F2972 High Linearity Broadband SP2T 5MHz to 10GHz Datasheet Description Features (75Ω) The F2972 is a single-pole double-throw (SP2T) reflective RF switch featuring high linearity and wide bandwidth. This device is optimized from 5MHz to 1.8GHz to support downstream cable modem future migration for DOCSIS 3.1 applications, and operates at up to 10GHz to support a multitude of wireless RF applications. Superb performance is achieved when used in either 50Ω or 75Ω terminating impedance applications. Low insertion loss: 0.23dB at 204MHz 0.34dB at 1.8GHz High Isolation: 40dB at 1.8GHz P0.1dB compression of +37dBm at 204MHz Second Harmonic: -100dBc at 204MHz Third Harmonic: -120dBc at 204MHz Composite Second Order Distortion > 100dBc Composite Triple Beat Distortion > 100dBc The F2972 uses a single positive supply voltage of either +3.3V or +5.0V and is compatible with either 1.8V or 3.3V control logic. Competitive Advantage Features (50Ω) The F2972 provides extremely low insertion loss across the entire bandwidth while providing superb distortion performance. Low insertion loss: 0.40dB at 2.4GHz 0.55dB at 8GHz High Isolation: 34dB at 2.4GHz High Linearity: IIP2 +125dBm at 2.4GHz IIP3 +77dBm at 2.4GHz P0.1dB compression of +40dBm at 2.4GHz Second Harmonic: -100dBc at 2.4GHz Third Harmonic: -110dBc at 2.4GHz Optimized for DOCSIS 3.1 applications up to 1.8GHz Optimized for Wi-Fi applications up to 5.9GHz Low insertion loss High isolation Fast switching No external matching required Typical Applications Broadband cable DOCSIS 3.0 / 3.1 Set top box CATV filter bank switching Wi-Fi Cellular BTS General purpose Block Diagram Figure 1. Block Diagram General Features Supply voltage: +2.5V to +5.25V 1.8V and 3.3V compatible control logic 2mm x 2mm, 12-pin TQFN package © 2017 Integrated Device Technology, Inc. 1 Rev O April 19, 2017 F2972 Datasheet Pin Assignments Figure 2. Pin Assignments for 2mm x 2mm x 0.5mm 12-pin TQFN, NEG12 – Top View GND 1 RFC 2 GND 3 GND RF2 GND 12 11 10 F2972 9 VCC 8 EN 7 VCT L EP 4 5 6 GND RF1 GND Pin Descriptions Table 1. Pin Descriptions Number Name 1 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 2 RFC RF Common Port. If this pin is not 0V DC, then an external coupling capacitor must be used. 3 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 4 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 5 6 RF1 GND RF1 Port. If this pin is not 0V DC, then an external coupling capacitor must be used. Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 7 VCTL Logic control pin. 8 EN Active high enable pin. If low, neither RF1 nor RF2 are connected to RFC. Pin is internally pulled up to 2.5V through a 500kΩ resistor. 9 VCC Power supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as possible to pin. 10 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. 11 RF2 RF2 Port. If this pin is not 0V DC, then an external coupling capacitor must be used. 12 GND Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias. EP Description Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground vias are also required to achieve the specified RF performance. © 2017 Integrated Device Technology, Inc. 2 Rev O April 19, 2017 F2972 Datasheet Absolute Maximum Ratings Stresses beyond those listed below may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Parameter VCC to GND VCTL, EN RF1, RF2, RFC Symbol Minimum Maximum Units VCC -0.3 +5.5 V VLOGIC -0.3 Lower of (VCC + 0.3, 3.9) V VRF -0.3 +0.3 V 5MHz ≤ fRF ≤ 10MHz PABSCW1 30 10MHz < fRF ≤ 25MHz PABSCW2 32 25MHz < fRF ≤ 200MHz 200MHz < fRF ≤ 6000MHz PABSCW3 PABSCW4 33 34 fRF > 6000MHz PABSCW5 33 5MHz ≤ fRF ≤ 10MHz PABSPK1 35 10MHz < fRF ≤ 25MHz PABSPK2 37 25MHz < fRF ≤ 200MHz PABSPK3 38 200MHz < fRF ≤ 6000MHz PABSPK4 39 fRF > 6000MHz PABSPK5 38 TJMAX +140 °C +150 °C TLEAD +260 °C Electrostatic Discharge – HBM (JEDEC/ESDA JS-001-2012) VESDHBM 2500 (Class 2) V Electrostatic Discharge – CDM (JEDEC 22-C101F) VESDCDM 1000 (Class C3) V Maximum Input CW Power, 50Ω, TEP = 25°C, Vcc = 5.25V (any port, insertion loss state) [a,b] Maximum Peak Power, 50Ω, TEP = 25°C, Vcc = 5.25V (any port, insertion loss state) [a, b, c] Maximum Junction Temperature Storage Temperature Range Lead Temperature (soldering, 10s) TST -65 dBm dBm a. In a 50L system, dBmV = dBm [50Ω] + 47. In a 75L system, dBmV = dBm [75Ω] + 48.75. b. TEP = Temperature of the exposed paddle. c. 5% duty cycle of a 4.6ms period. © 2017 Integrated Device Technology, Inc. 3 Rev O April 19, 2017 F2972 Datasheet Recommended Operating Conditions Table 3. Recommended Operating Conditions Parameter Symbol Supply Voltage VCC Operating Temperature Range TEP RF Frequency Range fRF Maximum Operating Input Power PMAX Port Impedance (RFC, RF1, RF2) ZRF Condition Minimum Typical Maximum Units 2.5 3.3 5.25 V -40 +105 °C 75Ω 0.005 1.8 50Ω 0.005 10 Exposed Paddle Insertion Loss State ZS = ZL = 50Ω See Figure 3 [a] 75Ω System 75 50Ω System 50 GHz dBm Ω a. In a 50Ω system, dBmV = dBm [50Ω] + 47. In a 75Ω system, dBmV = dBm [75Ω] + 48.75. Figure 3. Maximum Operating RF Input Power (ZS = ZL = 50Ω) © 2017 Integrated Device Technology, Inc. 4 Rev O April 19, 2017 F2972 Datasheet General Specifications Table 4. General Specifications See F2972 Typical Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C, EN = HIGH, single tone signal applied at RF1 or RF2 and measured at RFC, unless otherwise noted. Parameter Symbol Condition Minimum Typical Maximum Units Logic Input High Threshold VIH VCTL, EN pins 1.17 [b] Lower of ( VCC, 3.6 ) V Logic Input Low Threshold VIL VCTL, EN pins -0.3 0.6 V -10 [a] +10 µA Logic Current DC Current (VCC) Switching Rate Startup Time Maximum Video Feed-Through, RFC Port IIH, IIL ICC VCTL, EN pins (each pin) Normal Operation 80 150 Standby (EN = LOW) 20 35 SWRATE TSTRTUP VIDFT 25 From Standby State, 50% EN to 90% RF No Change in RF Path 1.0 Change in RF Path 1.6 Peak transient during switching. ZS = ZL = 75Ω. Measured with 20ns rise time, 0V to 3.3V (3.3V to 0V) control pulse applied to VCTL. Switching Time [c] SWTIME 50% VCTL to 90% or 10% RF a. Items in min/max columns in bold italics are guaranteed by test. b. Items in min/max columns that are not bold italics are guaranteed by design characterization. c. Measured at fRF = 1GHz. © 2017 Integrated Device Technology, Inc. 5 µA kHz µs 5 1.5 mVp-p 3 µs Rev O April 19, 2017 F2972 Datasheet Electrical Characteristics Table 5. Electrical Characteristics - 75Ω SPECIFICATION See F2972 75Ω Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C. ZS = ZL = 75Ω, EN = HIGH, single tone signal applied at RF1 or RF2 and measured at RFC, EVKit trace and connector losses are de-embedded, unless otherwise noted. Parameter Insertion Loss (RFC to RF1, RF2) Isolation (All Paths) Return Loss (RFC, RF1, RF2) (Insertion Loss States) Symbol IL ISO1 RL Condition Minimum 0.20 5MHz < fRF ≤ 204MHz 0.23 0.43 [b] 204MHz < fRF ≤ 1.2GHz 0.32 0.52 1.2GHz < fRF ≤ 1.8GHz 0.34 0.54 fRF = 5MHz 77 5MHz < fRF ≤ 204MHz 60 204MHz < fRF ≤ 1.2GHz 44 1.2GHz < fRF ≤ 1.8GHz fRF = 5MHz 40 35 5MHz < fRF ≤ 204MHz 30 204MHz < FRF ≤ 1.2GHz 17 fIN = 27MHz POUT = 20dBm 3rd Harmonic Harmonic Input 0.1dB Compression Point [d] (RFC to RF1, RF2) H2 H3 P0.1dB Composite Second Order CSO Composite Triple Beat CTB Maximum fRF = 5MHz 1.2GHz < FRF ≤ 1.8GHz 2nd Typical dB dB dB 16 -80 -70 fIN = 204MHz POUT = 20dBm -100 -90 fIN = 800MHz POUT = 20dBm -120 -110 fIN = 17MHz POUT = 20dBm -95 -80 fIN = 204MHz POUT = 20dBm -120 -105 fIN = 800MHz POUT = 20dBm -115 -100 [c] fRF = 5MHz 37 fRF =204MHz 37 fRF =1.8GHz 38 41 dBmV / channel 137 channels [e] Units dBc dBc dBm >100 dBc >100 a. b. c. d. Items in min/max columns in bold italics are guaranteed by test. Items in min/max columns that are not bold italics are guaranteed by design characterization. dBmV = dBm [75Ω] + 48.75. The input 0.1dB compression point is a linearity figure of merit. Refer to Figure 3 for the maximum operating RF input power levels. e. Total power = -7.75dBm [75Ω] + 10*log (137) = +13.62dBm [75Ω]. © 2017 Integrated Device Technology, Inc. 6 Rev O April 19, 2017 F2972 Datasheet Electrical Characteristics Table 6. Electrical Characteristics - 50Ω SPECIFICATION See F2972 50L Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C. ZS = ZL = 50Ω, EN = HIGH, single tone signal applied at RF1 or RF2 and measured at RFC, EVKit trace and connector losses are de-embedded, unless otherwise noted. Parameter Insertion Loss (RFC to RF1, RF2) Isolation (RFC to RF1, RF2) Isolation (RF1 to RF2, RF2 to RF1) Return Loss (RFC, RF1, RF2) (Insertion loss states) Symbol IL ISO1 ISO2 RL Condition Minimum Typical Maximum fRF = 5MHz 0.25 0.45 [b] 5MHz < fRF ≤ 1GHz 0.33 0.53 1GHz < fRF ≤ 2GHz [c] 0.36 0.56 [a] 2GHz < fRF ≤ 3GHz 0.40 3GHz < fRF ≤ 6GHz 0.45 6GHz < fRF ≤ 8GHz 0.55 8GHz < fRF ≤ 9GHz 0.65 9GHz < fRF ≤ 10GHz 0.80 5MHz < fRF ≤ 1GHz 43 