Rohm BD39012EFV-C Independent enable control Datasheet

Datasheet
Management IC for Automotive Microcontroller
System Regulator for microcontroller for
automotive
BD39012EFV-C
General Description
Key Specifications
 Input voltage range:
4 V to 45 V
(Startup voltage needs to be above 4.5V.)
 Output Voltage Accuracy
Step-down DC / DC Converter FB Voltage:
0.8 V ±2 %
Secondary LDO:
5.0 V ±2 %
 Output Maximum Current
Step-down DC / DC Converter:
1.0 A
Secondary LDO:
0.4 A
 Operating Frequency
Step-down DC / DC Converter:
200 k to 600 kHz (Typ)
 Standby Current:
0 μA (Typ)
 Operating Temperature Range: -40 °C to +125 °C
BD39012EFV-C is a power management IC with
1 ch DC / DC convertor, 1 ch LDO, reset and watch dog
timer. It can supply the power supply to module from
battery directly. LDO has reset built-in and always
watches that it supplies stable power supply to module.
In addition, window watch dog timer is provided to detect
the abnormality of the microcomputer. BD39012EFV-C
enables a superior heat dissipation and a compact PCB
design by HTSSOP-B24 package.
Features






Package
Synchronous rectifier step-down DC / DC converter
with built-in FET (Adjustable output)
Secondary LDO with built-in 5 V output FET
Monitoring function
Output over voltage / under voltage detection
(PG output), Reset function (LDO)
Window Watchdog Timer
Built-in protection function
Input under voltage protection (UVLO)
Thermal shut down (TSD)
Output over current protection (OCP)
Independent enable control
HTSSOP-B24 package
HTSSOP-B24
Applications
W(Typ) x D(Typ) x H(Max)
7.80 mm x 7.60 mm x 1.00 mm
HTSSOP-B24
 Microcontroller for Automotive
Typical Application Circuit
VCC
VREG
EN1
PVCC
VO1
VO1
RT
SW
(Note1)
FB
PGND
COMP
VS
VCC
or
VO1
EN2
VO2
PG1
RST2
PG2
RSTWD
CT
ENWD CLK
RTW GND
OPEN
☆These specifications may be changed without a notice.
(Note 1) Please connect when the application is that the load current of VO1 output exceed in 500 mA.
〇Product structure : Silicon monolithic integrated circuit
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〇This product has no designed protection against radioactive rays
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package
.................................................................................................................................................................................. 1
Typical Application Circuit ............................................................................................................................................................... 1
Pin Description................................................................................................................................................................................ 3
Block Diagram ................................................................................................................................................................................ 4
Description of Blocks ...................................................................................................................................................................... 5
Absolute Maximum Ratings ............................................................................................................................................................ 7
Recommended Operating Conditions ............................................................................................................................................. 7
Electrical Characteristics................................................................................................................................................................. 8
Typical Performance Curves ......................................................................................................................................................... 11
Application Example ..................................................................................................................................................................... 24
Example of Constant Setting ........................................................................................................................................................ 24
Notes for pattern layout of PCB .................................................................................................................................................... 24
Selection of Components Externally Connected ........................................................................................................................... 25
Power Dissipation ......................................................................................................................................................................... 32
I / O equivalent circuits ................................................................................................................................................................. 33
Operational Notes ......................................................................................................................................................................... 35
Ordering Information ..................................................................................................................................................................... 37
Marking Diagrams ......................................................................................................................................................................... 37
Physical Dimension, Tape and Reel Information ........................................................................................................................... 38
Revision History ............................................................................................................................................................................ 39
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Pin Configuration
(TOP VIEW)
PVCC
1
24
SW
VCC
2
23
PGND
EN1
3
22
COMP
T1
4
21
FB
CLK
5
20
RT
RSTWD
6
19
VREG
PG1
7
18
RTW
PG2
8
17
T3
ENWD
9
16
VS
RST2
10
15
EN2
CT
11
14
T2
GND
12
13
VO2
Pin Description
Pin No.
Pin Name
Function
Pin No.
Pin Name
Function
1
PVCC
Power VCC supply terminal
13
VO2
LDO output terminal
2
VCC
Signal VCC supply terminal
14
T2
Test terminal (Note1)
3
EN1
Enable terminal (DC / DC)
15
EN2
Enable terminal (LDO)
4
T1
Test terminal (Note1)
16
VS
Power supply input terminal
for LDO
5
CLK
WDT CLK input terminal
17
T3
Test terminal (Note1)
6
RSTWD
Reset output terminal
(WDT monitoring)
18
RTW
Frequency setting terminal for
WDT
7
PG1
Power good output terminal
(DC / DC monitoring)
19
VREG
Internal power supply terminal
8
PG2
Power good output terminal
(LDO monitoring)
20
RT
Frequency setting terminal for
DC / DCl
9
ENWD
Enable terminal (WDT)
21
FB
DC / DC output voltage
feed buck terminal
10
RST2
Reset output terminal
(LDO monitoring)
22
COMP
DC / DC error amp output terminal
11
CT
Power on reset time
setting capacitor connect terminal
23
PGND
Power GND terminal
12
GND
Signal GND terminal
24
SW
DC / DC output terminal
(Note 1) Be sure to connect to ground.
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Block Diagram
CVCC
CVRE G
V CC
V RE G
V CC
V CC
V CC
E N1
UVLO
V RE G
TS D1
UVLO
TS D1
V RE G
V RE G
RT
CURRE NT
S ENS E
OS C_DCDC
RRT
P VCC
V RE G
V RE G
CLK(DCDC)
OCP
OCP
V O1
CFB1
Current
S ens e
S
RFB1B
S LOPE
PWM
ERR
V CC
V RE F1A
V RE G
UVLO
TS D1
OCP
V SOV P
S CP
V RE G
V O1
SW
CVO 1A
CVO 1B
R
E N1
V RE G
P GND
S CP
UVLO
TS D1
OCP
V SOV P
E N1
S OFT
S TART
L1
DRV
LOGI C
V RE G
V RE G
FB
RFB1A
CPV CCA
V RE G
V RE G
V SOV P
V SOV P lach
Releas e aft er c ount
VS
VS
VS
CVS
COMP
V RE F2A
RCO1
V CC
CCO1
V RE G
V RE F1B
V O2
V RE G
OVD
CVO 2
TS D2
P G1
V RE G
UVLO
E N1
LVD
V RE G
V O2
V RE G
OCP
S CP l atc h
Release
aft er count
SC P
V IN
or
V O1
V O2
V O2
S CP
V O2
V RE F2B
P G2
OVD
V O2
RST 2
V O2
E N2
V O2
LVD
P OR
P G1
P G1
V O2
V O2
V O2
V O2
P G2
V O2
P G2
RST WD
WDT
V O2
CLK(DCDC)
OS C_V OUT
CLK(WDT)
CT
CCT
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E NWD
CLK
RTW
GND
RRTW1
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Description of Blocks

Internal Power Supply (VREG)
It is the block which generates 4.0 V internal power supply voltage. It is a power supply to supply to the IC inside.
Please do not be connected to the outside circuit.
VREG needs to outside capacitor more than 1 μF. Low capacitor of the ESR is recommended.

Enable (EN1)
The circuit becomes standby state when EN1 pin becomes less than 0.8 V. Internal power supply and DC / DC convertor
are OFF and consumption current from VCC becomes 0 μA (25 °C, Typ) when standby state.
It can be used when connected to VCC or inputted into the signal from a microcomputer.

Soft Start (SOFT START)
The Soft start is a block to prevent over short of the output voltage in the startup and inrush current to an output step.
With controlling error amp input voltage and increasing switching pulse width gradually, it prevents then.
Because the soft start time operate an internal counter by oscillation frequency and decides time, it depends on the
oscillation frequency setting of the DC / DC converter. It becomes 3.28 ms (Typ) when oscillation frequency is 500 kHz.
It reboots after an internal SS pin is discharged when VSOVP, TSD1, and SCP are detected.

Error Amp (ERR)
The error amp compares the output feedback voltage to the 0.8V reference voltage. This comparison result is output to
COMP pin as current. By the voltage of the COMP pin, switching duty is decided. In the startup because soft start is taken,
COMP voltage is limited by SOFT START voltage. In addition, COMP pin needs to outside resistance and capacitor for
phase compensation.

