AP50WN750I
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ 100% UIS Test
BVDSS
500V
▼ Simple Drive Requirement
RDS(ON)
0.75Ω
▼ Fast Switching Characteristic
3
ID
D
G
▼ RoHS Compliant & Halogen-Free
10A
S
Description
AP50WN750 series are from Advanced Power innovated design and
silicon process technology to achieve the lowest possible onresistance and fast switching performance. It provides the designer
with an extreme efficient device for use in a wide range of power
applications.
The TO-220CFM package is widely preferred for all commercialindustrial through hole applications. The mold compound provides a
high isolation voltage capability and low thermal resistance between
the tab and the external heat-sink.
G
D
S
TO-220CFM(I)
.
Absolute Maximum Ratings@Tj=25oC(unless otherwise specified)
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID@TC=25℃
3
Drain Current, VGS @ 10V
1
IDM
Pulsed Drain Current
PD@TC=25℃
Total Power Dissipation
PD@TA=25℃
Total Power Dissipation
4
Rating
Units
500
V
+30
V
10
A
40
A
34.7
W
1.92
W
50
mJ
EAS
Single Pulse Avalanche Energy
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Value
Units
Rthj-c
Maximum Thermal Resistance, Junction-case
3.6
℃/W
Rthj-a
Maximum Thermal Resistance, Junction-ambient
65
℃/W
1
201709211
AP50WN750I
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
BVDSS
Parameter
Test Conditions
Drain-Source Breakdown Voltage
Min.
Typ.
500
-
-
V
VGS=10V, ID=5A
-
-
0.75
Ω
VGS=0V, ID=250uA
2
Max. Units
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
2
-
4
V
gfs
Forward Transconductance
VDS=20V, ID=5A
-
13
-
S
IDSS
Drain-Source Leakage Current
VDS=400V, VGS=0V
-
-
100
uA
IGSS
Gate-Source Leakage
VGS=+30V, VDS=0V
-
-
+1
uA
Qg
Total Gate Charge
ID=10A
-
29
46.4
nC
Qgs
Gate-Source Charge
VDS=400V
-
5.5
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=10V
-
11.5
-
nC
td(on)
Turn-on Delay Time
VDD=250V
-
14
-
ns
tr
Rise Time
ID=10A
-
35
-
ns
td(off)
Turn-off Delay Time
RG=25Ω
-
88
-
ns
tf
Fall Time
VGS=10V
-
50
-
ns
Ciss
Input Capacitance
VGS=0V
-
Coss
Output Capacitance
VDS=100V
-
55
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
13
-
pF
Rg
Gate Resistance
f=1.0MHz
-
3.3
6.6
Ω
Min.
Typ.
.
1050 1680
pF
Source-Drain Diode
Symbol
Parameter
2
Test Conditions
Max. Units
VSD
Forward On Voltage
IS=10A, VGS=0V
-
-
1.5
V
trr
Reverse Recovery Time
IS=10A, VGS=0V
-
300
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
2.1
-
uC
Notes:
1.Pulse width limited by max. junction temperature.
2.Pulse test
3.Ensure that the junction temperature does not exceed TJmax..
4.Starting Tj=25oC , VDD=50V , L=1mH , RG=25Ω, VGS=10V
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP50WN750I
16
24
10V
8.0V
7.0V
6.0V
V G =5.0V
T C =25 C
ID , Drain Current (A)
20
16
o
T C =150 C
ID , Drain Current (A)
o
12
8
12
0.37Ω
10V
8.0V
7.0V
6.0V
V G =5.0V
8
4
4
0
0
0
10
20
30
0
40
10
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
30
40
Fig 2. Typical Output Characteristics
700
4
I D =5A
I D =5A
V G =10V
T C =25 o C
660
640
.
Normalized RDS(ON)
680
RDS(ON) (mΩ)
20
V DS , Drain-to-Source Voltage (V)
3
2
620
1
600
0
580
2
4
6
8
-100
10
-50
0
50
100
150
T j , Junction Temperature ( o C )
V GS Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
10
2
I D =250uA
1.6
Normalized VGS(th)
IS (A)
8
6
T j = 150 o C
T j = 25 o C
4
1.2
0.8
0.4
2
0
0
0
0.2
0.4
0.6
0.8
1
V SD (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.2
-100
-50
0
50
100
150
o
T j , Junction Temperature ( C )
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP50WN750I
f=1.0MHz
12
2400
I D =10A
V DS =400V
2000
8
1600
C (pF)
VGS , Gate to Source Voltage (V)
10
6
C iss
1200
4
800
2
400
0
0.37Ω
C oss
C rss
0
0
10
20
30
40
50
0
100
200
Q G , Total Gate Charge (nC)
300
400
500
600
V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
100
ID (A)
10
10us
100us
1
1ms
10ms
100ms
DC
0.1
T C =25 o C
Single Pulse
.
Normalized Thermal Response (Rthjc)
Duty factor=0.5
Operation in this area
limited by RDS(ON)
0.2
0.1
0.1
0.05
0.02
0.01
0.01
PDM
t
Single Pulse
T
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
0.01
0.001
1
10
100
1000
0.00001
0.0001
V DS , Drain-to-Source Voltage (V)
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig10. Effective Transient Thermal Impedance
2
40
1.6
Normalized BVDSS
PD , Power Dissipation (W)
I D =1mA
30
20
1.2
0.8
10
0.4
0
0
0
50
100
T C , Case Temperature ( o C )
Fig 11. Total Power Dissipation
150
-100
-50
0
50
100
150
o
T j , Junction Temperature ( C)
Fig 12. Normalized BVDSS v.s. Junction
Temperature
4
AP50WN750I
MARKING INFORMATION
Part Number
50WN750
YWWSSS
Date Code (YWWSSS)
Y：Last Digit Of The Year
WW：Week
SSS：Sequence
.
5