdo_en to go high and actively drive the SDO pin high or low. A short delay after CS has
been de-asserted, sdo_en will go low and the SDO pin will tri-state and be ready to be driven by other devices
on the SPI bus.
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
15
EMB1428Q
SNVS812A – MAY 2012 – REVISED MAY 2013
www.ti.com
tCSU
tHD
tCDSU
CS
SCLK
SDI
cmd[3]
cmd[2]
cmd[1]
cmd[0]
SDO
fault[3]
fault[2]
fault[1]
fault[0]
cmd[3]
cmd[2]
cmd[1]
cmd[0]
sdo_en
tSU
tHD
tDIS
Figure 9. Serial Interface (proper operation)
If CS goes high at any point before the 8th rising edge of SDI, the transaction will be considered aborted and the
data that was received on SDI will be discarded. No command change will occur from such a transaction.
However, if FAULT_INT was cleared by the transaction it will remain cleared and the fault data will no longer be
accessible.
tTRANS
CS
Figure 10. Serial Interface (inter transaction timing)
The serial clock (SCLK) will be gated low outside this block (in the IO). Thus SCLK will always be low when CS
is high.
16
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
EMB1428Q
www.ti.com
SNVS812A – MAY 2012 – REVISED MAY 2013
tCDSU
CS
SCLK
SDI
cmd[3]
cmd[2]
cmd[1]
cmd[0]
Figure 11. Serial Interface (aborted transaction)
Command Decoding
The EMB1428 will receive the cmd[3:0] from the SPI interface, synchronize it into the internal clock domain, and
enable the switches according to the following table:
Table 2. Switch Settings for Each Command
SPI Command
State of Cell Switches
State of Polarity Switches
cmd[3:0]
CSW[7:0]
PSW[3:0]
Description
0_000
0000_0000
0000
Open all switches
0_001
0000_0011
1001
Connect Cell 1
0_010
0000_0110
0110
Connect Cell 2
0_011
0000_1100
1001
Connect Cell 3
0_100
0001_1000
0110
Connect Cell 4
0_101
0011_0000
1001
Connect Cell 5
0_110
0110_0000
0110
Connect Cell 6
0_111
1100_0000
1001
Connect Cell 7
1_000
0000_0000
0000
Test Mode
1_001
0000_0011
1001
Connect Cell 1
1_010
0000_0110
0110
Connect Cell 2
1_011
0000_1100
1001
Connect Cell 3
1_100
0001_1000
0110
Connect Cell 4
1_101
0011_0000
1001
Connect Cell 5
1_110
0110_0000
0110
Connect Cell 6
1_111
1100_0000
1001
Connect Cell 7
Power On Reset
The following will be asynchronously reset when the internal POR block is triggered:
1. Serial Interface
2. cmd[3:0] = 4’h0
3. FAULT_INT = 1’b0
4. EN = 1’b0
5. PSW[3:0] = 4’h0
6. CSW[7:0] = 8’h00
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
17
EMB1428Q
SNVS812A – MAY 2012 – REVISED MAY 2013
www.ti.com
7. Shutdown Mode = yes
8. Internal Clock = off
9. Normal Mode/Test Mode = Normal Mode
The serial interface is reset so that it is prepared to detect aborted transactions. If POR block isn’t triggered, the
serial interface will still function. However the initial state of the part will be unknown, so the first transaction may
clock out a fault code.
Normal Control Sequencing
30176820
Wait for new
command
START
Command
Processed
Reset EN, Wait
for DONE
DONE set
Set DIR, check
DIR_RT
Internal Fault
Checking
Enable FET
Switches for
Selected Cell
Set FAULT_INT
output
Read FAULT
Pins
Set EN
STOP
Command
Processed
SLEEP
Open all FET
Switches
DONE set
unexpectedly
Figure 12. EMB1428 Flowchart
Switches are turned on one at a time to avoid drawing too much current from the charge pump. The following list
details the normal sequence that will be used for changing the Switch and EMB1499 Controls each time a new
command is received. Exceptions to the sequence (due to errors) will be explained later.
1. Wait for new command.
2. Set EN low.
3. Wait for DONE to be high.
4. Wait for those cell and polarity switches to be turned off as necessitated by the new command.
5. If new command is 4’b0_000 and the EMB1428 is in shutdown mode, go to #1. If new command is not
4’b0_000 and the EMB1428 is in shutdown mode, then exit shutdown mode.
6. Set DIR to be logically equal to the complement of cmd[3]
7. Wait for /DIR_RT to become logically equal to cmd[3]
8. If any switches are currently on, turn off the ones that are not needed for this new command. (All switches
can be turned off at once. Switches that are currently on and needed for the new command will not be turned
off.)