PWM COMP (PWM)
PWM comparator makes a conversion to a continuous duty cycle to control an output transistor in the voltage of
COMP pin. The duty becomes 100 % and the high-side output transistor becomes ON state if input voltage becomes less
than setting output voltage.

Oscillation frequency for DC / DC convertor (OSC_DCDC)
Oscillation frequency is decided by the current which is caused by resistance connected to RT pin.
The range of oscillation frequency can be set 200 kHz to 600 kHz.
Short circuit protection starts operating and oscillator stops when RT pin is short-circuited to ground.

Short Circuit Protection (SCP)
DC / DC convertor stores with short circuit protection. The short circuit protection starts operation after the short circuit
protection circuit considers that the output is in short state when the over current protection starts operation in a state with
FB pin voltage less than 0.45 V (Typ) (Except during soft start).
DC / DC convertor output is OFF when the short circuit protection starts operation. In addition, SOFT START is initialized
and COMP pin is discharged. Afterwards, it reboots after 1,024 cycles of the oscillation frequency.

Reference Voltage of 2 systems
DC / DC convertor and LDO have a reference voltage which is made from an independent block in both output voltage part
and abnormal detection part.
In this way, even if there was an abnormality in reference voltage of whichever it is suitable for a safe design because
abnormality can be informed from PG pin
Each reference voltage is used as follows.
VREF1A: Reference of DC / DC convertor output voltage and VREG voltage.
VREF1B: Reference of DC / DC convertor OVD, LVD, SCP, VSOVP and OCP.
VREF2A: Reference of LDO output voltage.
VREF2B: Reference of LDO OVD and LVD.

Over Voltage Detection (OVD)
PG1 pin becomes L when reference voltage of DC / DC convertor exceeds 0.95 V (Typ).
PG2 pin becomes L when output voltage of LDO exceeds 5.38 V (Typ).

Low Voltage Detection (LVD)
PG1 pin becomes L when reference voltage of DC / DC convertor is less than 0.65 V (Typ).
PG2 pin becomes L when output voltage of LDO is less than 4.62 V (Typ).

Over Current Protection Circuit (OCP, SCP)
DC / DC convertor and LDO store with over current protection. Current limit is taken in the over current detection of the
DC / DC converter, and ON duty cycle is limited, and output voltage decreases. In addition, when it becomes overloaded
and FB pin voltage decreases and is less than 0.45 V (Typ), SCP is detected. Afterwards, it reboots after 1,024 cycles of the
oscillation frequency. Current limit is taken in the over current detection of the LDO, and output voltage decreases (foldback
current limiting characteristic). When it load-short-circuited, it prevents the destruction of the IC, but this protection circuit is
effective for prevention of destruction by the sudden accident. It is not supported use at the continuous protection circuit
operation and a transitional period.
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
DRV LOGIC
This is the driver block of FET. It drives SW pin.

Over Voltage Protection Circuit (VSOVP_latch)
VS pin possesses over voltage protection. If the voltage of the VS pin becomes more than over voltage detection level
13.5 V (Typ), it starts operation. SS and COMP is discharged after DC / DC output is OFF when the over voltage protection
circuit starts operation. Afterwards, it reboots after 1,024 cycles of the oscillation frequency from release when VS returned
to 13.0 V (Typ). VSOVP is effective for prevention of destruction by the sudden accident. VSOVP is effective for prevention
of the destruction by the sudden accident. Please avoid using it at continuous protection circuit operation.

Under Voltage malfunction prevention circuit (UVLO_VCC)
DC / DC convertor circuit shuts down after UVLO starts operating when VCC voltage is less than 3.5 V (Typ).
It starts normal operating after UVLO is released when VCC voltage is more than 4.0 V (Typ).
Please apply more than 4.45 V to the VCC voltage in initial startup.

Thermal Shut Down (TSD1, TSD2)
DC / DC convertor (TSD1) and LDO (TSD2) of BD39012EFV-C, each has thermal shutdown and operates individually.
The protection is taken when chip temperature Tj exceeds 175 °C (Typ). DC / DC convertor lets the switching OFF.
The Output is OFF in LDO. In addition, it returns if it becomes less than 150 °C (Typ).

SLOPE, CURRENT SENCE
This block is a block to give slope compensation of the current mode of DC / DC convertor and current return.

LDO Block
LDO operates by full independence. Even if it is the state that does not contain the voltage in PVCC pin and VCC pin, power
on reset (POR), watch dog timer (WDT), PG2 pin, RST pin, RSTWD pin and ENWD pin become effective when a power
supply is spent to VS pin.
But OSC_WDT ERR Detect informing abnormality does not function. (Timing chart 6 (*4))

Power On Reset (POR)
POR starts charge to the outside capacitor of CT pin (= CCT) when VO2 of LDO output releases under voltage detect.
RST2 pin outputs `H` when CT pin voltage becomes more than 1.18 V (Typ). CCT is discharged and RST2 pin outputs `L`
when VO2 detects low voltage. Please set the setting range of CCT in the range of 0.001 μF from 10 μF

Oscillator for Watch Dog Timer (OSC_VOUT)
This block creates a reference frequency of the Watch Dog Timer. The oscillation frequency is determined by the RTW
resistance. The oscillation frequency can be set in the range of 50 kHz to 250 kHz.
Short circuit protection starts operating and oscillator stops when RTW pin is short-circuited to ground.

