EGP10D Glass Passivated Junction Fast Efficient Rectifiers PRODUCT SUMMARY Reverse Voltage 50 to 400 Volts Forward Current 1.0 Ampere FEATURES Cavity-free glass-passivated junction Ultrafast reverse recovery time Low forward voltage drop Low leakage current Low switching losses, high efficiency High forward surge capability Solder Dip 260 °C, 40 seconds MECHANICAL DATA Case: DO-204AL, molded epoxy over glass body Epoxy meets UL-94V-0 Flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002B and JESD22-B102D E3 suffix for commercial grade, HE3 suffix for high reliability grade (AEC Q101 qualified) Polarity: Color band denotes cathode end Weight: 0.012 ounce, 0.34 gram Pb-free; RoHS-compliant 07/11/2007 Rev.1.00 www.SiliconStandard.com 1 EGP10D MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Rating at 25 oC ambient temperature unless otherwise specified. Symbol EGP 10A EGP 10B EGP 10C EGP 10D EGP 10F EGP 10G Unit Maximum repetitive peak reverse voltage VRRM 50 100 150 200 300 400 Volts Parameter Maximum RMS voltage VRMS 35 70 105 140 210 280 Volts Maximum DC blocking voltage V DC 50 100 150 200 300 400 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=55oC IF(AV) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM Maximum instantaneous forward voltage at 1.0A VF Maximum DC reverse current at rated DC blocking voltage @TA=25oC @TA=125oC 1.0 30.0 0.95 IR Maximum reverse recovery time at IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A trr 50 Typical junction capacitance at 4.0 V, 1 MHz CJ Operating junction and storage temperature range Notes: Amps 1.25 5.0 100 Typical thermal resistance (Note 1) Amp 22.0 Volts uA nS 15.0 RθJA 50.0 TJ, TSTG -55 to +150 pF o C/W o C 1. Thermal resistance from junction to ambient at 0.375"(9.5mm) lead length 2. Pulse test: 300us pulse width, 1% duty cycle 07/11/2007 Rev.1.00 www.SiliconStandard.com 2 EGP10D RATINGS AND CHARACTERISTIC CURVES o (TA=25 C unless otherwise noted) Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 07/11/2007 Rev.1.00 www.SiliconStandard.com 3