9. If any switches were turned off in #9, wait for them to complete their turn-off process.
10. If the new command is 4’b0_000 (open all switches), enter shutdown mode. Then go to #1. Otherwise,
continue with next step.
11. Turn on next cell switch that is currently off. If all requested cell switches are on, go to #14. (Order for
selecting the next cell switch does not matter.)
12. Wait for the cell switch to fully turn on. Then go to #12.
13. Turn on next polarity switch that is currently off. If all requested polarity switches are on, go to #16. (Order
for selecting the next polarity switch does not matter.)
14. Wait for the polarity switch to fully turn on. Then go to #14.
15. Set EN high.
16. Wait for DONE to go low.
17. Go to #1.
18
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
EMB1428Q
www.ti.com
SNVS812A – MAY 2012 – REVISED MAY 2013
Any time a new command arrives, the EMB1428 immediately goes back to step #2, regardless of where it was at
in the sequence. Any time an error occurs that causes FAULT_INT to go high, the EMB1428 immediately goes
back to step #1 and acts as if it received a command to open all switches.
Emergency Shutdown
If the EMB1428 receives two consecutive commands to open all switches (no intervening commands), it will
immediately set {CSW[7:0], PSW[3:0]} = 12’h0. This allows all switches to be shut off if there is a problem in the
EMB1499 communication or in the EMB1428 charge pump circuitry.
An emergency shutdown will cause the EMB1428 to enter shutdown mode and turn off its internal clock within a
few clock cycles without waiting for switches to finish turning on or off.
EMB1499 Control Signaling
The DIR_RT from the EMB1499 will be synchronized into the EMB1428’s internal clock domain. On every rising
edge of the internal clock,DIR_RT will be compared to DIR. If they are ever at the same logic level, a fault will be
generated.
tDIRSU
tDIRSU
EN
DIR
DIR_RT
tDIR
tDIR
Figure 13. Direction Signals
Error Detection
The EMB1428 contains combinatorial circuitry that will monitor the CSW[7:0], PSW[3:0] outputs for any illegal
combination. If an illegal combination occurs, all 12 of the switch control outputs will be forced to zero. The
switch control outputs are allowed to glitch low as long as the glitches are typically less than 10ns in length.
These short glitches will not pass through the switch circuitry and cause a problem. The switch control output will
return to normal operation after the next serial transaction.
This circuitry is included in case the POR circuit does not function or if a radiation event occurs that could be
destructive to the battery pack.
The illegal combinations are:
1. More than two bits of CSW[7:0] set.
2. Two non-consecutive bits of CSW[7:0] set.
3. (PSW3 | PSW0) & (PSW2 | PSW1) = 1
Fault Reporting
The EMB1428 detects and reports faults from various sources. If a fault causes FAULT_INT to go high, the IC
will immediately act as if it received a command to open all switches: EN will go low, all switches will be turned
off, and the IC will enter sleep/shutdown mode. Some faults that are only detected by a subsequent serial
transaction do not trigger FAULT_INT and thus do not cause all switches to be opened.
The fault code should always be interpreted as a problem completing the prior command. Reading the fault code
clears the fault condition. The EMB1428 will always attempt to perform the command that was sent as the fault
code was being read. If two commands are sent in quick succession, a fault may be read when the second
command is sent because the first did not have time to complete. At this point, the EMB1428 will attempt to
perform the second command.
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
19
EMB1428Q
SNVS812A – MAY 2012 – REVISED MAY 2013
www.ti.com
Serial Interface Faults
If a 9th rising edge of SCLK is detected while CS is low (Figure 14), a fault will be generated and the IC will drive
FAULT_INT high.
CS
SCLK
FAULT_INT
tINT
Figure 14. Serial Interface (too many clocks)
If SDI clocks in a high during any of the 4 bits when it should be low, a fault will be generated and the IC will
drive FAULT_INT high. See Figure 15.
CS
SCLK
SDI
cmd[3]
cmd[2]
cmd[1]
cmd[0]
FAULT_INT
tINT
Figure 15. Serial Interface (invalid SDI high)
EMB1499 Control Faults
Incorrect DIR_RT
If DIR_RT matches DIR on any rising edge of the internal clock, a fault will be generated and the IC will drive
FAULT_INT high. This fault will be masked during serial transactions. If DIR_RT is the wrong value only during
the serial transaction, it will be masked and never reported.