Watch Dog Timer (WDT)
Microcontroller (μC) operation is monitored with CLK pin. Window watch dog timer is included to enhance the assurance of
the system. WDT starts operating when POR and ENWD becomes high. It watches both edges (rising edge, falling edge) of
the CLK pin. When the width of both edges is lower than the watch dog lower limit (Fast NG) or more than the watch dog
upper limit (Slow NG), RSTWD is made low during WDT reset time (tWRES) (μC ERR Detect).
Fast NG and Slow NG are decided by the number of the counts of OSC_WDT. Therefore a time change of Fast NG and
Slow NG is possible by changing frequency of OSC_WDT. In addition, it lets RSTWD low and informs abnormality when
abnormality occurs in OSC_WDT (including the RTW pin ground) (OSC_WDT ERR Detect).
POR=Low or ENWD=Low
OSC_WDT Error detection
WDT_CLK
Error detection release
OSC_WDT ERR
Detect
“RSTWD=Low”
Fast NG or Slow NG detection
μC ERR
Detect
“RSTWD=Low”
Standby
MODE
OSC_WDT Error detection
POR=Low or ENWD=Low
POR=High and ENWD=High
“RSTWD=High”
Nomal
MODE
“RSTWD=High”
RSTWD Low range > tWRES
μC error not detect
(Fast NG, Slow NG not detect)
RSTWD Low range < tWRES
Figure 1. Witch Dog Timer State Change Diagram (WDT FSM)
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Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply Voltage
VCC
-0.3 to 45 (Note 1)
V
Output Switch Pin Voltage
VSW
-0.3 to VCC
V
EN1 Pin Voltage
VEN1
-0.3 to 45
V
VREG Pin Voltage
VREG
-0.3 to 7
V
VRT, VFB, VCOMP
-0.3 to 7
V
VS
-0.3 to 45*1
V
EN2 Pin Voltage
VEN2
-0.3 to 45
V
VO2 Pin Voltage
VO2
-0.3 to 7
V
VPG1, VPG2
-0.3 to VO2
V
VRST2, VRSTWD
-0.3 to VO2
V
VCT
-0.3 to 7 (Note 2)
V
VRTW
-0.3 to 7
V
VENWD
-0.3 to VO2
V
VCLK
-0.3 to 7
V
Pd
4.0
W
Tstg
-55 to +150
°C
Tjmax
150
°C
RT, FB, COMP Pin Voltage
VS Pin Voltage
PG1, PG2 Pin Voltage
RST2, RSTWD Pin Voltage
CT Pin Voltage
RTW Pin Voltage
ENWD Pin Voltage
CLK Pin Voltage
Power Dissipation (Note 3)
Storage Temperature Range
Junction Temperature
(Note 1) Pd, should not be exceeded
(Note 2) VS+0.3 V, should not be exceeded.
(Note 3) Derating in done 32.0 mW / °C for operating above Ta ≥ 25 °C (Mount on 4-layer 70.0mm x 70.0mm x 1.6mm board)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta = -40 °C to +125 °C)
Parameter
Symbol
Min
Typ
Max
Unit
VCC
4 (Note 4)
-
36 (Note 5)
V
VS Operating Voltage
VS
6.0
-
10
V
Switch Current
ISW
0
-
1
A
FOSC
200
-
600
kHz
FOSCW
50
-
250
kHz
LDO Output Current
IVO2
0
-
0.4 (Note 5)
A
Operating Temperature Range
Topr
-40
-
125
°C
Operating Power Supply Voltage
Oscillation Frequency
WDT Oscillation Frequency
(Note 4) Initial startup is over 4.45 V
(Note 5) Pd, should not be exceeded
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Electrical Characteristics (Unless otherwise specified Ta = -40 to 125 °C, VCC = 4 to 36 V)
Parameter
Symbol
Min
Typ
Max
Unit
Function
Standby Circuit Current 1
ISTB1
-
0
10
μA
VEN1 = 0 V, Ta = 25 °C
Standby Circuit Current 2
ISTB2
-
-
50
μA
VEN1 = 0 V
VCC Circuit Current
IQVCC
-
2
4
mA
FB = 0 V
IQVS
-
505
1100
μA
VS = 6 V, VEN2 = 5 V,
ENWD = 0 V, RTW = 24 kΩ,
CLK = 0 V,
PG1, PG2, RST2, RSTWD = H
UVLO Detection Voltage
VUVLO
3.3
3.5
3.7
V
VCC detection
UVLO Hysteresis Voltage
VUVLOHYS
0.25
0.5
0.75
V
VCC detection
VREG Output Voltage
VVREG
3.6
4.0
4.4
V
EN1L Threshold Voltage
VEN1L
-
-
0.8
V
EN1H Threshold Voltage
VEN1H
3.5
-
-
V
IEN1
-
13
26
μA
VEN1 = 5 V
Pch MOSFET ON Resistance
RONSWP
-
0.4
1
Ω
ISW = 300 mA
Nch MOSFET ON Resistance
RONSWN
-
0.4
1
Ω
ISW = -300 mA
IOLIM
1
-
-
A
Output Leak Current 1
ISWLK1
-
0
10
μA
VEN1 = 0 V, Ta = 25 °C
Output Leak Current 2
ISWLK2
-
-
50
μA
VEN1 = 0 V
Reference Voltage
VREF
0.784
0.800
0.816
V
VCOMP = VFB
FB Input Bias Current
IFBB
-1
-
1
μA
FB = 0.8 V
Soft Start Time
TSS
2.70
3.28
4.00
ms
RT = 24 kΩ
FOSC
450
500
550
kHz
RT = 24 kΩ
VS Over Voltage Detection
VVSOVP
11
13.5
16
V
PG1 Pull-up Resistance
RPUPG1
30
50
75
kΩ
VPG1L
-
-
0.3
V
VLVD1
0.60
0.65
0.70
V
VFB monitor, PG1 output
VOVD1
0.90
0.95
1.00
V
VFB monitor, PG1 output
< The Whole >
VS Circuit Current
EN1 Inflow Current
< DCDC >
Over Current Protection
Oscillation Frequency
PG1 Output L Voltage
PG1 Low Voltage
Detection Voltage
PG1 Over Voltage
Detection Voltage
Internal Resistance
(VO2 Pull-up)
PG1, PG2, RST2, RSTWD pin
short (Note 1)
(Note 1) PG1, PG2, RST2, RSTWD pin is shorted. In the case of ON, it is met only Tr of PG1.
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Electrical Characteristics – Continued (Unless otherwise specified Ta = -40 to 125 °C, VCC = 4 to 36 V)
Parameter
Symbol
Min
Typ
Max
Unit
Condition
Output Voltage
VO2
4.90
5.00
5.10
V
5 mA to 400 mA,
VS = 6.0 V to 10 V
Drop Voltage 1
ΔVdd1
-
0.17
0.33
V
VS = 4.75 V, Io = 200 mA
Drop Voltage 2
ΔVdd2
-
0.33
0.67
V
VS = 4.75 V, Io = 400 mA
EN2L Threshold Voltage
VEN2L
-
-
0.8
V
EN2H Threshold Voltage
VEN2H
2.8
-
-
V
IEN2
-
25
50
μA
VRST2DET
4.50
4.62
4.75
V
VRST2DETH
20
60
100
mV
tPOR0
10
14
18
ms
CCT = 0.1 μF (Note 2)
RPURST2
30
50
75
kΩ
RST2 Output L Voltage
VRST2L
-
0.15
0.30
V
PG2 Pull-up Resistance
RPUPG2
30
50
75
kΩ
VPG2L
-
-
0.3
V
Internal Resistance
(VO2 Pull-up)
VO2 ≥ 1 V,
PG1, PG2, RST2, RSTWD pin
short (Note 3)
Internal Resistance
(VO2 Pull-up)
PG1, PG2, RST2, RSTWD pin
short (Note 4)
VLVD2
4.50
4.62
4.75
V
VO2 monitor, PG2 output
VOVD2
5.25
5.38
5.50
V
VO2 monitor, PG2 output
< LDO / Reset >
EN2 Inflow Current
Under Voltage Detection
Detection Voltage
Under Voltage Detection
Hysteresis
Power On Reset Time
RST2 Pull-up Resistance
PG2 Output L Voltage
PG2 Low Voltage
Detection Voltage
PG2 Over Voltage
Detection Voltage
VEN2 = 5 V
(Note 2) Power on reset time tPOR can be changed by capacity of the capacitor to connect to CT. (Available range 0.001 to 10 µF)
tPOR (ms) ≒ tPOR0 (Reset delay time at the time of the 0.1 µF connection) × CCT (μF) / 0.1
CT capacity: 0.1 ≤ CCT ≤ 10 μF
tPOR (ms) ≒ tPOR0 (Reset delay time at the time of the 0.1 µF connection) × CCT (μF) / 0.1 (±0.1)
CT capacity: 0.001 ≤ CCT ≤ 0.1 μF
(Note 3) PG1, PG2, RST2, RSTWD pin is shorted. In the case of ON, it is met only Tr of RST2.
(Note 4) PG1, PG2, RST2, RSTWD pin is shorted. In the case of ON, it is met only Tr of PG2.
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Electrical Characteristics – Continued (Unless otherwise specified Ta = -40 to 125 °C, VCC = 4 to 36 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
FOSCW
75
100
125
kHz
RTW = 24 kΩ,
VO2 = 4.9 V to 5.1 V
123 /
FOSCW
865 /
FOSCW
123 /
FOSCW
128 /
FOSCW
870 /
FOSCW
128 /
FOSCW
133 /
FOSCW
875 /
FOSCW
133 /
FOSCW
< WDT >
WDT Oscillation Frequency
CLK FAST NG Threshold
tWF
CLK SLOW NG Threshold
tWS
s
CLK edge time
s
WDT Reset Time
tWRES
CLK Detection
Minimum Pulse Width
WCLK
1
-
-
μs
CLK L Threshold Voltage
VCLKL
-
-
0.8
V
CLK H Threshold Voltage
VCLKH
2.6
-
-
V
ICLK
-
25
50
μA
VCLK = 5 V
ENWD L Threshold Voltage
VENWDL
-
-
0.2 ×
VO2
V
VO2 = 4.9 V to 5.1 V
ENWD H Threshold Voltage
VENWDH
0.8 ×
VO2
-
-
V
VO2 = 4.9 V to 5.1 V
ENWD Pull-up Resistance
RPURENWD
100
200
300
kΩ
RSTWD Pull-up Resistance
RPURSTWD
30
50
75
kΩ
VRSTWDL
-
-
0.3
V
CLK Inflow Current
RSTWD Output L Voltage
s
Internal Resistance
(VO2 Pull-up)
PG1, PG2, RST2, RSTWD pin
short (Note 5)
(Note 5) PG1, PG2, RST2, RSTWD pin is shorted. In the case of ON, it is met only Tr of RSTWD.
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BD39012EFV-C
Typical Performance Curves
4
5
Standby Current: I [μA]
VCC Circuit Current: IQVCC [mA]
-40℃
4
25℃
125℃
3
2
1
0
-1
0
6
12
18
24
Supply Voltage: VCC [V]
30
-40℃
3
125℃
2
1
0
36
0
Figure 2. Standby Current vs Supply Voltage
(Standby Circuit Current)
6
12
18
24
Supply Voltage: VCC [V]
30
36
Figure 3. VCC Circuit Current vs Supply Voltage
(VCC Circuit Current)
4.3
2.0
4.2
UVLO Detect Voltage: VUVLO [V]
-40℃
VS Circuit Current: IQVS [mA]
25℃
25℃
1.5
125℃
1.0
0.5
UVLO Undetect
4.1
4.0
3.9
3.8
3.7
UVLO Detect
3.6
3.5
3.4
0.0
0
2
4
6
Supply Voltage: VS [V]
8
3.3
10
-40
Figure 4. VS Circuit Current vs VS Supply Voltage
(VS Circuit Current)
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TSZ22111 • 15 • 001
-10
20
50
80
Ambient Temperature: Ta [ C]
110
Figure 5. UVLO Detect Voltage vs Ambient Temperature
(UVLO Detection Voltage)
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- continued
0.75
4.5
0.70
4.4
-40℃
4.3
25℃
VREG Output Voltage: VVREG [V]
UVLO Hysteresis Voltage: VUVLOHYS [V]
Typical Performance Curves
0.65
0.60
0.55
0.50
0.45
0.40
0.35
0.30
4.1
4.0
3.9
3.8
3.7
3.6
0.25
3.5
-40
-10
20
50
80
110
Ambient Temperature: Ta [ C]
0
Figure 6. UVLO Hysteresis Voltage vs Ambient Temperature
(UVLO Hysteresis Voltage)
6
12
18
24
Supply Voltage: VCC [V]
30
36
Figure 7. VREG Output Voltage vs Supply Voltage
(VREG Output Voltage)
30
5
-40℃
-40℃
4
25
25℃
EN1 Input Current: IEN [μA]
VREG Output Voltage: VVREG [V]
125℃
4.2
125℃
3
2
1
25℃
125℃
20
15
10
5
0
0
0
1
2
3
4
EN1 Supply Voltage: EN1 [V]
0
5
Figure 8. VREG Output Voltage vs EN1 Supply Voltage
(EN Threshold Voltage)
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TSZ22111 • 15 • 001
1
2
3
4
EN1 Supply Voltage: EN1 [V]
5
Figure 9. EN1 Input Current vs EN1 Supply Voltage
(EN Inflow Current)
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Typical Performance Curves
- continued
0.820
4.00
0.815
0.810
Soft Start Time: TSS [ms]
Reference Voltage: VREF [V]
3.75
0.805
0.800
0.795
0.790
3.50
3.25
3.00
2.75
0.785
2.50
0.780
-40
-40
-10
20
50
80
110
Ambient Temperature: Ta [ C]
Figure 11. Soft Start Time vs Ambient Temperature
(Soft Start Time)
550
16.0
540
15.5
VSOVP Detevt Voltage: VVSOVP [V]
OSC Frequency: FOSC [ｋHz]
Figure 10. Reference Voltage vs Ambient Temperature
(Reference Voltage)
530
520
510
500
490
480
470
-10
20
50
80
110
Ambient Temperature: Ta [ C]
460
15.0
14.5
14.0
13.5
13.0
12.5
12.0
11.5
450
11.0
-40
-10
20
50
80
110
Ambient Temperature: Ta [ C]
-40
Figure 12. OSC Frequency vs Ambient Temperature
(Oscillation Frequency)
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TSZ22111 • 15 • 001
-10
20
50
80
110
Ambient Temperature: Ta [ C]
Figure 13. VSOVP Detect Voltage vs Ambient Temperature
(VS Over Voltage Detection)
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Typical Performance Curves
- continued
0.70
PG1 Under Voltage Detect Voltage: VLVD1 [V]
PG1 Pull-up Resistance: RPUPG1 [kΩ]
75
60
45
30
15
0
-40
-10
20
50
80
UVD Undetect
0.68
0.66
UVD Detect
0.64
0.62
0.60
110
-40
Ambient Temperature: Ta [℃]
Figure 15. PG1 Under Voltage Detect Voltage
vs Ambient Temperature
(PG1 Low Voltage Detection Voltage)
1.00
5.5
0.98
5.0
OVD Detect
4.5
0.96
Output Voltage: VO2 [V]
PG1 Over Voltage Detect Voltage: VOVD1 [V]
Figure 14. PG1 Pull-up Resistance vs Supply Voltage
(PG1 Pull-up Resistance)
0.94
0.92
0.90
OVD Undetect
0.88
-10
20
50
80
110
Ambient Temperature: Ta [ C]
0.86
4.0
3.5
3.0
2.5
2.0
1.5
-40℃
0.84
1.0
25℃
0.82
0.5
125℃
0.80
0.0
-40
-10
20
50
80
110
Ambient Temperature: Ta [ C]
0
Figure 16. PG1 Over Voltage Detect Voltage
vs Ambient Temperature
(PG1 Over Voltage Detection Voltage)
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2
4
6
8
VS Supply Voltage: VS [V]
10
Figure 17. Output Voltage vs VS Supply Voltage
(Output Voltage)
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Typical Performance Curves
- continued
600
7
-40℃
500
6
VO2 Output Voltage: VO2 [V]
25℃
VO2 Drop Voltage: ΔVdd [V]
125℃
400
300
200
5
4
3
2
100
1
0
0
100
200
300
0
400
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
VO2 Load Current: IO [A]
VO2 Load Current: IO [mA]
Figure 18. VO2 Drop Voltage vs VO2 Load Current
(Drop Voltage)
Figure 19. VO2 Output Voltage vs VO2 Load Current
(LDO OCP)
30
6
-40℃
25
EN2 Input Current: IEN [μA]
VO2 Output Voltage: VO2 [V]
5
4
3
2
-40℃
25℃
1
25℃
125℃
20
15
10
5
125℃
0
0
0
1
2
3
4
EN2 Supply Voltage: EN2 [V]
5
0
Figure 20. VO2 Output Voltage vs EN2 Supply Voltage
(EN2 Threshold Voltage)
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TSZ22111 • 15 • 001
1
2
3
4
EN2 Supply Voltage: EN2 [V]
5
Figure 21. EN2 Input Current vs EN2 Supply Voltage
(EN2 Inflow Current)
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- continued
4.74
5.49
4.72
5.47
PG2 OVD Detect Voltage: VOVD2 [V]
PG2 LVD Detect Voltage: VLVD2 [V]
Typical Performance Curves
LVD2 Undetect
4.70
4.68
4.66
4.64
4.62
4.60
LVD2 Detect
4.58
4.56
4.54
4.52
5.45
OVD2 Detect
5.43
5.41
5.39
5.37
5.35
5.33
OVD2 Undetect
5.31
5.29
5.27
4.50
5.25
-40
-10
20
50
80
110
Ambient Temperature: Ta [ C]
-40
Figure 22. PG2 LVD Detect Voltage vs Ambient Temperature
(PG2 Low Voltage Detection Voltage)
-10
20
50
80
110
Ambient Temperature: Ta [ C]
Figure 23. PG2 OVD Detect Voltage vs Ambient Temperature
(PG2 Over Voltage Detection Voltage)
18
120
Power On Reset Time: tPOR0 [ms]
LVD Hysteresis: VRST2DETH [mV]
17
100
80
60
40
20
16
15
14
13
12
11
10
0
-40
-40
-10
20
50
80
110
Ambient Temperature: Ta [ C]
Figure 24. LVD Hysteresis vs Ambient Temperature
(Under Voltage Detection Hysteresis)
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TSZ22111 • 15 • 001
-10
20
50
80
Ambient Temperature: Ta [ C]
110
Figure 25. Power On Reset Time vs Ambient Temperature
(Power On Reset Time)
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Typical Performance Curves
- continued
75
PG2 Pull-up Resistance: RPUPG2 [kΩ]
RST2 Pull-up Resistance: RPURST2 [kΩ]
75
60
45
30
15
60
45
30
15
0
0
-40
-10
20
50
80
-40
110
-10
20
50
80
110
Ambient Temperature: Ta [℃]
Ambient Temperature: Ta [℃]
Figure 26. RST2 Pull-up Resistance vs Ambient Temperature
(RST2 Pull-up Resistance)
Figure 27. PG2 Pull-up Resistance vs Ambient Temperature
(PG2Pull-up Resistance)
133
125
CLK FAST NG Threshold: ｔWF [s]
WDT OSC Frequency: FOSCW [kHz]
120
115
110
105
100
95
90
131
128
126
85
80
123
75
-40
-40
-10
20
50
80
110
Ambient Temperature: Ta [ C]
Figure 28. WDT OSC Frequency vs Ambient Temperature
(WDT Oscillation Frequency)
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TSZ22111 • 15 • 001
-10
20
50
80
110
Ambient Temperature: Ta [ C]
Figure 29. CLK FAST NG Threshold vs Ambient Temperature
(CLK FAST NG Threshold)
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Typical Performance Curves
- continued
133
WDT Reset Time: tWRES [s]
CLK SLOW NG Threshold: tWS [s]
875
873
870
868
865
131
128
126
123
-40
-40
-10
20
50
80
110
Ambient Temperature: Ta [ C]
Figure 30. CLK SLOW NG Threshold
vs Ambient Temperature
(CLK SLOW NG Threshold)
-10
20
50
80
110
Ambient Temperature: Ta [ C]
Figure 31. WDT Reset Time vs Ambient Temperature
(WDT Reset Time)
50
2.5
CLK Input Current: ICLK [μA]
CLK Threshold Voltage: VCLK [V]
-40℃
2.0
1.5
1.0
0.5
25℃
40
125℃
30
20
10
0
-40
-10
20
50
80
110
0
Ambient Temperature: Ta [℃]
Figure 32. CLK Threshold Voltage vs Ambient Temperature
(CLK Threshold Voltage)
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TSZ22111 • 15 • 001
1
2
3
4
CLK Supply Voltage: CLK [V]
5
Figure 33. CLK Input Current vs CLK Supply Voltage
(CLK Inflow Current)
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Typical Performance Curves
- continued
4.0
ENWD Pullup Resistance: RPURENWD [kΩ]
300
ENWD Threshold Voltage: VENWD [V]
VO2 = 5 V
3.5
ENWD detect
3.0
2.5
2.0
ENWD Undetect
1.5
1.0
250
200
150
100
-40
-10
20
50
80
110
-40
Ambient Temperature: Ta [℃]
-10
20
50
80
110
Ambient Temperature: Ta [℃]
Figure 34. ENWD Threshold Voltage vs Ambient Temperature
(ENWD Threshold Voltage)
Figure 35. ENWD Pull-up Resistance
vs Ambient Temperature
(ENWD Pull-up Resistance)
RSTWD Pullup Resistance: RPURSTWD [kΩ]
75
60
45
30
15
0
-40
-10
20
50
80
110
Ambient Temperature: Ta [℃]
Figure 36. RSTWD Pull-up Resistance
vs Ambient Temperature
(RSTWD Pull-up Resistance）
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BD39012EFV-C
Timing Chart
1. Start up・Stop
EN1 short to VCC, EN2 short to VS, VOUT = 6 V, load from VO2 is 400 mA.
VCC
PVCC
EN1
UVLO_VCC ON 3.5 V (Typ)
UVLO_VCC OFF 4 V (Typ)
Soft start time 3.28 ms (Typ)
RT=24kΩ
Internal ss
FB
LVD ON 0.65 V (Typ)
LVD OFF 0.68 V (Typ)
SCP ON 0.45 V (Typ)
EN2 ON
VO1
VS
EN2
EN2 OFF
VO2 level
PG1
LVD ON 4.62 V (Typ)
LVD OFF 4.68 V (Typ)
EN2 ON
VO2
VO2 level
PG2
1.18 V (Typ)
CT
0.25 V (Typ)
VO2 level
RST2
Power on reset time
14 ms (Typ) CCT=0.1μF
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2. Start up・Stop
EN1 is controlled, EN2 short to VS, VOUT = 6 V, load from VO2 is 400 mA after VCC starts up.
VCC
PVCC
EN1
VREG
VREG UVLO OFF 3.4V (Typ)
Soft start time 3.28 ms (Typ)
RT=24kΩ
Internal ss
FB
VO1
VS
EN2
LVD ON 0.65 V (Typ)
LVD OFF 0.68 V (Typ)
EN2 ON
EN2 OFF
VO2 level
PG1
LVD ON 4.62 V (Typ)
LVD OFF 4.68 V (Typ)
VO2
VO2 level
PG2
1.18 V (Typ)
0.25 V (Typ)
CT
VO2 level
RST2
Power on reset time
14 ms (Typ) CCT=0.1μF
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3. DCDC Converter Protection Operations
VCC, PVCC
TSD1 TSD1
ON OFF
OVPVS
13.5 V (Typ)
OVD
13 V (Typ)
LVD
175 °C (Typ) TSD 150 °C (Typ)
OCP
+
OCP SCP
OCP
+
SCP
Short to GND
VOUT
(VS)
OVD
0.95 V (Typ)
FB
1024clk
1024clk
LVD
0.90 V (Typ)
0.65 V (Typ)
0.45 V (Typ)
0.68 V (Typ)
0.45 V (Typ)
ISW
PG1
Internal
SOFT
START
1024clk
SW
Switching operate
until ISW becomes
over voltage protection level
SW pulse width
is limited by OCP
4. LDO Protection Operations (The Whole)
VS
TSD2 TSD2
ON OFF
5.38 V (Typ)
OVD
TSD
LVD
4.68 V (Typ)
VO2
OCP
LVD
LVD
5.32 V (Typ)
4.62 V (Typ)
IO2
1.18 V (Typ)
CT
1.18 V (Typ)
0.24 V (Typ)
RST2
tPOR
tPOR
0.24 V (Typ)
1.18 V (Typ)
tPOR
PG2
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BD39012EFV-C
5. LDO Protection Operations (RESET timing)
VO2
VO2
5V
VO2
4.68V (TYP)
4.68V (TYP)
5V
4.68V (TYP)
4.62V (TYP)
4.62V (TYP)
4.62V (TYP)
CT
3.0V (TYP)
5V
CT
5V
CT
1.18V (TYP)
1.18V (TYP)
0.25V (TYP)
RST2
RST2
RST2
PG2
PG2
0.25V (TYP)
PG2
VO2 returns before RESET is detected
after LVD is detected
VO2 returns after taking a pause enough
after LVD is detected
When VO2 output decreases
earlier than discharge time of CT
6. WDT
(*2)
Standby(*1)
Normal(*2)
(*3)
(*2)
(*3)
(*2)
(*1)
(*2)
(*4)
(*3)
(*2)
(*1)
WDT_FSM
LVD
VO2
tPOR
PO R
ENWD
Slow NG
ｔWRES
ｔWRES
ｔWRES
RSTWD
Fast NG
Fast NG
CLK
(Note 1)
CLK have to be on low start
WDT_CLK
*1：Standby Mode, *2：Normal Mode, *3：μC ERR Detect, *4：OSC_WDT ERR Detect (See Figure 1. WDT FSM)
(Note 1) Please release power on reset in a state of CLK = LOW by all means.
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BD39012EFV-C
Application Example
*There are many factors (Board layout, variation of the part, etc.) that can affect the characteristics.
Please verify and confirm using practical applications.
*Be sure to connect the T1, T2 and T3 pin to ground.
*In the case of high current application (About more than 500 mA from DC / DC convertor), please insert the schottky barrier
diode between SW and PGND
CVCC2
CPVCC
VO1
3
4
5
24
VCC
PGND
23
EN1
COMP
22
T1
FB
21
CLK
RT
20
6
RSTWD
7
PG1
8
9
VREG
19
RTW
18
PG2
T3
17
ENWD
VS
16
10
RST2
EN2
15
11
CT
T2
14
12
GND
VO2
13
L1
CVO1
RCO1
CCO1
RFB1A
2
SW
CFB1
CVCC1
OPEN
PVCC
RFB1B
Micro
controller
1
RRT
CVREG
RRTW
CVS
CCT
CVO2
Example of Constant Setting
VCC = 13.5 V, VO1 = 6.5 V, fsw = 500 kHz, ILOAD (VO2) = 400 mA, fwdt = 100 kHz
name
Value
Unit
Parts No
size
manufacture
IC
-
-
BD39012EFV-C
7.8mm × 7.6mm
ROHM
L1
4.7
uH
3N1CDH74NP470KC
7.0mm × 7.0mm
SUMIDA
CVCC1
4.7
uF
GCM32ER71H475KA40L
3225
murata
CVCC2
47
uF
-
-
-
CPVCC
4.7
uF
GCM32ER71H475KA40L
3225
murata
CVO1
10 // 2
uF
GCM31CR71C106K
3216
murata
CVS
1
uF
GCM188R71C105K
1608
murata
CCT
0.1
uF
GCM188R11H104K
1608
murata
CVREG
1
uF
GCM188R71C105K
1608
murata
CFB1
100
pF
GCM1882C1H101JA01
1608
murata
CCO1
4700
pF
GCM2162C1H472JA01
1608
murata
CVO2
10
uF
GCM31CR71C106K
3216
murata
RFB1B
22
kΩ
MCR03
1608
ROHM
RFB1A
6.2 // 6.2
kΩ
MCR03
1608
ROHM
RRT
24
kΩ
MCR03
1608
ROHM
RRTW
24
kΩ
MCR03
1608
ROHM
RCO1
12
kΩ
MCR03
1608
ROHM
Notes for pattern layout of PCB
1. Design the wirings shown in bold line as short as possible.
2. Place the input ceramic capacitor CVCC1, CVCC2, CPVCC, CVO1, CVS and CVO2 as close to IC as possible.
3. Place RRT and RRTW in GND pin nearest IC not to receive a noise.
4. Place the RFB1A and RFB1B as close to FB pin as possible and provide the shortest wiring from FB pin. In addition,
be careful not to arrange it in parallel with SW pin and high current line of L1 because it is the high Impedance line.
5. The loop of the red arrow is the line which high current line. Please layout with the shortest loop as much as possible, and
wire with the 1-layer without pass the through hall.
6. Please connect to GND thermal plate of IC back.
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Selection of Components Externally Connected
CVCC2
CPVCC
1
PVCC
2
SW
24
VCC
PGND
23
3
EN1
COMP
22
4
T1
FB
21
Outside
5
CLK
RT
20
flag
6
RSTWD
VREG
19
flag
7
PG1
RTW
18
flag
8
PG2
T3
17
Outside
9
ENWD
VS
16
10
RST2
EN2
15
11
CT
T2
14
12
GND
VO2
13
L1
D1
CVO1
RCO1 CCO1
CFB1
RFB1B
VCC or
Outside control
RFB1A
RRT
CVREG
CVCC1
flag
RRTW
CVS
VCC or Outside control
or VO1
CCT
CVO2
1)
Setting the output voltage (RFB1A, RFB1B, CFB1B)
In BD39012EFV-C, VO1 voltage can be set from reference voltage 0.8 V (Typ) and the resistance division ratio of feed
buck resistance RFB1A and RFB1B. Output voltage can be calculated as follow.
VO1
CFB1
RFB1B
FB
RFB1A
VO1 = 0.8 × (1 +
𝑅𝐹𝐵1𝐵
) [𝑉]
𝑅𝐹𝐵1𝐴
VREF
[Output voltage setting resistance]
Use of highly precise resistance less than ±1 % is recommended for output voltage setting. It is recommended that it is
set around 1 kΩ to 100 kΩ for resistor value. The FB pin is very high impedance and easy to be affected by the noise.
By all means connect resistance to nearest an IC. In addition, please layout it not to be affected by the noise of the SW
pin without layout nearness. As needed, 0 point is made by assembling CFB1 beside RFB1B, and the stable ratio of
the control system can be planned.
The equation of 0 points is as follows.
𝑓𝑧𝑐𝑓 =
1
[𝐻𝑧]
2𝜋 × 𝑅𝐹𝐵1𝐵 × 𝐶𝐹𝐵1
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2)
Setting frequency of DC / DC convertor (RRT)
Internal oscillation frequency can be set by resistor value connecting with RT. (See Figure 37)
Settable range is 200 kHz to 600 kHz. The relations of resistor value and the oscillation frequency is decided as follow.
Because in the setting that deviated from this range, the operation is not guaranteed, please be careful.
When it is affected by the parasitism capacity of a board, it cannot be set to desired frequency.
Therefore please connect it to nearest IC and drop it to ground.
FOSC vs RRT
650
600
FOSC [kHz]
550
500
y = 9115.6x-0.913
450
400
350
300
250
200
20
25
30
35
40
45
50
55
60
65
70
RRT [kΩ]
Figure 37. DC / DC oscillation frequency characteristics
3)
Duty Cycle
Duty cycle of DC / DC convertor is similar to the following equation.
(Vout = output voltage, Vin = input voltage, η = efficiency)
D=
4)
𝑉𝑜𝑢𝑡 100
[%]
×
𝑉𝑖𝑛
𝜂
Selecting the inductance (L1)
The inductor value is chosen based on a duty cycle of operation frequency (fsw), load current (Iout), ripple current (ΔIL),
input voltage (Vin) and output voltage (Vout). The loss of the coil becomes the total of wired resistance of a coil LDCR
and loss to occur in ferrite core. It is thought that the most of the loss of coil depend on LDCR when oscillation
frequency is to around 2 MHz. Please choose a small thing of LDCR because the range of set frequency of
BD39012EFV-C is f = 200 kHz to 600 kHz.
When LDCR is made too much small, inductance value becomes small, and peak current value flowing at ON time
grows too much big, and internal loss and power dissipation of coil grow big and efficiency turns worse. When a big
inductance value is greatly set too much, LDCR grows big and efficiency in the high load turns worse. Moreover a
ferrite core causes magnetic saturation and an inductance value suddenly decreases. Then there is the risk that
excessive current flows in. Generally, if it is set to become the ripple current of less than 30 % of output peak loads,
in most cases, stable characteristics can be got.
The aim of the smallest inductance level can be calculated by next equation.
∆𝐼𝐿 = 0.3 × 𝐼𝑜𝑢𝑡 [𝐴]
𝐿𝑚𝑖𝑛 =
(𝑉𝑖𝑛 − 𝑉𝑜𝑢𝑡 ) × 𝐷
[𝐻]
∆𝐼𝐿 × 𝑓𝑠𝑤
The inductance value chosen here is one of the indexes insistently.
Please confirm whether peak current can meet the direct current weight characteristics of the inductor enough.
The equation of peak current (Ipeak) is as follows.
1
𝐼𝑝𝑒𝑎𝑘 = 𝐼𝑜𝑢𝑡 + ∆𝐼𝐿 [𝐴]
2
ΔIL
Iout
Inductor current waveform
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5)
Selecting the input capacitor (CVCC1, CPVCC)
Input capacitors reduce the power output impedance that is connected to VCC and PVCC. It is recommended that
electrolytic capacitor such as CVCC2 is inserted in the case of the PCB layout which power supply impedance grows
big. Please use the capacitor that impedance is low and an implementation area is small (more than at least 2 μF) for
the bypass capacitor connected to nearest IC.
The ripple current limit of input capacitor is approached by the following equation.
It is recommended that ceramic capacitor with enough limit current is used.
𝐼𝐶𝑉𝐶𝐶,𝐶𝑃𝑉𝐶𝐶 ≈ 𝐼𝑜𝑢𝑡 ∗ √𝐷 × (1 − 𝐷)[𝐴𝑟𝑚𝑠 ]
Minimum input capacity is approached by the following equation based on the input ripple voltage of the aim.
Input capacitor ESR (Cesr)
𝐶𝐶𝑉𝐶𝐶,𝐶𝑃𝑉𝐶𝐶 ≥
𝐼𝑜𝑢𝑡 × 𝐷 × (1 − 𝐷)
[𝐹]
∆𝐼
(∆𝑉𝑖𝑛 − (𝐼𝑜𝑢𝑡 + 2𝐿 ) × C𝑒𝑠𝑟 ) × 𝑓𝑠𝑤
6)
Setting of the internal REG input capacitor (CVREG)
Please insert ceramic capacitor of 1μF in nearest VREG pin of internal reference power supply.
7)
Setting of the output capacitor (CVO1)
The output capacitor CVO1 has an important role in output ripple voltage, load-responsive and stability of the loop.
The output voltage ripple is generally set in less than 1 % of the output voltage and approached by the following
equation. (ESR of CVO1 = RCVO1)
∆𝑉𝑜𝑢𝑡 = ∆𝐼𝐿 × (𝑅𝐶𝑉𝑂1 +
1
) ⌈𝑉⌉
8 × 𝑓𝑠𝑤 × 𝐶𝑉𝑂1
An output capacitor significantly influences the output voltage change in the load fluctuation. The quantity of change
depends on many factors including capacity, parasitism ESR, parasitism inductor phase characteristics and through
rate of load. Please use it after confirmation with an actual product enough.
When phase characteristics are enough, the quantity of drop VDROP of the output voltage by the load fluctuation can
be approached by following equation. A figure of image is shown as follows.
𝑉𝐷𝑅𝑂𝑃 = 𝐼𝑝𝑢𝑙𝑠𝑒 × 𝐶𝑉𝑂1𝑒𝑠𝑟 +
𝐿 × 𝐼𝑝𝑢𝑙𝑠𝑒 2
[𝑉]
𝐶𝑉𝑂1 × (𝑉𝑖𝑛 − 𝑉𝑜𝑢𝑡 )
VPP
Ripple Voltage
VDROP
Load
Please use an input capacitor and the output capacitor after considering DC voltage characteristics and temperature
characteristics enough. When a ceramic capacitor is used, the capacity comes under a big influence of an applied
voltage and temperature, and capacity suddenly decreases. Please consider characteristics enough, and it is
necessary to choose the product superior in temperature characteristics such as B characteristics or X7R
characteristics. When aluminum electrolytic capacitor is used, large-capacity is got in small size. But it is necessary to
inspect temperature characteristics of ESR and the capacity enough because capacity and ESR suddenly change by a
temperature change. The capacitor 1.5 times to 2 times larger than a limit is recommended about the
pressure-resistant.
8)
Setting of the schottky barrier diode of SW pin (D1)
When big load current is pulled, SW pin waggles lower than ground while SW pin is L because BD39012EFV-C is
DC / DC convertor of the synchronous rectification system.
Please insert schottky barrier diode between SW and PGND to prevent the IC from malfunctioning by this.
In the case of the setting that load current of DC / DC convertor (Iout) exceeds 500 mA, it is recommended that it is
inserted.
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9)
Setting the soft start time
Soft start is a function to reduce rush current and over shoot. Soft start time of BD39012EFV-C is decided by the
oscillation frequency of DC / DC convertor.
When EN1 is released, VREG start up after internal circuit delay operation.
SS pin is counted up when VREG arrives at 3.4 V (Typ). Output voltage VO1 starts up to approximately 90 % when SS
pin starts up to 0.8 V.
The time from internal SS pin begins to start up to arrive at 0.8 V can be calculated by the equation as below.
VCC
EN1
VREG
VREG UVLO 3.4V(typ)
Soft start time
SS=0.8V(typ)
𝑆𝑜𝑓𝑡 𝑠𝑡𝑎𝑟𝑡 𝑡𝑖𝑚𝑒 = 1638.4 ×
SS(Internal pin)
VO
1
[𝑚𝑠]
𝑓𝑠𝑤
90%
VO1
10)
Setting CT pin (CCT)
Power on reset time is decided freely by adding capacitor between CT pin and ground.
As the value of CCT becomes big, power on reset time becomes long. Standard power on reset time corresponded to
the list of CCT capacitors is shown below. Please connect to ground nearest the IC not to do wrong operation by noise.
CCT (μF)
Power ON RESET TIME [ms]
10
1400
4.7
658
1
140
0.47
65.8
0.1
14
0.047(Note1)
6.58
0.01(Note1)
1.4
0.0047(Note1)
0.658
0.001(Note1)
0.14
(Note1) Setting time ±100 μs
11)
Setting the PG1, PG2, RST2 and RSTWD pin
PG1, PG2, RST2 and RSTWD are the open drain pin that is pulled up inside by VO2 output. When each abnormality is
detected each becomes L output. When it come back normally, each becomes H (VO2 output) output.
All these 4 pins can be connected and used to OR output. Logic image by each protection is shown below.
VO2
VO1 OVD
VO1 LVD
PG1
VO1 VSOVP
EN1
UVLO
TSD1
PG2
VO2 OVD
VO2 LVD
TSD2
RST2
RSTWD
WDT FAST N.G.
WDT SLOW N.G.
WDT CLK N.G.
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12)
Setting the phase compensation circuit (DC / DC Converter)
DC / DC is current mode control and is 2-pole and 1-zero system. It has two poles formed by error amp and output load
and one zero added by phase compensation. The appropriate pole point and zero point placement results in good
transient response and stability. Generic Bode plot of DC / DC converters is shown below. At point (a), gain starts
falling due to the pole formed by output impedance of error amp and C CO1 capacitance. After that, in order to cancel out
the pole formed by output load, insert zero formed by RCO1 and CCO1 and offset the fluctuation of gain and phase before
reaching out to point (b).
(a)
A
Gain [dB]
GBW (b)
0
F[kHz]
FCRS
PHASE[deg]
0
-90°
-90
Phase margin
-180°
-180
F[kHz]
Phase margin level
External component values are determined in this way. The RCO1 determines the cross over frequency FCRS, i.e., the
frequency at which DC / DC total gain falls down to 0 dB. When FCRS is set high, good transient response is expected
but stability is sacrificed on the other hand. When F CRS is set low, good stability is expected but transient response is
sacrificed on the other hand.
In this example, component value is set in a way F CRS is 1 / 5 to 1 / 10 of the switching frequency.
(i) RCO1 for Phase compensation
Phase compensation resistor RCO1 can be obtained by the following equation.
𝑅𝐶𝑂1 =
2𝜋 × 𝑉𝑂1 × 𝐹𝐶𝑅𝑆 × 𝐶𝑉𝑂1
[𝛺]
0.8 × 𝐺𝑁𝑃 × 𝐺𝑀𝐴
Where：
𝑉𝑂1 : 𝑂𝑢𝑡𝑝𝑢𝑡 𝑣𝑜𝑙𝑡𝑎𝑔𝑒
𝐹𝐶𝑅𝑆 : 𝐶𝑟𝑜𝑠𝑠 𝑜𝑣𝑒𝑟 𝑓𝑟𝑒𝑞𝑢𝑒𝑛𝑐𝑦
𝐶𝑂1 : 𝑂𝑢𝑡𝑝𝑢𝑡 𝑐𝑎𝑝𝑎𝑐𝑖𝑡𝑜𝑟, 𝑓𝑒𝑒𝑑𝑏𝑢𝑐𝑘 𝑟𝑒𝑓𝑒𝑟𝑒𝑛𝑐𝑒 𝑣𝑜𝑙𝑡𝑎𝑔𝑒 (0.8𝑉 (𝑇𝑦𝑝))
𝐺𝑀𝑃 : 𝐶𝑢𝑟𝑟𝑒𝑛𝑡 𝑠𝑒𝑛𝑠𝑒 𝑔𝑎𝑖𝑛 (0.2 𝐴 / 𝑉 (𝑇𝑦𝑝))
𝐺𝑀𝐴 : 𝐸𝑟𝑟𝑜𝑟 𝑎𝑚𝑝 𝑡𝑟𝑎𝑛𝑐𝑒 𝑐𝑜𝑛𝑑𝑢𝑐𝑡𝑎𝑛𝑐𝑒 (300𝑢𝐴 / 𝑉 (𝑇𝑦𝑝))
(ii) CCO1 for Phase compensation
Phase compensation capacitor CCO1 can be obtained by the following equation.
𝐶𝐶𝑂1 =
𝑉𝑂1 × 𝐶𝑉𝑂1
[𝐹]
𝐼𝑜𝑢𝑡 × 𝑅𝐶𝑂1
Where：
𝐼𝑂𝑢𝑡 : 𝑂𝑢𝑡𝑝𝑢𝑡 𝑙𝑜𝑎𝑑
However these are simple equation and thus adjustment of the value using the actual product may be necessary for
optimization. Also compensation characteristics are influenced by PCB layout and load conditions and thus thorough
evaluation using the production intent unit is recommended.
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13)
Setting the phase compensation circuit
It is suitable that the starting point of the phase compensation is set by the following condition equation. Please make a
board wire diagram, and confirm whether frequency characteristic to aim for is satisfied. Actually, the characteristics
greatly change by layout of PCB, taking wiring around, kind of used parts or terms of use (temperature etc.).
For example, it might resonate after LC resonance point moves by capacity decrease at the low temperature and
increase of the ESR when electrolytic capacitor is used for an output capacitor.
To a capacitor for the phase compensation, using such as temperature compensation types is recommended.
Please confirm stability and responsiveness with practical application by all means.
The frequency characteristic with the practical application is confirmed using gain phase analyzer and FRA.
Please refer to each measuring instrument manufacturer for the methods of the measurement. In addition, when there
are not these measuring instruments, there is a method to guess margin degree by load reply.
It is said that responsiveness is low when there is much quantity of change, and there are few phase margin when
there is much number of ringing times after the change in the case of monitoring change of the output when it was
made to fluctuate from a no load state to a peak load.
The aim is ringing more than twice. But the quantitative phase margin level cannot be confirmed.
Maximum Load
Load
0
Phase margin is a little.
Output Voltage
Phase margin exists.
t
14)
Setting the LDO output capacitor (CVO2)
The capacitor must be added between output pin and GND in order to stop from having it oscillated. Please ensure to
select the Capacitor higher than 6 µF in the range of voltage and temperature. Please confirm in the last state to use
because it changes by wiring impedance of the board, input power supply and load actually.
When selecting a ceramic capacitor, B characteristics or X7R higher is recommended which is good in temperature
characteristic and has excellent DC bias characteristic.
Please do final decision of the capacitance after confirming it by practical application enough.
15)
Setting the LDO input capacitor (CVS)
Please add the capacitor more than 0.1 µF between VS and GND. Because the capacitance setting varies according to
application, confirm and design it with a margin. Capacitors that have good voltage and temperature characteristics are
recommended. Do not use it together with CVO1, please insert in the place nearest VS by all means.
16)
Oscillator for watch dog timer Setting the frequency (RRTW)
Internal oscillation frequency can be set by resistor value connecting with RTW.
The settable range is 50 kHz to 250 kHz. The relations of resistor value and oscillation frequency is decided like the
below figure.
Oscillator for watch dog timer Setting the frequency (FOSCW vs. RTW)
FOSCW
RTW
FOSCW
vs vs
RRTW
FOSCW = 1839.1 x RTW -0.919
350
FOSCW
[kHz]
FOSCW [kHz]
300
250
200
150
100
50
0
0
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RTW
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RTW [kΩ]
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1. Example of WDT setting method
In the case of RTW = 24 kΩ, CLK edge width becomes 1.773 ms to 6.920 ms when it is normal.
Symbol
Min
Typ
Max
Unit
FOSCW
75
100
125
kHz
tWT
0.984
1.280
1.773
ms
tWS
6.920
8.700
11.667
ms
1.773
11.667
[ms]
1.280
8.700
[ms]
0.984
6.920
[ms]
Fast NG
Slow NG
tWF
Nomal
tWS
Watch dog setting method
17)
ENWD Pin
This pin validates the WDT function. Usually pulled up inside by VO2 pin, the WDT function becomes effective.
To invalidate the WDT function, please short ENWD pin to ground.
Then RSTWD pin always becomes H (VO2 output).
18)
RSTWD Pin
H (VO2 output) is usually shown when the normal operating.
The output is changed from H to L when the abnormality is detected in WDT.
19)
CLK Pin
Clock input pin for WDT. Please input the signal from a microcomputer depending on WDT set frequency.
Please release power on reset in a state of CLK = LOW by all means.
20)
T1, T2, T3 Test Pin
Be sure to connect to GND.
21)
EN1, EN2 Pin
Please control EN1 from VCC or microcomputer, and EN2 from VCC or VO1 or microcomputer.
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Power Dissipation
Maximum Junction Temperature Tj is 150 °C. If the junction temperature reaches 175 °C or higher, the circuit will be shut
down. Please make sure that the junction temperature must not exceed 150C at all time.
For thermal design, be sure to operate the IC within the following conditions.
(Since the temperatures described hereunder are all guaranteed temperatures, take margin into account.)
1. Ambient temperature Ta is less than 125 °C.
2. Tj is less than 150 °C.
Temperature Tj can be calculated by two ways as below.
1. To obtain Tj from the IC surface temperature Tc in actual use
𝑇𝑗 = 𝑇𝐶 + 𝜃𝑗𝑐 × 𝑃𝑇𝑂𝑇𝐴𝐿
2. To obtain Tj from the ambient temperature Ta
𝑇𝑗 = 𝑇𝑎 + 𝜃𝑗𝑎 × 𝑃𝑇𝑂𝑇𝐴𝐿
Thermal resistance value θja is varied by the number of the layer and copper foil area of the PCB.
See Figure 38 for the thermal design.
Thermal Derating Characteristics
4.5
①3.99W
POWER DISSIPATION: Pd [W]
4.0
IC mounted on ROHM standard board
・Board size: 70 mm × 70 mm × 1.6 mm
・Board size: 15 mm × 15 mm × 1.6 mm
・PCB and back metal are connected by soldering
3.5
3.0
②2.80W
2.5
2.0
③1.70W
1.5
④1.10W
① : 4-layer board 70 × 70 × 1.6mmt
② : 2-layer board 70 × 70 × 1.6mmt
③ : 2-layer board 15 × 15 × 1.6mmt
④ : Single IC
1.0
0.5
0.0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta [℃]
Figure 38. Package data of HTSSOP-B24 (Reference data)
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I / O equivalent circuits
1.PVCC, 2.VCC
3.EN1
4.T1, 14.T2, 17.T3
VCC
VO2
EN1
PVCC
T3
T2
T1
PGND
GND
GND
GND
5.CLK
6.RSTWD, 7.PG1, 8.PG2
VO2
VO2
VO2
CLK
RSTWD
PG2
PG1
ENWD
GND
GND
GND
10.RST2
VO2
9.ENWD
11.CT
13.VO2
VO2
VS
CT
VO2
GND
GND
RST2
GND
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I / O equivalent circuits - Continued
15.EN2
16.VS
18.RTW
VO2
EN2
VS
RTW
GND
GND
GND
19.VREG
VCC
20.RT
VO2
VREG
VREG
FB
RT
GND
VREG
GND
GND
22.COMP
21.FB
24.SW
PVCC
SW
COMP
GND
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
When the application pulls load current more than 500 mA from DC / DC convertor, be sure to connect to the schottky
barrier diode between SW and PGND.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P
P
+
N
N
P
+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD39012EFV-C
Ordering Information
B
D
3
9
0
1
Part Number
2
E
F
V
Package
EFV: HTSSOP-B24
-
CE 2
Packaging and forming specification
C: For in-vehicle
E2: Embossed tape and reel
(HTSSOP-B24)
Marking Diagrams
HTSSOP-B24 (TOP VIEW)
Part Number Marking
BD39012
LOT Number
1PIN MARK
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BD39012EFV-C
Physical Dimension, Tape and Reel Information
Package Name
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BD39012EFV-C
Revision History
Date
Revision
11.Sep.2014
002
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – SS
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – SS
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001