48 1GHz < fRF ≤ 2GHz 36 42 2GHz < fRF ≤ 3GHz 31 37 3GHz < fRF ≤ 6GHz 27 6GHz < fRF ≤ 8GHz 22 8GHz < fRF ≤ 10GHz 5MHz < fRF ≤ 1GHz 40 18 45 1GHz < fRF ≤ 2GHz 33 38 2GHz < fRF ≤ 3GHz 29 34 3GHz < fRF ≤ 6GHz 6GHz < fRF ≤ 8GHz 26 21 8GHz < fRF ≤ 10GHz 18 5MHz < fRF ≤ 1GHz 28 1GHz < fRF ≤ 2GHz 26 2GHz < fRF ≤ 3GHz 26 3GHz < fRF ≤ 6GHz 25 6GHz < fRF ≤ 8GHz 23 8GHz < fRF ≤ 9GHz 18 9GHz < fRF ≤ 10GHz 16 Units dB dB dB dB a. Items in min/max columns in bold italics are guaranteed by test. b. Items in min/max columns that are not bold italics are guaranteed by design characterization. c. Minimum or maximum specification guaranteed by test at 2GHz and by design characterization over the whole frequency range. © 2017 Integrated Device Technology, Inc. 7 Rev O April 19, 2017 F2972 Datasheet Electrical Characteristics Table 7. Electrical Characteristics - 50Ω SPECIFICATION See F2972 50L Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C. ZS = ZL = 50Ω, EN = HIGH, single tone signal applied at RF1 or RF2 and measured at RFC, EVKit trace and connector losses are de-embedded, unless otherwise noted. Parameter Input 0.1dB Compression [c] Input IP3 (RF1, RF2 to RFC) Input IP2 (RF1, RF2 to RFC) Symbol Minimum Typical Maximum fRF = 2.4GHz 40 fRF = 6.0GHz 40 fRF = 8.0GHz 40 fRF = 2.4GHz PIN = +24dBm/tone 100MHz spacing 77 f1 = 700MHz f2 = 1.7GHz PIN = +24dBm/tone Measure 2.4GHz product 125 f1 = 2.4GHz f2 = 3.5GHz PIN = +24dBm/tone Measure 5.9GHz product 120 fIN = 2.4GHz, PIN = +24dBm -100 -90 [b] fIN = 5.9GHz, PIN = +24dBm -90 -80 fIN = 2.4GHz, PIN = +24dBm -110 -95 fIN = 5.9GHz, PIN = +24dBm -100 -85 PSPUR1 fOUT ≥ 5MHz All unused ports terminated -133 PSPUR2 fOUT < 5MHz All unused ports terminated -120 P0.1dB IIP3 IIP2 Second Harmonic (RF1, RF2 to RFC) H2 Third Harmonic (RF1, RF2 to RFC) H3 Spurious Output (No RF Applied) Condition Units dBm dBm dBm dBc dBc dBm a. Items in min/max columns in bold italics are guaranteed by test. b. Items in min/max columns that are not bold italics are guaranteed by design characterization. c. The input 0.1dB compression point is a linearity figure of merit. Refer to Figure 3 for the maximum RF operating input power levels. © 2017 Integrated Device Technology, Inc. 8 Rev O April 19, 2017 F2972 Datasheet Thermal Characteristics Table 8. Package Thermal Characteristics Parameter Symbol Value Units Junction to Ambient Thermal Resistance θJA 102 °C/W Junction to Case Thermal Resistance (Case is defined as the exposed paddle) θJC_BOT 56 °C/W Moisture Sensitivity Rating (Per J-STD-020) MSL 1 Typical Operating Conditions (TOCs) Unless otherwise noted: VCC = +3.3V EN = HIGH ZL = ZS = 75Ω ZL = ZS = 50Ω All temperatures are referenced to the exposed paddle Evaluation Kit traces and connector losses are de-embedded © 2017 Integrated Device Technology, Inc. 9 Rev O April 19, 2017 F2972 Datasheet Typical Performance Characteristics - 75Ω Performance Figure 4. RF1 to RFC Insertion Loss Figure 5. 0.00 -0.05 -40 C / 2.5 V -40 C / 3.3 V -40 C / 5.25 V 25 C / 2.5 V 25 C / 3.3 V 25 C / 5.25 V -0.10 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -0.05 -0.10 Insertion Loss (dB) Insertion Loss (dB) 0.00 RF2 to RFC Insertion Loss -0.15 -0.20 -0.25 -0.30 -0.35 -40 C / 3.3 V -40 C / 5.25 V 25 C / 2.5 V 25 C / 3.3 V 25 C / 5.25 V 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -0.15 -0.20 -0.25 -0.30 -0.35 -0.40 -0.40 -0.45 -0.45 -0.50 -40 C / 2.5 V -0.50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.5 1.0 Frequency (GHz) Figure 6. RF1 to RFC Isolation [RF2 On State] Figure 7. 0 -40 C / 2.5 V -40 C / 3.3 V -40 C / 5.25 V 25 C / 2.5 V 25 C / 3.3 V 25 C / 5.25 V 2.5 3.0 RF2 to RFC Isolation [RF1 On State] 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -10 -20 Isolation (dB) -20 Isolation (dB) 2.0 0 -10 -30 -40 -50 -60 -40 C / 2.5 V -40 C / 3.3 V -40 C / 5.25 V 25 C / 2.5 V 25 C / 3.3 V 25 C / 5.25 V 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -30 -40 -50 -60 -70 -70 -80 -80 -90 -90 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.5 1.0 Frequency (GHz) Figure 8. 1.5 2.0 2.5 3.0 Frequency (GHz) RF1 to RF2 Isolation [RF1 On State] Figure 9. 0 RF1 to RF2 Isolation [RF2 On State] 0 -10 -40 C / 2.5 V -40 C / 3.3 V -40 C / 5.25 V 25 C / 2.5 V 25 C / 3.3 V 25 C / 5.25 V 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -10 -40 C / 2.5 V -40 C / 3.3 V -40 C / 5.25 V 25 C / 2.5 V 25 C / 3.3 V 25 C / 5.25 V 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -20 Isolation (dB) -20 Isolation (dB) 1.5 Frequency (GHz) -30 -40 -50 -60 -30 -40 -50 -60 -70 -70 -80 -80 -90 -90 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 Frequency (GHz) © 2017 Integrated Device Technology, Inc. 0.5 1.0 1.5 2.0 2.5 3.0 Frequency (GHz) 10 Rev O April 19, 2017 F2972 Datasheet Typical Performance Characteristics - 75Ω Performance Figure 10. RFC Return Loss [RF1 On State] Figure 11. RFC Return Loss [RF2 On State] 0 0 -40 C / 2.5 V 25 C / 2.5 V 105 C / 2.5 V -5 -40 C / 3.3 V 25 C / 3.3 V 105 C / 3.3 V -40 C / 5.25 V 25 C / 5.25 V 105 C / 5.25 V -5 -15 -20 -25 -40 C / 5.25 V 25 C / 3.3 V 25 C / 5.25 V 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -15 -20 -25 -30 -30 -35 -35 -40 -40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.5 Frequency (GHz) 1.0 1.5 2.0 2.5 3.0 Frequency (GHz) Figure 12. RF1 Return Loss [RF1 On State] Figure 13. RF2 Return Loss [RF2 On State] 0 0 -40 C / 2.5 V 25 C / 2.5 V 105 C / 2.5 V -5 -40 C / 3.3 V 25 C / 3.3 V 105 C / 3.3 V -40 C / 5.25 V 25 C / 5.25 V 105 C / 5.25 V -5 -40 C / 2.5 V -40 C / 3.3 V -40 C / 5.25 V 25 C / 2.5 V 25 C / 3.3 V 25 C / 5.25 V 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -10 Match (dB) -10 Match (dB) -40 C / 3.3 V 25 C / 2.5 V -10 Match (dB) Match (dB) -10 -40 C / 2.5 V -15 -20 -25 -15 -20 -25 -30 -30 -35 -35 -40 -40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 Frequency (GHz) © 2017 Integrated Device Technology, Inc. 0.5 1.0 1.5 2.0 2.5 3.0 Frequency (GHz) 11 Rev O April 19, 2017 F2972 Datasheet Typical Performance Characteristics - 50Ω Performance Figure 14. RF1 to RFC Insertion Loss Figure 15. RF2 to RFC Insertion Loss 0.0 0.0 -0.1 -40 C / 3.3 V -40 C / 5.25 V 25 C / 2.5 V 25 C / 3.3 V 25 C / 5.25 V 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -0.1 -0.2 Insertion Loss (dB) Insertion Loss (dB) -0.2 -40 C / 2.5 V -0.3 -0.4 -0.5 -0.6 -0.7 -40C / 3.3V -40C / 5.25V 25C / 2.5V 25C / 3.3V 25C / 5.25V 105C / 2.5V 105C / 3.3V 105C / 5.25V -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.8 -0.9 -0.9 -1.0 -40C / 2.5V -1.0 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 Frequency (GHz) Figure 16. RF1 to RFC Isolation [RF2 On State] 6 7 8 9 10 0 -10 -40 C / 2.5 V -40 C / 3.3 V -40 C / 5.25 V 25 C / 2.5 V 25 C / 3.3 V 25 C / 5.25 V 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -10 -20 Isolation (dB) -20 Isolation (dB) 5 Figure 17. RF2 to RFC Isolation [RF1 On State] 0 -30 -40 -50 -60 -40 C / 2.5 V -40 C / 3.3 V -40 C / 5.25 V 25 C / 2.5 V 25 C / 3.3 V 25 C / 5.25 V 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -30 -40 -50 -60 -70 -70 -80 -80 -90 -90 0 1 2 3 4 5 6 7 8 9 0 10 1 2 3 4 5 6 7 8 9 10 Frequency (GHz) Frequency (GHz) Figure 18. RF1 to RF2 Isolation [RF1 On State] Figure 19. RF1 to RF2 Isolation [RF2 On State] 0 0 -10 -40 C / 2.5 V -40 C / 3.3 V -40 C / 5.25 V 25 C / 2.5 V 25 C / 3.3 V 25 C / 5.25 V 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -10 -20 -40 C / 2.5 V -40 C / 3.3 V -40 C / 5.25 V 25 C / 2.5 V 25 C / 3.3 V 25 C / 5.25 V 105 C / 2.5 V 105 C / 3.3 V 105 C / 5.25 V -20 Isolation (dB) Isolation (dB) 4 Frequency (GHz) -30 -40 -50 -60 -30 -40 -50 -60 -70 -70 -80 -80 -90 -90 0 1 2 3 4 5 6 7 8 9 10 0 Frequency (GHz) © 2017 Integrated Device Technology, Inc. 1 2 3 4 5 6 7 8 9 10 Frequency (GHz) 12 Rev O April 19, 2017 F2972 Datasheet Typical Performance Characteristics - 50Ω Performance Figure 20. RFC Return Loss [RF1 On State] Figure 21. RFC Return Loss [RF2 On State] 0 0 -40 C / 2.5 V 25 C / 2.5 V 105 C / 2.5 V -5 -10 -40 C / 3.3 V 25 C / 3.3 V 105 C / 3.3 V -40 C / 5.25 V 25 C / 5.25 V 105 C / 5.25 V -5 -10 -20 -25 -30 -40 C / 5.25 V 25 C / 5.25 V 105 C / 5.25 V -20 -25 -30 -35 -35 -40 -40 -45 -45 -50 -50 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 Frequency (GHz) 0 0 -5 -10 -40 C / 3.3 V 25 C / 3.3 V 105 C / 3.3 V 6 7 8 9 10 Figure 23. RF2 Return Loss [RF2 On State] -5 -40 C / 2.5 V 25 C / 2.5 V 105 C / 2.5 V 5 Frequency (GHz) Figure 22. RF1 Return Loss [RF1 On State] -40 C / 5.25 V 25 C / 5.25 V 105 C / 5.25 V -40 C / 2.5 V 25 C / 2.5 V 105 C / 2.5 V -10 -40 C / 3.3 V 25 C / 3.3 V 105 C / 3.3 V -40 C / 5.25 V 25 C / 5.25 V 105 C / 5.25 V -15 Match (dB) -15 Match (dB) -40 C / 3.3 V 25 C / 3.3 V 105 C / 3.3 V -15 Match (dB) -15 Match (dB) -40 C / 2.5 V 25 C / 2.5 V 105 C / 2.5 V -20 -25 -30 -20 -25 -30 -35 -35 -40 -40 -45 -45 -50 -50 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 7 Frequency (GHz) Frequency (GHz) Figure 24. Switching Time [Isolation to Insertion Loss State] Figure 25. Switching Time [Insertion Loss to Isolation State] © 2017 Integrated Device Technology, Inc. 13 8 9 10 Rev O April 19, 2017 F2972 Datasheet Control Mode Table 9. Switch Control Truth Table VCTL (pin 7) EN (pin 8) Switch State LOW HIGH RFC to RF1 Insertion Loss State HIGH HIGH RFC to RF2 Insertion Loss State Don’t Care LOW Standby Application Information Power Supplies A common VCC power supply should be used for all pins requiring DC power. All supply pins should be bypassed with external capacitors to minimize noise and fast transients. Supply noise can degrade noise figure and fast transients can trigger ESD clamps and cause them to fail. Supply voltage change or transients should have a slew rate smaller than 1V / 20µs. In addition, all control pins should remain at 0V (+/-0.3V) while the supply voltage ramps up or while it returns to zero. Control Pin Interface If control signal integrity is a concern and clean signals cannot be guaranteed due to overshoot, undershoot, ringing, etc., the following circuit at the input of each control pin is recommended. This applies to control pins 7 and 8 as shown below. GND 1 RFC 2 GND RF2 GND Figure 26. Control Pin Interface Schematic 12 11 10 9 VCC 5kΩ 8 F2972 EN 2 pF GND 3 7 © 2017 Integrated Device Technology, Inc. 5 RF1 5kΩ 6 VCTL 2 pF GND 4 GND EP 14 Rev O April 19, 2017 F2972 Datasheet 75Ω Evaluation Kit Picture Figure 27. Top View (75Ω) Figure 28. Bottom View (75Ω) © 2017 Integrated Device Technology, Inc. 15 Rev O April 19, 2017 F2972 Datasheet 50Ω Evaluation Kit Picture Figure 29. Top View (50Ω) Figure 30. Bottom View (50Ω) © 2017 Integrated Device Technology, Inc. 16 Rev O April 19, 2017 F2972 Datasheet 75Ω Evaluation Kit / Applications Circuit Figure 31. Electrical Schematic (75Ω) © 2017 Integrated Device Technology, Inc. 17 Rev O April 19, 2017 F2972 Datasheet 50Ω Evaluation Kit / Applications Circuit Figure 32. Electrical Schematic (50Ω) © 2017 Integrated Device Technology, Inc. 18 Rev O April 19, 2017 F2972 Datasheet Table 10. 75Ω Bill of Material (BOM) Part Reference QTY C1 1 C2, C4 Manufacturer Part # Manufacturer 0.1µF ±10%, 16V, X7R, Ceramic Capacitor (0402) GRM155R71C104KA88D Murata 2 100pF ±5% 50V, C0G, Ceramic Capacitor (0402) GRM1555C1H101JA01D Murata C3 1 0.01µF ±5% 50V, X7R, Ceramic Capacitor (0603) GRM188R71H103JA01D Murata R2, R3 2 100L 1/10W, Resistor (0402) ERJ-2RKF1000X Panasonic J1 – J5 5 F-Type Edge Mount 222181 Amphenol RF J6 1 Conn Header Vert 5x1 Pos Gold 68002-205HLF Amphenol FCI U1 1 SP2T Switch 2mm x 2mm 12-pin TQFN F2972NEGK IDT 1 Printed Circuit Board F2972 75L PCB IDT Manufacturer Part # Manufacturer ERJ-2GE0R00X Panasonic Table 11. Description 50Ω Bill of Material (BOM) Part Reference QTY Description C1 – C7 0 Not Installed (0402) R1– R3 3 0L 1/10W, Resistor (0402) J1 – J5 5 SMA Edge Mount 142-0761-881 Cinch Connectivity J6 1 Conn Header 10 Pos 0.100” Str 15 Au 68602-210HLF Amphenol FCI TP1, TP2, TP3, TP4, TP5 0 Not Installed Test Point Loop U1 1 SP2T Switch 2mm x 2mm 12-pin TQFN F2972NEGK IDT 1 Printed Circuit Board F2972 50L PCB IDT © 2017 Integrated Device Technology, Inc. 19 Rev O April 19, 2017 F2972 Datasheet Evaluation Kit (EVKit) Operation External Supply Setup Set up a VCC power supply in the voltage range of 2.5V to 5.25V with the power supply output disabled. For the 75L EVKit, connect the disabled Vcc supply connection to J6 pin 2 and GND to J6 pins 1 or 5. For the 50L EVKit, connect the disabled Vcc supply connection to J6 pin 3 and GND to J6 pin 1, 2, 4, 6, 8, 9, or 10. Logic Control Setup With the logic control lines disabled set the HIGH and LOW logic levels to satisfy the levels stated in the electrical specifications table. For the 75L EVKit, connect the disabled logic control lines to J6 EN (pin 3) and VCTL (pin 4). For the 50L EVKit, connect the disabled logic control lines to J6 EN / LS (pin 5) and VCTL (pin 7). See Table 9 for the logic truth table. Turn On Procedure Setup the supplies and EVKit as noted in the External Supply Setup and Logic Control Setup sections above. Enable the VCC supply. Enable the logic control signals. Set the logic setting to achieve the desired Table 9 configuration. Note that external control logic should not be applied without VCC being present. Turn Off Procedure Set the logic control pins to a logic LOW. Disable the VCC supply. © 2017 Integrated Device Technology, Inc. 20 Rev O April 19, 2017 F2972 Datasheet Package Drawings Figure 33. Package Outline Drawing NEG12 PSC-4642 © 2017 Integrated Device Technology, Inc. 21 Rev O April 19, 2017 F2972 Datasheet Recommended Land Pattern Figure 34. Recommended Land Pattern NEG12 PSC-4642 © 2017 Integrated Device Technology, Inc. 22 Rev O April 19, 2017 F2972 Datasheet Marking Diagram 2972 YW** Line 1 Line 2 Line 2 Line 2 - 2972 = Abbreviated part number. Y = Year code. W = Work week code. ** = Sequential alpha for lot traceability. Ordering Information Orderable Part Number Package MSL Rating Shipping Packaging Temperature F2972NEGK 2mm x 2mm x 0.5mm 12-VFQFP-N MSL1 Cut Reel -40°C to +105°C F2972NEGK8 2mm x 2mm x 0.5mm 12-VFQFP-N MSL1 Tape and Reel -40°C to +105°C F2972EVBI-75OHM 75Ω Evaluation Board F2972EVBI-50OHM 50Ω Evaluation Board © 2017 Integrated Device Technology, Inc. 23 Rev O April 19, 2017 F2972 Datasheet Revision History Revision Revision Date Rev O 2017-Apr-19 Description of Change Initial Release Corporate Headquarters Sales Tech Support 6024 Silver Creek Valley Road San Jose, CA 95138 www.IDT.com 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com/go/sales www.IDT.com/go/support DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated Device Technology, Inc. All rights reserved © 2017 Integrated Device Technology, Inc. 24 Rev O April 19, 2017