20
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
EMB1428Q
www.ti.com
SNVS812A – MAY 2012 – REVISED MAY 2013
Int. clock
DIR
DIR_RT
FAULT_INT
tINT
Figure 16. Direction failure (DIR rising case)
EMB1499 Fault
If there is a rising edge on DONE while EN is high, the EMB1428 will detect it as an EMB1499 fault. If this
occurs, the EMB1428 will drive FAULT_INT high. If FAULT[2:0] ≠ 000, then the EMB1428 will output the
corresponding EMB1499 fault code.
The EMB1499 faults are masked during serial transactions. If an EMB1499 failure occurs between the start of a
serial transaction and the falling edge of EN, it will be masked and never reported.
UVLO Tripping
if a UVLO event occurs, the internal signal bg_good will be driven low. If a falling edge is seen on the internal
signal bg_good while the EMB1428 is in active mode, the EMB1428 will drive FAULT_INT high.
Previous Command Not Completed
If CS goes low and the EMB1428 has not completed its sequence from the previous command, this will generate
a fault. These fault conditions will be generated immediately and the fault code will be shifted out in the current
serial transaction. The EMB1428 will not drive FAULT_INT high in any of these situations.
If CS goes low and the EMB1428 is still waiting for DONE to go high (i.e. the EMB1428 is still waiting for the
EMB1499 to stop charging or discharging so it can set up for the command it received on the previous serial
transaction), then the EMB1428 will generate a fault.
If CS goes low and the EMB1428 has set EN high but is still waiting for DONE to go low, the EMB1428 will
generate a fault.
If CS goes low while slew is low or the EMB1428 is waiting for the falling edge of slew, the EMB1428 will
generate a fault.
If CS goes low while bg_good is low and the current command is not 4’h0 (open all switches), the EMB1428 will
generate a fault.
Clearing FAULT_INT
The EMB1428 will clear FAULT_INT between the 4th and 6th rising edges of the SCLK. Faults from the
EMB1499 that occur between the falling edge of CS and the point where DIR is set in the control sequence will
be ignored. This way, the user can be assured that triggered faults are always related to the current serial
command.
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
21
EMB1428Q
SNVS812A – MAY 2012 – REVISED MAY 2013
www.ti.com
CS
SCLK
SDI
cmd[3]
cmd[2]
cmd[1]
cmd[0]
FAULT_INT
Figure 17. Clearing FAULT_INT
Generating Fault Codes
The EMB1428 will generate FAULT[3:0] according to the following table. This table is in order of priority. So if
multiple fault conditions occur, the fault code that is higher in the table will be generated.
Table 3. Fault Codes
Failure Description
fault[3:0]
FAULT_INT triggered?
DONE went high while EN was high and FAULT[2:0] ≠ 000
{1’b0, FAULT[2:0]}
yes
DONE went high while EN was high and FAULT[2:0] = 000
1100
yes
SDI sampled high when it should be low
1101
yes
DIR_RT is not the opposite of DIR
1110
yes
CS falling edge while the EMB1428 is still waiting for a transition
on DONE (rising or falling edge)
1000
no
CS falling edge while slew is low or the EMB1428 is waiting for it
to go high
1001
no
CS falling edge while bg_good is low and the current command
is not 4’h0 (open all switches)
1011
no
9th SCLK rising edge seen while CS is low
bg_good went low after it was sampled high
No fault condition
22
yes
1010
Submit Documentation Feedback
yes
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
EMB1428Q
www.ti.com
SNVS812A – MAY 2012 – REVISED MAY 2013
REVISION HISTORY
Changes from Original (April 2013) to Revision A
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 22
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: EMB1428Q
23
PACKAGE OPTION ADDENDUM
www.ti.com
18-Dec-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
EMB1428QSQ/NOPB
ACTIVE
WQFN
RHS
48
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
EMB1428Q
EMB1428QSQE/NOPB
ACTIVE
WQFN
RHS
48
250
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
EMB1428Q
EMB1428QSQX/NOPB
ACTIVE
WQFN
RHS
48
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
EMB1428Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Dec-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Nov-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
EMB1428QSQ/NOPB
WQFN
RHS
48
EMB1428QSQE/NOPB
WQFN
RHS
EMB1428QSQX/NOPB
WQFN
RHS
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1000
330.0
16.4
7.3
7.3
1.3
12.0
16.0
Q1
48
250
178.0
16.4
7.3
7.3
1.3
12.0
16.0
Q1
48
2500
330.0
16.4
7.3
7.3
1.3
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Nov-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
EMB1428QSQ/NOPB
WQFN
RHS
48
1000
367.0
367.0
38.0
EMB1428QSQE/NOPB
WQFN
RHS
48
250
213.0
191.0
55.0
EMB1428QSQX/NOPB
WQFN
RHS
48
2500
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
RHS0048A
SQA48A (Rev B)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated